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    SOT-103 Search Results

    SOT-103 Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC75S102F Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TCR2EF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation
    TCR2LF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation
    TCR3DF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 300 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation

    SOT-103 Datasheets (12)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT1030-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm Original PDF
    SOT1031-1 NXP Semiconductors Plastic thermal enhanced very very thin quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 0.7 mm Original PDF
    SOT1031-2 NXP Semiconductors Plastic thermal enhanced very very thin quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 0.7 mm Original PDF
    SOT1033-1 NXP Semiconductors HWQFN56R: plastic thermal enhanced very very thin quad flat package Original PDF
    SOT1034-1 NXP Semiconductors Plastic ball grid array package; 736 balls Original PDF
    SOT1035-1 NXP Semiconductors Plastic thermal enhanced ball grid array package; 736 balls; heatsink Original PDF
    SOT1036-1 NXP Semiconductors Plastic thermal enhanced ultra thin quad flat package; no leads; 76 terminals; UTLP based; body 6 x 6 x 0.55 mm Original PDF
    SOT1039-1 NXP Semiconductors Footprint for reflow soldering SOT1039-1 Original PDF
    SOT1039-1 NXP Semiconductors Plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals; UTLP based; body 3 x 3 x 0.5 mm Original PDF
    SOT1039-1_115 NXP Semiconductors Standard product orientation 12NC ending 115 Original PDF
    SOT1039-2 NXP Semiconductors Plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals Original PDF
    SOT1039-2 NXP Semiconductors Footprint for reflow soldering SOT1039-2 Original PDF