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SOD962 Datasheet

Part Manufacturer Description PDF Type
SOD962 NXP Semiconductors Footprint for reflow soldering SOD962 Original
SOD962 NXP Semiconductors Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm Original
SOD962 NXP Semiconductors AN11046 - DSN0603-2 (SOD962) soldering requirements Original
SOD962-2 NXP Semiconductors sod962_fr Original
SOD962-2 NXP Semiconductors Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm Original

SOD962

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: indicates the cathode. Outline version SOD962 References IEC JEDEC JEITA European projection sod962_po , AN11046 DSN0603-2 (SOD962) soldering requirements Rev. 1 - 1 June 2012 Application note Document information Info Keywords Content DSN0603-2 (SOD962), 0201 package size, reflow soldering, surface , ultra small DSN0603-2 (SOD962) 0201 size packages. This technical report provides recommendations for , NXP Semiconductors AN11046 DSN0603-2 (SOD962) soldering requirements Revision history Rev 1 NXP Semiconductors
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M705-GRN360-MZ M705-GRN360 M705-GRN360-M-Z NC257 senju solder bar WLCSP stencil design
Abstract: barrier rectifier with an integrated guard ring for stress protection in a DSN0603-2 (SOD962-2) leadless , top view DSN0603-2 (SOD962-2) [1] The marking bar indicates the cathode. 6. Ordering , Version DSN0603-2 Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 , package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 L 1 2 b e1 A A1 E D , 0.15 0.13 Note 1. The marking bar indicates the cathode. Outline version sod962-2_po NXP Semiconductors
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PMEG4002AESF
Abstract: barrier rectifier with an integrated guard ring for stress protection in a DSN0603-2 (SOD962-2) leadless , top view DSN0603-2 (SOD962-2) [1] The marking bar indicates the cathode. 6. Ordering , Version DSN0603-2 Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 , package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 L 1 2 b e1 A A1 E D , 0.15 0.13 Note 1. The marking bar indicates the cathode. Outline version sod962-2_po NXP Semiconductors
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PMEG3002AESF
Abstract: including coating foil thickness. 2. The marking bar indicates the cathode. Outline version sod962_po , paste deposit solder resist Dimensions in mm sod962_fr Reflow soldering is the required , bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD962 leadless ultra small Surface-Mounted , small package; 2 terminals; body 0.6 × 0.3 × 0.3 mm PESD5V0L1BSF - Description SOD962 4 , package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962 L 1 2 b e1 A A1 E D (2 NXP Semiconductors
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A1BD
Abstract: Dimensions in mm sod962_fr Fig 9. Reflow soldering footprint DSN0603-2 (SOD962) PESD5V0F1BSF All , bidirectional ElectroStatic Discharge (ESD) protection diode in a DSN0603-2 (SOD962) leadless ultra small , . Ordering information Package Name PESD5V0F1BSF Description Version SOD962 DSN0603-2 leadless ultra small , outline 'LPHQVLRQV LQ PP Fig 8. Package outline DSN0603-2 (SOD962 , -315 DSN0603-2 2 mm pitch, 8 mm tape and reel (SOD962) For further information and the NXP Semiconductors
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Abstract: barrier rectifier with an integrated guard ring for stress protection in a DSN0603-2 (SOD962-2) leadless , top view DSN0603-2 (SOD962-2) [1] The marking bar indicates the cathode. 6. Ordering , Version DSN0603-2 Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 , package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 L 1 2 b e1 A A1 E D , 0.15 0.13 Note 1. The marking bar indicates the cathode. Outline version sod962-2_po NXP Semiconductors
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PMEG3002ESF
Abstract: rectifier with an integrated guard ring for stress protection in a DSN0603-2 (SOD962-2) leadless ultra , -2 (SOD962-2) [1] The marking bar indicates the cathode. 6. Ordering information Table 3. Ordering , ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 7. Marking Table 4 , SOD962-2 L 1 2 b e1 A A1 E D (1) 0 0.5 mm scale Dimensions (mm are , cathode. Outline version sod962-2_po References IEC JEDEC JEITA European projection NXP Semiconductors
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PMEG2005AESF
Abstract: rectifier with an integrated guard ring for stress protection in a DSN0603-2 (SOD962-2) leadless ultra , -2 (SOD962-2) [1] The marking bar indicates the cathode. 6. Ordering information Table 3. Ordering , ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 7. Marking Table 4 , 0.6 x 0.3 x 0.3 mm SOD962-2 L 1 2 b e1 A A1 E D (1) 0 0.5 mm , marking bar indicates the cathode. Outline version sod962-2_po References IEC JEDEC JEITA NXP Semiconductors
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PMEG2005ESF
Abstract: version sod962_po References IEC JEDEC JEITA Issue date 10-11-03 10-11-11 SOD962 , sod962_fr Reflow soldering is the required soldering method. Fig 10. Required reflow soldering , capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD962 leadless ultra small , small package; 2 terminals; body 0.6 ï'´ 0.3 ï'´ 0.3 mm SOD962 4. Marking Table 4. Marking , small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962 L 1 2 b e1 A A1 E NXP Semiconductors
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Abstract: Package outline Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962 L 1 2 b e1 A A1 E D (2) 0 Dimensions Unit mm A(1) A1 b D E e1 L 0.15 0.13 scale 0.5 mm max 0.32 0.0076 0.25 0.325 0.625 nom 0.4 0.23 0.275 0.575 min 0.28 Note 1. Dimension A is including coating foil thickness. 2. The marking bar indicates the cathode. Outline version SOD962 References IEC JEDEC JEITA European projection sod962_po Issue date 10-11-03 10-11-11 NXP Semiconductors
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Abstract: rectifier with an integrated guard ring for stress protection in a DSN0603-2 (SOD962-2) leadless ultra , -2 (SOD962-2) [1] The marking bar indicates the cathode. 6. Ordering information Table 3. Ordering , ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 7. Marking Table 4 , package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 L 1 2 b e1 A A1 E D , 0.15 0.13 Note 1. The marking bar indicates the cathode. Outline version sod962-2_po NXP Semiconductors
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PMEG4002ESF
Abstract: rectifier with an integrated guard ring for stress protection in a DSN0603-2 (SOD962-2) leadless ultra , symbol 1 1 2 2 sym001 Transparent top view DSN0603-2 (SOD962-2) [1] The marking bar , terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 7. Marking Table 4. Marking codes Type number , 0.3 x 0.3 mm SOD962-2 L 1 2 b e1 A A1 E D (1) 0 0.5 mm scale , indicates the cathode. Outline version sod962-2_po References IEC JEDEC JEITA European NXP Semiconductors
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PMEG2002AESF
Abstract: paste solder paste deposit solder resist Dimensions in mm Fig 8. sod962_fr Reflow , ESD and other transients. The device is encapsulated in a leadless super small DSN0603-2 (SOD962 , terminals; body 0.6 ï'´ 0.3 ï'´ 0.3 mm SOD962 4. Marking Table 4. Marking code Type number , Package outline DSN0603-2 (SOD962) 9. Packing information Table 9. Packing methods The indicated , , 8 mm tape and reel (SOD962) -315 For further information and the availability of packing NXP Semiconductors
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Abstract: rectifier with an integrated guard ring for stress protection in a DSN0603-2 (SOD962-2) leadless ultra , -2 (SOD962-2) [1] The marking bar indicates the cathode. 6. Ordering information Table 3. Ordering , ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 7. Marking Table 4 , 0.6 x 0.3 x 0.3 mm SOD962-2 L 1 2 b e1 A A1 E D (1) 0 0.5 mm , marking bar indicates the cathode. Outline version sod962-2_po References IEC JEDEC JEITA NXP Semiconductors
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PMEG3005ESF
Abstract: projection sod962_po Issue date 10-11-03 10-11-11 Fig 9. Package outline PESD5V0V1BCSF (SOD962 , land plus solder paste solder paste deposit solder resist Dimensions in mm sod962_fr Reflow , capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD962 leadless ultra small , Description leadless ultra small package; 2 terminals; body 0.6 0.3 0.3 mm Version SOD962 Type number 4 , small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962 L 1 2 b e1 A A1 E D NXP Semiconductors
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Abstract: marking bar indicates the cathode. Outline version sod962_po References IEC JEDEC JEITA , Dimensions in mm sod962_fr Reflow soldering is the required soldering method. Fig 12. Required , bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD962 leadless ultra small Surface-Mounted , '´ 0.3 mm PESD5V0S1BSF - Description SOD962 4. Marking Table 4. Marking codes Type , SOD962 L 1 2 b e1 A A1 E D (2) 0 0.5 mm scale Dimensions Unit A NXP Semiconductors
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Abstract: including coating foil thickness. 2. The marking bar indicates the cathode. Outline version sod962_po , paste deposit solder resist Dimensions in mm sod962_fr Reflow soldering is the required , bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD962 leadless ultra small Surface-Mounted , small package; 2 terminals; body 0.6 0.3 0.3 mm PESD5V0S1BSF - Description SOD962 4 , package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962 L 1 2 b e1 A A1 E D (2 NXP Semiconductors
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PESD5V0S1BSF
Abstract: SOD962-2 www.nxp.com sod962-2_po References © 2010 NXP B.V. All rights reserved , Package outline Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 L 1 2 b e1 A A1 E D (1) 0 0.5 mm scale Dimensions (mm are the original dimensions) Unit mm A max 0.32 nom min 0.28 A1 0.03 b D E e1 0.25 0.325 0.625 0.23 0.275 0.575 0.4 L 0.15 0.13 Note 1. The marking bar indicates the cathode NXP Semiconductors
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Abstract: Reflow soldering footprint Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962-2 0.85 0.4 0.4 R0.025 (8×) 0.22 (2×) 0.12 (2×) 0.2 (2×) solder land solder land plus solder paste solder paste deposit solder resist Dimensions in mm www.nxp.com © 2010 NXP B.V. sod962-2_fr All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented NXP Semiconductors
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Abstract: marking bar indicates the cathode. Outline version sod962_po References IEC JEDEC JEITA , resist Dimensions in mm sod962_fr Reflow soldering is the required soldering method. Fig 12 , capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD962 leadless ultra small , PESD5V0V1BSF - Description SOD962 4. Marking Table 4. Marking codes Type number PESD5V0V1BSF , SOD962 L 1 2 b e1 A A1 E D (2) 0 0.5 mm scale Dimensions Unit A NXP Semiconductors
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Abstract: and other transients. The device is encapsulated in a leadless super small DSN0603-2 (SOD962 , DSN0603-2 Description leadless ultra small package; 2 terminals; body 0.6 0.3 0.3 mm Version SOD962 Type , LQ PP Fig 7. Package outline DSN0603-2 (SOD962) 9. Packing information Table 9. Packing , and reel (SOD962) For further information and the availability of packing methods, see Section 13 , for reflow soldering of leadless ultra small package; 2 terminals SOD962 0.85 0.4 R0.025 (8 NXP Semiconductors
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SMD MARKING CODE QV
Abstract: ElectroStatic Discharge (ESD) protection diode in a DSN0603-2 (SOD962) leadless ultra small Surface-Mounted , '´ 0.3 ï'´ 0.3 mm SOD962 4. Marking Table 4. Marking codes Type number Marking code , DSN0603-2 (SOD962) 9. Packing information Table 9. Packing methods The indicated -xxx are the last , and reel (SOD962) -315 For further information and the availability of packing methods, see , reflow soldering of leadless ultra small package; 2 terminals SOD962 0.85 0.4 0.4 R0.025 (8Ã NXP Semiconductors
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Abstract: encapsulated in a leadless super small DSN0603-2 (SOD962) Surface-Mounted Device (SMD) package. 1.2 Features , terminals; body 0.6 0.3 0.3 mm Version SOD962 Type number 4. Marking Table 4. Marking codes Marking , 10. Package outline DSN0603-2 (SOD962) 9. Packing information Table 9. Packing methods The , ] Package Description Packing quantity 9000 -315 DSN0603-2 2 mm pitch, 8 mm tape and reel (SOD962 , of leadless ultra small package; 2 terminals SOD962 0.85 0.4 R0.025 (8×) 0.4 0.22 (2 NXP Semiconductors
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