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SOD962 Datasheet

Part Manufacturer Description PDF Type Ordering
SOD962 NXP Semiconductors Footprint for reflow soldering SOD962
ri

1 pages,
280.22 Kb

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SOD962 NXP Semiconductors Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm
ri

1 pages,
197.37 Kb

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SOD962 NXP Semiconductors AN11046 - DSN0603-2 (SOD962) soldering requirements
ri

11 pages,
766.61 Kb

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SOD962-2 NXP Semiconductors sod962_fr
ri

1 pages,
285.37 Kb

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SOD962-2 NXP Semiconductors Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm
ri

1 pages,
304.02 Kb

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SOD962

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: indicates the cathode. Outline version SOD962 References IEC JEDEC JEITA European projection sod962_po , AN11046 AN11046 DSN0603-2 DSN0603-2 (SOD962) soldering requirements Rev. 1 - 1 June 2012 Application note Document information Info Keywords Content DSN0603-2 DSN0603-2 (SOD962), 0201 package size, reflow soldering, surface , ultra small DSN0603-2 DSN0603-2 (SOD962) 0201 size packages. This technical report provides recommendations for , NXP Semiconductors AN11046 AN11046 DSN0603-2 DSN0603-2 (SOD962) soldering requirements Revision history Rev 1 ... NXP Semiconductors
Original
datasheet

11 pages,
766.62 Kb

WLCSP stencil design senju solder bar NC257 M705-GRN360-M-Z M705-GRN360 M705-GRN360-MZ AN11046 DSN0603-2 TEXT
datasheet frame
Abstract: barrier rectifier with an integrated guard ring for stress protection in a DSN0603-2 DSN0603-2 (SOD962-2) leadless , top view DSN0603-2 DSN0603-2 (SOD962-2) [1] The marking bar indicates the cathode. 6. Ordering , Version DSN0603-2 DSN0603-2 Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 , package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 L 1 2 b e1 A A1 E D , 0.15 0.13 Note 1. The marking bar indicates the cathode. Outline version sod962-2_po ... NXP Semiconductors
Original
datasheet

15 pages,
189.69 Kb

PMEG4002AESF TEXT
datasheet frame
Abstract: barrier rectifier with an integrated guard ring for stress protection in a DSN0603-2 DSN0603-2 (SOD962-2) leadless , top view DSN0603-2 DSN0603-2 (SOD962-2) [1] The marking bar indicates the cathode. 6. Ordering , Version DSN0603-2 DSN0603-2 Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 , package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 L 1 2 b e1 A A1 E D , 0.15 0.13 Note 1. The marking bar indicates the cathode. Outline version sod962-2_po ... NXP Semiconductors
Original
datasheet

15 pages,
188.72 Kb

PMEG3002AESF TEXT
datasheet frame
Abstract: including coating foil thickness. 2. The marking bar indicates the cathode. Outline version sod962_po , paste deposit solder resist Dimensions in mm sod962_fr Reflow soldering is the required , bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD962 leadless ultra small Surface-Mounted , small package; 2 terminals; body 0.6 × 0.3 × 0.3 mm PESD5V0L1BSF - Description SOD962 4 , package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962 L 1 2 b e1 A A1 E D (2 ... NXP Semiconductors
Original
datasheet

13 pages,
140.68 Kb

TEXT
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Abstract: Dimensions in mm sod962_fr Fig 9. Reflow soldering footprint DSN0603-2 DSN0603-2 (SOD962) PESD5V0F1BSF All , bidirectional ElectroStatic Discharge (ESD) protection diode in a DSN0603-2 DSN0603-2 (SOD962) leadless ultra small , . Ordering information Package Name PESD5V0F1BSF Description Version SOD962 DSN0603-2 DSN0603-2 leadless ultra small , outline 'LPHQVLRQV LQ PP Fig 8. Package outline DSN0603-2 DSN0603-2 (SOD962 , -315 DSN0603-2 DSN0603-2 2 mm pitch, 8 mm tape and reel (SOD962) For further information and the ... NXP Semiconductors
Original
datasheet

12 pages,
352.95 Kb

TEXT
datasheet frame
Abstract: barrier rectifier with an integrated guard ring for stress protection in a DSN0603-2 DSN0603-2 (SOD962-2) leadless , top view DSN0603-2 DSN0603-2 (SOD962-2) [1] The marking bar indicates the cathode. 6. Ordering , Version DSN0603-2 DSN0603-2 Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 , package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 L 1 2 b e1 A A1 E D , 0.15 0.13 Note 1. The marking bar indicates the cathode. Outline version sod962-2_po ... NXP Semiconductors
Original
datasheet

15 pages,
187.1 Kb

PMEG3002ESF TEXT
datasheet frame
Abstract: rectifier with an integrated guard ring for stress protection in a DSN0603-2 DSN0603-2 (SOD962-2) leadless ultra , -2 (SOD962-2) [1] The marking bar indicates the cathode. 6. Ordering information Table 3. Ordering , ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 7. Marking Table 4 , SOD962-2 L 1 2 b e1 A A1 E D (1) 0 0.5 mm scale Dimensions (mm are , cathode. Outline version sod962-2_po References IEC JEDEC JEITA European projection ... NXP Semiconductors
Original
datasheet

16 pages,
188.96 Kb

PMEG2005AESF TEXT
datasheet frame
Abstract: rectifier with an integrated guard ring for stress protection in a DSN0603-2 DSN0603-2 (SOD962-2) leadless ultra , -2 (SOD962-2) [1] The marking bar indicates the cathode. 6. Ordering information Table 3. Ordering , ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 7. Marking Table 4 , 0.6 x 0.3 x 0.3 mm SOD962-2 L 1 2 b e1 A A1 E D (1) 0 0.5 mm , marking bar indicates the cathode. Outline version sod962-2_po References IEC JEDEC JEITA ... NXP Semiconductors
Original
datasheet

16 pages,
189.35 Kb

PMEG2005ESF TEXT
datasheet frame
Abstract: version sod962_po References IEC JEDEC JEITA Issue date 10-11-03 10-11-11 SOD962 , sod962_fr Reflow soldering is the required soldering method. Fig 10. Required reflow soldering , capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD962 leadless ultra small , small package; 2 terminals; body 0.6  0.3  0.3 mm SOD962 4. Marking Table 4. Marking , small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962 L 1 2 b e1 A A1 E ... NXP Semiconductors
Original
datasheet

13 pages,
210.31 Kb

TEXT
datasheet frame
Abstract: Package outline Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962 L 1 2 b e1 A A1 E D (2) 0 Dimensions Unit mm A(1) A1 b D E e1 L 0.15 0.13 scale 0.5 mm max 0.32 0.0076 0.25 0.325 0.625 nom 0.4 0.23 0.275 0.575 min 0.28 Note 1. Dimension A is including coating foil thickness. 2. The marking bar indicates the cathode. Outline version SOD962 References IEC JEDEC JEITA European projection sod962_po Issue date 10-11-03 10-11-11 ... NXP Semiconductors
Original
datasheet

1 pages,
197.32 Kb

SOD962 TEXT
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