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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Package outline Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962 L 1 2 b e1 A A1 E D (2) 0 Dimensions Unit mm A(1) A1 b D E e1 L 0.15 0.13 scale 0.5 mm max 0.32 0.0076 0.25 0.325 0.625 nom 0.4 0.23 0.275 0.575 min 0.28 Note 1. Dimension A is including coating foil thickness. 2. The marking bar indicates the cathode. Outline version SOD962 References IEC JEDEC JEITA European projection sod962_po Issue date 10-11-03 10-11-11 ... | Original |
1 pages, |
SOD962 datasheet abstract |
| Abstract: indicates the cathode. Outline version SOD962 References IEC JEDEC JEITA European projection sod962_po , AN11046 AN11046 DSN0603-2 DSN0603-2 (SOD962) soldering requirements Rev. 1 - 1 June 2012 Application note Document information Info Keywords Content DSN0603-2 DSN0603-2 (SOD962), 0201 package size, reflow soldering, surface , ultra small DSN0603-2 DSN0603-2 (SOD962) 0201 size packages. This technical report provides recommendations for , NXP Semiconductors AN11046 AN11046 DSN0603-2 DSN0603-2 (SOD962) soldering requirements Revision history Rev 1 ... | Original |
11 pages, |
senju solder bar NC257 M705-GRN360-MZ AN11046 DSN0603-2 AN11046 abstract |
| Abstract: Reflow soldering footprint Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962 0.85 0.4 R0.025 (8Ã-) 0.4 0.22 (2Ã-) 0.12 (2Ã-) 0.2 (2Ã-) solder land solder paste deposit solder land plus solder paste solder resist Dimensions in mm sod962_fr www.nxp.com © 2010 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not form part of ... | Original |
1 pages, |
datasheet abstract |
| Abstract: deposit solder resist Dimensions in mm sod962_fr Fig 8. Reflow soldering footprint DSN0603-2 DSN0603-2 , and other transients. The device is encapsulated in a leadless super small DSN0603-2 DSN0603-2 (SOD962 , DSN0603-2 DSN0603-2 Description leadless ultra small package; 2 terminals; body 0.6 0.3 0.3 mm Version SOD962 Type , 'LPHQVLRQV LQ PP Fig 7. Package outline DSN0603-2 DSN0603-2 (SOD962) 9. Packing information Table 9. Packing , and reel (SOD962) For further information and the availability of packing methods, see Section 13. ... | Original |
12 pages, |
SMD MARKING CODE QV datasheet abstract |
| Abstract: resist Dimensions in mm sod962_fr Fig 11. Reflow soldering footprint DSN0603-2 DSN0603-2 (SOD962 , encapsulated in a leadless super small DSN0603-2 DSN0603-2 (SOD962) Surface-Mounted Device (SMD) package. 1.2 Features , terminals; body 0.6 0.3 0.3 mm Version SOD962 Type number 4. Marking Table 4. Marking codes Marking , 10. Package outline DSN0603-2 DSN0603-2 (SOD962) 9. Packing information Table 9. Packing methods The , ] Package Description Packing quantity 9000 -315 DSN0603-2 DSN0603-2 2 mm pitch, 8 mm tape and reel (SOD962 ... | Original |
13 pages, |
SMD MARKING CODE QV datasheet abstract |
| Abstract: solder resist Dimensions in mm sod962_fr Fig 11. Reflow soldering footprint DSN0603-2 DSN0603-2 (SOD962 , transients. The device is encapsulated in a leadless super small DSN0603-2 DSN0603-2 (SOD962) Surface-Mounted Device , SOD962 Type number 4. Marking Table 4. Marking codes Marking code 2 Type number PESD5V0L1USF , 'LPHQVLRQV LQ PP Fig 10. Package outline DSN0603-2 DSN0603-2 (SOD962) 9. Packing information Table 9. Packing , and reel (SOD962) For further information and the availability of packing methods, see Section 13. ... | Original |
13 pages, |
SMD MARKING CODE QV datasheet abstract |
| Abstract: solder paste deposit solder resist Dimensions in mm sod962_fr Fig 8. Reflow soldering footprint , ElectroStatic Discharge (ESD) protection diode in a DSN0603-2 DSN0603-2 (SOD962) leadless ultra small Surface-Mounted , Ordering information Package Name PESD5V0V1BDSF Description Version SOD962 DSN0603-2 DSN0603-2 leadless ultra small , 'LPHQVLRQV LQ PP Fig 7. Package outline DSN0603-2 DSN0603-2 (SOD962) 9. Packing information Table 9. Packing , and reel (SOD962) For further information and the availability of packing methods, see Section 13. ... | Original |
12 pages, |
datasheet abstract |
| Abstract: Our extensive Discrete Flat No-leads portfolio Ultra small >> >> Medium power 2 Pins The first DFN packages with solderable side pads DSN0603-2 DSN0603-2* (SOD962) 0.6 x 0.3 x 0.3 DFN1006D-2 DFN1006D-2 (SOD882D) 1.0 x 0.6 x 0.37 DFN1006-2 DFN1006-2 (SOD882) 1.0 x 0.6 x 0.5 DFN1608D-2 DFN1608D-2 (SOD1608) 1.6 x 0.8 x 0.37 3-5 Pins Tin-plated side pad DFN1006B-3 DFN1006B-3 (SOT883B) 1.0 x 0.6 x 0.37 DFN1006-3 DFN1006-3 (SOT883) 1.0 x 0.6 x 0.5 DFN1010C-4 DFN1010C-4 (SOT1194) 1.0 x 1.0 x 0.55 DFN2020-3 DFN2020-3 (SOT1061) 2.0 x 2.0 x ... | Original |
1 pages, |
SOT1061 DFN2510 DFN1006B-3 SOD962 datasheet abstract |
| Abstract: including coating foil thickness. 2. The marking bar indicates the cathode. Outline version sod962_po , solder paste deposit solder resist Dimensions in mm sod962_fr Reflow soldering is the required , bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD962 leadless ultra small Surface-Mounted , small package; 2 terminals; body 0.6 Ã- 0.3 Ã- 0.3 mm PESD5V0L1BSF - Description SOD962 4. , package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962 L 1 2 b e1 A A1 E D (2 ... | Original |
13 pages, |
datasheet abstract |
| Abstract: version sod962_po References IEC JEDEC JEITA European projection Issue date 10-11-03 , solder paste solder paste deposit solder resist Dimensions in mm sod962_fr Reflow soldering , capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD962 leadless ultra small , Description SOD962 4. Marking Table 4. Marking codes Type number Marking code PESD5V0V1BSF , small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962 L 1 2 b e1 A A1 E ... | Original |
13 pages, |
datasheet abstract |
| Abstract: capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD962 leadless ultra small , Description leadless ultra small package; 2 terminals; body 0.6 0.3 0.3 mm Version SOD962 Type number 4. , small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962 L 1 2 b e1 A A1 E D , thickness. 2. The marking bar indicates the cathode. Outline version SOD962 References IEC JEDEC JEITA , (SOD962) All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All ... | Original |
13 pages, |
datasheet abstract |
| Abstract: Our extensive package range provides maximum flexibility Ultra small Very small Small Medium power 2 Pins SOD962 (DSN0603-2 DSN0603-2) 0.6 x 0.3 x 0.3 WLCSP2 0.7 x 0.52 x 0.4 SOD882D (DFN1006D-2 DFN1006D-2) 1.0 x 0.6 x 0.37 SOD882 (DFN1006-2 DFN1006-2) 1.0 x 0.6 x 0.5 SOD523 1.2 x 0.8 x 0.6 SOD1608 (DFN1608D-2 DFN1608D-2) 1.6 x 0.8 x 0.37 SOD323 1.7 x 1.25 x 0.95 SOD323F 1.7 x 1.25 x 0.7 SOD123F 2.6 x 1.6 x 1.1 SOD123W 2.6 x 1.7 x 1.0 SOD128 3.8 x 2.6 x 1.0 3 Pins SOT883B (DFN1006B-3 DFN1006B-3) 1.0 ... | Original |
1 pages, |
sod962 SOD123W datasheet abstract |
| Abstract: bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD962 leadless ultra small Surface-Mounted , SOD962 4. Marking Table 4. Marking codes Type number Marking code PESD5V0S1BSF S 5. , package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962 L 1 2 b e1 A A1 E D (2 , References IEC JEDEC JEITA European projection Issue date 10-11-03 10-11-11 SOD962 Fig 11. Package outline PESD5V0S1BSF (SOD962) PESD5V0S1BSF Product data sheet All information ... | Original |
13 pages, |
PESD5V0S1BSF datasheet abstract |
| Abstract: capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD962 leadless ultra small , PESD5V0V1BSF - Description SOD962 4. Marking Table 4. Marking codes Type number PESD5V0V1BSF , small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962 L 1 2 b e1 A A1 E , 10-11-11 SOD962 Fig 11. Package outline PESD5V0V1BSF (SOD962) PESD5V0V1BSF Preliminary data sheet , Description Packing quantity 9000 PESD5V0V1BSF [1] SOD962 2 mm pitch, 8 mm tape and reel -315 ... | Original |
13 pages, |
sod962 datasheet abstract |