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LTC3854IMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC3854IMSE#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC3854EMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC3854IDDB#TRMPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC3854IDDB#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC3854EDDB#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy

SO16 footprint

Catalog Datasheet MFG & Type PDF Document Tags

SD card socket, footprint to PCB

Abstract: SD card CARD PCB FOOTPRINT MBED module. Through hole, Ethernet socket footprint for use with Ethernet connectors with built in magnetic. Surface mount SD Card connector footprint. Surface mount miniUSB footprint. Single in line row of 12 x 0.1 inch through-hole footprint for use with Spark Fun LCD modules. 3 x SO8 footprints. 2 x TSSOP8 footprints. 2 x SOT23-3 footprints. 1 x SOT23-6 footprint. 2 x SOT363-6 footprints. 1 x SOT223 footprint. 1 x SO16 footprint. 1 x wide SO16 footprint. 1 x TSSOP28 footprint. 1 x wide TSSOP28
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SD card socket, footprint to PCB SD card CARD PCB FOOTPRINT SO16 footprint FOOTPRINTS CONNECTOR 2 PIN so8 wide socket SD card footprint PCB

P603

Abstract: cpu 8082 -3 footprints. 2 x SOT363-6 footprints. 1 x SOT223 footprint. 1 x SOT26-6 footprint. 1 x TO252 footprint. 3 x SO8 footprints. 2 x TSSOP8 footprints. 1 x TSSOP28 footprint. 1 x wide TSSOP28 footprint. 1 x SO16 footprint. 1 x wide SO16 footprint. 20 x 19 through plated holes on a general purpose on 0.1 , to a common 0.1 inch pitch array of through-hole pads. This means an SO8 footprint for example has on the reverse a TSSOP8 footprint, which means the user has the option of either placing an SO8
RS Components
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P603 cpu 8082 SOT363-6 410101 82 sot363-6 390201 7310101PAP 0410101PAP 9310101PAP 0101PAP 60N60363TOSAP 50N60363TOSAP

STM8S105C6T6

Abstract: LD1117-3V3 ) STM8S105C6T6 module STM8S105C6T6 Touch sensing button (TS1) Wrapping area SO16 footprint Doc ID
STMicroelectronics
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UM0817 LD1117-3V3 MB867 stm8s105 STM8S105C6 STM8S-DISCOVERY STM8S105

LD1117-3V3

Abstract: stm8s-discovery Touch sensing button (TS1) Wrapping area SO16 footprint Doc ID 16361 Rev 3 5/18 Hardware
STMicroelectronics
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AN2927 stm32f103c8t6 s1ck mb867 a LD1117_3V3 STM8S105C

STM8S105C6T6

Abstract: STM8S-DISCOVERY ) STM8S105C6T6 module STM8S105C6T6 Touch sensing button (TS1) Wrapping area SO16 footprint Doc ID
STMicroelectronics
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adc example sTM8s stm8s family 3v3 regulator STMicroelectronics UM0627 RN0011 STM8 CPU programming manual

harddisk motor driver

Abstract: CON16A connect the CN5 and CN6 of EVAL-STR910, and a wrap area with 2.54 mm pitch through-hole with one SO16 footprint. Figure 1. STEVAL-PCC006V1, HDD bridge extension board AM01397v1 August 2009 Doc ID
STMicroelectronics
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ARM966E-S LQFP128 harddisk motor driver CON16A ATX SMPS DC ATX SMPS schematic flash disk Harddisk motor UM0592 STEVALPCC006V1 STR912FAW44X6 AM01397

passive rfid tag circuit diagram

Abstract: STM8S105C6T6 RP1 RP2 LD1 SO16 footprint J1 HE10 I2C bus GPIO's STM8S105C6T6 5V STLINK , couplers Contactless coupler compliant with shortrange ISO14443 type-B standard SO16 13.56 MHz
STMicroelectronics
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AN3255 UM0834 CRX14 passive rfid tag circuit diagram how to design 13.56 MHz RFID tag smd diode code B4 ST J1 HE10 RFID tag i2c

ST7FLITE05

Abstract: ST7FLITE09 SO16 (150") device adapter footprint constraint . 60 , If you are using the SO16 (150") package, your SO16 footprint must follow constraints described in Section B.4: SO16 (150") device adapter footprint constraint on page 60. ST7MDT00-EMU2B Emulator User , analyzer probe cable. 6 A SO16 (150") device adapter (ref.: DB489). See Section B.4: SO16 (150") device adapter footprint constraint on page 60 for additional information. 7 One generic emulation
STMicroelectronics
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ST7FLITE05 ST7FLITE09 DOC-ST7MDT00-EMU2B 89/336/EEC EN55022

SO16 footprint

Abstract: for the SO-16 package assumes the use of the recommended footprint on a glass epoxy printed circuit , 751B-05, STYLE 4 SO-16 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 ELECTRICAL CHARACTERISTICS (TA = 25 , ns ns http://onsemi.com 1107 MMPQ3467 INFORMATION FOR USING THE SO-16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to
ON Semiconductor
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MMPQ3467/D

SO16 footprint

Abstract: for the SO-16 package assumes the use of the recommended footprint on a glass epoxy printed circuit , 16 1 mAdc CASE 751B-05, STYLE 4 SO-16 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 ELECTRICAL , Publication Order Number: MMPQ6700/D MMPQ6700 INFORMATION FOR USING THE SO-16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to
ON Semiconductor
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SO16 footprint

Abstract: 10 9 Unit Vdc Vdc Vdc mAdc 2 3 4 5 6 7 8 1 SO-16 CASE 751B STYLE 4 MARKING DIAGRAM , Week ORDERING INFORMATION Device MMPQ3904 Package SO-16 Shipping 48 Units/Rail Preferred devices , ://onsemi.com 1110 MMPQ3904 INFORMATION FOR USING THE SO-16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder
ON Semiconductor
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MMPQ3904/D
Abstract: 1.0 watt The 125°C/W for the SO-16 package assumes the use of the recommended footprint on a glass , Unit Vdc Vdc Vdc mAdc 2 3 4 5 6 7 8 1 SO-16 CASE 751B STYLE 4 MARKING DIAGRAM MMPQ3906 , ORDERING INFORMATION Device MMPQ3906 Package SO-16 Shipping 48 Units/Rail Preferred devices are , - 43 155 - - ns ns http://onsemi.com 1113 MMPQ3906 INFORMATION FOR USING THE SO-16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout ON Semiconductor
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MMPQ3906/D

wave footprint so14

Abstract: MLC745 SO & SOJ FOOTPRINT (WAFE SOLDERING) Philips Semiconductors enlarged solder land handbook, full pagewidth solder lands C solder resist occupied area 0.3 1.20 B A F board direction 0.60 G 1.27(N-2)x) MLC745 Wave soldering PACKAGE NAME SO8 SO8 SO14 SO16 SO16 SO16 SO16 SO20 , -1 SOT163-1 SOT137-1 SOT136-1 SOT287-1 SOT449-1 FOOTPRINT DIMENSIONS (mm) N A 8 8 14 16 16 16 16 20 24 28 32 , footprint PDF: 2001 Feb 14 Not suitable for wave soldering. Philips Semiconductors
Philips Semiconductors
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SOJ40 wave footprint so14 SOT163-1 SOT136-1 SOT109-1 SOT109-2
Abstract: INFORMATION FOR USING THE SO-16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the , CASE 751B-05, STYLE 4 SO-16 1 2 3 4 5 6 7 16 15 14 13 12 11 10 9 ELECTRICAL CHARACTERISTICS , SO-16 SO-16 POWER DISSIPATION The power dissipation of the SO-16 is a function of the pad size , temperature, TA. Using the values provided on the data sheet for the SO-16 package, PD can be calculated as ON Semiconductor
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MMPQ2369 MMPQ2369/D

MMPQ2222A

Abstract: ­55 to +150 °C SO­16 CASE 751B STYLE 4 MARKING DIAGRAM MMPQ2222A AWLYWW MMPQ2222A = , INFORMATION Device Package Shipping MMPQ2222A SO­16 48 Units/Rail Preferred devices are , %. http://onsemi.com 2 MMPQ2222A INFORMATION FOR USING THE SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure
ON Semiconductor
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MMPQ2222A/D

MMPQ3906

Abstract: INFORMATION FOR USING THE SO-16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the , °C/W = 1.0 watt The 125°C/W for the SO-16 package assumes the use of the recommended footprint , mW/°C 16 1 Four Transistors Equal Power SO-16 CASE 751B STYLE 4 Power Dissipation @ , Device MMPQ3906 Package Shipping SO-16 48 Units/Rail Preferred devices are recommended
ON Semiconductor
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MMPQ2222A

Abstract: SO­16 CASE 751B STYLE 4 MARKING DIAGRAM MMPQ2222A AWLYWW MMPQ2222A = Specific Device Code , Package Shipping MMPQ2222A SO­16 48 Units/Rail Preferred devices are recommended choices , %. http://onsemi.com 2 MMPQ2222A INFORMATION FOR USING THE SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure
ON Semiconductor
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MMPQ3467

Abstract: °C/W = 1.2 watts The 104°C/W for the SO­16 package assumes the use of the recommended footprint , 11 7 10 8 Motorola Preferred Device 9 16 1 CASE 751B­05, STYLE 4 SO­16 , Small­Signal Transistors, FETs and Diodes Device Data MMPQ3467 INFORMATION FOR USING THE SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be
Motorola
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Abstract: MMPQ2222A INFORMATION FOR USING THE SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR , 1.0 watts The 125°C/W for the SO­16 package assumes the use of the recommended footprint on a glass , Unit Vdc Vdc Vdc mAdc CASE 751B­05, STYLE 4 SO­16 ELECTRICAL CHARACTERISTICS (TA = 25°C unless , footprint for the semiconductor packages must be the correct size to insure proper solder connection , 1.270 inches mm SO­16 SO­16 POWER DISSIPATION The power dissipation of the SO­16 is a function of Motorola
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MMPQ2222/D MMPQ2222

SO16 footprint

Abstract: MMPQ3906 SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor , 156°C/W for the SO­16 package assumes the use of the recommended footprint on a glass epoxy printed , CASE 751B­05, STYLE 4 SO­16 Four Transistors Equal Power Power Dissipation @ TA = 25°C Derate , reflow process. 0.060 1.52 0.275 7.0 0.155 4.0 0.024 0.6 0.050 1.270 inches mm SO­16
ON Semiconductor
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