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Part : TIP758SO560 Supplier : Conexant Systems Manufacturer : Rochester Electronics Stock : 3 Best Price : - Price Each : -
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SO-56

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: 46 GND 1Y 8 12 45 1A 8 1Y 9 13 14 2Y 1 15 SO56-1 44 SO56-2 43 SO56-3 , Clara, CA 95054 Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) ­ 40°C to +85°C for SALES: 800-345-7015 or 408-727-6116 Integrated Device Technology
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IDT74ALVCH162827 ALVCH162827 20-BIT MIL-STD-883
Abstract: Output and I/O terminals. 3. Output and I/O terminals for FCT162XXX. SO56-1 SO56-2 SO56-3 , Package PV PA PF Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) 601AT 601CT 18-Bit Universal Bus Transceiver 162 Integrated Device Technology
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IDT74FCT162601AT/CT 18-BIT FCT162601T F/500 74FCT162601C
Abstract: SO56-1 14 SO56-2 15 SO56-3 42 A 11 41 B 11 A 12 17 40 B 12 18 39 GND , PF Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) 501A 18-bit Registered Transceiver with 3 State Outputs 162 Integrated Device Technology
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LVC162501A IDT74LVC162501A
Abstract: 13 44 B8 A9 14 B9 A10 15 SO56-1 43 SO56-2 SO56-3 42 A11 16 41 , Range X Package PV PA PF Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) 163501 163501A Non-Inverting 18 Integrated Device Technology
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IDT74FCT163501/A/C FCT163501/A/C
Abstract: 15 44 SO56-1 SO56-2 43 SO56-3 42 1A 9 1 Y 10 2A 1 2Y 2 16 41 2A 2 2Y 3 , Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) 827A 20-Bit Buffer 16 Double-D ensity with Resistors, ±24m A Blank No Integrated Device Technology
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IDT74LVC16827A LVC16827A
Abstract: 12 45 B7 A8 13 B8 A9 14 A 10 15 44 SO56-1 SO56-2 43 SO56-3 42 A , Package PV PA PF Shrink Sm all Outline Package (SO56-1) Thin Shrink Sm all Outline Package (SO56-2) Thin Very Sm all Outline Package (SO56-3) 601A 18-Bit Universal Bus Transceiver w ith 3 Integrated Device Technology
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IDT74LVCH16601A LVCH16601A
Abstract: 13 44 B8 A9 14 B9 A10 15 SO56-1 43 SO56-2 SO56-3 42 A11 16 41 , Type Range X Package PV PA PF Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) 163501 163501A Non-Inverting 18 Integrated Device Technology
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Abstract: 1 2 3 4 5 6 7 8 9 10 11 12 13 SO56-1 14 SO56-2 SO56-3 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56 , Package Temp. R ange PV PA PF 721A 162 H 74 Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) 20-Bit Flip-Flop w ith 3-State Outputs Integrated Device Technology
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IDT74LVCH162721A LVCH162721A
Abstract: ) 1A 1 1Y 2 Symbol VTERM(2) 1 OE 2 1 OE 1 SO56-1 SO56-2 SO56-3 E56-1 41 NOTES , -883, Class B PV PA PF E Shrink Sm all Outline Package (SO56-1) Thin Shrink Sm all O utline Package (SO56-2) Thin Very Sm all O utline Package (SO56-3) CERPACK (E56-1) 827AT 827BT 827CT 827ET Integrated Device Technology
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IDT54/74FCT16827AT/BT/CT/ET FCT16827AT/BT/CT/ET IL-STD-883
Abstract: Respect to GND TSTG Storage Temperature SI SO56-1 SO56-2 SO56-3 I OUT ­65 to +150 °C , Temp. Range Device Type X Package PV PA PF Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) 163214 12-Bit 3:1 Integrated Device Technology
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IDT74FST163214 FST163214 11b3 DIODE 10A1 10B3 11A1 11B3 12A1 12-BIT FST163
Abstract: GND 18 39 A 13 19 A 14 NEW16link SO56-1 SO56-2 SO56-3 NOTES: 1. Stresses , Type Package ALVC Temp. R ange PV PA PF Shrink Sm all Outline Package (SO56-1) Thin Shrink Sm all Outline Package (SO56-2) Thin Very Sm all Outline Package (SO56-3) 524 18 Integrated Device Technology
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IDT74ALVCH16524 CMOS 4551 ALVCH16524
Abstract: COUT Output Capacitance VOUT = 0V 3.5 8 SO56-1 SO56-2 SO56-3 Unit V NOTES: 1 , Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3 Integrated Device Technology
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IDT74FCT16V345 FCT16V345
Abstract: 9 48 1D5 1Q 6 10 47 1D 6 GND 11 46 GND 45 1D 7 1Q 8 SO56-1 12 SO56-2 13 SO56-3 44 1D 8 1Q 9 14 43 1D 9 NOTES: 1. Stresses greater than , Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Sm all Outline Package (SO56-3) 823A 18-Bit Bus Interface Register 162 Double-Density w ith R esistors, ±12m Integrated Device Technology
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IDT74LVCH162823A LVCH162823A
Abstract: 2 CE AB 26 31 2 CEBA 2 LEAB 27 30 2 LEBA 5v16-link SO56-1 SO56-2 SO56-3 , Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) CERPACK (E56-1) 543T 543AT 543CT 543ET 16-Bit Latched Transceiver 16 Integrated Device Technology
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543e IDT54/74FCT16543T/AT/CT/ET 16-BIT FCT16543T/AT/CT/ET
Abstract: Level Z = High Impedance ABSOLUTE MAXIMUM RATINGS(1) 14 SO56-1 43 SO56-2 15 SO56-3 42 A7 A6 , PA PF Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) 163344 163344A 163344C Address Line Driver 74 ­40°C Integrated Device Technology
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MAX 3249 IDT74FCT163344/A/C FCT163344/A/C
Abstract: 12 45 0A 8 GND 13 44 GND 43 V CC SO56-1 SO56-2 SO56-3 VCC 14 1A , Family Device Type Package PV PA PF Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) 233 16-Bit 2:1 Mux/Demux Integrated Device Technology
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IDT74FST163233 FST163233
Abstract: 27 30 2 LEBA SO56-1 SO56-2 SO56-3 E56-1 NOTES: 1. Stresses greater than those listed , -883, Class B PV PA PF Industrial Options Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Sm all Outline Package (SO56-3) E Military Options CERPACK (E56 Integrated Device Technology
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FCT16543T
Abstract: V CC A 16 A 17 GND A 18 OEBA LEBA 1 2 3 4 5 6 7 8 9 10 11 12 13 SO56-1 14 SO56-2 15 SO56-3 16 17 18 , . Range PV PA PF 501A R16 Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) 18-bit Registered Transceiver with 3 State Outputs Integrated Device Technology
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IDT74LVCR16501A LVCR16501A
Abstract: 13 1 Q 10 2Q 1 15 SO56-1 44 SO56-2 43 SO56-3 42 1D 9 14 DC Output Current ­ , Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) ­40°C to +85°C for SALES: 800-345-7015 or 408-727-6116 fax: 408-492-8674 Integrated Device Technology
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IDT74ALVCH162841 ALVCH162841
Abstract: 11 46 GND 1Y 8 12 45 1A 8 1Y 9 13 14 2Y 1 15 44 SO56-1 SO56-2 43 SO56-3 42 1A 9 1 Y 10 2A 1 2Y 2 16 41 2A 2 2Y 3 17 40 2A 3 GND , Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) 827A 20-Bit Buffer 16 Double-D ensity with Resistors, ±24m A Blank No Integrated Device Technology
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Abstract: GND 45 1D 7 1Q 8 SO56-1 12 SO56-2 13 SO56-3 44 1D 8 1Q 9 14 43 1D 9 , Device Type Package PV PA PF Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Sm all Outline Package (SO56-3) 823A 18-Bit Bus Interface Register Integrated Device Technology
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Abstract: 12 45 1B 6 1A 7 13 14 2A 1 15 44 SO56-1 SO56-2 43 SO56-3 42 1B 7 1A 8 , Package PV PA PF Shrink S m all Outline Pa ckage (SO56-1) Thin Shrink Sm all O utline Package (SO56-2) Thin Very Sm all Outline Package (SO56-3) 543A 16-Bit R egistered Transceiver w ith 3 Integrated Device Technology
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IDT74LVC16543A LVC16543A d1839
Abstract: 2A 2 SO56-1 SO56-2 SO56-3 E56-1 CAPACITANCE (TA = +25OC, f = 1.0MHz) Unit pF pF 5v16 , Shrink Sm all Outline Package (SO56-1) Thin Shrink Sm all Outline Package (SO56-2) Thin Very Sm all Outline Package (SO56-3) E M ilitary Options CERPACK (E56-1) 646T 646AT 646CT 16-Bit Bus Integrated Device Technology
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IDT54/74FCT162646T/AT/CT FCT162646T
Abstract: 8 1A 9 2A 1 2A 2 2A 3 GND 1B 7 1B 8 1B 9 2B 1 2B 2 2B 3 SO56-1 SO56-2 43 SO56-3 42 41 40 39 , Shrink Sm all Outline Package (SO56-1) Thin Shrink Sm all Outline Package (SO56-2) Thin Very Sm all Outline Package (SO56-3) 9-Bit, 4-Port Universal Bus Exchanger with 3-State Outputs Double-Density w ith Integrated Device Technology
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IDT74ALVCHR16409 ALVCHR16409 NEW16
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