NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Sn63/Pb37 ElectropureTM Solder Alloy Features: - High Purity - Reduces Drossing - Melting Temperature 183° C (361°F) - Exceeds IPC-J-STD-006 IPC-J-STD-006 Specifications Description: Sn63/Pb37 ElectropureTM is , soldering. Sn63/Pb37 is a eutectic alloy with a melting point of 183°C (361°F). Typical applications are wave soldering and plating where Sn63/Pb37 is primarily used as a coating for corrosion protection , , preforms, powder, solder paste, ingot, and anode form. Flux Compatibility: Sn63/Pb37 ElectropureTM is ... | Original |
1 pages, |
SN63 PB37 IPC-J-STD-006 SN63 IPC-J-STD-006 abstract |
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| Abstract: Liquidous Temp. (degrees C.) Recommended Platings for Heatsink/Baseplates SN63 SN96 80Au/20Sn , amount of RMA flux (MIL-F-14256 MIL-F-14256) to the areas to be soldered. 3. SN63 solder is generally recommended , device. (Aeroflex-KDI can supply pretinned devices, SN63 or SN96) Tabs: When attaching tabs to a device , board using SN63 (183 °C) Wire Bonding: Attach the device to the circuit board using solder as ... | Original |
2 pages, |
80Au SN96 mil-f-14256* rma SN63 "ultrasonic cleaner" MIL-F-14256 datasheet abstract |
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| Abstract: 190 220 o C FR4, Sn63/Pb37, 0.65mm www.meder.com 186 RM , o C FR4, Sn63/Pb37, 0.65mm www.meder.com g o 190 g RM , o C JEDECJESD22-A113A JEDECJESD22-A113A 190 220 o C FR4, Sn63/Pb37 , 1.5 190 FR4, Sn63/Pb37, 0.65mm www.meder.com 197 ... | Original |
15 pages, |
SN63 PB37 RM05-8A Sn63 RM05-4A-S-4/2RM05-2A2B-S-4/2 RM05-4A-S-4/2RM05-2A2B-S-4/2 abstract |
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| Abstract: 190 220 o C FR4, Sn63/Pb37, 0.65mm www.meder.com 186 RM , o C FR4, Sn63/Pb37, 0.65mm www.meder.com g o 190 g RM , o C JEDECJESD22-A113A JEDECJESD22-A113A 190 220 o C FR4, Sn63/Pb37 , 1.5 190 FR4, Sn63/Pb37, 0.65mm www.meder.com 197 ... | Original |
15 pages, |
SN63 PB37 Sn63 RM05-4A-S-4/2RM05-2A2B-S-4/2 RM05-4A-S-4/2RM05-2A2B-S-4/2 abstract |
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| Abstract: device on mounting surface and solder in place using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 type solder with a controlled temperature iron (210°C). Sales Desk USA ... | Original |
2 pages, |
RFP-300-50TD SN63 RFP-300-50TD abstract |
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| Abstract: device on mounting surface and solder in place using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 type solder with a controlled temperature iron (210°C). Sales Desk USA ... | Original |
2 pages, |
RFP-125-50TS Sn63 RFP-125-50TS abstract |
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| Abstract: Drill thermal vias through PCB and fill with solder, such as SN63 type. Dimension given in inches. , 2. Solder part in place using SN63 type solder with controlled temperature iron (700°F). 3. To ... | Original |
2 pages, |
D30AXXY4 SN63 D30AXXY4 abstract |
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| Abstract: solder in place using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 ... | Original |
2 pages, |
RFP-200-100RK SN63 indalloy 100 RFP-200-100RK abstract |
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| Abstract: mounting surface and solder in place using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 type solder with a controlled temperature iron (210°C). Sales Desk USA: Voice ... | Original |
2 pages, |
Sn63 RFP-150-100RCGN RFP-150-100RCGN abstract |
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| Abstract: SN63 type solder. CASE TEMPERATURE - °C 3. Solder leads in place using an SN63 type solder with ... | Original |
2 pages, |
SN63 RFP-40-100RPP RFP-40-100RPP abstract |
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| Abstract: SOT-89 PCB MOUNTING CONSIDERATIONS Hole diameter is limited by pcb thickness usually 2 x pcb thk. Hole density is limited by fab tolerance usually .01" SN63 Solder paste water clean Use .02" oversize solder templete .03"vias T = 72c .02"vias T = 75c Vds = 7.0v, IDS = .5amp EPA480C-SOT89 EPA480C-SOT89 SOT-89: R = 30 C/W A 105C temperature drops between tab and device junction. A maximum junction temperature of 150c is recommended. .012"vias T = 67c ... | Original |
1 pages, |
SN63 EPA480C-SOT89 a105 transistor a105 a105 transistor datasheet abstract |
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| Abstract: 0.039"�003" 0.030" 0.100" 0.65mm 0.240" 0.300" 2 0.054" 0.050" 0.015" 0.200" 0.134" 0.023" 0.274" 1 Bottom View Top View Side View 1 2 Substrate: 0.0315"�007" FR4/G10 FR4/G10 or equivalent high temp material. Solder Balls: SN63 PB37. Description: Package Convertor 8 position 0.050" pitch surface mount pads to 8 position 0.65mm pitch surface mountable foot with solder columns on the bottom of the substrate. Pin Mapping 1:1. PC-SO/SO8-F-01Drawing � 1999 ... | Original |
1 pages, |
FR4 substrate Sn63 SN63 PB37 datasheet abstract |
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| Abstract: 0.041" ±0.003" 0.060" 0.050" 0.050" Pin 1 0.670" 0.010" 0.5 mm 0.700" Ø 0.025" Typ. 2 0.700" 1 0.670" Top View Bottom View Side View 1 Substrate: 0.0315"±0.007" FR4/G10 FR4/G10 or equivalent high temp material. 2 Solder Balls: SN63 PB37. Description: Custom Adapter 100 position 0.5mm pitch surface mount pads to 100 position 0.5mm pitch surface mountable foot with solder columns on the bottom of the substrate. FX-QFE100SC-S-F-01 FX-QFE100SC-S-F-01 Drawing © 1997 IRONWOOD ... | Original |
1 pages, |
SN63 PB37 SN63 FX-QFE100SC-S-F-01 PAL 007 a FR4 substrate PAL 007 c pal 007 datasheet abstract |
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| Abstract: . 074 030 + . 006 - . 024 + . 018 - . 004 .300 MAX GLASS PIN #1 I DENT NOTE 3 006 ±.002 TYP NOTE 2 .013+.005 MAX TYP .010 ±.002 NOTES: UNLESS OTHERWISE SPECIFIED 1. LEAD FINISH: SOLDER DIPPED WITH Sn60 OR Sn63 SOLDER CONFORMING TO MIL - M-3851 M-3851 0 TO A MINIMUM THICKNESS OF 200 MICROINCHES. SOLDER MAY BE APPLIED OVER LEAD BASIS METAL OR Sn PLATE. 2. MAXIMUM LIMIT MAY BE INCREASED BY .003 INCHES AFTER LEAD FINISH APPLI ED. 3. LEAD 1 IDENTIFICATION SHALL BE: a) A NOTCH OR OTHER MARK WITHIN THIS AREA b) A TAB ON ... | OCR Scan |
1 pages, |
datasheet abstract |
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| Abstract: SPECIFICATION CONTROL DRAWING SOLDERSHIELD* Device SOLDERSLEEVE* Device Insulation Tubing MATERIALS 1. INSULATION SLEEVE: Heat -shrinkable, transparent clear, radiation cross-linked modified polyolefin. 2. SHIELD: Solder impregnated, flux coated, tin plated copper braid. SOLDER: TYPE Sn63 per ANSI-J-STD-006 ANSI-J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004 ANSI-J-STD-004. 3. INSULATION SLEEVE: Heat -shrinkable, transparent clear, radiation cross-linked modified polyvinylidene fluoride. 4. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 ... | Original |
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RPIP-699-00 raychem splice kit J-STD-004 Raychem splice raychem heat shrinkable sleeve ANSI-J-STD 004 ANSI-J-STD-004 ansi-j-std-006 ANSI-J-STD-006 ANSI-J-STD-006 abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| Soldering condition : Standard soldering conditions are as follows. a) Flow solder Pre-heating : 120+/-10°C, 60~120sec. Solder : Sn 63 solder Flux : Rosin flux Temperature : 250+/-10°C Time : 3+/-2sec. b) Reflow solder Reflow soldering should not be applied c) Soldering . Heat power : 45W max. Solder : Sn 63 solder Flux www.datasheetarchive.com/files/murata/products/data/a09x/pkgat02e.txt |
Murata | 08/05/1998 | 0.62 Kb | TXT | pkgat02e.txt |
| processes that are common for board assemblies using traditional Sn63/Pb37 (tin/lead) solder. As the AD260 AD260 AD260 AD260 www.datasheetarchive.com/files/analog-devices/gendesc/223.htm |
Analog Devices | 05/06/2003 | 1.92 Kb | HTM | 223.htm |
| ) wave solder processes that are common for board assemblies using traditional Sn63/Pb37 (tin www.datasheetarchive.com/files/analog-devices/gendesc/224.htm |
Analog Devices | 05/06/2003 | 2.02 Kb | HTM | 224.htm |
| Sn63/Pb37 (tin/lead) solder. As the AD260/AD261 AD260/AD261 AD260/AD261 AD260/AD261 is manufactured from an assembled board process www.datasheetarchive.com/files/analog-devices/doc/productdescriptions/232.html |
Analog Devices | 2.67 Kb | HTML | 232.html | |
| Sn63/Pb37 (tin/lead) solder. As the AD260/AD261 AD260/AD261 AD260/AD261 AD260/AD261 is manufactured from an assembled board process www.datasheetarchive.com/files/analog-devices/doc/productdescriptions/233.html |
Analog Devices | 2.67 Kb | HTML | 233.html | |
| parasitic inductances coming from the redistribution metal tracks to be minimized. The eutectic Sn63Pb37 provided through a product example in the figure 1 below. Bumps are in Sn63Pb37 alloy with an eutectic with the use of eutectic Sn63Pb37 solder paste with no clean flux. ST's recommendations for Flip www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7272.htm |
STMicroelectronics | 20/10/2000 | 18.62 Kb | HTM | 7272.htm |
| eutectic Sn63Pb37 bumps make this package compatible with standard reflow processes. The Bumps' dimension of 150mm. Flip-Chip CSPs are fully compatible with the use of eutectic Sn63Pb37 solder paste with dimensions of Flip-Chip CSPs are provided through a product example in the figure 1 below. Bumps are in Sn63Pb37 alloy with an eutectic melting point of 1835C 1835C 1835C 1835C. Die size and bumps count are adapted to the www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7272-v1.htm |
STMicroelectronics | 18/08/2000 | 18.26 Kb | HTM | 7272-v1.htm |
| % epoxy 15 % Sb 4 % SiO2 80 % Composition of SnPb37 Pb 37 % Sn 63 % General package www.datasheetarchive.com/files/philips/packages/sot534-1.html |
Philips | 15/04/2003 | 3.57 Kb | HTML | sot534-1.html |
| .) 159 mg Composition of SnPb37 Pb 37 % Sn 63 % Soldering Information www.datasheetarchive.com/files/philips/packages/sot536-1-v2.html |
Philips | 05/02/2002 | 20.62 Kb | HTML | sot536-1-v2.html |
| Pb37 Pb 37 % Sn 63 % Composition of partially brominated epoxy Br 1 % epoxy 15 % Sb 4 www.datasheetarchive.com/files/philips/packages/sot571-1-v3.html |
Philips | 16/06/2005 | 3.72 Kb | HTML | sot571-1-v3.html |