500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Top Results

Part Manufacturer Description Datasheet BUY
70-1002-0510 Kester SOLDER 500G JAR, SN63/PB37 visit Digikey Buy
SMD4300AX250T3 Chip Quik Inc SOLDER PASTE SN63/PB37 250G visit Digikey Buy
SMD291AX250T3 Chip Quik Inc SOLDER PASTE SN63/PB37 250G visit Digikey Buy
SMD291AX500T3 Chip Quik Inc SOLDER PASTE SN63/PB37 500G visit Digikey Buy
SMD2215-25000 Chip Quik Inc SOLDER SPHERES SN63/PB37 .030 D visit Digikey Buy
SMD291AX50T3 Chip Quik Inc SLDR PASTE NO-CLN SN63/PB37 50G visit Digikey Buy

Search Stock

Shift+Click on the column header for multi-column sorting 
Part
Manufacturer
Supplier
Stock
Best Price
Price Each
Ordering
Part : 62GB-16J10-06SN-63 Supplier : Amphenol Manufacturer : Avnet Stock : - Best Price : - Price Each : -
Part : CTSN631/12W Supplier : CamdenBoss Manufacturer : Newark element14 Stock : 62 Best Price : $1.89 Price Each : $2.38
Part : CTSN635/12W Supplier : CamdenBoss Manufacturer : Newark element14 Stock : 100 Best Price : $4.95 Price Each : $6.46
Part : CG5SN63TNSR-150-X6011 Supplier : SMC Manufacturer : Allied Electronics & Automation Stock : - Best Price : $416.4570 Price Each : $416.4570
Part : LSN-63 Supplier : Festo Manufacturer : Allied Electronics & Automation Stock : 5 Best Price : $78.80 Price Each : $82.95
Part : SN63PB37ROL0-.032 Supplier : - Manufacturer : Bisco Industries Stock : 75 Best Price : - Price Each : -
Part : SN63PB37 Supplier : - Manufacturer : Chip One Exchange Stock : 100 Best Price : - Price Each : -
Part : CTSN631/12W Supplier : CamdenBoss Manufacturer : Chip1Stop Stock : 196 Best Price : $2.3443 Price Each : $2.3443
Part : CTSN633/12W Supplier : CamdenBoss Manufacturer : Chip1Stop Stock : 200 Best Price : $2.8278 Price Each : $2.8278
Part : CTSN631/12W Supplier : CamdenBoss Manufacturer : element14 Asia-Pacific Stock : 75 Best Price : $1.63 Price Each : $2.6160
Part : CTSN633/12W Supplier : CamdenBoss Manufacturer : element14 Asia-Pacific Stock : 198 Best Price : $1.80 Price Each : $2.5120
Part : CTSN634/12W Supplier : CamdenBoss Manufacturer : element14 Asia-Pacific Stock : 137 Best Price : $2.32 Price Each : $3.2320
Part : CTSN635/12W Supplier : CamdenBoss Manufacturer : element14 Asia-Pacific Stock : 100 Best Price : $3.76 Price Each : $5.2560
Part : CTSN631/12W Supplier : CamdenBoss Manufacturer : Farnell element14 Stock : 84 Best Price : £1.19 Price Each : £2.67
Part : CTSN633/12W Supplier : CamdenBoss Manufacturer : Farnell element14 Stock : 241 Best Price : £1.05 Price Each : £3.59
Part : CTSN634/12W Supplier : CamdenBoss Manufacturer : Farnell element14 Stock : 143 Best Price : £1.44 Price Each : £4.45
Part : CTSN635/12W Supplier : CamdenBoss Manufacturer : Farnell element14 Stock : 102 Best Price : £3.02 Price Each : £6.81
Part : FLSTEHUE-(SN)-6,3X0,8(0,5-1,5) Supplier : MISC HE-G Manufacturer : Heilind Electronics - Europe Stock : 51 Best Price : €0.1303 Price Each : €0.1304
Part : FLSTEHUE-(SN)-6,3X0,8(4,0-6,0) Supplier : MISC HE-G Manufacturer : Heilind Electronics - Europe Stock : 90 Best Price : €0.2345 Price Each : €0.2345
Part : FLSTEHUE-(SN)6,3X0,8-(2,5-4,0) Supplier : MISC HE-G Manufacturer : Heilind Electronics - Europe Stock : 88 Best Price : €0.1562 Price Each : €0.1563
Part : SN63209AXT2%-.062-1 Supplier : Aimtec Manufacturer : Master Electronics Stock : 21 Best Price : $15.82 Price Each : $19.46
Part : SN6337NC210AX-.025 Supplier : Aimtec Manufacturer : Master Electronics Stock : 22 Best Price : - Price Each : -
Shipping cost not included. Currency conversions are estimated. 

SN63

Catalog Datasheet MFG & Type PDF Document Tags

SN95PB5

Abstract: Gold Gold Gold Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 100%Tin Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 Gold Sn63/Pb37 Sn63/Pb37 Sn63/Pb37 4211 4212 4214 4221 4222 4232 4302 4307 4379 4426 4445 4448 4470 4494 4501 Sn90/Pb10 Sn90/Pb10 Sn90/Pb10 Sn90/Pb10 Sn90/Pb10 Sn63/Pb37 Sn63/Pb37
API Delevan
Original
SN95PB5 S1008 1008HF S1210 P1330 P1812 S1812

HST X-Ref

Abstract: M83519 Sn63 Solder with ROL1 Flux NO Thermal Indicator SEIP GLENAIR Braid Description Solder , 640 CMA - 6" long 640 CMA - 6" long 640 CMA - 6" long 640 CMA - 6" long 640 CMA - 6" long Sn63 Solder with ROL1 Flux NO Thermal Indicator Sn63 Solder with ROL1 Flux NO Thermal Indicator Sn63 Solder with ROL1 Flux NO Thermal Indicator Sn63 Solder with ROL1 Flux NO Thermal Indicator Sn63
Glenair
Original
M83519/1-2 M83519/2-8 HST X-Ref M83519 S01-02-R M83519/1-1 M83519/1-3 M83519/1-4 M83519/1-5 M83519/2-1

SN63

Abstract: SN63 PB37 Sn63/Pb37 ElectropureTM Solder Alloy Features: - High Purity - Reduces Drossing - Melting Temperature 183° C (361°F) - Exceeds IPC-J-STD-006 Specifications Description: Sn63/Pb37 ElectropureTM is , soldering. Sn63/Pb37 is a eutectic alloy with a melting point of 183°C (361°F). Typical applications are wave soldering and plating where Sn63/Pb37 is primarily used as a coating for corrosion protection , , preforms, powder, solder paste, ingot, and anode form. Flux Compatibility: Sn63/Pb37 ElectropureTM is
-
Original
SN63 SN63 PB37 361F ingot ISO9001

MIL-F-14256

Abstract: SN63 Liquidous Temp. (degrees C.) Recommended Platings for Heatsink/Baseplates SN63 SN96 80Au/20Sn , amount of RMA flux (MIL-F-14256) to the areas to be soldered. 3. SN63 solder is generally recommended , device. (Aeroflex-KDI can supply pretinned devices, SN63 or SN96) Tabs: When attaching tabs to a , circuit board using SN63 (183 °C) Wire Bonding: Attach the device to the circuit board using solder as
Aeroflex
Original
SN96 mil-f-14256* rma 80Au

LFCSP

Abstract: TM0011 26. XI. 10k 51 9.6031 0.9828 Sn63/Pb37 10 1 7mm×7mm LFCSP = 9.6031 = 169739373 = 0.9828 18756 Sn63/Pb37 SnPb , 827 T50.0% 50 1634 Sn95.5/Ag4.0/Cu0.5 SnPb 27919 Sn63/Pb37 Sn 98384 67 Sn63/Pb37 SnPb 149652 103 Sn95.5/Ag4.0/Cu0.5 Sn 87494 60 Sn95.5/Ag4.0/Cu0.5 SnPb 146450 100 Sn63/Pb37 Sn 21502 59 Sn63/Pb37 SnPb 32706
Analog Devices
Original
AN-772 EM-2000-011 LFCSP TM0011 ipc-SM-782* LFCSP IPC-SM-782 21502 5mm MO220MO229 AN-617 EM-99-19 EM-99-03 EM-98-57

SMD-291AX

Abstract: 2.66E+10 PASS Recommended Profiles: Profile-A for Sn62 & Sn63 alloy Ramp Profile Profile-A , øó÷î ìpÝñ-»1/2±21/4·-·1/4»¿´º±®¬¸» Liquidus Temperature for Sn62 & Sn63 alloys , allow more time for solvent components of the Profile-B for Sn62 & Sn63 alloy Soak Profile , Sn63 alloys solder paste to outgas prior to reflow. Reflow Time: 30-60 S ec. Flux Activation
AMTECH
Original
SMD-291AX SMD291AX SMD291AX10 IPC-TM-650
Abstract: . Ramp Profile Profile-A for Sn62 & Sn63 alloy 250 Temp.(°C) 220 200 183 Topside temperature of board to be @ 220-230°C Liquidus Temperature for Sn62 & Sn63 alloys Reflow Time: 30-60 , Profile-B for Sn62 & Sn63 alloy 250 Temp.(°C) 220 200 183 Topside temperature of board to be @ 220-230°C Liquidus Temperature for Sn62 & Sn63 alloys Reflow Time: 30-60 Sec. Flux AMTECH
Original
SMD4300AX10

Sn63

Abstract: RM05-8A 190 220 o C FR4, Sn63/Pb37, 0.65mm www.meder.com 186 RM , o C FR4, Sn63/Pb37, 0.65mm www.meder.com g o 190 g RM , o C JEDECJESD22-A113A 190 220 o C FR4, Sn63/Pb37 , 1.5 190 FR4, Sn63/Pb37, 0.65mm www.meder.com 197 Meder Electronic
Meder Electronic
Original
RM05-8A MEDER rm05 bga1014 meder -b RM05-4A-S-4/2RM05-2A2B-S-4/2 RM05-4A-S-4/2

SN62 PB36 ag2

Abstract: SN62 PB36 ag2 kester Sn62/Pb36/Ag2,Sn63/Pb37 · Artikelnummer: 7087 · Ämnets användning / tillredningen Lödlegering · , : 07.11.2002 Handelsnamn: 256-; 276 Sn62/Pb36/Ag2,Sn63/Pb37 (Fortsättning från sida 1) · Efter förtäring , -; 276 Sn62/Pb36/Ag2,Sn63/Pb37 (Fortsättning från sida 2) · Personlig skyddsutrustning: · Allmänna , -; 276 Sn62/Pb36/Ag2,Sn63/Pb37 (Fortsättning från sida 3) · Farliga upplösningsprodukter: Inga , /Pb36/Ag2,Sn63/Pb37 (Fortsättning från sida 4) · Farosymbol och farobeteckning: Xn Hälsoskadlig
-
Original
SN62 PB36 ag2 SN62 PB36 ag2 kester SN63 PB36 gefstoffv PB36 SN62 MP 91/155/EEG D-82216
Abstract:   Solder Paste Water Washable with Lead and No_lead in Jars - 250g & 500g   Sn63/Pb37 250g jar, 25-45 microns   (T3), water washable 90% Sn63/Pb37 250g jar, 15-25 microns   SMD4300AX250T5     (T5 Chip Quik
Original
ANSI/J-STD-006 SMD4300AX250T3 SAC305 SMD4300SNL250T5 SMD4300SNL250T3
Abstract: Jars - 250g & 500g   Sn63/Pb37 250g jar, 25-45 microns (T3), No-Clean 90.25% Sn63/Pb37 500g jar Chip Quik
Original
SMD291AX500T3 SMD291AX250T3
Abstract: for a tin-lead soldering process is Sn63 (63%Sn, 37%Pb), which clearly is the industry standard for a number of reasons. Sn63 is a eutectic compound with a melting point (+183°C) high enough to , internal component materials are not damaged during proper solder refold. The one draw back of Sn63 , the solder joint. Pretinning the package leads with Sn63 solder paste with RMA flux reduces the gold M/A-COM
Original
J-STD-020

RFP-125-100RF

Abstract: Sn63 using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 type solder with
Anaren
Original
RFP-125-100RF MIL-E-5400

RFP-200-50TB

Abstract: SN63 mounting surface and solder in place using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 type solder with a controlled temperature iron (210°C). Sales Desk USA: Voice
Anaren
Original
RFP-200-50TB 210c
Abstract: a thermal design. Solder Selection A typical solder for a tin-lead soldering process is Sn63 (63%Sn, 37%Pb), which clearly is the industry standard for a number of reasons. Sn63 is a eutectic , proper solder refold. The one draw back of Sn63 solder when used in combination with gold plated , with Sn63 solder paste with RMA flux reduces the gold concentration and produces a stronger joint. A M/A-COM
Original

RFP-40-50TPP

Abstract: SN63 mounting surface and solder in place using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 type solder with a controlled temperature iron (210°C). Sales Desk USA: Voice
Anaren
Original
RFP-40-50TPP

Sn63

Abstract: RFP-300-100RN using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 type solder with
Anaren
Original
RFP-300-100RN 300100r

81A3001B

Abstract: 81A3001BXXXF finishes include: Lead-free, RoHS compliant plating (silver or gold), solder finish with SN63 or solder fused finish with SN63 depending upon package type. Select from bulk, tape & reel, or waffle packaging
Florida RF Labs
Original
81A3001BXXXF 81A3001B

ansi-j-std-006

Abstract: ANSI-J-STD-004 SPECIFICATION CONTROL DRAWING SOLDERSHIELD* Device SOLDERSLEEVE* Device Insulation Tubing MATERIALS 1. INSULATION SLEEVE: Heat -shrinkable, transparent clear, radiation cross-linked modified polyolefin. 2. SHIELD: Solder impregnated, flux coated, tin plated copper braid. SOLDER: TYPE Sn63 per ANSI-J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004. 3. INSULATION SLEEVE: Heat -shrinkable, transparent , : TYPE Sn63 per ANSI-J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004. 5. DIELECTRIC BARRIER
Tyco Electronics
Original
RPIP-699-00 ANSI-J-STD 004 raychem heat shrinkable sleeve Raychem splice ANSI-J-STD-006 a J-STD-004 rol1 B20282 D980565 B-202-82

bc 103

Abstract: ET-7403 10-55-10Hz (1) 1.5mm 326 JIS C 5102 8.4 Sn63/Pb37 (60/40) 230±5 3±0.5 Sn63/Pb37 (60/40) 0.2wt 150±5 3 260±5 , 51028.2 PTCPCB 10-55-10Hz (1) 1.5mm 326 JIS C 5102 8.4 Sn63/Pb37 (60/40) 230±5 3±0.5 Sn63/Pb37 (60/40
muRata
Original
bc 103 ET-7403 pth posistor JIS 5102 pdf/bd138 smd ptf04bd PRF18 PRF21 PRF18BG471QB1RB PRF18BF471QB1RB PRF18BE471QB1RB PRF18BD471QB1RB

diode 1283

Abstract: Schottky diode Die flip chip with a Sn63 / Pb37 alloy. A Sn63 / Pb37 no clean solder paste is recommended. Die attach with an
M/A-COM
Original
diode 1283 Schottky diode Die flip chip SEMICONDUCTOR DEVICE, DIODE 1283 B 1283 MA4FCS100M-1283 MA4FCS100M-1283W MA4FCS100M-1283T
Abstract: Digits Maximum + Decimal) Sn63 Solder dip at +230°C ±5°C for 5 seconds/95% coverage. Random drop on , Solderability Sn63 Solder dip at +230°C ±5°C for 5 seconds/95% coverage. Marking Permanency 10 Strokes , seconds minimum (internal crystal only). Line 2: XX.XXX M Solderability Sn63 Solder dip at , crystal only). Solderability Sn63 Solder dip at +230°C ±5°C for 5 seconds/95% coverage. Marking , : XX.XXX M Solderability Sn63 Solder dip at +230°C ±5°C for 5 seconds/95% coverage. Marking -
OCR Scan
MD-20-8 2J899

E13C1

Abstract: E11C2 10-55-10Hz (1) 1.5mm 326 JIS C 5102 8.4 Sn63/Pb37 (60/40) 230±5 3±0.5 Sn63/Pb37 (60/40) 0.2wt 150±5 3 260±5 , 51028.2 PTCPCB 10-55-10Hz (1) 1.5mm 326 JIS C 5102 8.4 Sn63/Pb37 (60/40) 230±5 3±0.5 Sn63/Pb37 (60/40
Ecliptek
Original
E11C1 E13C1 E11C2 E11J1 E11W1 E11J2 OS63 E13C2 E31C2 E32C2

HMC408

Abstract: QFN PACKAGE Junction to PCB thermal resistance a thermal design. Solder Selection A typical solder for a tin-lead soldering process is Sn63 (63%Sn, 37%Pb), which clearly is the industry standard for a number of reasons. Sn63 is a eutectic , proper solder refold. The one draw back of Sn63 solder when used in combination with gold plated , with Sn63 solder paste with RMA flux reduces the gold concentration and produces a stronger joint. A
Hittite Microwave
Original
HMC408 QFN PACKAGE Junction to PCB thermal resistance HMC408LP3 RO4350

JESD22A113-A

Abstract: MEDER rm05 ) 0.016 FR4 or G-10 Laminate 0.008 Alumina (Al2O3) 0.701 SN63 Solder 1.270 Thermally , through with ½ oz. copper (0.0007â' thick). During assembly, the via holes are filled with SN63 solder , calculate Θsn63, we use a thermal conductivity for SN63 solder of 1.27 W/in-ºK, an area of 0.004225 in2
Meder Electronic
Original
JESD22A113-A JEDEC wave 166 relay JESD22-A113-A RM05-2A2B-S-4/2 JESD22-A113A
Abstract: / Umpresswerkstoff FR4, Thermoset Moding Verbindung BGA Lötkontaktanschlüsse Sn63/Pb37, 0.65 mm Durchmesser , FR4, Thermoset Moding Verbindung BGA Lötkontaktanschlüsse Sn63/Pb37, 0.65 mm Durchmesser , Verbindung BGA Lötkontaktanschlüsse Sn63/Pb37, 0.65 mm Durchmesser www.meder.com 194 MEDER , Printmaterial / Umpresswerkstoff FR4, Thermoset Moding Verbindung BGA Lötkontaktanschlüsse Sn63/Pb37 Hittite Microwave
Original

Schieberegister

Abstract: relais JEDEC Norm JESD22-A113A o o FR4, Thermoset Molding Compound Sn63/Pb37, 0.65mm diameter , o o JEDEC Norm JESD22-A113A o FR4, Thermoset Molding Compound Sn63/Pb37, 0.025" diameter , -20 -35 190 1011 1.5 50 10 85 125 220 fully sealed FR4, Thermoset Molding Compound Sn63/Pb37, 0.025 , Compound Sn63/Pb37, 0.65mm diameter kVDC g g o C C C o o www.meder.com 197 Meder
Meder Electronic
Original
Schieberegister relais
Showing first 20 results.