NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: 1165 1475 2220 3255 5865 To Order SESI SMD Energy Storage Inductor 9 Size Packaging , : Date code PCB Layout (mm, top view) F Tel : + 33 (0) 3 82 59 13 33 Marking xR yywwP , Energy Storage Inductor 14 Size Packaging SESI 14 ### 1SR ### Value code 4K7 = 4,7 uH M10 , Order SESI SMD Energy Storage Inductor 15 Size Packaging Tol. 30 20 Version W , yyww : Date code PCB Layout (mm, top view) F P1 Marking 8 5 Unreeling I peak ... | Original |
14 pages, |
106 35K 043 SMD MARKING CODE 7002 smd marking M22 smd transistor M21 SMD MARKING code 7K7 Sn90Pb10 SESI 91 SESI 15 1K5 2SR identification marking M18 marking code m15 22wr SESI 15 SR SESI 9 15K 2WR datasheet abstract |
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| Abstract: TMD12AAA TMD12AAA Micro SMD Wafer Level Package X1: 1215 um +/- 30 um X2: 1615 um +/- 30 um X3: 600 um +/- 75 um , the use of an inductor by operating the charge pump in a gain of either 3/2 or 2 according to the , 1.2 mm X 1.6 mm 12Âbump micro SMD device. Built in soft-start, over-current protection, and thermal , Protection. Tiny 1.2 mm X 1.6 mm X 0.4 mm pitch, 12Âbump micro SMD package. Applications , LM2757 LM2757 Connection Diagram and Package Mark Information 12ÂBump Micro SMD Package, 0.4mm Pitch ... | Original |
16 pages, |
SMD-12 SMD M0 smd ic 4406 LM2757TMX LM2757TM LM2757 JESD51-7 SMD INDUCTOR marking code UM LM2757 abstract |
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| Abstract: NSC Package TMD12AAA TMD12AAA Micro SMD Wafer Level Package X1: 1215 um +/- 30 um X2: 1615 um +/- 30 um X3 , the use of an inductor by operating the charge pump in a gain of either 3/2 or 2 according to the , 1.2 mm X 1.6 mm 12Âbump micro SMD device. Built in soft-start, over-current protection, and thermal , Protection. Tiny 1.2 mm X 1.6 mm X 0.4 mm pitch, 12Âbump micro SMD package. Applications , , 2009 LM2757 LM2757 Connection Diagram and Package Mark Information 12ÂBump Micro SMD Package, 0.4mm ... | Original |
16 pages, |
supercapicator HDMI SDI JESD51-7 LM2757 LM2757TM LM2757TMX sim card holder smd SMD-12 C1005 SMD INDUCTOR marking code UM hdmi CONVERTER SDI IC sdi to hdmi converter ic LM2757 abstract |
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| Abstract: part to part. The package marking "X" designates the single digit date code. "V" is a NSC internal , the use of an inductor by operating the charge pump in a gain of either 3/2 or 2 according to the , 1.2 mm X 1.6 mm 12Âbump micro SMD device. Built in soft-start, over-current protection, and thermal , pitch, 12Âbump micro SMD package. Applications Keypad LED Drive USB/USB-OTG Power , and Package Mark Information 12ÂBump Micro SMD Package, 0.4mm Pitch National Semiconductor Package ... | Original |
14 pages, |
SMD-12 sim card holder smd LM2757TMX LM2757TM LM2757 JESD51-7 3*4 keypad LM2757 abstract |
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| Abstract: include a tiny 4 x 4 x 0.8mm LLP 24Âpin package and an even smaller 2.5 x 2.5mm micro SMD 25-bump package. , Ã- 0.8mm LLP or 25Âbump 2.5 x 2.5mm micro SMD package Software Programmable Regulators External , 30017803 24-Lead LLP Package (top view Note: The physical placement of the package marking will vary from part to part. (*) UZXYTT format: `U' Â wafer fab code; `Z' Â assembly code; 'XY' 2 digit date code; `TT" Â die run code. See http://www.national.com/quality/ marking_conventions.html for more information ... | Original |
44 pages, |
smd H1A transistor SMD INDUCTOR marking code UM h1a smd transistor spec H1A transistor SMD smd marking H1A 3 pin h1a smd transistor smd marking code H1A smd transistor H1a smd transistor marking H1A transistor H1A smd LP3907 LP3907 abstract |
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| Abstract: without the use of an inductor by operating the charge pump in a gain of either 3/2 or 2 according to the , 1.2 mm X 1.6 mm 12Âbump micro SMD device. Built in soft-start, over-current protection, and thermal , Shutdown Protection. Tiny 1.2 mm X 1.6 mm X 0.4 mm pitch, 12Âbump micro SMD package. Applications , www.national.com LM2757 LM2757 Connection Diagram and Package Mark Information 12ÂBump Micro SMD Package, 0.4mm , of the package marking will vary from part to part. The package marking "X" designates the single ... | Original |
18 pages, |
hdmi to SDI IC sdi to hdmi converter ic LM2757 SNVS536D LM2757 abstract |
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| Abstract: 6-pin SOT363 plastic SMD package. 1 2 3 Top view RF in MBL251 MBL251 GND Marking code , SMD inductor - 10 nH 0603 L2 SMD inductor - 8.2 nH 0603 Note 1. The , thickness = 0.64 mm, copper thickness = 35 um, gold thickness = 5 um. 2000 Dec 04 4 Philips ... | Original |
12 pages, |
smd Product type marking code 039 BGA2011 29 pt 8521 philips STR 6753 MBD128 MBD128 abstract |
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| Abstract: voltage applications in a 6-pin SOT363 plastic SMD package. 1 2 e2 3 Top view MAM210 MAM210 RF in GND Marking code: A6- Fig.1 Simplified outline (SOT363) and symbol. QUICK REFERENCE , C6 multilayer ceramic chip capacitor - 100 nF 0805 L1 SMD inductor - 3.9 nH 0603 L2 SMD inductor - 3.9 nH 0603 Note 1. The stripline is on a gold plated double copper-clad printed-circuit board (r = 6.15), board thickness = 0.64 mm, copper thickness = 35 um, gold ... | Original |
11 pages, |
SMD transistor MARKING CODE 213 smd ic 4051 BP317 BGA2012 str 6659 MBD128 MBD128 abstract |
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| Abstract: 6-pin SOT363 plastic SMD package. 1 2 e2 Circuit 3 Top view MAM210 MAM210 RF in GND Marking code:A5- Fig.1 Simplified outline (SOT363) and symbol. QUICK REFERENCE DATA SYMBOL , 0603 C6 multilayer ceramic chip capacitor - 2 x 100 nF 0805 L1 SMD inductor - 10 nH 0603 L2 SMD inductor - 8.2 nH 0603 Note 1. The stripline is on a gold , = 35 um, gold thickness = 5 um. 2000 Aug 18 4 Philips Semiconductors Preliminary ... | Original |
11 pages, |
STR 6753 SMD 6PIN IC MARKING CODE mcc 65-12 MARKING 5F SOT363 BP317 BGA2011 5- pin smd IC 358 STR G 6753 MBD128 MBD128 abstract |
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| Abstract: 6-pin SOT363 plastic SMD package. 1 2 3 Top view RF in MBL251 MBL251 GND Marking code , C6 multilayer ceramic chip capacitor - 100 nF 0805 L1 SMD inductor - 3.9 nH 0603 L2 SMD inductor - 3.9 nH 0603 Note 1. The stripline (w = 0.7 mm) is on a gold , = 35 um, gold thickness = 5 um. 2000 Dec 04 4 Philips Semiconductors Product ... | Original |
12 pages, |
BGA2012 MBD128 MBD128 abstract |
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