NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: RECEIVER SLDS116A SLDS116A - MARCH 2000  REVISED JUNE 2000 MECHANICAL DATA PZP (S-PQFP-G100) PowerPAD , technology, along with TI PowerPAD package technology to achieve a reliable, low-powered, low noise , . . . . . . . . . . . . . . . . . . . . . . . . 260°C Package power dissipation/PowerPAD: Soldered , temperature, 70°C. 2. PowerPAD bond pad on the backside of the package is not soldered to a thermal plane. , PowerPAD 100-TQFP 100-TQFP package The TFP201/201A TFP201/201A is packaged in TI's thermally enhanced PowerPAD 100TQFP 100TQFP ... | Original |
18 pages, |
TFP201PZP 100-PIN RX-2 -G s S-PQFP-G100 Package powerPAD 0.18-um CMOS Flash technology TFP201 TFP201A TFP201APZP S-PQFP-G100 Package powerPAD layout S-PQFP-G100 Package footprint SLDS116A TFP201 abstract |
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| Abstract: (S-PQFP-G100) PowerPAD PLASTIC QUAD FLATPACK 0,27 0,17 0,50 75 0,08 M 51 50 76 Thermal , technology, along with PowerPAD package technology to achieve a reliable, low-powered, low-noise, high-speed , . . . 260°C Package power dissipation/PowerPAD: Soldered (see Note 1) . . . . . . . . . . . . . . . , reliability. NOTES: 1. Specified with PowerPAD bond pad on the backside of the package soldered to a 2 oz. Cu , package The TFP403 TFP403 is packaged in TI's thermally enhanced PowerPAD 100TQFP 100TQFP packaging. The PowerPAD ... | Original |
18 pages, |
TFP501 TFP403 S-PQFP-G100 Package powerPAD layout S-PQFP-G100 Package footprint SLDS125A TFP403 abstract |
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| Abstract: JUNE 2003 MECHANICAL DATA PZP (S-PQFP-G100) PowerPAD PLASTIC QUAD FLATPACK 0,27 0,17 0,50 , process technology, along with TI PowerPAD package technology to achieve a reliable, low-powered, low , maximum allowed operating temperature, 70°C. 2. PowerPAD bond pad on the backside of the package is not , PowerPAD 100-TQFP 100-TQFP package The TFP401/401A TFP401/401A is packaged in TI's thermally enhanced PowerPAD 100TQFP 100TQFP packaging. The PowerPAD package is a 14 mm Ã- 14 mm Ã- 1 mm TQFP outline with 0.5 mm lead-pitch. The PowerPAD ... | Original |
19 pages, |
TFP401PZP TFP401APZP TFP401A 100-PIN TFP401 S-PQFP-G100 Package powerPAD layout 0.18-um CMOS technology characteristics S-PQFP-G100 Package footprint SLDS120B TFP401 abstract |
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| Abstract: line. PowerPAD 100-terminal TQFP package The TFP503 TFP503 is packaged in TI's thermally enhanced PowerPAD 100-terminal TQFP packaging. The PowerPAD package is a 14-mm Ã- 14-mm Ã- 1-mm TQFP outline with 0.5-mm lead-pitch. The PowerPAD package has a specially designed die-mount pad that offers improved thermal capability over typical TQFP packages of the same outline. The TI 100-terminal TQFP PowerPAD package offers , 100-Terminal TQFP PowerPAD Packaging Advanced Technology Using TI's 0.18-um EPIC-5 CMOS Process Embedded ... | Original |
26 pages, |
TFP503 DDC Panel RX-2 -G s dvi 24 pin diagram dvi dual link schematic CIRCUIT DIAGRAM OF 9 INCH TFT MONITOR S-PQFP-G100 Package footprint DVI dual link transmitter DVI dual link receiver SLDS149 TFP503 abstract |
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| Abstract: PowerPAD 100-pin TQFP package The TFP501 TFP501 is packaged in TI's thermally enhanced PowerPAD 100-pin TQFP packaging. The PowerPAD package is a 14 mm Ã- 14 mm Ã- 1 mm TQFP outline with 0.5mm lead-pitch. The PowerPAD , packages of the same outline. The TI 100-pin TQFP PowerPAD package offers a backside solder plane that , thermal properties of the TI 100-pin TQFP PowerPAD package. The 100-pin TQFP non-PowerPAD package is , NOTES: 15. Specified with the PowerPAD bond pad on the backside of the package soldered to a 2 oz Cu ... | Original |
24 pages, |
TFP501 SLDS127B TFP501 abstract |
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| Abstract: JUNE 2000 MECHANICAL DATA PZP (S-PQFP-G100) PowerPAD PLASTIC QUAD FLATPACK 0,27 0,17 0,50 , process technology, along with TI PowerPAD package technology to achieve a reliable, low-powered, low , maximum allowed operating temperature, 70°C. 2. PowerPAD bond pad on the backside of the package is not , power management circuit to drive PD is preferred. TI PowerPAD 100-TQFP 100-TQFP package The TFP201/201A TFP201/201A is packaged in TI's thermally enhanced PowerPAD 100TQFP 100TQFP packaging. The PowerPAD package is a 14 mm Ã- 14 mm Ã- ... | Original |
17 pages, |
tmds receiver HSYNC, VSYNC, DE HSYNC, VSYNC, DE, input, output receiver CONTROLLER rx-2 RX-2 -G s TFP201 TFP201A TFP201APZP TFP201PZP 100-PIN dvi schematic SLDS116A TFP201 abstract |
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| Abstract: RECEIVER SLDS120A SLDS120A - MARCH 2000  REVISED JUNE 2000 MECHANICAL DATA PZP (S-PQFP-G100) PowerPAD , process technology, along with TI PowerPAD package technology to achieve a reliable, low-powered, low , maximum allowed operating temperature, 70°C. 2. PowerPAD bond pad on the backside of the package is not , SLDS120A SLDS120A - MARCH 2000  REVISED JUNE 2000 TI PowerPAD 100-TQFP 100-TQFP package The TFP401/401A TFP401/401A is packaged in TI's thermally enhanced PowerPAD 100TQFP 100TQFP packaging. The PowerPAD package is a 14 mm Ã- 14 mm Ã- 1 mm ... | Original |
17 pages, |
TFP401PZP TFP401APZP TFP401A TFP401 HSYNC, VSYNC, DE, input, output 401A 100-PIN SLDS120A TFP401 abstract |
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| Abstract: (S-PQFP-G100) PowerPAD PLASTIC QUAD FLATPACK 0,27 0,17 0,50 75 0,08 M 51 50 76 Thermal , technology, along with PowerPAD package technology to achieve a reliable, low-powered, low-noise, high-speed , . . . 260°C Package power dissipation/PowerPAD: Soldered (see Note 1) . . . . . . . . . . . . . . . , reliability. NOTES: 1. Specified with PowerPAD bond pad on the backside of the package soldered to a 2 oz. Cu , package The TFP403 TFP403 is packaged in TI's thermally enhanced PowerPAD 100TQFP 100TQFP packaging. The PowerPAD ... | Original |
17 pages, |
TFP501 TFP403 SLDS125A TFP403 abstract |
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| Abstract: PanelBus DIGITAL RECEIVER SLDS125 SLDS125  DECEMBER 2000 MECHANICAL DATA PZP (S-PQFP-G100) PowerPAD , circuit innovation with TIs advanced 0.18-um EPIC-5 CMOS process technology, along with PowerPAD package , . . . . . . . . . . . . . . . . . . . . 260°C Package power dissipation/PowerPAD: Soldered (see , temperature, 70°C. 2. PowerPAD bond pad on the backside of the package is not soldered to a thermal plane. , package The TFP403 TFP403 is packaged in TI's thermally enhanced PowerPAD 100TQFP 100TQFP packaging. The PowerPAD ... | Original |
17 pages, |
TFP501 TFP403 S-PQFP-G100 Package powerPAD layout RX-2 -G s dvi schematic SLDS125 TFP403 abstract |
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| Abstract:  REVISED JUNE 2000 MECHANICAL DATA PZP (S-PQFP-G100) PowerPAD PLASTIC QUAD FLATPACK 0,27 0 , technology, along with TI PowerPAD package technology to achieve a reliable, low-powered, low noise , . . . . . . . . . . . . . . . . . . . . . . . . 260°C Package power dissipation/PowerPAD: Soldered , temperature, 70°C. 2. PowerPAD bond pad on the backside of the package is not soldered to a thermal plane. ,  REVISED JUNE 2000 TI PowerPAD 100-TQFP 100-TQFP package The TFP101/101A TFP101/101A is packaged in TI's thermally ... | Original |
17 pages, |
tft monitor schematic diode 101a HSYNC, VSYNC, DE HSYNC, VSYNC, DE, input, output RX-2 -G s S-PQFP-G100 Package powerPAD layout TFP101 TFP101A TFP101APZP TFP101PZP 100-PIN dvi schematic TFP101 abstract |
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