500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Top Results

Part Manufacturer Description Datasheet BUY
PTPSM84824MOLR Texas Instruments 4.5V to 17V Input, 0.6V-10V Output, 8A Power Module in Compact 7.5x7.5mm Footprint 24-QFM -40 to 105 visit Texas Instruments Buy
TPSM84824MOLR Texas Instruments 4.5V to 17V Input, 0.6V-10V Output, 8A Power Module in Compact 7.5x7.5mm Footprint 24-QFM -40 to 105 visit Texas Instruments Buy
ISO7142CCQDBQQ1 Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125 visit Texas Instruments
REF3425IDBVR Texas Instruments Low-Drift Low-Power Small-Footprint Series Voltage Reference 6-SOT-23 -40 to 125 visit Texas Instruments Buy
REF2125IDBVR Texas Instruments Low-Drift Low-Power Small-Footprint Series Voltage Reference With Clean Start 5-SOT-23 -40 to 125 visit Texas Instruments Buy
ISO7142CCQDBQRQ1 Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125 visit Texas Instruments Buy

QFN 76 9x9 footprint

Catalog Datasheet MFG & Type PDF Document Tags

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint LeadFrame® (MLF®/QFN/SON/DFN) Package · Small size (reduce package footprint by 50% or more and improved , only) 2x3 3x3 4x4 5x5 6x5 6x6 7x7 8x8 9x9 10 x 10 11 x 11 12 x 12 13 x 13 QFN / DFN / SON Leadcounts , ) Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package , Design "Punch" LEADFRAME Micro LeadFrame® (MLF®/QFN/SON/DFN) Package Process Highlights · Die , / 32 / 36 / 44 / 48 / 56 / 68 / 80 32 / 36 / 40 / 52 / 56 / 68 / 76 / 88 36 / 44 / 48 / 60 / 64 / 76
Amkor Technology
Original

BD 4914

Abstract: QFN 76 9x9 footprint Semiconductor, Inc. AN1902/D 11.8mils (0.30mm) separation between the openings. For the 9x9 QFN, the , land Pettern Freescale Semiconductor, Inc. QFN 4x4 Stencil aperture 9x9 4x4 9x9 , for 9x9 QFN PCB land 0.69mm 0.69mm Freescale Semiconductor, Inc. Aperture opening , X-Ray of 9x9 mm QFN Package 18 Quad Flat Pack No-Lead (QFN) For More Information On This , the new package up. The split light system displays images of both the QFN leads and the footprint on
Motorola
Original
BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint QFN 4x4 Version 9x9 4x4 9x9 E S E S E S E S Lead pad width (mm , light system displays images of both the QFN leads and the footprint on the PCB. The two superimposed , (QFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and , generically to encompass various Quad Flat Pack No-lead (QFN) packages assembled internally and externally , . .1 3.0 3.1 3.2 3.3 3.4 Quad Flat Pack No-Lead (QFN) Package . . . . .2 Package
Freescale Semiconductor
Original
AN1902 QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA Theta-JA 7x7 MO-220 4914 smd

FOOTPRINT MO-229 2X3 SOLDERING

Abstract: Theta-JC QFP die down . The split light system displays images of both the uDFN / QFN leads and the footprint on the PCB. The , (QFN) Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for , / QFN) packages assembled internally and externally. It should be noted that device specific , . . . . . . . . . . . .1 3.0 Micro Dual Flat No-Lead (uDFN) and Quad Flat No-Lead (QFN) Package . , . .2 3.2 Package Dimensioning . . . . . . . . . . . . . . . . . . . .2 3.3 QFN Package Design . .
Freescale Semiconductor
Original
FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down EIA-783 EIA and EIAJ standards 783 QFN 56 7x7 footprint qfn 64 9x9 stencil

hd-SDI splitter

Abstract: HDMI to SDI converter chip Comparison* Then. Now ! NEW Half the size Competition LMH0356SQ QFN-64 9x9 81 mm2 , -25 package (3 x 3 mm) ° 44% board area savings compared to QFN-16 package · 3G-SDI cable driver: LMH0307GR ° microArray-25 package (3 x 3 mm) ° 44% board area savings compared to QFN-16 package · 3G , compared to QFN-64 package · 3G-SDI reclocker: LMH0346SQ ° LLP-24 package (5 x 4 mm) ° 75% board area savings compared to QFN-64 package Cleaner Layout, Reduced Board Area, and Simplified BOM
National Semiconductor
Original
hd-SDI splitter HDMI to SDI converter chip HDMI verilog VHDL code for ADC and DAC SPI with FPGA hdmi CONVERTER SDI IC Video sync splitter lm LMH0303/07 LMH0384
Abstract: . 75 Current Shunt Monitors/Current Sense Amplifiers .76 Temperature Sensors , 76 114 120 7.5 1.1 5.1 Y Y Y Out Out Out N Y N 4.5 36 4.5 45 27 , 116 4.6 Y Out Y QFN-10, SOT23-6 0.90 2 2.5 5.5 1 118 580 0.4 , 400000 113 10.0 Y Out Y MSOP-10, SOIC-8, 1.50 QFN-10 QFN-10, SOT23-6 0.85 2 2.5 , ) Single to- HiRel (typ) Supply Rail Avail. (min) MSOP-10, SOIC-8, 1.35 QFN-10 *Suggested resale Texas Instruments
Original
ISO/TS16949

USB2514b

Abstract: USB2517I-JZX packages: - 36-pin QFN (6x6 mm) - 48-pin QFN (7x7 mm) - 64-pin QFN (9x9 mm) USB251xi, USB2512Ai , . . . . . . . . . . . . . . . . . . . . 64-Pin QFN, 9x9 mm Body, 0.5 mm Pitch . . . . . . . . . . . , performance, low-power, small footprint hub controller IC with 2, 3, 4, or 7 downstream ports (indicated by , strength resolution USB251xB/xBi products are fully footprint compatible with USB251x/xi/xA/xAi , -pin QFN (6x6x0.5 mm) RoHS Compliant Part Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Standard MicroSystems
Original
USB2514b USB2517I-JZX USB2513B USB2514Bi USB2514B-AEZG USB2512Bi USB2512/12A/12B USB2513/13B USB2514/14B USB2517 USB251

USB2514Bi

Abstract: passive hub usb2517 packages: - 36-pin QFN (6x6 mm) - 48-pin QFN (7x7 mm) - 64-pin QFN (9x9 mm) USB251xi, USB2512Ai , . . . . . . . . . . . . . . . . . . . . 64-Pin QFN, 9x9 mm Body, 0.5 mm Pitch . . . . . . . . . . . , performance, low-power, small footprint hub controller IC with 2, 3, 4, or 7 downstream ports (indicated by , strength resolution USB251xB/xBi products are fully footprint compatible with USB251x/xi/xA/xAi , -pin QFN (6x6x0.5 mm) RoHS Compliant Part Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Standard MicroSystems
Original
passive hub usb2517 USB22514i USB2514 USB2514BI-AEZ USB2513-AEZG

laptop LCD inverter SCHEMATIC

Abstract: ADS1248 RTD 3 wire 95 120 76 114 120 104 110 114 23 7.5 1.1 3 4 Y Y N Y N N N Out Out N I/O , 20000 100 80 4.5 45 Y Y I/O Out SOT23, MSOP MSOP, SON SOT23, SON, DFN, QFN SOT23 , 0.005 3 15 0.5 0.02 10 100 25000 200 76 76 91 110 32 45 25 62 I/O SOT23, SOIC , ) · Packaging: SOT23-5, DNF-8 (3x3mm), MSOP-8, TSSOP-14, QFN-16 (4x4mm) The OPA245 family of , 5.5 8 44 22 8 5 10 76 18 Y I/O $1.00 1, 2, 4 2.2 5.5 0.95
Texas Instruments
Original
laptop LCD inverter SCHEMATIC ADS1248 RTD 3 wire dc-ac inverter PURE SINE WAVE schematic diagram ecg semiconductors master replacement guide ph probe amplifier using INA101 cdi ignition circuit diagram 00800-ASK-TEXAS D093008

IGBT 60A spice model

Abstract: 8 pin ic 3842 ) CASE NO. 403C (page 75) SMB CASE NO. 403D (page 76) SMA SOD-123 SC-77 SCALE 1:1 , Surface Mount Gull Wing SO SOD-323 SC-76 CASE NO. 477 (page 92) SCALE 4:1 Surface Mount , (Not to Scale) SURFACE MOUNT Section 7: Leadless/QFN/DFN Packages MicroLeadless MicroLeadless , -PIN QFN 4x4 SCALE 2:1 MicroLeadless HP CASE NO. 485E (page 95) 20-PIN QFN 4x4 SCALE 2:1 , HP HP CASE NO. 485G (page 97) 16-PIN QFN 3x3 SCALE 2:1 CASE NO. 485H (page 97) 32
ON Semiconductor
Original
IGBT 60A spice model 8 pin ic 3842 motorola an569 thermal IR 948P 0.65mm pitch BGA socket bt 2323

INA821

Abstract: OPA245 95 120 76 114 120 104 110 114 23 7.5 1.1 3 4 Y Y N Y N N N Out Out N I/O , 20000 100 80 4.5 45 Y Y I/O Out SOT23, MSOP MSOP, SON SOT23, SON, DFN, QFN SOT23 , 3 15 0.5 0.02 10 100 25000 200 76 76 91 110 32 45 25 62 I/O SOT23, SOIC , ) · Packages: SOT23-5, DNF-8 (3x3mm), MSOP-8, TSSOP-14, QFN-16 (4x4mm) The OPA245 family of , 5.5 8 44 22 8 5 10 76 18 Y I/O $1.00 1, 2, 4 2.2 5.5 0.95
Texas Instruments
Original
INA821 cdi ignition Hall sensor 45e ADS1281 12v 100W subwoofer CIRCUIT DIAGRAM opay211 C6000TM C5000TM MSP430 C2000TM

TRANSFORMER bck 2801

Abstract: 100W car power amplifier stereo dc 12 volts 0.075 0.075 0.5 0.4 0.1 0.1 4 90000 10000 10000 10 100 120 120 76 2.5 3 3 5 , 0.5 2 0.4 0.4 0.3 1.5 2.5 4 1 1 1 100 10 10 10 100 106 106 86 80 80 76 8 , 17 96 8 120 3 100 2.5 106 5.2 86 10 120 3 76 5 106 5.2 - 5 at 1MHz - 5 at 1MHz , 0.1 4 50 50 10 - - 76 5 at 1MHz 5 at 1MHz 5 Y Y Y 1Suggested resale price , 800 Y 100 7 Y 100 8.5 Y 106 5.2 N 106 8 N 90 16 N 80 N 96 8 N 86 8 N 76 45
Texas Instruments
Original
TRANSFORMER bck 2801 100W car power amplifier stereo dc 12 volts pc preamp with bass treble circuit diagrams lm324 musical fidelity preamp 2a adjustable zero span circuit with lm358 ADS1211 C51 Microcontroller MSC12

ATA5722

Abstract: ATAVRDRAGON footprint in accordance with customer demand as well as legislative directives such as RoHS 2002/95/EC. For , . . . . . . . . 76 Smart Card Reader ICs ­ Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Smart Card Reader ICs ­ Ready-to-Use Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 , debugWIRE S PDIP, TQFP, QFN, DIE 2.7-5.5V 0-20 ­ Now ATmega48V 4 256 512 23
Atmel
Original
ATA5722 ATAVRDRAGON AT97SC3204 tsop Ir sensor interface with atmega 16 atr0834t ATA5721

LE79Q2281

Abstract: PLAD15KP Microcircuits High-Rel Non-Hermetic TVS High-Rel Rectifier Modules High-Rel TVS Modules 71 73 76 76 , advantages of flexibility devices time-to-market in low-power and small footprint profiles. historical FPGA advantages of flexibility and quick time-to-market in low-power and small footprint profiles. IGLOO nano
Microsemi
Original
LE79Q2281 PLAD15KP IC ZL70572 STK 084 power amplifier transistor SI 6822 LED Driver aplications

cdi ignition circuit diagram

Abstract: hp laptop MOTHERBOARD pcb CIRCUIT diagram 70 35 10 80 32 100 76 45 25000 96 24 200 110 - RailtoRail Package(s) Price* I/O , 7.5 5 8 38 50 44 22 25 22 0.5 0.5 8 4 1 5 10 10 10 76 100 76 5 5 , , TSSOP 10 76 5 Y I/O PDIP, MSOP, SOIC 10 100 5 Y IN SOT23, SO8 10 80 7.5 Y I/O , N N N N N Out N 100 10000 10 10 10 15000 86 120 76 12.5 100 114 10 3 5 , 1 3.5 3 15 100 76 45 N 0.35 0.2 0.1 0.5 25000 91 25 N 1.4 0.5 0.75 2 40000 78
Texas Instruments
Original
hp laptop MOTHERBOARD pcb CIRCUIT diagram hp laptop battery pinout temperature controlled fan project using 8051 16 pin diagram of lcd display 16x2 diagram circuit usb mp3 player with radio fm lcd hp laptop display LVDS connector pins datasheet

2057 LED dot matrix display 5x7

Abstract: lm3630 Battery (Li-Ion) Protection 68 Wireless Power 69 73 76 80 81 General Illumination LCD , -SOIC-W/DIL (PDIP) 10-MSOP/QFN 8-MSOP 10-MSOP 0.59 0.90 0.66 1.13 1 MHz 1 MHz 4.1 to 15 4 , -HTSSOP, 24-QFN 16-TSSOP 20-HTSSOP, 24-QFN 28-HTSSOP/QFN 300 kHz 7 to 40 0.2/0.2 16-TSSOP/SOIC , , Push-Pull, Half-Bridge Interleaved Fwd/Flyback/Boost 1 MHz/ch. 4 1/5/1.5 20-TSSOP 10-MSOP/QFN , (PDIP), 20-PLCC 16-SSOP/TSSOP/SOIC/ SOIC-W/DIL (PDIP), 20-PLCC 16-TSSOP/QFN UC3827-1/-2 50 to
Texas Instruments
Original
2057 LED dot matrix display 5x7 lm3630 tps59620 schematic diagram TCON lcd samsung LM2585 36 V - 72 V to 24 V LM5045
Abstract: â'" Low External Host Driver Footprint: Less Than 7KB of Code Memory and 700 B of RAM Memory , -mm × 9-mm QFN â'" Ambient Temperature Range: â'"40°C to 85°C 1 An IMPORTANT NOTICE at the end , and the TI E2Eâ"¢ support community. The CC3100 device is available in an easy-tolayout QFN package , the host memory footprint requirements requiring less than 7KB of code memory and 700 B of RAM memory , BODY SIZE QFN (64) 9.0 mm x 9.0 mm For all available packages, see the orderable addendum at Texas Instruments
Original
SWAS031C 256-B
Abstract: Footprint: Less Than 7KB of Code Memory and 700 B of RAM Memory Required for TCP Client Application , Clock Package and Operating Temperature â'" 0.5-mm Pitch, 64-Pin, 9-mm × 9-mm QFN â'" Ambient , device is available in an easy-tolayout QFN package. The Wi-Fi network processor subsystem features a , -bit MCU over the SPI or UART Interface. The device driver minimizes the host memory footprint , . Device Information (1) PART NUMBER CC3100 (1) 2 PACKAGE BODY SIZE QFN (64) 9.0 mm x Texas Instruments
Original
SWAS031B

8051 f310

Abstract: em 154* "stepping motor" . . . . . . . . . . . . . 75 . . . . . . . . . . . . . . . . . . . . . . . . 76 . . . . . . . . . , oscillator: Crystal, RC, C, or CMOS Clock Ordering Part Numbers - C8051F500-IM, 48-Pin QFN (RoHS-compliant), 7x7 mm2 - C8051F500-IQ, 48-Pin QFP (RoHS-compliant), 9x9 mm2 VIO Power On Reset Reset C2CK , Numbers - C8051F501-IM, 48-Pin QFN (RoHS-compliant), 7x7 mm2 - C8051F501-IQ, 48-Pin QFP (RoHS-compliant), 9x9 mm2 VIO Power On Reset Reset C2CK/RST C2D Debug / Programming Hardware Port I/O
Silicon Laboratories
Original
8051 f310 em 154* "stepping motor" C8051F020-GQ AN191 c8051f130-gq c8051f350 adc code example C8051F500 C8051F501 C8051F502 C8051F503 C8051F504 C8051F505

design of 4-20mA transmitter for bridge type transducer using op-amp

Abstract: Voltage to Current Converter 4-20mA using LM324 power amp Upcoming Products · LOG114-5V, high-speed LOG amp in QFN package · OPA567-5V, 2A power amp in QFN package · TPA3008D2-8.5W, stereo Class-D audio power amp FilterProTM Design Tool . . , , 38MHz 1, 2, 4 2.7 5.5 7.5 38 22 0.5 4 10 76 5 Y I/O PDIP, MSOP, 1.23 SOIC, SSOP TLC220x , 0.5 4 10 76 5 Y I/O PDIP, MSOP, 1.23 TLC220x Precision, Low Noise 1, 2 4.6 16 1.5 1.8 , , 4 2.7 5.5 7.5 38 22 0.5 4 10 76 5 Y I/O PDIP, MSOP, 1.23 Precision, Low Voltage VS
Texas Instruments
Original
design of 4-20mA transmitter for bridge type transducer using op-amp Voltage to Current Converter 4-20mA using LM324 lm2904 4-20ma 30w stereo amplifier with bass and treble bass treble using lm324 Current to voltage Converter 4-20mA using LM324
Showing first 20 results.