L17H2771120
Amphenol Communications Solutions
Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 15 High Density/15 High Density (Socket/Socket), 0.38m (15 in) Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 2*Arrowhead Boardlock
68771-122HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54 mm (0.100in) Pitch.
68771-127HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 27 Positions, 2.54 mm (0.100in) Pitch.
10128477-112500ULF
Amphenol Communications Solutions
ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, Hermaphroditic, Vertical, Press-Fit, 2 Pair, 11 Column, 88 Position, 12.50mm Stack Height, 2.00mm (0.079in) Column Pitch
68771-126HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm (0.100in) Pitch.
68771-128HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm (0.100in) Pitch.
