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Part Manufacturer Description Datasheet BUY
CYCLONE-IITM-PCI-EXPRESS-DEVELOPMENT-KIT Texas Instruments PCI Express x1 Development kit based on Cyclone II? and XIO1100 visit Texas Instruments
SPARTAN-3TM-CYCLONE-IITM-PCI-EXPRESS-DEV-KIT Texas Instruments Spartan 3?/Cyclone II? based x1 PCI Express Development kit visit Texas Instruments
CS4224-KSZR Cirrus Logic CODECs - Audio IC 24-Bit 105dB Ster Cod w/o Vol Con visit Digikey

PCI+Express+connector+8x+pinout

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Abstract: 1300 nm Singlemode Min Typ Max Unit Pkg ST MRTEXX001-8X 10 15 20 uW A,B MRTEXX002-8X 20 30 40 uW A MRTEXX003-8X 30 40 60 uW A Part Number 1300 nm Multimode Min Typ Max Unit Pkg ST MRTEXX003-8X 30 40 60 uW A,B MRTEXX004-8X 40 50 80 uW A MRTEXX005-8X 50 60 100 uW , 1500 nm Singlemode Min MRTEXX50005-8X 5 7 10 uW A MRTEXX5002-8X 20 30 LuminentOIC
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MRTEST001-82A/B MRTEXX001-8X MRTEXX002-8X MRTEXX003-8X MRTEXX004-8X MRTEXX005-8X MRTEXX50005-8X
Abstract: Singlemode Min Typ Max Unit Pkg ST MRTEXX001-8X 10 15 20 uW A,B MRTEXX002-8X 20 30 40 uW A MRTEXX003-8X 30 40 60 uW A Part Number 1300 nm Multimode Min Typ Max Unit Pkg ST MRTEXX003-8X 30 40 60 uW A,B MRTEXX004-8X 40 50 80 uW A MRTEXX005-8X 50 60 100 uW A Min Typ Max , MRTEXX50005-8X 5 7 10 uW A MRTEXX5002-8X 20 30 40 uW A MRTEXX5001-8X 10 MRV Communications
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MRTEXX5002-8X MRTEXX5001-8X MRTEXX5003-8X MRTEST001-82A
Abstract: CM1248â'08DE PACKAGE / PINOUT DIAGRAMS Top View CH1 (1) CH8 (8) CH2 (2) CH7 (7) CH3 (3 , (Refer to package / pinout diagrams) CHx (Refer to package / pinout diagrams) VN Description , C L L (A3) L1 8X DETAIL A 0.05 C A1 NOTE 4 C SIDE VIEW SEATING , 0.50 0.40 BSC 0.15 â'â'â' 0.20 0.30 â'â'â' 0.05 DETAIL A 8X D2 L 1 RECOMMENDED SOLDERING FOOTPRINT* E2 1.40 8X 8X 8 K e e/2 0.40 8X b PACKAGE OUTLINE ON Semiconductor
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CM1248-08DE 517BC 3000/T BRD8011/D 08DE/D
Abstract: : CM1248-08DE/D CM1248-08DE PACKAGE / PINOUT DIAGRAMS Top View CH1 (1) CH2 (2) CH3 (3) CH4 (4) 8 , / pinout diagrams) (Refer to package / pinout diagrams) Name CHx VN Description The cathode of the , ) L1 DETAIL A L 0.05 C 8X 0.05 C NOTE 4 SIDE VIEW DETAIL A A1 C SEATING PLANE ALTERNATE TERMINAL CONSTRUCTIONS 8X L D2 1 E2 RECOMMENDED SOLDERING FOOTPRINT* 1.40 8X 8X K e e/2 8 8X b 0.40 0.10 C A B 0.05 C NOTE 3 PACKAGE OUTLINE BOTTOM VIEW 0.50 0.25 ON Semiconductor
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l48 diode marking diode L48
Abstract: Package/Pinout Diagrams for expanded pin information. © Semiconductor Components Industries, LLC, 2011 April, 2011 â' Rev. 3 1 Publication Order Number: CM1623/D CM1623 PACKAGE / PINOUT DIAGRAMS , 0.05 C L L (A3) L1 8X DETAIL A 0.05 C A1 NOTE 4 C SIDE VIEW SEATING , 0.50 0.40 BSC 0.15 â'â'â' 0.20 0.30 â'â'â' 0.05 DETAIL A 8X D2 L 1 RECOMMENDED SOLDERING FOOTPRINT* E2 1.40 8X 8X 8 K e e/2 0.40 8X b PACKAGE OUTLINE ON Semiconductor
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Abstract: all family devices from a single 32 pin DIP pinout (Select COP87Lxx-32 Adapter from the programmer menu). The 32DIP pinout mapping is similar to a 1M EPROM, and allows support of family devices on , , lidded socket and marked: COP87L2/4/6/8x. E. Three different 28 DIP to 32DIP adapters should use a , should use a standard DIP socket and marked: COP87L2/4/6/8x. G. 68PLCC to 32DIP adapter should use a , pinouts are detailed in the programmer specification. The 32DIP pinout and adapter pinouts are detailed National Semiconductor
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IC128 27nC COP87L 40DIP COP87L8 44PLCC
Abstract: *See Package/Pinout Diagrams for expanded pin information. © Semiconductor Components Industries , PACKAGE / PINOUT DIAGRAMS Top View (Pins Down View) 8 7 6 5 Bottom View (Pins Up View) 1 2 3 4 1 2 3 4 , 0.20 0.30 - 0.05 TOP VIEW DETAIL B A L (A3) L1 DETAIL A L 0.05 C 8X 0.05 C NOTE 4 SIDE VIEW DETAIL A A1 C SEATING PLANE ALTERNATE TERMINAL CONSTRUCTIONS 8X L D2 1 E2 RECOMMENDED SOLDERING FOOTPRINT* 1.40 8X 8X K e e/2 8 8X b 0.40 0.10 ON Semiconductor
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marking p23 CM1623-04DE
Abstract: 4x 9 pin D-sub male 8x 9 pin D-sub male 16 open Lines 16x 78 pin D-sub female 8x 78 pin D-sub , ME AB-D9/8 Connectivity box. 78 pin D-sub male to 8x 9 pin D-sub male connectors. (see picture, but with 78 pin D-sub) For ME-9100i, ME-9000 ME AB-D9/8-V Connectivity box. 68 pin VHDC male to 8x 9 pin , to 8x 9 pin D-sub male connectors. (see picture, but with 78 pin D-sub) For ME-9100i, ME-9000 ME AB-D9/8-HV* Connectivity board. 68 pin VHDC male to 8x 9 pin D-sub male connectors. (see picture) For Meilhaus Electronic
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ME-26 D-Sub 78-pin female Connector me 6100 D-SUB 50 PIN feMALE CONNECTOR D-Sub 78-pin Connector D-Sub 78-pin male Connector 37-pin pinout AK-D78 AK-D37 AK-D15 AK-D25 AK-D37M AK-D50
Abstract: . Table 5. Pinout for DIP and SMT Packages Output Type Pin 1 Pin 2 analog NC Vsupply Table 6. Pinout for , [0.441] 8X 0,46 [0.018] 8X 0,46 [0.018] DIP LN: Single axial barbless port 5,80 [0.228] 8 7 6 5 , [0.274] 1,00 [0.039] 8X 0,46 [0.018] 8X 0,46 [0.018] DIP RR: Dual radial barbed ports, same , ] 3,78 [0.149] 8X 0,46 [0.018] 8X 0,46 [0.018] Issue 3 Figure 2. SMT Pressure Port , ] 13,4 [0.53] 1 2 3 4 2,54 TYP. [0.100] 4,80 [0.189] 6,41 [0.252] 8X 0,46 [0.018 Honeywell
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MIL-STD-202F J-STD-020-C 50044172-3-EN
Abstract: W S 1M 8-X D JX M/HITE /M ICROELECTRONICS 2x512Kx8 DUALITHICâ"¢ SRAM ADVANCED* FEATURES REVOLUTIONARY PINOUT 36 CSOJ â  Access Times 17, 20, 25, 35, 45, 55ns â  TOP VIEW AO e r r A1 1 , - 12 SRAM VCCI- 9 Revolutionary, Center Power/Ground Pinout â'¢ 36 lead Ceramic SOJ , ) 437-1520 a W S 1M 8-X D JX M/HITE /M ICROELECTRONICS ABSOLUTE MAXIMUM RATINGS Parameter , ca W S 1M 8-X D JX 1/1/HITE /M ICROELECTRONICS AC CHARACTERISTICS (Vcc= 5.0V, Vss = 0V, Ta -
OCR Scan
A91------- AO-18
Abstract: L5 C T10 L2 L3 L1 L11 L13 L15 L17 L19 8X 42.1 L12 L14 L16 L18 L20 B 4X DETAIL H CONNECTOR PIN-OUT COMPONENT SIDE OF BOARD 8X INDIVIDUALLY SCALE 10:1 8 B 4.5 X 2 BSC 2 A Y 8X 14.25 69X ( 1.05 ) 6 7 RECOMENDED PCB LAYOUT , DWN APVD - - - D D 8X 16X 7.125 4 SEE DETAIL 8X SEE DETAIL 8X 1.625 8X G SEE DETAIL 11 H F 7.5 T20 T18 T16 T14 T12 T19 T17 T15 T13 T11 C TE Connectivity
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ECO-13-003678 04APR2013 17OCT2011 ECO-11-020522 EIA/ECA-364-1000 5M-2009
Abstract: »ETXexpress®-MC « « CM-®sserpxeXTE» Performance COM ExpressTM module » Intel® CoreTM2 Duo (up to 2.2GHz) Processors » Up to 4GB DDR2 memory, dual channel » 5x PCI Express, 8x USB 2.0 and 3x SerialATA 300 » Wide Input Supply Support - 8.5V-18V » Onboard TPM 1.2 ETXexpress®-MC Built around , PATA USB 8x USB 2.0 PCI Express 5 PCI Express x1 (1 PCIe x4 possible), 1 PEG x16 PCI , / Pin-out Type COM ExpressTM Basic: 125 x 95 mm / Pin-out Type 2 Power Consumption typ. Idle 11W @ Kontron
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IC JRC 4558 JRC 4558 L7500 T7500 lvds 1080p pinout T7500 intel 800FSB 82566MM 533MH 38006-0000-99-0C02 38006-0000-99-0C01
Abstract: L20 DETAIL H CONNECTOR PIN-OUT COMPONENT SIDE OF BOARD 8X INDIVIDUALLY SCALE 10:1 42.1 B B 4X 8 4.5 X 7 BSC 8X 14.25 69X ( 1.05 ) 6 2 2 Y , ) T1 ( 25 ) L10 8X ( 6.6 ) ( 25.5 ) ( 27.96 ) L11 ( 3 ) TYP L1 L20 2169788-1 , RESERVED. BY - 1 REVISIONS DIST 00 P LTR DESCRIPTION SEE SHEET 1 - D 8X 8X 8X DWN APVD - - - D 11 7.125 16X 4 SEE DETAIL 1.625 H SEE TE Connectivity
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ECO-14-002692 12MAY2014 18JAN2011
Abstract: SO-8 Features Industry-standard pinout SO-8 Package Compatible with Existing Surface Mount , MIN .0532 e1 8 6 MAX A1 .0040 5 A MIN 0.25 [.010] 4 A MAX 8X , ° 8° K x 45° C A1 y 0.10 [.004] 8X L 8X c 7 C A B FOOT PRINT NOT ES : 1. DIMENS IONING & T OLERANCING PER AS ME Y14.5M-1994. 8X 0.72 [.028] 2. CONT ROLLING DIMENS ION , . 3X 1.27 [.050] 8X 1.78 [.070] SO-8 Part Marking EXAMPLE: THIS IS AN IRF7101 (MOSFET International Rectifier
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IRF7309P IRF7309TRP IRF7309 EIA-481 EIA-541 D-020D
Abstract: °2-56 UNC 2 M 1,6 B 4,2 35 0,05 B 8X Figure 3-3. 45° X 0,5 Bolster Isolator ± , 29 0,05 8X 4 45° X 0,5 Application Note 6309A­ATARM­19-Apr-07 Application Note , ­ATARM­19-Apr-07 4. Related AT91 Evaluation Boards Layout and Pinout This section shows the layout and pinout for , EBI Connector Layout and Pinout J14 Interposer 100 TOP AT91SAM7SE-EK Board edge 4,0 A1 E1 , SPARE1 SPARE0 E20 D20 NRST AT91SAM7SE-EK EBI CONNECTOR PINOUT 6 Application Note Atmel
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AT91SAM AT91SAM9260-EK loctite 243 7170 d29 08 PB20 ATMEL A4 AT91SAM9XE-EK
Abstract: + ESD Channels *See Package/Pinout Diagrams for expanded pin information. © Semiconductor , CM1408â'04DE PACKAGE / PINOUT DIAGRAMS Top View (Pins Down View) 8 7 6 5 1 2 3 4 N08 4E GND , C NOTE 4 A1 SIDE VIEW C SEATING PLANE D2 DETAIL A 8X 1 ÇÇ ÉÉ ÇÇà , BSC 0.25 REF 0.20 0.40 â'â'â' 0.15 RECOMMENDED SOLDERING FOOTPRINT* L 4 8X 1.70 PACKAGE OUTLINE 0.50 E2 8 5 e BOTTOM VIEW 8X b 2.30 1.00 0.10 C A B ON Semiconductor
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CM1408-04DE 511BE 04DE/D
Abstract: VN 3 1 2 VN 3 1 2 3 4 Note: DAP (Die Attach Pad) is on back-side of chip. . PACKAGE / PINOUT , DESCRIPTIONS Pins (Refer to package / pinout diagrams) (Refer to package / pinout diagrams) NAME CHx VN , 0.008 0.006 0.010 0.014 8X 0.10 M uDFN MO-229C* 8 Inches Nom 0.020 0.001 0.008 0.067 0.047 0.053 , REF TOP VIEW 0.020 BSC 0.016 A1 A3 SIDE VIEW 8X 0.10 M A Controlling dimension , of the D, E and L dimensions as called out in the table above. e 8X 0.10 M CAB b Pin 1 California Micro Devices
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IR 229C 4VN2 SOT-95 CM1248-04S9 CM1248-04QG CM1248-04QF
Abstract: 4 EMI Filtering + ESD Channels * See Package/Pinout Diagrams for expanded pin information , Filter Channel 1 Device Ground Pin 1 Marking 6E GND PAD PACKAGE / PINOUT DIAGRAMS Top View (Pins Down , MOLD CMPD A1 DETAIL B ÉÉÉ ÉÉÉ ÇÇÇ A3 0.08 C NOTE 4 SIDE VIEW D2 A1 8X C L E2 , 0.15 DETAIL A 1 4 K e e/2 8 5 RECOMMENDED SOLDERING FOOTPRINT* 8X b 0.10 C A B 0.05 C NOTE 3 1.30 0.43 8X BOTTOM VIEW 1.65 0.50 0.25 8X 0.40 PITCH DIMENSION ON Semiconductor
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CM1436-04DE marking 6E CM1436 MIL-STD-883 511BF CM1436-04DE/D
Abstract: /Pinout Diagrams for expanded pin information. MARKING DIAGRAM WE ï'· Four Channels of EMI , CM1431â'04DE PACKAGE / PINOUT DIAGRAMS Top View (Pins Down View) 8 7 6 5 Pin 1 Marking Bottom , B 0.08 C SIDE VIEW DETAIL A D2 1 K 8 A1 C 8X 4 5 e e/2 A3 , â'â'â' 0.15 L E2 RECOMMENDED SOLDERING FOOTPRINT* 8X b 0.10 C A B 0.05 C 1.30 8X 0.43 NOTE 3 BOTTOM VIEW 1.65 0.50 0.25 8X 0.40 PITCH DIMENSION: MILLIMETERS *For ON Semiconductor
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CM1431-04DE IEC61000
Abstract: 8.5 pF 8.5 pF C FILTER+ESDn* Pins 5 - 8 1 of 4 EMI / RFI + ESD Channels *See Package/Pinout , Rev. 3 1 Publication Order Number: CM1408-04DE/D CM1408-04DE PACKAGE / PINOUT DIAGRAMS Top , 1 4 8X ALTERNATE CONSTRUCTIONS C SEATING PLANE DETAIL A L RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE 1.70 0.50 8X E2 8 5 e BOTTOM VIEW 8X b 0.10 C A B 0.05 C NOTE 3 1.00 2.30 1 0.50 PITCH 0.30 DIMENSIONS: MILLIMETERS 8X *For additional ON Semiconductor
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14 pin mobile phone camera pinout 20 pin mobile phone camera pinout
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