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551012876-001 Texas Instruments MSOP 8L 10L Amplifier Universal Evaluation PCB (unpopulated) ri Buy
CC1100EM_PCB_REF_DES Texas Instruments CC1100EM PCB Antenna Reference Design ri Buy
ADS8410-13REF Texas Instruments ADS8410-13REF Circuit Board ri Buy

PCB design for very fine pitch csp package

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: ) are the best package choice for your design. For the smallest size and highest reliability, the uBGA package remains the best single-die CSP for your design. For applications that use flash and SRAM, the , -mm ball pitch that allows for easy PCB Package Highlights: uBGA Package s Smallest single die package , handling s Printed Circuit Board (PCB) design considerations (trace/space, via, etc.) s CSP to PCB , (additional PCB design and manufacturing considerations) 1.1 CSP Applications Intel provides a full ... Intel
Original
datasheet

72 pages,
3751.96 Kb

bga rework Serial Flash 13640 diagram of gunn diode Intel Stacked CSP 28F3202C3 PSA B14 2900 micron tsop 48 PIN tray BGA reflow guide intel MOTHERBOARD pcb design in uBGA device MARKing intel 28F160C18 BGA Solder Ball 0.35mm collapse reballing csp process flow diagram TEXT
datasheet frame
Abstract: PCB Test PCB TABLE 1. Surface mount packages recommended for Wave Solder Immersion. Package , For Fine Pitch SM Packages Those solder pastes specifically designed for high lead count, fine pitch , point to point dispensing. Solder pastes specifically formulated for fine pitch SM components should , which it was taken. Water Soluble Solder Paste For Fine Pitch Surface Mount Packages Water soluble , most significant contributing factor to this reduction has been the inclusion of fine pitch, Surface ... National Semiconductor
Original
datasheet

10 pages,
947.74 Kb

epoxy adhesive paste cte table micron tsop 48 PIN tray IPC 6012 reflow temperature bga laptop IPC-6012 TEXT
datasheet frame
Abstract: Packages related to mounting devices to a PCB. Included is information on PCB layout for Systems Engineers, and manufacturing processes for Manufacturing Process Engineers. The Flip Chip CSP is a wafer , , depending on customer requirements. Package Overview Flip Chip CSP "Package" Overview Chip Scale , Publication Order Number: AND8081/D AND8081/D AND8081/D AND8081/D Printed Circuit Board Design Table 1. PCB Assembly Recommendations Recommended PCB Layout Two types of land patterns are commonly used for surface mount ... ON Semiconductor
Original
datasheet

6 pages,
85.42 Kb

underfill dispense needle dispense needle for csp IPC-SM-785 J-STD-005 AND8081/D TEXT
datasheet frame
Abstract: -ball Fine Pitch Ball Grid Array (FBGA) 0.80 mm pitch, 9 x 8 mm package WH = 63-ball Fine Pitch Ball Grid Array (FBGA) 0.80 mm pitch, 12 x 11 mm package WM = 48-ball Fine Pitch Ball Grid Array (FBGA) 0.80 mm pitch, 12 x 6 mm package DEVICE NUMBER/DESCRIPTION Valid Combinations for BGA Daisy Chain Density Package Order Number Package Marking 16 Mb 9 x 8 Fine Pitch BGA (WC) 13 x 11 mm Fortified BGA , fine pitch BGA package", Proc of SMI, pp 105-111, 1998. [4] C.F. Coombs Jr., "Printed Circuits ... Advanced Micro Devices
Original
datasheet

11 pages,
244.52 Kb

weibull test data 0.3mm pitch csp package bt resin FR4 substrate height and thickness HASL pi metal detector pitch 0.4mm BGA TSOP48 Thermal BGA Solder Ball 0.35mm Coffin-Manson Equation FBGA 63 0.4mm pitch BGA thermal cycling data weibull JEDEC FBGA 0.3mm pitch BGA eh 11757 TEXT
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Abstract: to fit standard JEDEC defined CSP footprint designs and hence avoid any requirements for fine pitch , . Specific guidelines for use and initial product performance are then discussed. Package Design Considerations Design for high volume assembly in commercial electronic equipment dictated the following constraints: a) Must be suitable for use with clean and no-clean flux processes b) Pitch of interconnects , FlipFETTM MOSFET Design for High Volume SMT Assembly Hazel Schofield, Tim Sammon, Aram Arzumanyan ... International Rectifier
Original
datasheet

6 pages,
74.3 Kb

with or without underfill process of mosfet joint IRF6150 IRF6100 gold embrittlement TEXT
datasheet frame
Abstract: design considerations. Specific guidelines for use and initial product performance are then discussed. Package Design Considerations Design for high volume assembly in commercial electronic equipment , for fine pitch substrate conductor definition. The size of the solder bumps has been designed to be , (b) pitch of interconnects must suit existing track design rules (c) interconnect material must , package design and this phenomenon was completed using a FEA model developed by Scott Popelar at IC ... International Rectifier
Original
datasheet

4 pages,
87.27 Kb

IRF6150 IRF6100 TEXT
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Abstract: close proximity to the device typical of those recommended for fine pitch. The fiducial targets allow , niicro-BGA package is a true CSP (chip size package) that gives system design engineers the smallest , routing underneath the package using standard PCB design rules, which often results in a smaller footprint , seen in either the package body or the board. On full-size BGA packages, for example, the |EDEC spec , P. Raad, S. Chen, R. Keith, "BGA Package Design: a Characterisation of the Effects of Molten ... OCR Scan
datasheet

18 pages,
7890.57 Kb

USR(pet) k type thermocouple utl gold embrittlement DALE SOMC of BGAS CU-106A shelf life CU-106A Indium Tac Flux 020 TEXT
datasheet frame
Abstract: pin count, the size of a W-CSP is 50 percent of the size of the fine pitch BGA and 25 percent of the fine pitch QFP package. The weight of Oki's ASIC W-CSP is one-fourth of BGA and one-tenth of QFP , functionality, smaller device size and lower costs are major challenges for today's ASIC design engineers , design issues < Oki is a leader in packaging solution choices with its W-CSP packaging technology for , package responds to the market demand for feature-rich ASIC solutions < < < · The Oki's W-CSP ... OKI Electric Industry
Original
datasheet

14 pages,
7483.36 Kb

oki packaging gps watch ceramic QFP Package 100 lead 2asic 0.4mm pitch BGA wcsp reliability oki pitch 0.3mm pitch csp package TEXT
datasheet frame
Abstract: Daisy-Chained Pinout List (195ZWV 195ZWV nFBGA Package) . 10 PCB Layout for , mm pitch Fine pitch requirement · Infra. issue (KGD) CSP (chip scale pkg.) solution · , ball pitch) QFP-0.5 BGA Package size QFP-0.4 CSP Bare chip (bump) Pin count Figure , www.ti.com PCB Design Considerations The nFBGA package has been fully qualified in numerous , (Not to scale) A = Via diameter on package B = Land diameter on PCB Ratio A/B should equal 1.0 for ... Texas Instruments
Original
datasheet

66 pages,
3048.29 Kb

HOT TO READ THE LABLE ON THE BOX 10x10mm BGA package thermal resistance .65mm bga land pattern nfbga tray repair tips of laptops SPRAA99 195ZWV tray bga 8x8 tqfp 64 pcb land pattern ti lable information TEXAS INSTRUMENTS, DIE ATTACH, CSP 72ZST 385Z SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance nFBGA 65X65 "0.4mm" bga "ball collapse" height TEXT
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Abstract: Standard, No. 95-1, "Design Requirements for Outlines of Solid State and Related Products." Fine Pitch , BGA's meet Jedec Standard No. 95-1 for Fine Pitch Ball Grid Array components. This specification , Packaging" [3] J.H. Lau and Y.H. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch , PCB. This controls the height of the BGA, and will allow for a more predictable solder alloy , joints to ensure trouble-free operation of the part. When designing a PCB for a BGA, the designer should ... Fairchild Semiconductor
Original
datasheet

7 pages,
118.36 Kb

bga rework station bga thermal cycling reliability Fairchild, BGA fbga Substrate design guidelines FDZ202P fine BGA thermal profile laser reball reball INTEL reflow hot air BGA Intel BGA Solder Loctite 3567 thick bga die size Loctite rework reflow hot air BGA underfill TEXT
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Archived Files

Abstract Saved from Date Saved File Size Type Download
fine pitch placement system. What makes the uBGA package unique from other CSPs is the Guide for uBGA* Packages . Chapter 5 will lead you through PCB design, the Solder Stencil and Reflow memory devices in the uBGA chip-size package (CSP) since mid-1997. There has been rapid acceptance of the than the current leaded packages. Because the package uses eutectic solder balls on a 0.75-mm pitch, issues such as coplanarity are a thing of the past. This package works with standard low-cost PCB
/datasheets/files/intel/products one/design/flash/bblock/ubga.htm
Intel 01/05/1999 20.19 Kb HTM ubga.htm
fine pitch placement system. What makes the uBGA package unique from other CSPs is the Guide for uBGA* Packages . Chapter 5 will lead you through PCB design, the Solder Stencil and Reflow memory devices in the uBGA chip-size package (CSP) since mid-1997. There has been rapid acceptance of the than the current leaded packages. Because the package uses eutectic solder balls on a 0.75-mm pitch, issues such as coplanarity are a thing of the past. This package works with standard low-cost PCB
/datasheets/files/intel/products one/design/flash/abblock/ubga.htm
Intel 01/05/1999 20.2 Kb HTM ubga.htm
fine pitch placement system. What makes the uBGA package unique from other CSPs is the Guide for uBGA* Packages . Chapter 5 will lead you through PCB design, the Solder Stencil and Reflow memory devices in the uBGA chip-size package (CSP) since mid-1997. There has been rapid acceptance of the than the current leaded packages. Because the package uses eutectic solder balls on a 0.75-mm pitch, issues such as coplanarity are a thing of the past. This package works with standard low-cost PCB
/datasheets/files/intel/design/flash/bblock/ubga.htm
Intel 01/02/1999 19.81 Kb HTM ubga.htm
recommended for fine pitch. Type 3 or 4 is the recommended solder paste for LLP packages.   advantages of LLP?    Small footprint (yields savings in PCB real estate)        Thin package Uses standard surface mount equipment and flow for PCB assembly.      There are no lead coplanarity issues with this package. Is National the only company offering this type of CSP during PCB design, stencil design and SMT assembly steps to ensure a successful SMT process. Is
/datasheets/files/national/faq3.html
National 25/09/2003 13.43 Kb HTML faq3.html
important  for the end user to follow during PCB design, stencil design and SMT assembly steps to ensure a GHz.  Actual maximum frequency is design dependent. What reliability data is available for this package ) Yes. Can we use a type 1 or 2 solder paste? a) No.  These are not recommended for fine pitch savings in PCB real estate)        Thin package ( cross talk and ground bounce)      Uses standard surface mount equipment and flow for PCB
/datasheets/files/national/htm/nsc02381-v3.htm
National 16/08/2002 17.52 Kb HTM nsc02381-v3.htm
important  for the end user to follow during PCB design, stencil design and SMT assembly steps to ensure a GHz.  Actual maximum frequency is design dependent. What reliability data is available for this package ) Yes. Can we use a type 1 or 2 solder paste? a) No.  These are not recommended for fine pitch savings in PCB real estate)        Thin package ( cross talk and ground bounce)      Uses standard surface mount equipment and flow for PCB
/datasheets/files/national/htm/nsc00909.htm
National 01/11/2002 18.57 Kb HTM nsc00909.htm
equipment investments for our customers in small form factor applications where fine pitch packaging is Industry Support Paves The Way For Intel Flash Memory uBGA* Package process are significantly reducing die size. For the user to benefit fully, the package must also shrink. The 40-bump uBGA package is 80% smaller than the 40-lead TSOP package, for example. Both die and package shrinks will open new applications for flash memory. Harvey Miller Kirk-Miller Associates
/datasheets/files/intel/design/news/endorse.htm
Intel 31/01/1997 29.56 Kb HTM endorse.htm
grid arrays (BGA), 1.0-mm fine pitch BGAs (FG), and 0.8-mm chip scale packages (CSP). Xilinx has added three new fine pitch BGA packages for the Virtex-E offering in 860- (FG860 FG860), 900- (FG900 FG900), and 1156- as well," said Paul Chang, manager of Hardware Design Group at Cisco Systems. "I'm very impressed Virtex-E series in design implementation and system level integration. Additional Xilinx DSP cores for Xilinx delivers two million gate Virtex solution for
/datasheets/files/xilinx/docs/rp00002/rp0029a.htm
Xilinx 06/03/2000 15.58 Kb HTM rp0029a.htm
No abstract text available
/download/49104857-995987ZC/xapp542.zip ()
Xilinx 11/11/2004 9180.01 Kb ZIP xapp542.zip