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    NP276-11052 Search Results

    NP276-11052 Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    10119110-526003LF Amphenol Communications Solutions BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angle Header, Through Hole, Double row , 26 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    54121-105201150LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    10076801-105-20LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 20 Positions, 2.54mm (0.100in) Pitch, Pin In Paste Visit Amphenol Communications Solutions
    54121-105250850LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 25 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions

    NP276-11052 Datasheets (7)

    Part ECAD Model Manufacturer Description Curated Type PDF
    NP276-110522AC-09796 Yamaichi Electronics Ball Grid Array (BGA, 1.27mm Pitch) Original PDF
    NP276-110522AC-11940 Yamaichi Electronics Ball Grid Array (BGA, 1.27mm Pitch) Original PDF
    NP276-110522AC-15751 Yamaichi Electronics Ball Grid Array (BGA, 1.27mm Pitch) Original PDF
    NP276-110522AC-16905 Yamaichi Electronics Ball Grid Array (BGA, 1.27mm Pitch) Original PDF
    NP276-110522AC-16906 Yamaichi Electronics Ball Grid Array (BGA, 1.27mm Pitch) Original PDF
    NP276-110522AC-17393 Yamaichi Electronics Ball Grid Array (BGA, 1.27mm Pitch) Original PDF
    NP276-110522AC-22842 Yamaichi Electronics Ball Grid Array (BGA, 1.27mm Pitch) Original PDF