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MS-013AE

Catalog Datasheet MFG & Type PDF Document Tags

751F-01

Abstract: soic 28 wide body : 98ASB42345B REV: G 10 MAR 2005 CASE NUMBER: 751F-05 STANDARD: MS-013AE 0. 29 0. 13 0. 32 0. 23 8° 0 , : 751F-05 STANDARD: MS-013AE NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING , 2005 CASE NUMBER: 751F-05 STANDARD: MS-013AE
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OCR Scan
751F-01 soic 28 wide body MS-013-AE 5M-1994

MS-012-AC

Abstract: ASEA -013AD MS-013AE JEDEC Outline Designation NOTES: 1. Webbed lead frame. Leads indicated are internally , -013AA MS-013AB MS-013AC MS-013AD MS-013AE JEDEC Outline Designation NOTES: 1. Webbed lead
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Original
MS-012-AC ASEA MS-013-AA MS-012AB Package MS 013AA MA007 MA-007 MS-012AA MS-012AB MS-012AC MA-008A MS-013AA

ansi y14.5m-1982

Abstract: 5M-1982 NOTES: 7.60 [.2992] 7.40 [.2914] EE i 18.10 [.7125] 17.70 [.6969] EB 11.27 [.050] 26X ^J L- ]0.635 [.025] | -28X 0.49 [.0192] DIMENSIONING & TOLERANCING PER ANSI Y14.5M-1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES], OUTLINE CONFORMS TO JEDEC OUTLINE MS-013AE. DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE. DIMENSION DOES NOT INCLUDE MOLD PROTUSIONS. MOLD PROTUSIONS SHALL NOT EXCEED 0.15 [.006], 0.35 [.0138] H0.25 [.010] é|Ç|B
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OCR Scan
ansi y14.5m-1982

MS 013AA

Abstract: A18 sot -013AA MS-013AA MS-013AB MS-013AC MS-013AD MS-013AE JEDEC Outline Designation NOTES: 1 , -013AA MS-013AA MS-013AB MS-013AC MS-013AD MS-013AE JEDEC Outline Designation NOTES: 1
Allegro MicroSystems
Original
A18 sot MS-012AA Package A16 SOT SOIC-7 xtal 32.768 MS-013-AB

MS-013-AE

Abstract: RW-28 STANDARDS MS-013AE CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE
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RW-28 7126

MS-013-AE

Abstract: 28-Lead Standard Small Outline Package [SOIC_W] Wide Body (RW-28) Dimensions shown in millimeters and (inches) a 18.10 (0.7126) 17.70 (0.6969) 15 28 7.60 (0.2992) 7.40 (0.2913) 14 2.65 (0.1043) 2.35 (0.0925) 0.30 (0.0118) 0.10 (0.0039) COPLANARITY 0.10 10.65 (0.4193) 10.00 (0.3937) 1.27 (0.0500) BSC 0.51 (0.0201) 0.31 (0.0122) SEATING PLANE 0.75 (0.0295) × 45° 0.25 (0.0098) 8° 0° 0.33 (0.0130) 0.20 (0.0079) COMPLIANT TO JEDEC STANDARDS MS-013-AE
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14AD

Abstract: MS-013-AE 28P2V-A Plastic 28pin 375mil SOP EIAJ Package Code SOP28-P-375-1.27 JEDEC Code MS-013AE Weight(g) 0.67 Lead Material Cu Alloy e 15 E Recommended Mount Pad 1 Symbol F 14 A D A2 A1 b y L e L1 HE e1 I2 28 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters Min Nom Max ­ ­ 2.65 0.1 0.2 0.3 ­ 2.3 ­ 0.35 0.4 0.49 0.23 0.25 0.3 17.8 17.9 18.0 7.4 7.5 7.6 ­ 1.27
Mitsubishi
Original
14AD 28P2V SOP28 package SOP28-P-375-1
Abstract: 7.60 [.2992] 7.40 [.2914] S i NOTES: 18.10 [.7125] 17.70 [.6969] S 11.27 [.050] 26X ^J L ] 0.635 [.025] | -28X 0.49 [.0192] DIMENSIONING & TOLERANCING PER ANSI Y14.5M-1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES], OUTLINE CONFORMS TO JEDEC OUTLINE MS-013AE. DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE. DIMENSION DOES NOT INCLUDE MOLD PROTUSIONS. MOLD PROTUSIONS SHALL NOT EXCEED 0.15 [.006], 0.75 [.029] c 0.25 [.010] A 3 0.35 [.0138] H0.25 [.010 -
OCR Scan

DIMENSIONS soic 28

Abstract: STANDARDS MS-013AE CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE
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DIMENSIONS soic 28

MS-013-AA

Abstract: PS28A # MS-013AA MS-013AC MS-013AD MS-013AE DWG# PS16A PS20A PS24A PS28A Symbol
Integrated Device Technology
Original
MS-013-AC 0044 300-MIL

075E06

Abstract: . OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION ISSUE DATE
Philips Semiconductors
Original

MS-013-AE

Abstract: 28 MS-013 Package Plastic Packages for Integrated Circuits Small Outline Plastic Packages (SOIC) M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 MIN MAX MILLIMETERS MIN MAX NOTES A 3 L 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B -CA1 B 0.25(0.010) M C B S NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section
Intersil
Original
28 MS-013 Package

MS-013-AE

Abstract: 28 MS-013 Package Plastic Package Small Outline Plastic Package (SOIC) M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 MIN MILLIMETERS MAX MIN MAX NOTES A 3 L 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B -C- e 0.25(0.010) M 9 0.32 - 0.6969 0.7125 17.70 18.10 3 0.2914 0.2992 7.40 7.60 4 0.05
Intersil
Original
Abstract: Plastic Packages for Integrated Circuits Small Outline Plastic Packages (SOIC) M28.3 (JEDEC MS-013-AE ISSUE C) N 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 MAX MILLIMETERS MIN MAX NOTES A L 0.0926 0.1043 2.35 2.65 - A1 3 0.0040 0.0118 0.10 0.30 - B a B - 0.6969 0.7125 17.70 18.10 3 0.2914 0.2992 7.40 7.60 4 0.05 BSC Intersil
Original
Abstract: free 20L SOIC 20L SOIC GREEN 20 SOIC G MS-013-AE 85 °C/W 30 °C/W MSL 1 / 250°C Matte Sn e3 RoHS , SOIC MS-013-AE 85 °C/W 30 °C/W MSL 1 / 250°C SnPb plate na Not Pb-free JC JEDEC Moisture Device Engineering
Original
DEI3283 MIL-STD-883B RM3283 RM3183 HI-8482

DEI3283

Abstract: DEI3283-SAS SnAgCu solder dip e1 Pb free 20L SOIC 20L SOIC GREEN 20 SOIC G MS-013-AE Reference (see ordering info) JEDEC MO Reference THERMAL RESISTANCE: JA (4 layer PCB) JC 20 SOIC MS-013-AE 85 °C/W 30 °C/W
Device Engineering
Original
DEI3283-SAS dei3283-ses M1-0104 DS-MW-03283-01 EI3283-CMS-G DEI3283-EMB DEI3283-EMS DEI3283-SAB

MS-013-AE

Abstract: . Falls within JEDEC MS-013-AE with the exception of the number of leads. F. Lead dimension is the
Texas Instruments
Original
MPDS105 R-PDSO-G8/28 4202103/B

MO-137-AB

Abstract: pericom sot23-6 /A N/A MS-013AA MS-013AC MS-013AD MS-013AE EIAJ SC-74A EIAJ SC-74A MO-187AA MO-118AA MO
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PD-1210 PD-1803 PD-1230 PD-1308 PD-1301 PD-1401 MO-137-AB pericom sot23-6 PD2001 MO-150AH MO-150AB TSSOP-48 TSSOP-56 BQSOP-40 BQSOP-48 BQSOP-80 SC70-5

MPDS106A

Abstract: R-PDSO-G12 from seating plane. I. Falls within JEDEC MS-013-AE with the exception of the number of leads
Texas Instruments
Original
MPDS106A R-PDSO-G12 D1065 R-PDSO-G12/28 4202104/B
Abstract: Small Outline Plastic Packages (SOIC) M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE -
OCR Scan
HI5735 HBC-10 HI5735KCP HI5735KCB H15735 IS09000

SOT23W-3

Abstract: transistor crossreference mount, 1.27 mm lead pitch MS-013AA MS-013AC MS-013AD MS-013AE Pictorial View/ Representative , , 1.27 mm lead pitch MS-013AA MS-013AB MS-013AC MS-013AD MS-013AE Pictorial View
Allegro MicroSystems
Original
PUB26013 SOT23W-3 transistor crossreference footprint soic DFN 10 socket 16 soic pcb footprint DUAL ROW QFN leadframe
Abstract: CONFORMS TO JEDEC OUTLINE MS-013AE. f i n DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE -
OCR Scan
IR2117 M0-047AC 554S2

SOT23W-3

Abstract: tssop 38 footprint -013AA MS-013AC MS-013AD MS-013AE 16 20 24 28 LC Plastic small-outline IC (SOIC, SO, SOP) with , , 1.27 mm lead pitch MS-013AA MS-013AB MS-013AC MS-013AD MS-013AE 16 18 20 24 28 LY
Allegro MicroSystems
Original
tssop 38 footprint MS-018-AC PLCC 44 pin through hole MO-220WGGC SOT23 MARK EW GTS2000
Abstract: (INCHES). 4 OUTLINE CONFORMS TO JEDEC OUTLINE MS-013AE. f i n DIMENSION IS THE LENGTH OF LEAD FOR -
OCR Scan
IR2152 A/210
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