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CS496102-CQZ Cirrus Logic 32-Bit AUDIO DSP IC; Package/Case:144-LQFP; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No visit Digikey Buy
CS496112-CQZ Cirrus Logic 32-Bit AUDIO DSP IC; Package/Case:144-LQFP; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes visit Digikey Buy
CS181002-CQZ Cirrus Logic 32-bit Microprocessor IC; Package/Case:144-LQFP; Leaded Process Compatible:No; MIPS:120; Peak Reflow Compatible (260 C):No visit Digikey Buy

MOA4 Package

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: MF1 MOA4 S70 Rev. 2.0 January 2004 1 General Information 1.1 Addendum This document gives specifications for the product MF1 MOA4 S70. The MF1 MOA4 S70 is the integrated circuit MF1 ICS70 in the package , package is given in the MOA4 Contactless Chip Card Module Specification. Functionality of the integrated , CHIP CARD MODULES ADDENDUM MF1 MOA4 S70 Contactless Chip Card Module Specification Preliminary Specification Revision 2.0 PUBLIC Philips Semiconductors January 2004 MF1 MOA4 S70 Philips Semiconductors
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MOA4 MOA4 package specification MIFARE Card Coil Design Guide MIFARE s70 chip SOT500BA2 Philips MF1 IC S70 SCA74
Abstract: MF1 MOA4 S70 Rev. 3.0 February 2004 1 General Information 1.1 Addendum This document gives specifications for the product MF1 MOA4 S70. The MF1 MOA4 S70 is the integrated circuit MF1 ICS70 in the package , package is given in the MOA4 Contactless Chip Card Module Specification. Functionality of the integrated , CHIP CARD MODULES ADDENDUM MF1 MOA4 S70 Contactless Chip Card Module Specification Product Specification Revision 3.0 PUBLIC Philips Semiconductors February 2004 MF1 MOA4 S70 Rev. 3.0 Philips Semiconductors
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Mifare MF1 IC S 70 MIFARE s70 Mifare MOA4 module package MIFARE Card IC Coil Design Guide
Abstract: MF1 MOA4 S20 Contactless chip card module Rev. 03.00 - 25 July 2007 Product data sheet 142130 PUBLIC 1. Introduction This document gives specifications for the product MF1 MOA4 S20.The MF1 MOA4 S20 is the integrated circuit MF1 IC S20 in the package SOT500BA2. Therefore this document , specification of the integrated circuit.Detailed information on the package is given in the MOA4 Contactless , . Ordering information Type number Package Name MF1 MOA4 S20 / D Description Version 9352 NXP Semiconductors
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MIL883D
Abstract: MF1 MOA4 S70 Contactless chip card module Rev. 03.01 - 2 April 2007 Product data sheet 092931 PUBLIC 1. Introduction This document gives specifications for the product MF1 MOA4 S70.The MF1 MOA4 S70 is the integrated circuit MF1 ICS70 in the package SOT500BA2. Therefore this document , specification of the integrated circuit.Detailed information on the package is given in the MOA4 Contactless , . Ordering information Type number Package Name MF1 MOA4 S70 / D Description Version 9352 NXP Semiconductors
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moa4 specifications
Abstract: specifications for the product MF0 MOA4 U10. The MF0 MOA4 U10 is the integrated circuit MF0 IC U10 in the package SOT500BA2. Therefore this document encompasses all information not covered by the specification of the package and/or the functional specification of the integrated circuit. Detailed information on the package is given in the MOA4 contactless chip card module specification. Functionality of , MF0 MOA4 U10 Mifare ultralight contactless chip card module Rev. 3.1 - 7 February 2007 NXP Semiconductors
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MIFARE Ultralight
Abstract: specifications for the product MF1 MOA4 S50. The MF1 MOA4 S50 is the integrated circuit MF1 ICS50 in the package , package and/or the functional specification of the integrated circuit. Detailed information on the package is given in the "MOA4 contactless chip card module specification". Functionality of the , . Ordering information Table 1. Ordering information Type number Package Name MF1 MOA4 S50 / D , MF1 MOA4 S50 Contactless Chip Card Module Specification Rev. 3.2 - 19 December 2006 Product NXP Semiconductors
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MOA4 S50 mifare s50 MIFARE mf1 s50 mifare s50
Abstract: MF1SPLUS8001DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, SOT500-2 4 kB EEPROM, 7-byte UID MF1SPLUS8011DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 , carrier package; 35 mm wide tape, SOT500-2 2 kB EEPROM, 7-byte UID MF1SPLUS6011DA4/03 MOA4 PLLMC , MF1SPLUS6031DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, SOT500-2 2K , IC 5. Ordering information Table 2. Ordering information Type number Package Commercial NXP Semiconductors
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mifare plus functional specification Mifare plus commands Mifare PLUS X command reference write perso mifare plus MIFARE PLUS 14443-4 command MF1ICS50 MF1ICS70 AES-128
Abstract: IC 5. Ordering information Table 2. Ordering information Type number Package Commercial , kB EEPROM, 7-byte UID MF1SPLUS8001DA4/03 PLLMC plastic leadless module carrier package; 35 , package; 35 mm wide tape, SOT500-2 4 kB EEPROM, 4-byte UID MF1SPLUS8021DUD/03 FFC - 8 inch wafer , /03 PLLMC plastic leadless module carrier package; 35 mm wide tape, SOT500-2 4 kB EEPROM, 4 , package; 35 mm wide tape, SOT500-2 2 kB EEPROM, 7-byte UID MF1SPLUS6011DUD/03 FFC - 8 inch wafer NXP Semiconductors
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mifare classic 1k Mifare plus protocol 14443-4 Mifare Plus X 4K UID 7 Byte ISO 14443-4 Mifare Plus
Abstract: MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 4 kB EEPROM, 4-byte UID, L1 card SOT500-2 MF1PLUS8031DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 , -2 MF1PLUS6011DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 2 kB EEPROM, 4 , Version MF1PLUS8001DA4/13 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape , MF1PLUS6001DA4/13 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 2 kB EEPROM, 7 NXP Semiconductors
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Mifare PLUS X Mifare plus security level 3 Mifare PLUS X commands MF1SPLUS mifare write perso nxp MF1PLUS6001DUD
Abstract: , L1 card - MF1PLUS8011DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm , MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 2 kB EEPROM, 4-byte UID , MF1PLUS8001DA4/13 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 4 kB EEPROM, 7 , 5. Ordering information Table 2. Ordering information Type number Package Commercial , kB EEPROM, 7-byte UID, L1 card - MF1PLUS8001DA4/03 MOA4 PLLMC plastic leadless module NXP Semiconductors
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mifare classic 1k card mifare plus personalization Mifare plus security level Mifare plus structure Car security system block diagram proximity card reader circuit design
Abstract: -byte non-unique ID - MF1S7030XDA4 MOA4 plastic leadless module carrier package; 35 mm wide tape, 4 , 1.4 Delivery options · 7-byte UID, 4-byte NUID · bumped die on wafer · MOA4 and MOA8 contactless , number Package Name Description Version MF1S7001XDUD FFC Bump 8 inch wafer, 120 m , , electronic fail die marking according to SECS-II format), Au bumps, 7-byte UID - MF1S7000XDA4 MOA4 plastic leadless module carrier package; 35 mm wide tape, 7-byte UID SOT500-2 MF1S7000XDA8 MOA8 NXP Semiconductors
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MOA8 MIFAre classic Commands MIFARE Classic Command MOA4 dimensions MIFARE Classic Command set auth 60h SOT500-4 MF1S70
Abstract: format), Au bumps, 7-byte UID - MF1S5000XDA4/V1 MOA4 plastic leadless module carrier package , MF1S5030XDA4/V1 MOA4 plastic leadless module carrier package; 35 mm wide tape, 4-byte non-unique ID , -byte NUID â'¢ Bumped die on sawn wafer â'¢ MOA4 and MOA8 contactless module 2. Features and benefits ï , . Ordering information Table 2. Ordering information Type number Package Name Description , package; 35 mm wide tape, 7-byte UID SOT500-4 MF1S5031XDUD/V1 FFC Bump 8 inch wafer, 120 m NXP Semiconductors
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MF1S50
Abstract: smart card IC â'¢ Bumped die on sawn wafer â'¢ MOA4 and MOA8 contactless module 2. Features and , Package Name Description Version MF1S7001XDUD/V1 FFC Bump 8 inch wafer, 120 m thickness, on , fail die marking according to SECS-II format), Au bumps, 7-byte UID - MF1S7000XDA4/V1 MOA4 plastic leadless module carrier package; 35 mm wide tape, 7-byte UID SOT500-2 MF1S7000XDA8/V1 MOA8 plastic leadless module carrier package; 35 mm wide tape, 7-byte UID SOT500 NXP Semiconductors
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MOA8 ev1
Abstract: die on wafer · MOA2, MOA4 and MOB6 contactless module NXP Semiconductors MF1S503x MIFARE , information Package Commercial Name Name MF1S5035DUD/L FFC Bump Description 8 inch wafer, 120 m thickness , MF1S5037DUA MF1S5030DA3 MF1S5030DA4 MF1S5030DA6 FFC FFC Bump FFC MOA2 MOA4 MOB6 PLLMC PLLMC PLLMC 8 , die marking according to SECSII format) applicable plastic leadless module carrier package; 35 mm wide tape plastic leadless module carrier package; 35 mm wide tape plastic leadless module carrier package NXP Semiconductors
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Mifare MOB6 module package mob6 package SOT500-2 package outline nxp MOB6 SOT500-1 MIFARE classic Specification MF1S503
Abstract: -byte UID - MF1S5000XDA4 MOA4 plastic leadless module carrier package; 35 mm wide tape, 7-byte UID SOT500-2 MF1S5000XDA8 MOA8 plastic leadless module carrier package; 35 mm wide tape, 7 , 1.4 Delivery options · 7-byte UID, 4-byte NUID · bumped die on wafer · MOA4 and MOA8 contactless , information Table 2. Ordering information Type number Package Name Description Version , according to SECS-II format), Au bumps, 4-byte non-unique ID - MF1S5030XDA4 MOA4 plastic NXP Semiconductors
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MF1S50YYX CL RC632 UID Mifare 1k commands nxp proximity antenna design NXP RC632 implementing MIFARE Classic
Abstract: MOA2 PLLMC plastic leadless module carrier package; 35 mm wide tape SOT500-1 MF1S5030DA4 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape SOT500-2 MF1S5030DA6 MOB6 PLLMC plastic leadless module carrier package; 35 mm wide tape SOT500-3 MF1S5030DA8 , on wafer, bumped die on wafer · MOA2, MOA4, MOA8 and MOB6 contactless module MF1S503x NXP , information Table 2. Ordering information Type number Package Commercial Name Name Description NXP Semiconductors
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MF1S503x MF1S5035DUH clrc632 antenna MF1S5035DUD e purse MOB6
Abstract: Mainstream contactless smart card IC 14. Package outline For more details on the contactless module MOA4 , on wafer, bumped die on wafer · MOA4 contactless module MF1S703x NXP Semiconductors MIFARE , 5. Ordering information Table 2. Ordering information Type number Package Commercial Name , fail die marking according to SECSII format) not applicable MF1S7035DA4 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape SOT500-2 6. Block diagram RF INTERFACE NXP Semiconductors
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MF1S703x MIFARE 4k Card IC Coil Design Guide RC632 Mifare protocol CONTACTLESS SMART CARD READER RC632 picc antenna substrate MF1S703
Abstract: information Commercial name P3SR008A4 P3SR008A6 MOA4 MOB6 Thickness 320 um ± 10 um 250 um ± 10 um Name PLLMC PLLMC Description plastic leadless module carrier package; 35 mm wide tape plastic leadless module carrier package; 35 mm wide tape Version SOT500-2 SOT500-3 Type number Package P3SR008_SDS_1 © NXP , ) Tstg Tamb Vesd Ilu [1] [2] [3] Parameter input current total power dissipation per package storage NXP Semiconductors
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MSD 7816
Abstract: ] Temperature range [°C] Package Approvals EMC Software Support 106 - 106/212/424 - 106/212/424 , P5DF081 - - HVQFN32: P5DF072EHN/ TOPD4090 HVQFN32 HVQFN48 HVQFN package Writ , encryption - HITAGTM 2 data encryption - HITAGTM S data encryption - Package SO14, Tube , EMV 4.2 yes yes EMV 4.2 Package LQFP32 TSSOP28 Software libraries (EMV 4.2) NDS , - - - - MOA4 Module - MF0MOU2001DA4 (17pF) MF0MOU2101DA4 (50pF) MF1MOA4S50/D NXP Semiconductors
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RC522 OM5596 PN544 NFC controller data sheet NXP PN544 PN544 JCOP 2.4.1 PN544 nfc P5CD081 RC530 RC400 RC531 RS232 18000-6-B
Abstract: MOA4 PLLMC plastic leadless module carrier package; 35 mm SOT500-2 wide tape, 17 pF input , information Type number Package Commercial Name Name Description Version MF0ICU1001W/S7DL , . Contact assignments for SOT500-2 (MOA4) Bonding pad assignments to smart card contactless module , single-ticket IC 11. Package outline PLLMC: plastic leadless module carrier package; 35 mm wide tape , given in the subpackage code. Note 1. Total package thickness, exclusive punching burr. REFERENCES NXP Semiconductors
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MF0ICU1 MIFARE Ultralight Coil Design Guide MIFARE Ultralight as Type 2 Tag MF0MOA4U10 EN753-2 14443 SAK
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