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MO-187-AA

Catalog Datasheet MFG & Type PDF Document Tags

MO-187-AA

Abstract: JEDEC STANDARDS MO-187AA a 8-Lead microSOIC Package [MSOP] (RM-8) Dimensions shown in millimeters 3.00 BSC 8 5 4.90 BSC 3.00 BSC 1 4 PIN 1 0.65 BSC 1.10 MAX 0.15 0.00 0.38 0.22 COPLANARITY 0.10 0.23 0.08 8 0 SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-187AA 0.80 0.40 -
-
Original
MO-187-AA JEDEC STANDARDS MO-187AA

coplanarity

Abstract: MO-187AA 8-Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters a 3.00 BSC 8 5 4.90 BSC 3.00 BSC 1 4 PIN 1 0.65 BSC 1.10 MAX 0.15 0.00 0.38 0.22 COPLANARITY 0.10 0.23 0.08 8 0 SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-187AA 0.80 0.60 0.40 -
-
Original
coplanarity

MO-187-AA Package

Abstract: JEDEC MO-187 8-Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters a 3.20 3.00 2.80 8 3.20 3.00 2.80 1 PIN 1 5.15 4.90 4.65 4 0.65 BSC 0.95 0.85 0.75 0.15 0.00 5 1.10 MAX 0.38 0.22 COPLANARITY 0.10 SEATING PLANE 0.23 0.08 8° 0° COMPLIANT TO JEDEC STANDARDS MO-187-AA 0.80 0.60 0.40 -
-
Original
MO-187-AA Package JEDEC MO-187 MO-187

DIMENSIONS

Abstract: BSC -23-01n15 a 8-Lead MSOP Package [MSOP] (RM-8) Dimensions shown in millimeters 3.00 BSC 8 5 4.90 BSC 3.00 BSC 1 4 PIN 1 0.65 BSC 1.10 MAX 0.15 0.00 0.38 0.22 COPLANARITY 0.10 0.23 0.08 8 0 SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-187AA 0.80 0.40 -
-
Original
DIMENSIONS BSC -23-01n15

MO-187AA

Abstract: a 8-Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters 3.00 BSC 8 5 4.90 BSC 3.00 BSC 1 4 PIN 1 0.65 BSC 1.10 MAX 0.15 0.00 0.38 0.22 COPLANARITY 0.10 0.23 0.08 8 0 SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-187AA 0.80 0.40 -
-
Original

MO-187-AA Package

Abstract: JEDEC MO-187 aa . Dimensioning and tolerancing conform to JEDEC MO-187-AA and AMSEY14.5m-1994. 3. Plastic or metal protrusions
-
Original
JEDEC MO-187 aa

MO-187-AA Package

Abstract: JEDEC MO-187 . Dimensions are in millimeters. 2. Dimensioning and tolerancing conform to JEDEC MO-187-AA and AMSE Y14
Intersil
Original
land pattern for msOP 8 8L AA 118a MDP0043

MO-187-AA

Abstract: JEDEC STANDARDS MO-187AA a 8-Lead MSOP Package [MSOP] (RM-8) Dimensions shown in millimeters 3.00 BSC 8 5 4.90 BSC 3.00 BSC 1 4 PIN 1 0.65 BSC 1.10 MAX 0.15 0.00 0.38 0.22 0.23 0.08 8 0 SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-187AA 0.80 0.40 -
-
Original
187AA 8 MSOP jedec
Abstract: 2. Dimensioning and tolerancing conform to JEDEC MO-187-AA and AMSEY14.5m-1994. 3. Plastic or Intersil
Original

BSC -23-01n15

Abstract: DIMENSIONS a 8-Lead microSOIC Package [MSOP] (RM-8) Dimensions shown in millimeters 3.00 BSC 8 5 4.90 BSC 3.00 BSC 1 4 PIN 1 0.65 BSC 1.10 MAX 0.15 0.00 0.38 0.22 0.23 0.08 8 0 SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-187AA 0.80 0.40 -
-
Original

thermocouple

Abstract: Cold Junction Compensation 6° 0° 0.23 0.13 COMPLIANT TO JEDEC STANDARDS MO-187-AA Analog Devices
Analog Devices
Original
thermocouple Cold Junction Compensation AD8494 Thermocouple Type g AD849 AD8494/AD8496 AD8495/AD8497 AD8613
Abstract: PATTERN 1 2. Dimensioning and tolerancing conform to JEDEC MO-187-AA and AMSEY14.5m-1994. 3 Intersil
Original

MO-187BA

Abstract: ansi-y14.5m-1994 Plastic Packages for Integrated Circuits Mini Small Outline Plastic Packages (MSOP) N M8.118 (JEDEC MO-187AA) 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 INCHES E MILLIMETERS SYMBOL 4X 0.25 (0.010) R1 R GAUGE PLANE SEATING PLANE -CA 4X A2 L - 0.002 0.006 0.05 0.15 - 0.030 0.037 0.75 0.95 - 0.010 0.014 0.25 0.36 9 c 0.004 0.008 0.09 0.20 - D TOP VIEW NOTES 1.10 b A B C MAX
Intersil
Original
MO-187BA ansi-y14.5m-1994 MO-187-BA 5M-1994
Abstract: MO-187-AA Plastic small outline package 1.2.3 Lead finishes. The lead finishes are as specified , . Falls within reference to JEDEC MO-187-AA. FIGURE 1. Case outline - Continued. DLA LAND AND DEPARTMENT OF DEFENSE
Original
V62/12648 5962-V102-12 ADP1720 V62/12648-01XE ADP1720TRMZ3 ADP1720TRMZ5-EP

TB379

Abstract: 187AA .118JEDEC MO187AA 8 MSOP A 0.037 0.043 0.94 1.10
Intersil
Original
ISL88031 TB379 ISL88031EVAL1 ISL88031IU8HFZ FN8227 1888INTERSIL 18884683774I STD020
Abstract: specified herein. Outline letter Number of pins X 8 JEDEC PUB 95 Package style MO-187-AA , . Falls within reference to JEDEC MO-187-AA. FIGURE 1. Case outline - Continued. DLA LAND AND Texas Instruments
Original
V62/12662 5962-V003-13 AD5543 V62/12662-01XB AD5543SRMZ-EP

l6920

Abstract: . TSSOP8 7113595 (Jedec MO-187-AA) 4/5 L6920 Information furnished is believed to be accurate
STMicroelectronics
Original

MO-137-AB

Abstract: pericom sot23-6 /A N/A MS-013AA MS-013AC MS-013AD MS-013AE EIAJ SC-74A EIAJ SC-74A MO-187AA MO-118AA MO
-
Original
PD-1210 PD-1803 PD-1230 PD-1308 PD-1301 PD-1401 MO-137-AB pericom sot23-6 PD2001 MO-150AH MO-150AB TSSOP-48 TSSOP-56 BQSOP-40 BQSOP-48 BQSOP-80 SC70-5
Abstract: shall not exceed 0.15mm (.006inch) per side. TSSOP8 7113595 (Jedec MO-187-AA) 4/5 L6920 STMicroelectronics
Original
D00IN1136

1206 land pattern

Abstract: -16, VSOR-16) MORN MSOP MO-187AA (MORN-8) 0.024 (0.610) 0.0160 0.0400 0.085 (2.159) 0.1700
Vishay Dale
Original
1206 land pattern IPC-SM-782 M/D55342 QFN-20
Abstract: Package style MO-187-AA MS-012-AA Plastic surface mount Plastic small outline 1.2.3 Lead , flash. Interlead flash shall not exceed (0.50 mm) 0.019 inch per side. 4. Falls within JEDEC MO-187-AA Texas Instruments
Original
V62/11601 5962-V053-13 V62/11601-01XE UCC27322TDGKREP V62/11601-02YE 27322M

MO-187-AA Package

Abstract: JEDEC MO-187 aa Number of pins 8 JEDEC PUB 95 JEDEC MO-187-AA Package style Mini Small Outline Package 1.2.3 Lead , 5.15 0.65 BSC 0.40 0.80 NOTES: 1. All linear dimensions are in millimeters. 2. Falls within JEDEC MO-187-AA
DEPARTMENT OF DEFENSE
Original
V62/12629 5962-V007-13 AD8138-EP V62/12629-01XE AD8138SRMZ-EP-R7
Showing first 20 results.