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XAM3517AZER Texas Instruments MICROPROCESSOR, PBGA484, 23 X 23 MM, 1 MM PITCH, GREEN, PLASTIC, MO-151, BGA-494 visit Texas Instruments
1601137-2 TE Connectivity (1601137-2) 151-003-014=WIRE2BLADE,MED,SMZ visit TE Connectivity
C92986-000 TE Connectivity (C92986-000) HVT-Z-151-G visit TE Connectivity
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ED0866-000 TE Connectivity (ED0866-000) HVT-Z-151-SG-T5 visit TE Connectivity
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MO-151 Datasheet

Part Manufacturer Description PDF Type
MO151C Micro Electronics Semiconductor Device Data Book Scan

MO-151

Catalog Datasheet MFG & Type PDF Document Tags

MO-151

Abstract: mo151 : 1106C-02 STANDARD: JEDEC MO-151 BAP-1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14 , AUG 2005 CASE NUMBER: 1106C-02 STANDARD: JEDEC MO-151 BAP-1
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OCR Scan
mo151 JEDEC DEFINE 98ARS23919W 5M-1994

MO-151

Abstract: mo-151 304 DOCUMENT CONTROL NO. PD - 2018 REVISION: DATE: 10/10/02 1 Notes: 1) Controlling dimensions in millimeters 2) Ref: JEDEC MO-151 Pericom Semiconductor Corporation 2380 Bering Drive, San Jose, CA 95131 Tel: (408) 435-0800 Fax: (408) 435-1100 DESCRIPTION: 304-Ball Plastic Ball Grid Array PACKAGE CODE: NA-304 -
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Original
mo-151 304 304-B

A15B

Abstract: A15A MO-151 PIN CONFIGURATION 1 A B C D E F G H J K L VSS VSS VSS VSS VSS A15A N/C , 74 PIN BGA JEDEC MO-151 15.0 max. 3.0 max. 1.27 15.0 max. 0.50/.070 White Electronic
White Electronic Designs
Original
EDI8L21664V A15B A15A TMS320C54 DQ0-15 EDI8L21664V10BC EDI8L21664V12BC EDI8L21664V15BC

MO-151

Abstract: sot697 y1 0.8 13.6 0.15 0.1 0.1 0.2 REFERENCES IEC JEDEC MO-151 EIAJ
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Original
sot697 LFBGA180

EDI8L21664V

Abstract: MO-151 Footprint Multiple VCC and VSS Pins Reduced Inductance and Capacitance 74 pin BGA, JEDEC MO-151 Pin , ) EDI8L21664V15BI 15 Package Description 74 Pin BGA JEDEC MO-151 15.0 max. 3.0 max. 1.27 15.0 max
Electronic Designs
Original
9704 64k x 16 SRAM 01581USA

A15B

Abstract: Capacitance 74 pin BG AJED EC MO-151 EDI8L21664V h 2xS4KxieSRAM The EDI8L21664VxxBC is a 3.3V , Description 74PinBGA JEDEC MO-151 ooooooooooo ooooooooooo 00 00 00 oo 00 oo 00 oo 00 oo 0 0 o o o
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OCR Scan
TMS320C54XE TMS320C54X DQO-15 16SRAM ECH8I21664V

PD-1503

Abstract: pd1503 -2001 MO-151 50 1.27 1063 27.0 1063 27.0 138 3.50 PBGA-272 PD-2006 MO-151
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Original
PD-1503 MO-203AB PD-1262 pd1503 h24 sot23-6 MS-026C PBGA272 MO-153-AB NA256 NA272 NB114 PD-1501 MO-153ED TSSOP-56

MO-151

Abstract: 04.99 package with heat slug (HSL) Flip chip application only Falls within JEDEC MO-151/BAR-2 POST OFFICE
Texas Instruments
Original
04.99 diode aa 90 MPBG113 S-PBGA-N352 4173524/A MO-151/BAR-2

MS-034-AAn-1

Abstract: ak 957 Matrix MO-151-AAN-1 MO-151-AAL-1 MO-151-AAU-1 MS-034-AAV MO-151-AAN-1 MO-151-AAR-1 MO-151 MO , # MS-034-BAU-1 (Depopulated) MO-151-CAL MO-151-CAL MO-151-BAR MO-151-BAU MO-151-BAR MO-151-BAV MS-034-BAN-1 (Depopulated) MS-034-BAR-1 MO-113-AD(3) MO-113-AA-AD(3) MO-113-AB-AD(3) MO-113-AD(3) MO-151 N/A MO-195 MO-205-BE MO-205-AH MO-03-AA MS-034-AAN-1 MS-034-AAR-1 (depopulated) MS-034-AAU-1 (depopulated) MO-151-AAF-1 MO-151-AAJ MO-151-AAJ-1 MO-151-AAN-1 Xilinx # OBG0036 OBG0001 OBG0011 OBG0008 OBG0009 OBG0026 OBG0010 0BG0039
Xilinx
Original
MO-83-AH OPQ0010 OPQ0014 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MS026-ACD MO-151 AAL-1 MO-047 Q1-02 BF957 BG225 BG256 BG352 BG432

MO-151

Abstract: IDENTIFICATION. 4. REFERENCE JEDEC REGISTRATION MO-151, VARIATION -1.27 PITCH, DATED NOV. 1993. 5. REFERENCE
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OCR Scan
MKT-UBE292A

MO-151

Abstract: BGA292 VERSION SOT489-1 REFERENCES IEC JEDEC MO-151 EIAJ EUROPEAN PROJECTION ISSUE DATE
Philips Semiconductors
Original
BGA292 C BGA292 transistor t 04 27

MO-151

Abstract: MO-151, VARIATION 1.27 PITCH, DATED 12/96. APPROVALS û.f Gr od/ DATE é» National Semiconduc
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OCR Scan
I-LI0-13I KSOMKT-UBB256B

BGA225

Abstract: MO-151 MO-151 EIAJ EUROPEAN PROJECTION ISSUE DATE 00-09-21 -
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Original
BGA225 sot648

LFBGA180

Abstract: 11-90 0.1 0.1 0.2 REFERENCES IEC JEDEC MO-151 EIAJ EUROPEAN PROJECTION ISSUE DATE
Philips Semiconductors
Original
11-90 sot622

mo-151

Abstract: 0X13 REGISTERED OUTLINE MO-151/C, VARIATION BAJ-2 EXCEPT FOR aaa DIMENSION. JEDEC DIM MIN NOM MAX aaa 0.20
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Original
0X13 marking 2x JEDEC FBGA MO-151/C 232-FBGA-13 BY-04094-O ADS17XXX

MO-151

Abstract: : 1145a-01 standard: jedec mo-151 balâ'"2
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OCR Scan

MO-151

Abstract: MU û 0.15 N 2.33±0.13 TYPâ  (1.17) - -SEATING PLANE (0.56 TYP)â  0.6*0.1 ITP - DIMENSIONS ARE IN MILLIMETERS NOTES: UNLESS OTHERWISE SPECIFIED 1. SOLDER BALL COMPOSITION: Sn 63*.Pb 37*. 2. DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N. 3. THE MOLD SURFACE AREA MAY INCLUDE DIMPLE FOR Al BALL CORNER IDENTIFICATION. 4. REFERENCE JEDEC REGISTRATION MO-151, VARIATION -1.27 PITCH, DATED JUNE, 1997. 5. REFERENCE ASE DRAWING 64-05-A000-PB20, REV A. REVISIONS LTR
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OCR Scan
C493A

MO-151

Abstract: 04.99 application only Falls within JEDEC MO-151/BAR-2 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 1
Texas Instruments
Original
MPBG111 S-PBGA-N256 4173519/A

CA-225

Abstract: ADSP-21161N W ITH JEDEC STANDAR D MO-151. 2. ACTUAL POSITION OF THE BALL GRID IS W ITHIN 0.25 OF ITS IDEAL
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Original
ADSP-21161N CA-225 225-B ADSP-21161NKCA-100 ADSP-21161NCCA-100

ADV9912

Abstract: MO-151 sales representative. * All package dimensions are within those specified in JEDEC MO-151
Altera
Original
ADV9912 Assembly Locations

FP160

Abstract: O A ) B G A 225 MO-151 Min Max Min B G A 313 MO-151 Max Package Name Dimensions A2 A1 c A D/E
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OCR Scan
FP160 MO-143 MO-136

MO-151

Abstract: , PARALLEL TO PR I MARY DATUM N. 3. REFERENCE JEDEC REGISTRATION MO-151, VARIATION -1.00, DATED JUNE 1997
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OCR Scan
MKT-UCK680A

SLB-26

Abstract: MO-151 . SOLDER BALL COMPOS ITION:Sn 63*.Pb 37*. 2. REFERENCE JEDEC REGISTRATION MO-151, VARIATION -1.27 PITCH
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OCR Scan
SLB-26 MKT-UCB352A

MO-151

Abstract: for A1 ball corner identification. 4. reference jedec registration MO-151, variation baj
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OCR Scan
SOMKT-UDC208B

AN-1126

Abstract: AN-1205 rectangular grid format with a pitch recommended by JEDEC registration standards (MO-151) for PBGAs. The , a square or rectangular grid format with a pitch recommended by the JEDEC registration standard (MO-151
National Semiconductor
Original
AN-1126 AN-1205 land pattern BGA 0.75 TMCL ACLV bga Shipping Trays Application Note 1126 BGA

2702

Abstract: MO-151 JEDEC REGISTRATION MO-151, VARIATION -1.27 P I TCH, DATED JUNE, 1 997. APPROVALS D.[ Grady DFTG. CHK
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OCR Scan
2702 SOMKT-UBB256A
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