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MIl-STD-883

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Abstract: 55°C to +125°) T = High Temp Grade (-55°C to +125°C) DSCC = Mil-STD-883 Compliant PROCESS FLOW , % 100% WAFER PROBE X X X X SAW 100% 100% 100% 100% MIL-STD-883, METHOD 2010 DIE VISUAL INSPECTION COND. B X X X X DIE ATTACH X X X X QC DIE ATTACH MONITOR MIL-STD-883, METHOD 2027 X X X X WIRE BOND X X X X BOND PULL MONITOR MIL-STD-883, METHOD 2011 COND. D X X X X PRE SEAL VISUAL X X X X SEAL 100% 100% 100% 100% 10 CYCLES, MIL-STD-883 TEMPERATURE CYCLE METHOD 1010, COND. C 100% 100% 100% 100% MIL-STD-883 -
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Mil-Std-883 Wire Bond Pull Method 2011 mil-std-883 2015 MIL-STD883 MIL-STD-883 Method 2010 MIL-STD-883 method 2011 centrifuge
Abstract: Test Physical Dimension Lead Integrity Test Resistance to Solvents EIA/JESD22-A110 MIL-STD-883 Method 1010 MIL-STD-883 Method 1005 MIL-STD-883 Method 1008 EIA/JESD22-A102 JEDEC J-STD-20 MIL-STD-883 Method 2010 MIL-STD-883 Method 2009 JEDEC J-STD-035 Per IDT specification MIL-STD-883 Method 2011 MIL-STD-883 Method 2003 EIA/JESD22-B116 MIL-STD-883 Method 2016 MIL-STD-883 Method 2004 MIL-STD-883 Method 2015 45 , Resistance to Solvents EIA/JESD22-A110 MIL-STD-883 Method 1010 MIL-STD-883 Method 1005 MIL-STD-883 Method Integrated Device Technology
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SB-U-02-002 SB-U-00-004 SB-U-03-002 SB-U-04-043 JEDEC JESD22-B116 SUMIKON EME EME-7351 EME7351-LP 71V016H KMC-184 G-0110-06 EME-7351LP EME-S351LP SB-U-03-003 SB-U-03-005
Abstract: FLOW W AFER PRF.P/MOUNT/SAW DIE VISUAL INSPECTION MIL-STD-883, METHOD 2010, CONDITION B P C DTE. VISIJAE EOT ACCEPTANCE MIL-STD-883, METHOD 2010, CONDITION B LTPD 5/0 DIE ATTACH PER PARADIGM BUILD SHEET SPECIFICATION DIE ATTACH MONITOR MIL-STD-883, METHOD 2019 OR 2017 WIRE BOND PER PARADIGM BUILD SHEET SPECIFICATION WIRE BOND MONITOR MIL-STD-883, METHOD 2011 INTERN AT. VISUAL INSPECTION MIL-STD-883, METHOD 2010, CONDITION B P C VISUAL LOT ACCEPTANCE MIL-STD-883, METHOD 2010, CONDITION B -
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Abstract: MIL-STD-833, Mtd 1010, Cond. B -55°C to +125°C; Air-to-Air; 100 cycles; 10 min. dwell MIL-STD-883 , MIL-STD-883, Mtd 1011.7 Cond. B MIL-STD-833, Mtd 1010, Cond. B MIL-STD-883, Mtd 3015 Class II MIL-STD-883, Mtd 2002, MIL-STD-883, Mtd 2022.2 Cond. B 100°C to 0°C; Water-to-Water; 15 cycles; 10 -55°C to , Meniscograph Criteria MIL-STD-883, Mtd 1014.8, Cond. B Mass spectro. 0.0610-8 atmos.; CC/sec He MIL-STD 883 , °C; 30 seconds MIL-STD-202, Mtd 103 40°C; 90%-95% R.H.; 56 days MIL-STD-883, Mtd 2004.5, Cond. A, B1 MtronPTI
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250MH 10TTL/15
Abstract: Mechanical Shock MIL-STD-833, Mtd 1010, Cond. B MIL-STD-883, Mtd 2002, Cond. B min. dwell +125°C; Air-to-Air; 100 cycles; 10 -55°C to min. dwell 1500 g's Mechanical Shock Vibration MIL-STD-883, Mtd , -202, Mtd 103 MIL-STD-883, Mtd 1011.7 Cond. B 40°C; 90%-95% R.H.; 56 days 100°C to 0°C; Water-to-Water; 15 cycles Thermal Shock Electrostatic Discharge MIL-STD-883, Mtd 1011.7 Cond. MIL-STD-883 , Solderability Discharge Hermeticity Solderability MIL-STD-883, Mtd 3015 MIL-STD-883, Mtd 2022.2 Class II MtronPTI
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K500F K1100FC K1100FA K1100FB MIL-STD 833 test method 3015 mtd2002 20222 100MH K500FA
Abstract: :.25 cycles, -55°C to +125°C per MIL-STD-883, Method 1010 Constant Acceleration:. 5000g's, 0.5mS, 3 shocks per direction, per MIL-STD-883, Method 2002 Sinusoidal Vibration:.0.06" D.A., 10 to 55 Hz and 30g's, 55 to 2000 Hz, 3 cycles per direction, per MIL-STD-883, Method 2007 Random Vibration:. 20GRS 20 to 2000 Hz, M, per MIL-STD-883, Method 2026 Lead MIL-STD-883, Method -
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MX045LV/MX045HSLV MX045LV MX045 104ATM- MIL-1-45208
Abstract: , 96 hours MIL-STD-883, Method 3015, Class 1, HBM = 1,500V UL94-V0 MIL-STD-883, Method 1014, Condition A MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1005, Condition B, Biased, 125°C, 1,000 hours MIL-STD-883, Method 1008, Condition C, 125°C, 168 hours JESD22-A110, Biased, 130°C, 85 , 100 100 100 Fail 0 0 0 0 0 0 0 0 0 MIL-STD-883, Method 2004 Per Datasheet MIL-STD-883 , , Condition K MIL-STD-202, Method 215 MIL-STD-883, Method 2003 MIL-STD-883, Method 1010, Condition B Ecliptek
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EA1620 JESD22-A102 J-STD-020 TEN01-100-244
Abstract: JESD22-A102, 121°C, 100% RH, 15 PSIG, 96 hours MIL-STD-883, Method 3015, Class 1, HBM = 1,500V UL94-V0 MIL-STD-883, Method 1014, Condition A MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1005, Condition B, Biased, 125°C, 1,000 hours MIL-STD-883, Method 1008, Condition C, 125°C, 168 hours , 100 10 10 100 100 100 100 100 Fail 0 0 0 0 0 0 0 0 0 MIL-STD-883, Method 2004 Per Datasheet MIL-STD-883, Method 2002, Condition B, 1,500Gâ'™s, 0.5msec, ½ sine J-STD-020, MSL = 1 Ecliptek
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EA2532 TEN01-100-285
Abstract: Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007 , JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking , Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883 ILSI America
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JESD22-B102D MIL-STD-883, Method 2002 ILCX07-24 000000M-2389 ILCX07-S
Abstract: -004 Gross Leak Test at PDI MIL-STD-883, Method 1014 (Fine & Gross) ML-003 Thermal Shock Oven Guide , Condition B Assemble Oscillators Internal Visual Visual & Mechanical Inspection Seal MIL-STD-883, Method 2017 MIL-STD-1285, method 1 (Marking) IAW 55310/16 H MIL-STD-883, Method 1008 100% Screening , Condition C MIL-STD-883, Method 1015, Test Condition B. Nominal supply voltage and load, 320 Hours Minimum. MIL-STD-883, Method 2001, Test Condition A. Y1 Axis only. IAW MIL-PRF-38534 & PDI Design Precision Devices
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workmanship ipc 610 ipc 610 MIL-STD-883 PRESSURE ML005 209E MIL-STD-790 MIL-STD-38534 800-274-XTAL ML-004
Abstract: MIL-STD-883, Method 1010 Constant Acceleration: . 5000g's, 0.5mS, 3 shocks per direction, per MIL-STD-883, Method 2002 Sinusoidal Vibration: . 0.06" D.A., 10 to 55 Hz and 30g's, 55 to 2000 Hz, 3 cycles per direction, per MIL-STD-883, Method 2007 Random Vibration: . 20GRMS, 20 to 2000 Hz, per MIL-STD-883, Method 2026 Lead Integrity: .per MIL-STD-883, Method 2004 CTS Reeves
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SXO550 CMOS 4060 MIL-STD-883 METHOD 1009 MIL-STD-883 METHOD 1009 condition A cts REEVES crystal MilSTD-883
Abstract: Temperature Cycle: . 25 cycles, -55°C to +125°C per MIL-STD-883, Method 1010 , MIL-STD-883, Method 2002 Sinusoidal Vibration: . 0.06" D.A., 10 to 55 Hz and 30g's, 55 to 2000 Hz, 3 cycles per direction, per MIL-STD-883, Method 2007 Random Vibration: . 20GRMS, 20 to 2000 Hz, per MIL-STD-883, Method 2026 Lead Integrity: .per MIL-STD-883, Method 2004 conditions B1 and B2 Hermeticity CTS Reeves
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cts REEVES CXO63HT
Abstract: days JESD22-A102, 121°C, 100% RH, 15 PSIG, 96 hours MIL-STD-883, Method 3015, Class 1, HBM = 1,500V UL94-V0 MIL-STD-883, Method 1014, Condition A MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1005, Condition B, Biased, 125°C, 1,000 hours MIL-STD-883, Method 1008, Condition C, 125°C, 168 , Pass 100 100 10 10 100 100 100 100 100 Fail 0 0 0 0 0 0 0 0 0 MIL-STD-883, Method 2004 Per Datasheet MIL-STD-883, Method 2002, Condition B, 1,500Gâ'™s, 0.5msec, ½ sine J-STD Ecliptek
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MIL-STD-883, Method 1010 EA2025 TEN01-100-197
Abstract: JESD22-A102, 121°C, 100% RH, 15 PSIG, 96 hours MIL-STD-883, Method 3015, Class 1, HBM = 1,500V UL94-V0 MIL-STD-883, Method 1014, Condition A MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1005, Condition B, Biased, 125°C, 1,000 hours MIL-STD-883, Method 1008, Condition C, 125°C, 168 hours , 100 10 10 100 100 100 100 100 Fail 0 0 0 0 0 0 0 0 0 MIL-STD-883, Method 2004 Per Datasheet MIL-STD-883, Method 2002, Condition B, 1,500Gâ'™s, 0.5msec, ½ sine J-STD-020, MSL = 1 Ecliptek
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EA5070 TEN01-100-195
Abstract: 1010, Cond. B MIL-STD-883, Mtd 2002, Cond. B min. dwell +125°C; Air-to-Air; 100 cycles; 10 -55°C to min. dwell 1500 gâ'™s Mechanical Shock Vibration MIL-STD-883, Mtd 2002, Cond. MIL-STD , MIL-STD-883, Mtd 1011.7 Cond. B 40°C; 90%-95% R.H.; 56 days 100°C to 0°C; Water-to-Water; 15 cycles Thermal Shock Electrostatic Discharge MIL-STD-883, Mtd 1011.7 Cond. MIL-STD-883, Mtd 3015 Class II B , Discharge Hermeticity Solderability MIL-STD-883, Mtd 3015 MIL-STD-883, Mtd 2022.2 Class II MIL-STD-883 MtronPTI
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K500FB K500FC K500FXXXX
Abstract: Mechanical Shock MIL-STD-833, Mtd 1010, Cond. B MIL-STD-883, Mtd 2002, Cond. B min. dwell +125°C; Air-to-Air; 100 cycles; 10 -55°C to min. dwell 1500 g's Mechanical Shock Vibration MIL-STD-883, Mtd , -202, Mtd 103 MIL-STD-883, Mtd 1011.7 Cond. B 40°C; 90%-95% R.H.; 56 days 100°C to 0°C; Water-to-Water; 15 cycles Thermal Shock Electrostatic Discharge MIL-STD-883, Mtd 1011.7 Cond. MIL-STD-883 , Solderability Discharge Hermeticity Solderability MIL-STD-883, Mtd 3015 MIL-STD-883, Mtd 2022.2 Class II MtronPTI
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MTD2007
Abstract: : . 25 cycles, -55°C to +125°C per MIL-STD-883, Method 1010 Constant Acceleration: . 5000g's, 0.5mS, 3 shocks per direction, per MIL-STD-883, Method 2002 Sinusoidal Vibration: . 0.06" D.A., 10 to 55 Hz and 30g's, 55 to 2000 Hz, 3 cycles per direction, per MIL-STD-883, Method 2007 Random Vibration: . 20GRMS, 20 to 2000 Hz, per MIL-STD-883, Method 2026 Lead Integrity: .per MIL-STD-883, Method CTS Reeves
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EXO-55 mil-std-883 random EXO55 EXO55P7
Abstract: :.-55°C to +125°C Temperature Cycle:. 25 cycles, -55°C to +125°C per MIL-STD-883 , direction, per MIL-STD-883, Method 2002 Sinusoidal Vibration:. 0.06" D.A., 10 to 55 Hz and 30g's, 55 to 2000 Hz, 3 cycles per direction, per MIL-STD-883, Method 2007 Random 20 to 2000 Hz, M, per MIL-STD-883, Method 2026 Lead Integrity:. per MIL-STD-883, Method 2004 conditions B1 and -
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EX055
Abstract: JESD22-A102, 121°C, 100% RH, 15 PSIG, 96 hours MIL-STD-883, Method 3015, Class 1, HBM = 1,500V UL94-V0 MIL-STD-883, Method 1014, Condition A MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1005, Condition B, Biased, 125°C, 1,000 hours MIL-STD-883, Method 1008, Condition C, 125°C, 168 hours , 100 10 10 100 100 100 100 100 Fail 0 0 0 0 0 0 0 0 0 MIL-STD-883, Method 2004 Per Datasheet MIL-STD-883, Method 2002, Condition B, 1,500Gâ'™s, 0.5msec, ½ sine J-STD-020, MSL = 1 Ecliptek
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EA2540 TEN01-100-292
Abstract: PSIG, 96 hours MIL-STD-883, Method 3015, Class 1, HBM = 1,500V UL94-V0 MIL-STD-883, Method 1014, Condition A MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1005, Condition B, Biased, 125°C, 1,000 hours MIL-STD-883, Method 1008, Condition C, 125°C, 168 hours JESD22-A110, Biased, 130°C, 85 , 100 100 100 Fail 0 0 0 0 0 0 0 0 0 JESD17, 200mA @ 25°C Per Datasheet MIL-STD-883 , 210, Condition K MIL-STD-202, Method 215 MIL-STD-883, Method 2003 MIL-STD-883, Method 1010 Ecliptek
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EB13E2 TEN01-100-050
Abstract: Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007 , JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking , Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883 Atmel
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ATC18RHA 4288C TM2001 TM1010 TM2020 TM1014 TM101 ISO9001 ISO9001/ MIL-PRF-38535
Abstract: Test Physical Dimension Lead Integrity Test Resistance to Solvents EIA/JESD22-A110 MIL-STD-883 Method 1010 MIL-STD-883 Method 1005 MIL-STD-883 Method 1008 EIA/JESD22-A102 JEDEC J-STD-20 MIL-STD-883 Method 2010 MIL-STD-883 Method 2009 JEDEC J-STD-035 Per IDT specification MIL-STD-883 Method 2011 MIL-STD-883 Method 2003 EIA/JESD22-B116 MIL-STD-883 Method 2016 MIL-STD-883 Method 2004 MIL-STD-883 Method 2015 45 , Resistance to Solvents EIA/JESD22-A110 MIL-STD-883 Method 1010 MIL-STD-883 Method 1005 MIL-STD-883 Method Linear Technology
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MIL-STD-976 5962-9208001MPA 8418001XA 5962-8688701CA 7703401YA 7703405XA 5962-8688701 MIL-Q-9858 MIL-I-45208 19J/883 LM119W/883 LT111AH/883
Abstract: 55°C to +125°) T = High Temp Grade (-55°C to +125°C) DSCC = Mil-STD-883 Compliant PROCESS FLOW , % 100% WAFER PROBE X X X X SAW 100% 100% 100% 100% MIL-STD-883, METHOD 2010 DIE VISUAL INSPECTION COND. B X X X X DIE ATTACH X X X X QC DIE ATTACH MONITOR MIL-STD-883, METHOD 2027 X X X X WIRE BOND X X X X BOND PULL MONITOR MIL-STD-883, METHOD 2011 COND. D X X X X PRE SEAL VISUAL X X X X SEAL 100% 100% 100% 100% 10 CYCLES, MIL-STD-883 TEMPERATURE CYCLE METHOD 1010, COND. C 100% 100% 100% 100% MIL-STD-883 Apex Microtechnology
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PA02M MIL-M-55565 60024 apex 883U PA02 Transistors smd mark code 546-APEX PA02/PA02A 000PPM PROC99
Abstract: Fine Leak Test: Gross Leak Test: Mechanical Shock: Vibration: Lead Integrity: MIL-STD-883, Method MIL-STD-883, Method MIL-STD-202, Method MIL-STD-883, Method MIL-STD-883, Method 1014 , Cycling: Resistance to Soldering Heat: Resistance to Solvents: MIL-STD-883, Method 2002 MIL-STD-883 , : Vibration: Lead Integrity: MIL-STD-883, Method MIL-STD-883, Method MIL-STD-202, Method MIL-STD-883, Method MIL-STD-883, Method 1014, Condition A 1014, Condition C 213, Condition C 2007, Condition A Xilinx
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XC2000 XC3000 XC3100 XC4000 X3132 XILINX XC2000 sumitomo epoxy 6300h MIL-M-38510 XC1700 XC1700D XC3000A
Abstract: Mechanical Shock MIL-STD-833, Mtd 1010, Cond. B MIL-STD-883, Mtd 2002, Cond. B min. dwell +125°C; Air-to-Air; 100 cycles; 10 -55°C to min. dwell 1500 g's Mechanical Shock Vibration MIL-STD-883, Mtd , -202, Mtd 103 MIL-STD-883, Mtd 1011.7 Cond. B 40°C; 90%-95% R.H.; 56 days 100°C to 0°C; Water-to-Water; 15 cycles Thermal Shock Electrostatic Discharge MIL-STD-883, Mtd 1011.7 Cond. MIL-STD-883 , Solderability Discharge Hermeticity Solderability MIL-STD-883, Mtd 3015 MIL-STD-883, Mtd 2022.2 Class II Atmel
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TM1015 escc TM2018 TM2012 TM2010 TM1008 4288D
Abstract: -976 (Certification Requirements for Microcircuits), MIL-STD-883 (Test Methods and Procedures for Microelectronics , certification and QPL approvals 12-3 MILITARY PRODUCTS were awarded to MIL-M-38510 and MIL-STD-883 , , contact your local LTC sales office or LTC Military Marketing. PRESEAL INTERNAL VISUAL MIL-STD-883 , % STABILIZATION BAKE MIL-STD-883, METHOD 1008 CONDITION C 100% In June 1994, LTC was granted transitional , . CONSTANT ACCELERATION MIL-STD-883, METHOD 2001 (Y1 ONLY) CONDITION E 100% WAFER FABRICATION AND Ecliptek
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EB51F2 EB52F2 mil-std-202 method 215 mil-std-202, method 215 D2002 d213 ES51F2 ES52F2 600MH 768MH
Abstract: 1010, Cond. B MIL-STD-883, Mtd 2002, Cond. B min. dwell +125°C; Air-to-Air; 100 cycles; 10 -55°C to min. dwell 1500 gâ'™s Mechanical Shock Vibration MIL-STD-883, Mtd 2002, Cond. MIL-STD , MIL-STD-883, Mtd 1011.7 Cond. B 40°C; 90%-95% R.H.; 56 days 100°C to 0°C; Water-to-Water; 15 cycles Thermal Shock Electrostatic Discharge MIL-STD-883, Mtd 1011.7 Cond. MIL-STD-883, Mtd 3015 Class II B , Discharge Hermeticity Solderability MIL-STD-883, Mtd 3015 MIL-STD-883, Mtd 2022.2 Class II MIL-STD-883 Linear Technology
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5962-8853701GA 5962-8951101EA 5962-9950101QPA 5962-8993301GA 8551401pa Linear 5962-8688203XA LM111H/883 LM111J8/883 LM119H/883 LM119J/883 LT111AJ8/883 LT119AH/883
Abstract: Component Parts MIL-STD-794 - Parts and Equipment, Procedures for Packaging of MIL-STD-883 - Test , MIL-STD-883, Meth 2017 Cond H, Meth 2032 Cond M MIL-STD-883, Meth 1008, Cond C, 150°C, 24 hours min. Thermal Shock MIL-STD-883, Meth 2017 Cond H, Meth 2032 Cond M MIL-STD-883, Meth 1008, Cond C, 150°C, 48 hours min. MIL-STD-883, Meth 1011, Cond A 5 Temperature Cycle MIL-STD-883, Meth 1010 , ) 4 10 11 12 13 Option S (MIL-PRF-55310 Product Level S) MIL-STD-883, Meth 2023 Linear Technology
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QML-38535 5962-3870701MPA 5962-8956201 LT119AH 5962-8989702 5962-9059503 12--MILITARY MIL-M-38535 M119W/883 LT119AJ/883 LT685MH/883 LT685MJ/883
Abstract: non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 , of MIL-STD-883 Certification and qualification to MIL-I-38535 The case outline(s) shall be as , 14 14 Dual-in-line Flat package 1.2.5 Lead finish. The lead finish shall be as specified in MIL-STD-883 , Specification for. STANDARDS MILITARY MIL-STD-883 - Test Methods and Procedures for Microelectronics , device class M shall be in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 Vectron International
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OS-80001 Mil Std 883, Method 1008 ipc 610 Class 3 class 10 up board Datasheet 2012 tip-over SURFACE MOUNT DIODES MIL GRADE MIL-HDBK-217
Abstract: , 96 hours MIL-STD-883, Method 3015, Class 1, HBM = 1,500V UL94-V0 MIL-STD-883, Method 1014, Condition A MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1005, Condition B, Biased, 125°C, 1,000 hours MIL-STD-883, Method 1008, Condition C, 125°C, 168 hours JESD22-A110, Biased, 130°C, 85 , 100 100 100 Fail 0 0 0 0 0 0 0 0 0 MIL-STD-883, Method 2004 Per Datasheet MIL-STD-883 , , Condition K MIL-STD-202, Method 215 MIL-STD-883, Method 2003 MIL-STD-883, Method 1010, Condition B Temex
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ISO9001-2000 ISO14001 2000H STD-883
Abstract: JESD22-A102, 121°C, 100% RH, 15 PSIG, 96 hours MIL-STD-883, Method 3015, Class 1, HBM = 1,500V UL94-V0 MIL-STD-883, Method 1014, Condition A MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1005, Condition B, Biased, 125°C, 1,000 hours MIL-STD-883, Method 1008, Condition C, 125°C, 168 hours , 100 10 10 100 100 100 100 100 Fail 0 0 0 0 0 0 0 0 0 MIL-STD-883, Method 2004 Per Datasheet MIL-STD-883, Method 2002, Condition B, 1,500Gâ'™s, 0.5msec, ½ sine J-STD-020, MSL = 1 -
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HS-246RH HS-248RH DD47D 5962-E137-96 5962-XXXXXZZ QML-38534 MIL-BUL-103 MIL-H-38534
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