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X9409WS24IZ-2.7T1 Intersil Corporation QUAD 10K DIGITAL POTENTIOMETER, 2-WIRE SERIAL CONTROL INTERFACE, 64 POSITIONS, PDSO24, 300 MIL, ROHS COMPLIANT, PLASTIC, MS-013AD, SOIC-24 visit Intersil
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Part : MIL-R-55182/1-1963RS Supplier : - Manufacturer : Bristol Electronics Stock : 100 Best Price : - Price Each : -
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MIL-R-55342E

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: mechanical change ±1 % +0.01 ohm Test Method MIL-R55342E Par 4.79 (-55°C =125°C) MIL-R55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ w orking voltage) MIL-R-55342E Par 4.7.5 2.5 x \/P x R fo r 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) MIL-STD-202, M ethod 208 (245°C fo r 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hour at 70°C intermittent) 1200 -
OCR Scan
Abstract: +200ppm/°C Short Time Overload MIL-R-55342E, Sect. 4.7.5 ±(1.0% + 0.050) Dielectric , % coverage Resistance to Soldering Heat MIL-R-55342E, Sect. 4.7.7 ±(1.0% + 0.05Q) Robustness of , ) Low Temperature Operation MIL-R-55342E, Sect. 4.7.4 +(1.0% + 0.050) High Temperature Exposure MIL-R-55342E, Sect. 4.7.6 ±(1.0% + 0.050) Thermal Shock MIL-STD-202F, Method 107 ±(0.5% + -
OCR Scan
1/16W 1/10W 10O-1MS2 10Q-1MQ 10Q-1MO MIL-STD-883F

TT 2240

Abstract: transistor ne22 Temperature coefficient Maximum Change MIL-R-55342E Par 4.7.9 (-55°C +125°C) As specified above MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) ±(0.5% +0.01 ohm) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) ±(0.25% +0.01 ohm) MIL-R55342E Par 4.7.5 (2.5 x (PxR)1/2) ±(1.0% +0.01 ohm) High temperature exposure MIL-R55342E Par 4.7.6 (+150°C for 100 hours) ±(0.5% +0.01 ohm) Resistance to bonding exposure MIL-R55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 sec.) ±
Welwyn Components
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TT 2240 transistor ne22
Abstract: Adhesion Strength Maximum Change Test Method As specified MIL-R-55342E Par 4.7.9 (-55°C +125°C) ±0.5% +0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) ±0.25% +0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) ±0.5% +0.01 ohm MIL-R-55342E Par 4.7.5 ±1% for R>100K ohm 2.5 x for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) ±0.5% +0.01 ohm ±0.25% 0.01 ohm MIL-R-55342E Par 4.7.7 , 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) ±0.5% +0.01 ohm MIL-R-55342E Par TT Electronics / IRC
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MMA0204

Abstract: MMA0204-50 MIL-R-55342E Par 4.7.9 (-55°C +125°C) Thermal Shock ±0.5% +0.01 MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) Low Temperature Operation ±0.25% +0.01 MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.5% +0.01 ±1% for R>100K MIL-R-55342E Par 4.7.5 2.5 x P x R for 5 seconds High Temperature Exposure ±0.5% +0.01 MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding Exposure ±0.25% +0.01 MIL-R-55342E Par 4.7.7 (Reflow soldered to
TT Electronics / IRC
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MMC0310 MMB0207 MMA0204 MMA0204-50 1206 footprint dimension 1R00 51R0

MRC 100

Abstract: 10k resistor 2 watt ) Test Method MIL-R-55342E Par 4.7.9 (-55°C + 125°C) MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x PxR for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) MIL-STD-202, Method 208 (245°C for 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent) 1200 gram push from underside of mounted chip
TT Electronics / IRC
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MRC 100 10k resistor 2 watt

specification of 330 ohm resistor

Abstract: MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R55342E Par 4.7.5 (2.5 x (PxR)1/2) MIL-R55342E Par 4.7.6 (+150°C for 100 hours) MIL-R55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 sec.) MIL-STD-202, Method 208 (245°C for 5 seconds) MIL-R55342E Par 4.7.8 (10 cycles, total 2240 hours) MIL-R55342E Par 4.7.10
TT Electronics
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specification of 330 ohm resistor L-R-55342E IEC62

resistor metal GLAZE 120 ohm 2 1W IRC

Abstract: IRC MAR Test Method MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x PxR for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) MIL-STD-202, Method 208 (245°C for 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hour at 70°C intermittent) 1200 gram push from underside of
TT Electronics / IRC
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resistor metal GLAZE 120 ohm 2 1W IRC IRC MAR MRC 058 datasheet EFB810-3/4-3/mrc 736 R250 ISO-9001 EIA-481
Abstract: specified MIL-R-55342E Par 4.7.9 (-55°C +125°C) Thermal Shock ±0.5% +0.01â"¦ MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) Low Temperature Operation ±0.25% +0.01â"¦ MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.5% +0.01â"¦ ±1% for R>100Kâ"¦ MIL-R-55342E Par 4.7.5 2.5 x âšP x R for 5 seconds High Temperature Exposure ±0.5% +0.01â"¦ MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding Exposure ±0.25% +0.01â"¦ MIL-R-55342E TT Electronics
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2011/65/EU

MF60SS

Abstract: MF55SS -202F, Method 304 MIL-R-55342E, Sect. 4.7.5 MIL-STD-202F, Method 301 MIL-STD-202F, Method 302 MIL-STD-202F, Method 308 MIL-STD-202F, Method 208 MIL-R-55342E, Sect. 4.7.7 MIL-STD-202F, Method 211 MIL-STD-202F, Method 215 MIL-STD-202F, Method 106 MIL-STD-883F, Method 1010.7 MIL-R-55342E, Sect. 4.7.4 MIL-R-55342E
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MF55SS MF60SS MF55* asj ASJ PTE MF 55SS MF55ss asj 1-10M MF50/MF55SS MF55/MF60SS
Abstract: Maximum Change Temperature Coefficient Test Method ±100 ppm/°C MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) ±0.25% + 0.01 ohm ±1% for R>100K ohm Short Time Overload MIL-R-55342E Par 4.7.5 2.5 x ⚠P x R for 5 seconds High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par TT Electronics
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Abstract: Test Method Thermal Shock ±(0.5% + 0.01 ohm) MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±(0.25% + 0.01 ohm) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±(1.0% + 0.01 ohm) MIL-R-55342E Par 4.7.5 (2.5 x (PxR)½ onmental Data eristic Shock High Temperature Exposure ±(0.5% + 0.01 Maximum Changeohm) MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Test Method Resistance to Bonding Exposure MIL-R-55342E Par 4.7.7 (Reï¬'ow TT Electronics
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PPS1-100RFI PPS11001000FLF

MIL-R55342E

Abstract: PAR/MR25 Change As specified Test Method MIL-R-55342E Par 4.7.9 (-55°C + 125°C) MIL-R-55342E Par 4.7.3 (-65°C + , Coefficient Short Time Overload High Temperature Exposure Resistance to Bonding Exposure MIL-R-55342E Par 4.7.4 (-65°C @ (-55°C working voltage) MIL-R-55342E Par 4.7.9 + 125°C) MIL-R-55342E Par 4.7.5 2.5 x P x , MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) voltage) MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) perature Operation ±0.25% + 0.01 ohm ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C
TT Electronics
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PAR/MR25 PAR/22G5R PAR/LS17-203W31 PAR/LS17 PAR/4100K PAR/PDS3S140 MIL-R-5534 HRISTI4EXAS53 083ERIES

MMA0204

Abstract: MMB0207 mum Ctolerance, hange Test Method As specified ±0.5% +0.01 ±0.25% +0.01 ±1% for R>100K MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x P x R for 5 seconds onmental Data Low , ±0.25% ±0.5% +0.01 +0.01 Solderability Moisture Resistance MIL-R-55342E Par 4.7.9 (-55°C MIL-R-55342E Par 4.7.6 (+150°C for 100 +125°C) hours) (Reflow soldered to board at 260°C for 10 seconds) MIL-R-55342E
TT Electronics / IRC
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1348K
Abstract: values 1R0 to 2M21 Test Method Method MIL-R55342E Test Par 4.79 (-55°C =125°C) MIL-R55342E Par 4.79 Par (-55°C =125°C) MIL-R55342E 4.7.3 (-65°C +150°C, 5 cycles) MIL-R55342E Par 4.7.3 Par (-65°C +150°C, MIL-R-55342E 4.7.4 (-65°C 5 @cycles) working voltage) MIL-R-55342E Par 4.7.4Par (-65°C @ working voltage) MIL-R-55342E 4.7.5 MIL-R-55342E Par 4.7.5 PxR for 5 seconds 2.5 x for 5 seconds 2.5 x PxR MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.6Par (+150°C for 100 soldered hours) to board at TT Electronics
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100RFI

MRC 025

Abstract: MRC 100 MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±(0.5% + 0.01) MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±(0.25% + 0.01) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±(1.0% + 0.01) MIL-R-55342E Par 4.7.5 2.5 x PxR for 5 seconds High Temperature Exposure ±(0.5% + 0.01) MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding Exposure ±(0.25% + 0.01) MIL-R-55342E Par 4.7.7 (Reflow soldered to
TT Electronics / IRC
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MRC 025 RESISTOR FOOTPRINT 1206
Abstract: Characteristics Temperature Coefficient Maximum Change ±100 ppm/°C Test Method MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.25% + 0.01 ohm ±1% for R>100K ohm MIL-R-55342E Par 4.7.5 2.5 x ⚠P x R for 5 seconds High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par TT Electronics
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MIL-R-39017 MIL-R-55182

3610 footprint

Abstract: mma0204-50 Test Method MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x P x R for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds , no mechanical damage ±0.5% +0.01 no mechanical damage MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent) 1200 gram push from underside of mounted
TT Electronics / IRC
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3610 footprint MMA-0204-50

10e 2w resistor

Abstract: 1R00 Temperature Coefficient Maximum Change As specified Test Method MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.5% + 0.01 ohm ±1% for R>100K ohm MIL-R-55342E Par 4.7.5 2.5 x P x R for 5 seconds High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to
TT Electronics / IRC
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10e 2w resistor
Abstract: specified ±0.5% +0.01 ohm ±0.25% +0.01 ohm ±0.5% +0.01 ohm Test Method MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E , seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hour at 70 TT Electronics / IRC
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Abstract: MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R55342E Par 4.7.5 (2.5 x (PxR)1/2) MIL-R55342E Par 4.7.6 (+150°C for 100 hours) MIL-R55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 sec.) MIL-STD-202, Method 208 (245°C for 5 seconds) MIL-R55342E Par 4.7.8 (10 cycles, total 2240 hours) MIL-R55342E Par 4.7.10 Welwyn Components
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