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MBBS

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Abstract: surface mount applications. These devices are shipped in sealed Moisture Barrier Bags (MBBs) with caution , the warning stated on the caution label, the sealed MBBs should be stored unopened in a relatively dry , ). Baked devices are then vacuum sealed and dry packed in MBBs within the 24 hour factory-floor-life limit under controlled environment. In each of the vacuum sealed MBBs, appropriate amount of desiccant ... Original
datasheet

2 pages,
45.65 Kb

datasheet abstract
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Abstract: sensitive in surface mount applications. These devices are shipped in sealed Moisture Barrier Bags (MBBs , Baked devices are then vacuum sealed and dry packed in MBBs within the 24 hour factory-floor-life limit under controlled environment. In each of the vacuum sealed MBBs, appropriate amount of desiccant packs , with the warning stated on the caution label, the sealed MBBs should be stored unopened in a ... Original
datasheet

2 pages,
34.4 Kb

datasheet abstract
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Abstract: mentioned in the section on MBBs. The Desiccant Barcode label (Figure 8-4) contains the date that the bag , section for additional information. 3. Opening MBBs. To open a moisture barrier bag when the contents , products in moisture barrier bags (MBBs). Based on the solderability work done at Intel it is recommended , moisture barrier bags (MBBs)*. The following information describes the appearance and handling of , are enclosed in sealed Moisture Barrier Bags (MBBs) with desiccant pouches. · Shipping Box. The ... Original
datasheet

28 pages,
243.43 Kb

molecular sieve MIL-STD-81705 manufacturing process calcium chloride A5753-01 MIL-B-81705 cap 822 smd datasheet abstract
datasheet frame
Abstract: mentioned in the section on MBBs. The Desiccant Barcode label (Figure 8-4) contains the date that the bag , section for additional information. 3. Opening MBBs. To open a moisture barrier bag when the contents , prior to sealing sensitive products in moisture barrier bags (MBBs). Based on the solderability work , Desiccant Pack Intel ships moisture sensitive PSMCs in a dry state inside moisture barrier bags (MBBs)*. , Moisture Barrier Bags (MBBs) with desiccant pouches. · Shipping Box. The label on the shipping box ... Original
datasheet

28 pages,
211.01 Kb

diode databook CRACK intel 851 molecular sieve external lead finish A5756 LEAD FRAME SURFACE MOUNT ic shelf life MIL-STD-38510 QFP Shipping Trays MIL-B-81705 cap 822 smd SMD CODE databook datasheet abstract
datasheet frame
Abstract: information. Opening MBBs. To open a moisture barrier bag when the contents are ready to be used or inspected , sealing sensitive products in moisture barrier bags (MBBs). Based on the solderability work done at Intel , inside moisture barrier bags (MBBs)*. The following information is intended to describe the appearance , been baked dry and are enclosed in sealed Moisture Barrier Bags, (MBBs), with desiccant pouches. · , · Desiccant Packing (General). When components are stored in MBBs with the appropriate amount of ... Original
datasheet

35 pages,
1099.66 Kb

ic shelf life IPC-SM-786 IPC-SM-786A moisture during operation PLCC 68 intel QFP Shipping Trays smt 28rh Intel Packaging Handbook 240800 solder PQFP 132 PACKAGE DIMENSION intel LEAD FRAME SURFACE MOUNT INTEL PLCC 68 dimensions tape PQFP die size datasheet abstract
datasheet frame
Abstract: prior to sealing sensitive products in moisture barrier bags (MBBs) Based on the solderability work , barrier bags (MBBs) The following information is intended to describe the appearance and handling of , enclosed in sealed Moisture Barrier Bags (MBBs) with desiccant pouches Shipping Box The label on the , information Opening MBBs To open a moisture barrier bag when the contents are ready to be used or inspected , Component Weight Gain Desiccant Packing (General) When components are stored in MBBs with the ... Original
datasheet

29 pages,
399.32 Kb

smt 28rh PLCC 68 intel package dimensions INTEL PLCC 68 dimensions tape IPC-SM-786A IPC-SM-786 MIL-B-81705 Ultrasonic cleaner circuit diagram ic shelf life datasheet abstract
datasheet frame
Abstract: foxconn max8774 pwm rqa130n03 T1251 pr cas 001 27p AOS6402 MAX8774 12,13 12,13 M_CLK_DDR2 12 M_CLK_DDR#2 12 M_CLK_DDR3 12 M_CLK_DDR#3 12 M_B_BS#2 12,13 M_B_BS#1 12,13 M_B_BS#0 12,13 M_B_RAS# 12,13 M_B_CAS# 12,13 M_B_WE# 12,13 M_B_CS#3 M_B_CS#2 M_B_CS#1 M_B_CS#0 12 ... Original
datasheet

37 pages,
1175.39 Kb

ASP-68200-07 C51MV MCP51 MCP51- a07 h21 105k 10p nvidia mcp 61 quanta quanta tw2q RJ-11 4-C thyristor t24 CX20549 new bright R288 quanta kn1 datasheet abstract
datasheet frame
Abstract: M_AA2 M_AA1 M_AA0 M_BRAS# M_BCAS# M_BWE# M_BBS#1 M_BBS#0 RSVD_M_BA15 RSVD_M_BA14 M_BA13 M_BA12 M_BA11 , ,9 M_BCAS# 8,9 M_BWE# 8,9 M_BBS#1 8,9 M_BBS#0 8,9 M_BA[13.0] 8,9 MEMRESET# M_CS#7 M_CS#6 M_CS#5 , M_BA11 M_BA12 M_BBS#0 M_BBS#1 112 111 110 109 108 107 106 105 102 101 115 100 99 117 116 5 7 13 17 6 8 , M_CS#2 M_BRAS# M_BBS#1 M_BCAS# M_BA0 M_BA2 1 2 3 4 5 6 7 8 3 RN48 M_DATA11 DATA11 M_DATA10 DATA10 M_DATA17 DATA17 , M_BBS#0 M_BWE# 1 2 3 4 5 6 7 8 M_BA5 M_BA8 M_BA4 M_BA11 1 2 3 4 SRN47J-1-U SRN47J-1-U RN38 8 7 6 5 ... Original
datasheet

17 pages,
612.06 Kb

wistron board epson c683 SB400 wistron wistron block diagram WISTRON AMD SCD1U16V kb 3910 datasheet abstract
datasheet frame
Abstract: M_A_WE# M_B_BS#2 (8,9) M_B_BS#1 (8,9) M_B_BS#0 (8,9) M_B_RAS# (8,9) M_B_CAS# (8,9) M_B_WE# (8,9) (8 , ) M_B_BS#0 M_B_BS#1 M_B_BS#2 M_B_DM0 M_B_DM1 M_B_DM2 M_B_DM3 M_B_DM4 M_B_DM5 M_B_DM6 M_B_DM7 M_B_DQS0 , M_B_WE# M_B_CAS# M_B_BS#0 M_B_A10 M_B_BS#2 RP7 M_B_A13 RP10 M_B_RAS# M_B_BS#1 RP13 RP8 RP12 RP31 0404-47X2 0404-47X2 , M_B_CAS# M_B_BS#0 M_CKE2 M_B_BS#2 M_B_CS#3 M_B_CS#0 M_ODT2 M_B_RAS# M_B_BS#1 M_CKE1 M_CKE3 M_A_BS#2 ... Original
datasheet

37 pages,
1035.48 Kb

PC87541 PR133 PR131 PR134 PC122 SONY quanta diode ziner AMD Athlon 64 X2 4800 pin diagram VDDIO10 ME2N7002E sd diode mx c417 max8774 pwm rtl8101e rs690mc max8774 datasheet abstract
datasheet frame
Abstract: ) M_A_WE# M_A_CAS# M_A_RAS# M_B_BS#0 M_B_BS#1 M_B_BS#2 M_B_WE# M_B_CAS# M_B_RAS# (5,10) (5,10) (5,10) (5,10 , AJ18 AK18 AJ19 AK19 AH19 AJ20 AH20 AJ16 AG18 AG20 AG15 AH14 AK14 AF15 AF14 AH16 M_B_BS#0 M_B_BS#1 M_B_BS#2 M_B_DM0 M_B_DM1 M_B_DM2 M_B_DM3 M_B_DM4 M_B_DM5 M_B_DM6 M_B_DM7 M_B_DQS0 M_B_DQS1 M_B_DQS2 , M_B_A12 M_B_A13 M_B_CAS# M_B_RAS# T50 T52 M_B_WE# M_B_CAS# (10) M_B_RAS# (10) M_B_WE# (10) M_B_BS#0 (10) M_B_BS#1 (10) M_B_BS#2 (10) M_B_DM[0.7] (10) (5,10) (5,10) (5,10) (5,10) (5,10) (5,10) (5,10) (5,10 ... Original
datasheet

32 pages,
1020.86 Kb

LANc to USB quanta quanta docking Aj36 sony lanc quanta rd1 1115A ics Socket AM2 datasheet abstract
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automotive industry). Using MBBs only guarantees safe solderability for up to 1 year. Although MBBs are sealed, they will still absorb moisture from the environment at a slow, but measurable, rate. For storage over 1 year: Inspect MBBs for signs
www.datasheetarchive.com/files/intel/products one/design/quality/icstor~1/env_lo~4.htm
Intel 01/05/1999 3.58 Kb HTM env_lo~4.htm
automotive industry). Using MBBs only guarantees safe solderability for up to 1 year. Although MBBs are sealed, they will still absorb moisture from the environment at a slow, but measurable, rate. For storage over 1 year: Inspect MBBs for signs
www.datasheetarchive.com/files/intel/design/quality/icstor~1/env_lo~4-v4-vx2.htm
Intel 01/05/1999 3.58 Kb HTM env_lo~4-v4-vx2.htm
automotive industry). Using MBBs only guarantees safe solderability for up to 1 year. Although MBBs are sealed, they will still absorb moisture from the environment at a slow, but measurable, rate. For storage over 1 year: Inspect MBBs for signs
www.datasheetarchive.com/files/intel/design/quality/icstor~1/env_lo~4-v4.htm
Intel 01/02/1999 3.58 Kb HTM env_lo~4-v4.htm
automotive industry). Using MBBs only guarantees safe solderability for up to 1 year. Although MBBs are sealed, they will still absorb moisture from the environment at a slow, but measurable, rate. For storage over 1 year: Inspect MBBs for signs
www.datasheetarchive.com/files/intel/design/quality/icstor~1/env_lo~4-v1.htm
Intel 31/10/1998 3.59 Kb HTM env_lo~4-v1.htm
automotive industry). Using MBBs only guarantees safe solderability for up to 1 year. Although MBBs are sealed, they will still absorb moisture from the environment at a slow, but measurable, rate. For storage over 1 year: Inspect MBBs for signs
www.datasheetarchive.com/files/intel/design/quality/icstor~1/env_lo~4-v2.htm
Intel 01/08/1998 3.59 Kb HTM env_lo~4-v2.htm
automotive industry). Using MBBs only guarantees safe solderability for up to 1 year. Although MBBs are sealed, they will still absorb moisture from the environment at a slow, but measurable, rate. For storage over 1 year: Inspect MBBs for signs
www.datasheetarchive.com/files/intel/design/quality/icstor~1/env_lo~4-v3.htm
Intel 01/02/1999 3.58 Kb HTM env_lo~4-v3.htm
automotive industry). Using MBBs only guarantees safe solderability for up to 1 year. Although MBBs are sealed, they will still absorb moisture from the environment at a slow, but measurable, rate. For storage over 1 year: Inspect MBBs for signs
www.datasheetarchive.com/files/intel/design/quality/icstor~1/env_lo~4.htm
Intel 30/04/1998 3.59 Kb HTM env_lo~4.htm
Bags (MBBs) with a desiccant and Humidity Indicator Card (HIC). A pre-solder bake will be required if: MBBs are damaged during short term storage.
www.datasheetarchive.com/files/intel/design/quality/icstor~1/env_sh~1-v4.htm
Intel 01/02/1999 4.54 Kb HTM env_sh~1-v4.htm
Bags (MBBs) with a desiccant and Humidity Indicator Card (HIC). A pre-solder bake will be required if: MBBs are damaged during short term storage.
www.datasheetarchive.com/files/intel/design/quality/icstor~1/env_sh~1-v4-vx2.htm
Intel 01/05/1999 4.54 Kb HTM env_sh~1-v4-vx2.htm
Bags (MBBs) with a desiccant and Humidity Indicator Card (HIC). A pre-solder bake will be required if: MBBs are damaged during short term storage.
www.datasheetarchive.com/files/intel/design/quality/icstor~1/env_sh~1.htm
Intel 30/04/1998 4.55 Kb HTM env_sh~1.htm