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| Part Number | Manufacturer | Description | ||||||
| 1. | ST Microelectronics | MEMORY CARD IC 64-32 KBIT SERIAL I2C BUS EEPROM | 125.14 Kb | 14 Pg. | ||||
| 2. | ST Microelectronics | Memory Micromodule | 275.54 Kb | 13 Pg. | ||||
| 3. | ST Microelectronics | Memory Card IC 64/32 Kbit Serial I C Bus EEPROM | 94.63 Kb | 14 Pg. | ||||
| 4. | ST Microelectronics | Memory Card IC 64 Kbit Serial I2C Bus EEPROM | 125.13 Kb | 14 Pg. | ||||
| 5. | ST Microelectronics | Memory Card IC 64/32 Kbit Serial I C Bus EEPROM | 94.63 Kb | 14 Pg. | ||||
| 6. | ST Microelectronics | 64 kBit Serial I2C Bus EEPROM | 125.14 Kb | 14 Pg. |
| « Previous 1 Next » |
| 1. | 49.06 Kb • 4 Pages |
Abstract: ... The M14C64 is available in micro-module. Micromodule (D22) 2. 2 2. 2. Micromodule (D20) Wafer. Figure 1. Logic Diagram. AI02164. SDA. VCC. M14Cxx WC. SCL. GND. Table 1. Signal Names. SDA Serial Data/Address ... Labels: M14C64 |
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| 2. | 94.63 Kb • 14 Pages |
Abstract: ... The M14C64 is available in micro-module Figure 1. Logic Diagram. AI02217. SDA. VCC. M14xxx WC. SCL. GND. Table 1. Signal Names. SDA Serial Data/Address Input/ Output. SCL Serial Clock. WC Write Control ... Labels: M14C64, Application Notes |
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| 3. | 125.14 Kb • 14 Pages |
Abstract: ... The M14C64 is available in micro-module Figure 1. Logic Diagram. AI02217. SDA. VCC. M14xxx WC. SCL. GND. Table 1. Signal Names. SDA Serial Data/Address Input/ Output. SCL Serial Clock. WC Write Control ... Labels: M14C64, Application Notes |
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| 4. | 27.73 Kb • 2 Pages |
Abstract: ... D22 M14C64, M14128, M14256. D3 ST16ST2G, ST16600, ST16601, ST16SF41, ST16SF42. D4. ST16SF44, ST16SF48, ST16SF4F, ST16CF54B, ST19SF08, ST19SF16, ST19SF32, ST19SF64, ST19CF68, ST19KF16. D5 ... Labels: M14C64 |
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| 5. | 275.54 Kb • 13 Pages |
Abstract: ... D22 M14C64, M14128, M14256. C30 M35101, M35102. C20 M35101, M35102. 2/13. MICROMODULES. The assembly flows is as follows: 1. Dice sawing 2. Dice attach 3. Wire bonding 4. Potting 5. Milling (depending ... Labels: M14C64 |
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| 6. | 1163.36 Kb • 13 Pages |
Abstract: ... D22 M14C64, M14128, M14256. C30 M35101, M35102. C20 M35101, M35102. 2/13. MICROMODULES. The assembly flows is as follows: 1. Dice sawing 2. Dice attach 3. Wire bonding 4. Potting 5. Milling (depending ... Labels: M14C64 |
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| 7. | 69.3 Kb • 7 Pages |
Abstract: ... M14C64 64 Kbit EEPROM (8K x 8) XI≤C 0.6 μm. M14128 128 Kbit EEPROM (16K x 8) XI≤C ST’s Hi-Endurance Double Polysilicon CMOS technology which guarantees an endurance well above 100,000 erase/write ... Labels: M14C64, Application Notes |
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