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  1 - 6 of about 6 for M14C64   
  Part Number Manufacturer   Description        
 1.   M14C64  M14C64 ST Microelectronics   MEMORY CARD IC 64-32 KBIT SERIAL I2C BUS EEPROM 125.14 Kb  14 Pg.    
 2.   M14C64  M14C64 ST Microelectronics   Memory Micromodule 275.54 Kb  13 Pg.    
 3.   M14C64-WD20  M14C64-WD20 ST Microelectronics   Memory Card IC 64/32 Kbit Serial I C Bus EEPROM 94.63 Kb  14 Pg.    
 4.   M14C64-WD20  M14C64-WD20 ST Microelectronics   Memory Card IC 64 Kbit Serial I2C Bus EEPROM 125.13 Kb  14 Pg.    
 5.   M14C64-WD22  M14C64-WD22 ST Microelectronics   Memory Card IC 64/32 Kbit Serial I C Bus EEPROM 94.63 Kb  14 Pg.    
 6.   M14C64-WD22  M14C64-WD22 ST Microelectronics   64 kBit Serial I2C Bus EEPROM 125.14 Kb  14 Pg.    

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  1 - 7 of about 7+ for M14C64   
1. Datasheet Text Contains M14C64
49.06 Kb  •  4 Pages

Abstract: ... The M14C64 is available in micro-module. Micromodule (D22) 2. 2 2. 2. Micromodule (D20) Wafer. Figure 1. Logic Diagram. AI02164. SDA. VCC. M14Cxx WC. SCL. GND. Table 1. Signal Names. SDA Serial Data/Address ...

Labels: M14C64

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2. Datasheet Text Contains M14C64
94.63 Kb  •  14 Pages

Abstract: ... The M14C64 is available in micro-module Figure 1. Logic Diagram. AI02217. SDA. VCC. M14xxx WC. SCL. GND. Table 1. Signal Names. SDA Serial Data/Address Input/ Output. SCL Serial Clock. WC Write Control ...

Labels: M14C64, Application Notes

Datasheet

 

3. Datasheet Text Contains M14C64
125.14 Kb  •  14 Pages

Abstract: ... The M14C64 is available in micro-module Figure 1. Logic Diagram. AI02217. SDA. VCC. M14xxx WC. SCL. GND. Table 1. Signal Names. SDA Serial Data/Address Input/ Output. SCL Serial Clock. WC Write Control ...

Labels: M14C64, Application Notes

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4. Datasheet Text Contains M14C64
27.73 Kb  •  2 Pages

Abstract: ... D22 M14C64, M14128, M14256. D3 ST16ST2G, ST16600, ST16601, ST16SF41, ST16SF42. D4. ST16SF44, ST16SF48, ST16SF4F, ST16CF54B, ST19SF08, ST19SF16, ST19SF32, ST19SF64, ST19CF68, ST19KF16. D5 ...

Labels: M14C64

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5. Datasheet Text Contains M14C64
275.54 Kb  •  13 Pages

Abstract: ... D22 M14C64, M14128, M14256. C30 M35101, M35102. C20 M35101, M35102. 2/13. MICROMODULES. The assembly flows is as follows: 1. Dice sawing 2. Dice attach 3. Wire bonding 4. Potting 5. Milling (depending ...

Labels: M14C64

Datasheet

 

6. Datasheet Text Contains M14C64
1163.36 Kb  •  13 Pages

Abstract: ... D22 M14C64, M14128, M14256. C30 M35101, M35102. C20 M35101, M35102. 2/13. MICROMODULES. The assembly flows is as follows: 1. Dice sawing 2. Dice attach 3. Wire bonding 4. Potting 5. Milling (depending ...

Labels: M14C64

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7. Datasheet Text Contains M14C64
69.3 Kb  •  7 Pages

Abstract: ... M14C64 64 Kbit EEPROM (8K x 8) XI≤C 0.6 μm. M14128 128 Kbit EEPROM (16K x 8) XI≤C ST’s Hi-Endurance Double Polysilicon CMOS technology which guarantees an endurance well above 100,000 erase/write ...

Labels: M14C64, Application Notes

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