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Part : AES-Z7-JESD3-G Supplier : Avnet Catalog Manufacturer : Avnet Stock : - Best Price : €2,827.3496 Price Each : €2,827.3496
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Part : AD-FMCJESDADC1-EBZ Supplier : Analog Devices Manufacturer : Newark element14 Stock : - Best Price : $630.50 Price Each : $630.50
Part : PK2N-2DJE-SD Supplier : Prolight Opto Technology Manufacturer : TME Electronic Components Stock : 283 Best Price : $1.37 Price Each : $1.71
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Part : JESD-204A-E3-U Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $1,057.0900 Price Each : $1,057.0900
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Part : JESD-207-E3-U1 Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $1,057.0900 Price Each : $1,057.0900
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JESD51-3

Catalog Datasheet MFG & Type PDF Document Tags

dap 010

Abstract: JESD51-3 : (TA) (PD) (TJ(MAX) (JA) JA 2 PCB (EIA/JESD51-3) Note 5: VADJ Note 6 , /W JA 67 /W DAP PCB 1 0.055 (0.22 × 0.25 ) JEDEC EIA/JESD51-3 PSOP-8 PSOP , ) JEDEC EIA/JESD51-3 Figure 1 4 PCB DAP TO-263 JA DAP JEDEC EIA/JESD51-5 EIA
National Semiconductor
Original
dap 010 dap11 JESD-51 100K adj dap 11 LP38511-ADJ DS300408-04-JP O-263 MRA08A
Abstract: . EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A , Coff Off-state capacitance pF Thermal Characteristics Parameter Test Conditions EIA/JESD51-3 , VGEN = 600 Vrms, 50/60 Hz RGEN = 1.4*VGEN/ITSM(t) EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C , = VGEN/IT(OV)M EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C TISP4360H3BJ IT(OV)M UL , (JESD51-3, 1996) defines two test PCBs for surface mount components; one for packages smaller than 27 mm Bourns
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GR-1089-CORE 4360H3 TISP4360H3BJR-S TISP4360H3BJ-S

TISP4350H4BJ

Abstract: DO214AA Information and 11 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB , Repetitive peak off- pF thermal characteristics PARAMETER TEST CONDITIONS MIN EIA/JESD51-3 , EIA/JESD51-3 PCB TA = 25 °C 10 9 8 7 6 5 4 3 2 1.5 0·1 1 10 100 100 70 50 , -2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 2 1.5 t - Current Duration - s 1 10 100 1000 t , (JESD51-3, 1996) defines two test PCBs for surface mount components; one for packages smaller than 27 mm
Texas Instruments
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TISP4165H4BJ TISP4200H4BJ TISP4265H4BJ TISP4350H4BJ DO214AA I3124 K20/21

TIP 122 100 V

Abstract: GR-1089-CORE Information and Figure 10 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 , NOTE Junction to free air thermal resistance Test Conditions Min. EIA/JESD51-3 PCB, IT = , RGEN = 1.4*VGEN/ITSM(t) 20 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 I - , Information 10 9 8 7 6 5 4 3 1.5 0·1 10 100 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB , Circuit Board) horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two
Bourns
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TIP 122 100 V TISP4360H3BJR

4250H3

Abstract: Information and Figure 11 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 , `4125 is tested with VD = -98 V. thermal characteristics PARAMETER TEST CONDITIONS EIA/JESD51-3 PCB , /JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C TI4HAC THERMAL IMPEDANCE vs POWER DURATION 150 ZJA , ) APPLIED FOR TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 10 t - Power Duration - s 100 1000 , (Printed Circuit Board) horizontally mounted at the centre. Part 3 of the standard (JESD51-3, 1996) defines
Bourns
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4250H3 TISP4070H3BJ TISP4115H3BJ TISP4125H3BJ TISP4220H3BJ TISP4240H3BJ TISP4400H3BJ
Abstract: at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint , 70 71 60 65 55 30 24 28 22 pF thermal characteristics PARAMETER TEST CONDITIONS EIA/JESD51-3 , /JESD51-3 PCB TA = 25 °C TI4HAC THERMAL IMPEDANCE vs POWER DURATION 150 ZJA(t) - Transient Thermal , -2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 10 t - Power Duration - s 100 1000 TI4HAE t - Current Duration - s , centre. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one Power Innovations
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GR-1089-CORE

Abstract: I3124 . EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A , free air thermal resistance Test Conditions Min. EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 , -2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 10 9 8 7 6 5 4 3 2 1.5 0·1 1 10 100 , ITSM(t) APPLIED FOR TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 2 1.5 t - , (JESD51-3, 1996) defines two test PCBs for surface mount components; one for packages smaller than 27 mm
Bourns
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GR-1089-CORE

Abstract: I3124 EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring track , Parameter RJA NOTE Junction to free air thermal resistance Test Conditions Min. EIA/JESD51-3 , /ITSM(t) 20 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 10 9 8 7 6 5 4 3 , /JESD51-3 PCB TA = 25 °C 2 1.5 t - Current Duration - s 1 10 1000 Figure 9. VDRM , center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one
Bourns
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Abstract: . EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A , PARAMETER TEST CONDITIONS EIA/JESD51-3 PCB, IT = ITSM(1000), RJA Junction to free air thermal resistance TA , -2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C TI4HAC THERMAL IMPEDANCE vs POWER DURATION 150 ZJA(t) - Transient , TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 10 t - Power Duration - s 100 1000 t - , centre. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one Power Innovations
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LM 4440

Abstract: 4180H3 EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring track , Conditions Min EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C, (see Note 7) 265 mm x 210 mm populated , EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 10 9 8 7 6 5 4 3 2 1.5 0·1 1 10 100 100 80 60 50 40 30 20 15 10 8 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 , center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one
Bourns
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TISP4070H3LM TISP4115H3LM TISP4125H3LM TISP4220H3LM TISP4240H3LM TISP4400H3LM LM 4440 4180H3 TISP4070H3

GR-1089-CORE

Abstract: I3124 Information and Figure 10 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 , NOTE 230 Junction to free air thermal resistance Test Conditions Min. EIA/JESD51-3 PCB , RGEN = 1.4*VGEN/ITSM(t) 20 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 I - , Information 10 9 8 7 6 5 4 3 1.5 0·1 10 100 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB , Circuit Board) horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two
Bourns
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TISP4350H3BJ
Abstract: and Figure 11 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB , characteristics PARAMETER TEST CONDITIONS EIA/JESD51-3 PCB, IT = ITSM(1000), RJA Junction to free air thermal , RGEN = 1.4*VGEN/ITSM(t) EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C TI4HAC THERMAL , 3 2 1.5 1 0·1 1 TI4HAE ITSM(t) APPLIED FOR TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA , (Printed Circuit Board) horizontally mounted at the centre. Part 3 of the standard (JESD51-3, 1996) defines Power Innovations
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TISP4095H3BJ TISP4200H3BJ E132482

LITTELFUSE PTC

Abstract: GR-1089-CORE current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard , PARAMETER TEST CONDITIONS MIN EIA/JESD51-3 PCB, IT = ITSM(1000), RJA Junction to free air , VGEN = 600 Vrms, 50/60 Hz RGEN = 1.4*VGEN/ITSM(t) EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 , TISP4360H3BJ IT(OV)M Figure 8. VDRM DERATING FACTOR 1.00 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB , PCB (Printed Circuit Board) horizontally mounted at the centre. Part 3 of the standard (JESD51-3
Power Innovations
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LITTELFUSE PTC

TISP4070H3BJ

Abstract: TISP4095H3BJ at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint , MIN TEST CONDITIONS TYP MAX EIA/JESD51-3 PCB, IT = ITSM(1000), RJA 265 mm x 210 mm , TI4HAC 30 VGEN = 600 Vrms, 50/60 Hz RGEN = 1.4*VGEN/ITSM(t) EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 , EIA/JESD51-3 PCB TA = 25 °C 2 1.5 t - Current Duration - s 1 10 100 1000 t - , (Printed Circuit Board) horizontally mounted at the centre. Part 3 of the standard (JESD51-3, 1996
Power Innovations
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tisp4300h3bj 4145H3

GR-1089-CORE

Abstract: I3124 EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring track , Junction to free air thermal resistance Test Conditions Min. EIA/JESD51-3 PCB, IT = ITSM(1000 , /ITSM(t) 20 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 10 9 8 7 6 5 4 3 , /JESD51-3 PCB TA = 25 °C 2 1.5 t - Current Duration - s 1 10 1000 Figure 9. VDRM , ) horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface
Bourns
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JESD51-2

Abstract: MOS Controlled Thyristor returns to its initial conditions. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint , EIA/JESD51-3 PCB, IT = ITSM(1000) , TA = 25 °C, (see Note 6) 265 mm x 210 mm populated line card, 4 , initial conditions. 10.EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions , Parameter R JA Junction to free air thermal resistance Test Conditions Min EIA/JESD51-3 PCB, IT , Vrms, 50/60 Hz RGEN = 1.4*VGEN/ITSM(t) EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 20
Bourns
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TISP4219H3BJ TISP4125M3BJ TISP4219M3BJ JESD51-2 MOS Controlled Thyristor TISP4125H3BJR-S TISP4125M3BJR-S TISP4125H3BJ/TISP4219H3BJ TISP4125M3BJ/TISP4219M3BJ 4125H3

TISP4080H3BJ

Abstract: GR-1089-CORE 11 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with , /JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C, (see Note 7) 265 mm x 210 mm populated line card, 4 , /60 Hz RGEN = 1.4*VGEN/ITSM(t) 20 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 , ) APPLIED FOR TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 2 1.5 1 0·1 1000 t , the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one for packages
Bourns
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TISP4080H3BJ UL1950 DO-214AA TISP4080H3 TISP4095H3 TISP4115H3 TISP4125H3

ramp generator 555

Abstract: GR-1089-CORE -2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring , Junction to free air thermal resistance NOTE 188 Test Conditions Min EIA/JESD51-3 PCB, IT = , initial conditions. 10.EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions , Parameter R JA Junction to free air thermal resistance Test Conditions Min EIA/JESD51-3 PCB, IT , /JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 20 15 10 9 8 7 6 5 4 3 2 1.5 0·1 1
Bourns
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ramp generator 555 TISP4125H3BJR TISP4125M3BJR TISP4219H3BJR 4219M3

DO214AA

Abstract: GR-1089-CORE at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint , °C Repetitive peak off- pF thermal characteristics PARAMETER TEST CONDITIONS MIN EIA/JESD51-3 , *VGEN/ITSM(t) EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 20 15 10 9 8 7 6 5 4 3 , ITSM(t) APPLIED FOR TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 2 1.5 t - , ) horizontally mounted at the centre. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface
Power Innovations
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TISP4360H4BJ

4070M3

Abstract: 11 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with , TEST CONDITIONS EIA/JESD51-3 PCB, IT = ITSM(1000), RJA Junction to free air thermal resistance TA = 25 , /JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C TI4MAC THERMAL IMPEDANCE vs POWER DURATION 150 ZJA , ITSM(t) APPLIED FOR TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 1 10 t - Power Duration , centre. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one
Power Innovations
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4070M3 TISP4070M3BJ TISP4095M3BJ TISP4200M3BJ TISP4240M3BJ TISP4400M3BJ

JESD51-3

Abstract: JESD51-2 Information and Figure 11 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 , Junction to free air thermal resistance Test Conditions Min. EIA/JESD51-3 PCB, IT = ITSM(1000 , /ITSM(t) 20 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 10 9 8 7 6 5 4 3 , /JESD51-3 PCB TA = 25 °C 2 1.5 t - Current Duration - s 1 10 1000 Figure 9. VDRM , ) horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface
Bourns
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230 98, "surge protector" 4165 TISP4180H4BJ TISP4300H4BJ 4165H4 4180H4 4200H4 4265H4

JESD51-2

Abstract: JESD51-3 at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint , Conditions EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C, (see Note 7) 265 mm x 210 mm populated line card, 4 , /JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C ITSM(t) APPLIED FOR TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 10 t - Power Duration - s 100 1000 1 10 100 1000 t - , (Printed Circuit Board) horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines
Bourns
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BOURNS 4300 impulse generator TISP4XXXH4BJ 4300H4 4350H4

4350M3

Abstract: -2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring , EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C, (see Note 7) 265 mm x 210 mm populated line card, 4 , -2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C TI4MAC THERMAL IMPEDANCE vs POWER DURATION 150 ZJA(t) - Transient , /JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 1 10 t - Power Duration - s 100 1000 TI4MAE t - , (Printed Circuit Board) horizontally mounted at the centre. Part 3 of the standard (JESD51-3, 1996) defines
Bourns
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4350M3 TISP4115M3BJ TISP4220M3BJ DO-214AA/SMB
Abstract: 12 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with , tested with VD = -98 V. thermal characteristics PARAMETER TEST CONDITIONS EIA/JESD51-3 PCB, IT = ITSM , /JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C TI4MAC THERMAL IMPEDANCE vs POWER DURATION 150 ZJA , ) APPLIED FOR TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 1 10 t - Power Duration - s 100 , BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED DECEMBER 2001 standard (JESD51-3 Power Innovations
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GR-1089-CORE

Abstract: I3124 11 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with , characteristics PARAMETER MIN TEST CONDITIONS TYP MAX EIA/JESD51-3 PCB, IT = ITSM(1000), RJA , ) 20 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 10 9 8 7 6 5 4 JA(t , /JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 1 10 100 1000 t - Power Duration - s , (Printed Circuit Board) horizontally mounted at the centre. Part 3 of the standard (JESD51-3, 1996
Power Innovations
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TISP4070M3LM TISP4095M3LM TISP4125M3LM TISP4220M3LM TISP4240M3LM TISP4400M3LM

4395H3

Abstract: 4260H3 . EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A , Junction to free air thermal resistance Test Conditions Min EIA/JESD51-3 PCB, IT = ITSM(1000), TA , /60 Hz RGEN = 1.4*VGEN/ITSM(t) 20 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 , EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 3 2 0·1 1000 ITSM(t) APPLIED FOR , ) horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface
Bourns
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TISP4350H3LM 4395H3 4260H3 DO-92 TISP4145H3 TISP4165H3 TISP4180H3 P0640EC

4250H3

Abstract: GR-1089-CORE current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard , resistance Test Conditions Min EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C, (see Note 7) 265 , /JESD51-3 PCB TA = 25 °C 15 10 9 8 7 6 5 100 80 60 50 40 30 E T E L O S B O , vs MINIMUM AMBIENT TEMPERATURE TI4HAIA 1.00 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA , center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one
Bourns
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P1300EC P0720EC P0900EC P1100EC TISP4220H3 TISP4240H3 TISP4250

GR-1089-CORE

Abstract: TISP4070M3 at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint , Test Conditions Min EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C, (see Note 7) 265 mm x 210 , (t) 20 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 10 9 8 7 6 5 3 2 , /JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 1 10 100 1000 t - Power Duration - s , ) horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface
Bourns
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TISP4115M3LM TISP4350M3LM TISP4070M3 TISP4080M3 TISP4095M3 TISP4115M3
Abstract: Information and Figure 11 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 , tested with VD = -98 V. Thermal Characteristics Parameter Test Conditions EIA/JESD51-3 PCB, IT = ITSM , /JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C ZJA(t) - Transient Thermal Impedance - °C/W 150 100 , -2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 1 10 t - Power Duration - s 100 1000 1 10 100 1000 t - , center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one Bourns
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TISP4125M3 TISP4145M3 TISP4165M3 TISP4180M3 TISP4220M3 TISP4240M3

4200H3

Abstract: TISP4300H3BJ other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions , NOTE Junction to free air thermal resistance Test Conditions Min. EIA/JESD51-3 PCB, IT = , /60 Hz RGEN = 1.4*VGEN/ITSM(t) 20 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 , ) APPLIED FOR TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 2 1.5 1 0·1 1000 t , the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one for packages
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4200H3 ER diode SMB TISP4200H3 TISP4250H3 TISP4265H3 TISP4290H3 TISP4300H3 TISP4350H3

GR-1089-CORE

Abstract: TISP4070H3 other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions , thermal resistance Test Conditions Min. EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C, (see Note , -2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 10 9 8 7 6 5 4 3 2 1.5 0·1 1 10 100 , 5 4 3 ITSM(t) APPLIED FOR TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 2 , center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one
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TISP4395H3 TISP4400H3

TISP4240

Abstract: 4180M3 . EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A , air thermal resistance Test Conditions Min EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C , -2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 10 9 8 7 6 5 4 3 2 1.5 0·1 1 10 100 , ITSM(t) APPLIED FOR TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 1 10 100 , ) horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface
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TISP4240 4180M3 P3100EA TISP4250M3 TISP4260M3 TISP4290M3 TISP4300M3 TISP4350M3 TISP4395M3

4350h3

Abstract: 4145H3 after the TISP4xxxH3LM returns to its initial conditions. 5. EIA/JESD51-2 environment and EIA/JESD51-3 , thermal resistance TEST CONDITIONS MIN EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C, (see Note , RGEN = 1.4*VGEN/ITSM(t) 20 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 10 9 8 , Duration - s Figure 8. 1.00 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 3 2 0·1 , (Printed Circuit Board) horizontally mounted at the centre. Part 3 of the standard (JESD51-3, 1996
Texas Instruments
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4350h3 4400h z 4350h3

LM 4440

Abstract: GR-1089-CORE Information and Figure 11 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 , resistance Test Conditions Min EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C, (see Note 7) 265 mm , ) 20 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 10 9 8 7 6 5 4 3 2 1.5 , /JESD51-3 PCB TA = 25 °C 3 2 0·1 1000 ITSM(t) APPLIED FOR TIME t 6 5 4 t - Current , center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one
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TISP4260H3 LM002 LMF002 EIA-468-B
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