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Part : J-STD-020C Supplier : ELM Electronics Manufacturer : Chip One Exchange Stock : 8,584 Best Price : - Price Each : -
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J-STD-035

Catalog Datasheet MFG & Type PDF Document Tags

JEDEC JESD22-B116

Abstract: SUMIKON EME -883 Method 2010 MIL-STD-883 Method 2009 JEDEC J-STD-035 Per IDT specification MIL-STD-883 Method 2011 MIL-STD , 1008 EIA/JESD22-A102 JEDEC J-STD-20 MIL-STD-883 Method 2010 MIL-STD-883 Method 2009 JEDEC J-STD-035 Per , -883 Method 2009 JEDEC J-STD-035 Per IDT specification MIL-STD-883 Method 2011 MIL-STD-883 Method 2003 EIA , -883 Method 2009 JEDEC J-STD-035 Per IDT specification MIL-STD-883 Method 2011 MIL-STD-883 Method 2003 EIA
Integrated Device Technology
Original
SB-U-00-004 SB-U-03-002 SB-U-04-043 JEDEC JESD22-B116 SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 G-0110-06 EME-7351LP EME-S351LP SB-U-03-003 SB-U-03-005 SB-U-02-002

J-STD-20

Abstract: MIL-STD-883, Method 1010 /JESD22-A102 JEDEC J-STD-20 MIL-STD-883, Method 2010 MIL-STD-883, Method 2009 JEDEC J-STD-035 Per IDT , JEDEC J-STD-20 MIL-STD-883, Method 2010 MIL-STD-883, Method 2009 JEDEC J-STD-035 Per IDT specification
Integrated Device Technology
Original
JESD22-B117 MIL-STD-883, Method 1010 J-STD20 JESD22A110 MIL-STD-883 Method 2010 Solder ball shear G0203 G-0203-01 EIA/JESD22-A110 P01-07-03 BS304 QEH84735

JEDEC JESD22-B116

Abstract: MIL-STD-883 Method 2011 Per IDT specification JEDEC J-STD-035 MIL-STD-883 Method 2009 MIL-STD-883 Method
Integrated Device Technology
Original
G0202-01 P01-11-01 EIA/JESD22-B116 J-STD-020

IDTQS3861QG

Abstract: IDT49FCT3805SOG JESD22-B116 MIL-STD-883, M 2011 J-STD-035 MIL-STD-883, M 2015 J-STD-020C 5/0 5/0 25/0 3/0 5/0 5/0 , Pull Test MIL-STD-883, M 2011 5/0 S.A.T J-STD-035 10/0 X-ray Examination MIL-STD
Integrated Device Technology
Original
IDTQS3VH257QG IDTQS3861QG IDT49FCT3805SOG IDT74FCT162244CTPA IDT74FCT164245TPVG IDT7204L35JG IDT71028S15Y 024S25YG IDT74FCT162244CTPVG IDT74FST163211PAG IDTCV132PVG IDTQS3VH126QG IDT71124S12YG

Reflow

Abstract: JEDEC J-STD-020d.1 , including defects and damage. See J-STD-035 for more information. area array package ­ A package that has , Surface Mount Devices J-STD-035 Acoustic Microscopy for Nonhermetic Encapsulated Electronic , /JEDEC J-STD-035 for operation of the acoustic microscope. 3.5 Cross-Sectioning Microsectioning
-
Original
Reflow JEDEC J-STD-020d.1 JEP-140 JEP140 JESD22-B112 JEDEC J-STD-020d J-STD-020D

JEDEC J-STD-020C

Abstract: JESD47 J-STD-035 Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components 3 APPARATUS 3.1 , /JEDEC J-STD-035 for operation of the scanning acoustic microscope. 3.5 Cross-Sectioning
-
Original
JEDEC J-STD-020C JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 JESD22-A120 J-STD-020B IPC-J-STD-020 1-580987-46-X

BGA and QFP Altera Package mounting profile

Abstract: BGA PROFILING Components (J-STD-035). New York: JEDEC/Electronic Industries Alliance, 1999. JEDEC/Electronic Industries
Altera
Original
JEP113-B BGA and QFP Altera Package mounting profile BGA PROFILING infrared heating gun J-STD-033 PCB JESD22-A113-B 800-EPLD

JESD22-A108-A

Abstract: JESD22-A104-A Tomography Lattice Procedure # 70-103772 J-STD-035 10 units/ Package family/ Subcontractor /month
Lattice Semiconductor
Original
JESD22-A108-A JESD22-A104-A JEDS22-C101-A JESD22*108 EIA-671 ISO14000 MIL-STD-883E