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Abstract: Industry standard RA cored wire for decades · Classified as ROM1 per J-STD-004 Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650 IPC-TM-650, Method 2.3.35.1 Application Notes Availability: 44 , Corrosion: Moderate Tested to J-STD-004, IPC-TM-650 IPC-TM-650, Method 2.3.32 Corrosion Test: Moderate Tested to J-STD-004, IPC-TM-650 IPC-TM-650, Method 2.6.15 Silver Chromate: Fail Tested to J-STD-004, IPC-TM-650 IPC-TM-650, Method 2.3.33 Chloride and Bromides: 0.44% Tested to J-STD-004, IPC-TM-650 IPC-TM-650, Method 2.3.35 Performance ... Original
datasheet

2 pages,
79.92 Kb

SN63PB37 IPC-TM-650 J-STD-004 solder wire rom1 kester Sn62Pb36Ag02 SN62PB36AG02 sn63pb37 solder wire datasheet abstract
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Abstract: and expense of cleaning · Low smoke and odor · Low spattering · Classified as ROM1 per J-STD-004 , (typical): Tested to J-STD-004, IPC-TM-650 IPC-TM-650, Method 2.4.46 Area of Spread mm2 (in2) Flux Core Solder , J-STD-004, IPC-TM-650 IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650 IPC-TM-650, Method 2.6.15 Silver Chromate: Fail Tested to J-STD-004, IPC-TM-650 IPC-TM-650, Method 2.3.33 Chloride and Bromides: 1.05% Tested to J-STD-004, IPC-TM-650 IPC-TM-650, Method 2.3.35 Performance Characteristics: · Unparalleled wetting ... Original
datasheet

2 pages,
41.28 Kb

Kester* 1544 IPC-TM-650 J-STD-004 datasheet abstract
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Abstract: SPECIFICATION CONTROL DRAWING MATERIALS 1. SEALING SLEEVE: High temperature fluid stabilized cross-linked elastomer according to Specification RK-6008 RK-6008. 2. MELTABLE RINGS: Modified stabilized elastomer-fluoropolymer thermoplastic. 3. BRAID: Tin-plated copper wire braid, fluxed and tinned at both ends. SOLDER: TYPE Sn96 per ANSI/J-STD-006 ANSI/J-STD-006. FLUX: TYPE ROM1 per ANSI/J-STD-004. 4. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI/J-STD-006 ANSI/J-STD-006. FLUX: TYPE ROM1 per ANSI/J-STD-004. 5. INSULATION SLEEVE: Heat-shrinkable ... Original
datasheet

1 pages,
72.17 Kb

RK-6008 2524E0524-9 RPIP-700-00 Raychem joint raychem copper cable JOINT procedure J-STD-006 ANSI/J-STD-006 ANSI/J-STD-004 -QQ-N-290 RK-6008 abstract
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Abstract: : Heat-shrinkable, translucent natural, radiation cross-linked thermoplastic, polyolefin. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI/J-STD-006 ANSI/J-STD-006. FLUX: TYPE ROM1 per ANSI/J-STD-004. 3. SHIELD: Solder impregnated, flux coated copper wire braid. SOLDER: TYPE Sn63 per ANSI/J-STD-006 ANSI/J-STD-006. FLUX: TYPE ROM1 per ANSI/J-STD-004 APPLICATION 1. These parts are designed to make a termination between the shield of a Tyco ... Original
datasheet

1 pages,
71.79 Kb

ANSI 60 J-STD-006 D-150-1013 D-150-1004 D-150-1005 D-150-1006 D-150-1007 D-150-1008 D-150-1009 D-150-1010 D-150-1011 D-150-1014 D-150-1016 D-150-1004 abstract
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Abstract: that are more difficult to solder. IPC/J-STD-004 Flux designator ROM1 Residue Removal Residue is , /J-STD-004 Flux Designator ROM1 331 Water-Soluble 1.25% 66 core (3.3%) IPC/J-STD-004 Flux designator ORH1 , non-corrosive if not cleaned. Per J-STD-004, "44"® is classified as ROM1 flux. "44"® RA Core 1 lb. Part # , /J-STD-004 Flux Designator ROL0 500g jar, 600g, 1400g cartridges EnviroMarkTM 828 Water-Soluble Stencil , , cleanability and lowvoiding. Cleanable in warm water 89.5%, -325/+500 (Type 3) IPC/J-STD-004 Flux Designator ... Original
datasheet

18 pages,
793.14 Kb

TSF-6852 2220-VF J-STD-006A RF-741 rom1 flux 14-6337-0015 Sn60Pb40 sn63pb37 solder wire J-STD-006B J-STD-004 solder wire rom1 TSF-6850 sn63pb37 TC-527 Sn62Pb36Ag2 datasheet abstract
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Abstract: TDS C502, December-2009 RELIABILITY PROPERTIES J-STD-004 Solder spread mm² Corrosion Test SIR , product characteristics: Technology Activity Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Solder wire - Cored Medium · No clean · Clear residue · Good wetting · , ) Bellcore TR-NWT-000078 TR-NWT-000078 Classification EN29454-1 EN29454-1 IPC-SF-818 IPC-SF-818 J-STD-004 310 Pass Pass Pass Pass , Nickel C502 cored solder wire has been specially formulated to complement no clean wave and reflow ... Original
datasheet

2 pages,
80.25 Kb

TR-NWT-000078 C502 SAC305 99c solder SAC387 solder SN60 SN62 SN63 SAC387 Multicore 96SC IPC-SF-818 J-STD-004 solder wire rom1 datasheet abstract
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Abstract: modified polyolefin. Transparent clear. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Cd18 per ANSI J-STD-006 J-STD-006. FLUX: TYPE ROM1 per ANSI J-STD-004. 3. MELTABLE RING: Thermally stabilized thermoplastic. Color: blue. APPLICATION 1. This controlled soldering device is designed for termination of a wire to the , øA max min C 29.3 (1.154) øB max 4.5 (0.175) Wire and Pin Dimensions øC min 2.3 , results, prepare the wire as shown: Tyco Electronics Corporation 300 Constitutional Drive Menlo Park ... Original
datasheet

1 pages,
108.97 Kb

J-STD-006 J-STD-004 solder wire rom1 J-STD-004 06090 H54286 RPIP-824-00 CWT-1505 CWT-1505 abstract
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Abstract: blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn96 per ANSI J-STD-006 J-STD-006. FLUX: TYPE ROM1 per ANSI J-STD-004. 3. & 4. MELTABLE RINGS: Low outgassing , SPECIFICATION CONTROL DRAWING Product Revision Product Name D-110-0220 D-110-0220 A L max 14.80 (0.580) Product Dimensions A B min min 1.70 2.00 (0.070) (0.080) D max 1.70 (0.070) Wire Dimensions E min , THERMOFIT DEVICES SOLDERSLEEVE WIRE TERMINATOR DOCUMENT NO.: DCR NUMBER: UNLESS OTHERWISE SPECIFIED ... Original
datasheet

1 pages,
41.64 Kb

D-110-0220 D-110-0220 abstract
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Abstract: CUSTOMER DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006 J-STD-006. FLUX: TYPE ROM1 per ANSI J-STD-004. 3. MELTABLE RING: Thermally stabilized thermoplastic. Color ­ , 5. Strip shield and wire and fold back braid to 9.40±1.27 (0.37±0.05) For best results, prepare the , Dr Menlo Park, CA 94025, U.S.A. TITLE: SOLDERSLEEVE , HIGH TEMPERATURE For Nickel Plated Wire ... Original
datasheet

1 pages,
39.41 Kb

J-STD-006 J-STD-004 RCPS-100-70 RT-1404 J-STD-006 abstract
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Abstract: , radiation cross-linked modified polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: Qty: see table. SOLDER: TYPE Sn42Bi58 per ANSI / J-STD-006 J-STD-006. FLUX: TYPE ROM1 per ANSI / J-STD-004. 3. CONICAL SPRING: Square copper wire. 4. END CLOSURE BALL: Tinted glass. Color: see table. 5. SEALING INSERT: Hot melt adhesive. , ] Bundle Diameter 鳧 max 3.3 [0.130] 4.5 [0.175] 7.0 [0.275] 9.0 [0.350] Qty: Item 2 (Solder) 1 2 2 3 L�5 , against immersion). Immersion resistant sealing is dependent on the wire combinations used. The user ... Original
datasheet

1 pages,
44.8 Kb

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