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IPC-TM650

Catalog Datasheet MFG & Type PDF Document Tags

bellcore GR-78

Abstract: -004 REL0 Copper Mirror IPC-TM-650 2.3.32 No removal of copper film Silver Chromate IPC-TM-650 2.3.33 Pass Corrosion IPC-TM-650 2.6.15 Pass SIR JSTD-004,Pattern Down IPC-TM-650 , Analysis 55% Acid Value IPC-TM-650 2.3.13 190-210 Flux Residue Dryness IPC-TM-650 2.4.47 Pass Spitting of Flux-Cored Solder IPC-TM-650 2.4.48 0.3% Solder Spread IPC-TM-650
MG Chemicals
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bellcore GR-78 SAC305 4900-35G 4900-112G 4900-227G 4900-454G
Abstract: (6â'"7) IPC-TM-650, Method 2.4.9 Method B Method D Solder Float â'ƒ 10 sec at 288°C (550°F) Pass IPC-TM-650, Method 2.4.13 Method B Dimensional Stability, % â'"0.02 â'ƒ â'"0.04 IPC-TM-650, Method 2.2.4 Method B, % Method C, % Dielectric Constant (at 1 MHz) 3.7 0.0014 Dielectric Strength, kV/mm (Kv/mil) IPC-TM-650, Method 2.5.5.3 200 (4.9) Dissipation Factor (at 1 MHz) IPC-TM-650, Method 2.5.5.3 ASTM D-149 Volume Resistivity (damp heat), megohm 10 DuPont
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354500R 352500R 182500R H-73247

kester Sn62Pb36Ag02

Abstract: Sn63pB37 temp profile viscometer @ 10rpm and 25°C Initial Tackiness (typical): 45 grams Tested to J-STD-005, IPC-TM-650, Method 2.4.44 Slump Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.35 Solder Ball Test: Preferred Tested to J-STD-005, IPC-TM-650, Method 2.4.43 â'¢ Excellent dispensing characteristics using , J-STD-004 Wetting Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.45 Reliability Properties Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test
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kester Sn62Pb36Ag02 Sn63pB37 temp profile IPC-TM-65
Abstract: Sn content Balance Flux Classification JSTD-004 REL0 Copper Mirror IPC-TM-650 2.3.32 No removal of copper film Silver Chromate IPC-TM-650 2.3.33 Pass Corrosion IPC-TM-650 2.6.15 Pass SIR JSTD-004,Pattern Down IPC-TM-650 2.6.3.3 2.33 x 10 11 ohms SIR , -78-CORE 13.1.4 Pass Post Reflow Flux Residue TGA Analysis 55% Acid Value IPC-TM-650 2.3.13 190-210 Flux Residue Dryness IPC-TM-650 2.4.47 Pass Spitting of Flux-Cored Solder IPC-TM-650 MG Chemicals
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4901-112G 4901-227G 4901-454G 4901-2LB
Abstract: (typical): 40 grams Tested to Kester Method 1W-QC-3-04 Slump Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.35 Solder Ball Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.43 Wetting Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.45 Reliability Properties Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.3 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Chloride and Kester
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EP256 GR-78 D-82216

bellcore GR-78

Abstract: sn63pb37 solder wire . Reliability Properties Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Chloride and Bromides: None Detected Tested to J-STD-004, IPC-TM-650, Method 2.3.35 Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method , -78 SIR, IPC (typical): Pass Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 Blank Day 1 Day 4 Day 7
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sn63pb37 solder wire sn63pb37 solder wire shelf life kester 245 solder wire sn63pb37 ROSIN FLUX TYPE ROL0 Sn62Pb36Ag02 MIL-F-14256
Abstract: Tackiness (typical): 100 grams Tested to J-STD-005, IPC-TM-650, Method 2.4.44 Acid Number: 75.4 mg KOH/g of flux Tested to J-STD-004, IPC-TM-650, Method 2.3.13 Reliability Properties Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Performance Characteristics: â'¢ â'¢ â , -78 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Chloride and Bromides: None Detected Tested to J-STD Kester
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TSF-6522
Abstract: Dispensing applications: 450Kcps +/-10% Tested according to IPC-TM-650 Synthetic materials Long stencil , ) Test Results Test Standard Values Flux Designator IPC-TM-650 2.3.35 NA RELO Copper Mirror IPC-TM-650 2.3.32 NA PASS Silver Chromate IPC-TM-650 2.3.33 NA PASS Bono Mirror Test AMTECH
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SMD291SNL SMD291SNL10 60-90S

Sn63Pb37

Abstract: (typical): 32 grams Tested to J-STD-005, IPC-TM-650, Method 2.4.44 Slump Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.35 Solder Ball Test: Preferred Tested to J-STD-005, IPC-TM-650, Method 2.4.43 Wetting Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.45 Reliability Properties Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.3 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method
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Kester 197

Abstract: Malcom viscometer @ 10rpm and 25°C Initial Tackiness (typical): 45 grams Tested to J-STD-005, IPC-TM-650, Method 2.4.44 Slump Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.35 Solder Ball Test: Preferred Tested to J-STD-005, IPC-TM-650, Method 2.4.43 Wetting Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.45 Reliability Properties Copper Mirror Corrosion: High Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate
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Kester 197

Sn62Pb36Ag02

Abstract: 959T lead-free soldering. Reliability Properties Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Chloride and Bromides: None Detected Tested to J-STD-004, IPC-TM-650, Method 2.3.35 Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650 , Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 Blank Day 1 Day 4 Day 7 275 1.6 ×10 1.2 ×1010
Kester
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959T Kester 275 kester Sn63pB37 IPC-TM650
Abstract: combined with a lead free alloy) Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Chloride and Bromides: None Detected Tested to J-STD-004, IPC-TM-650, Method 2.3.35 Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 Blank Day 1 Day 4 Day 7 275 1.6 ×10 â"¦ 1.2 ×1010 â"¦ 1.1 à Kester
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2002/95/EC

ROSIN FLUX TYPE ROL0

Abstract: kester 186 . Reliability Properties Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Chloride and Bromides: None Detected Tested to J-STD-004, IPC-TM-650, Method 2.3.35 Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method , alloy) Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 Blank Day 1 Day 4 Day 7 285 1.0 Ã
Kester
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kester 186 ROSIN 285 solder wire shelf life

J-STD-004

Abstract: IPC-TM-650 Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Performance Characteristics: · · · · · Improves , -004, IPC-TM-650, Method 2.3.33 Chloride and Bromides: None Detected Tested to J-STD-004, IPC-TM-650, Method 2.3.35 Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 SIR, IPC (typical): Pass Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 Blank Day 1 Day 4 Day 7 951
Kester
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IPC-TM-650 2.3.32 J-STD004 Kester J-STD-004 solder wire

2331-ZX

Abstract: Sn62Pb36Ag02 . Reliability Properties Copper Mirror Corrosion: High Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: High Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Fail Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Chloride and Bromides: 1.2% Tested to J-STD-004, IPC-TM-650, Method 2.3.35 Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 , -004 SIR, IPC (typical): Pass Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 Blank Day 1 Day 4 Day 7
Kester
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2331-ZX Kester LIQUID FLUX ZX 650

kester 245 solder wire

Abstract: bellcore GR-78 -78 Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Chloride and Bromides: None Detected Tested to J-STD-004, IPC-TM-650, Method 2.3.35 Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 , -004, IPC-TM-650, Method 2.4.46 Area of Spread mm2 (in2) Flux Core Solder Plastic Rosin Core 285 Mildly
Kester
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kester 245 SN62 MIL-F-14256 W kester 952-d6 952-D6

J-STD-004

Abstract: Kester 275 J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Chloride and Bromides: None Detected Tested to J-STD-004, IPC-TM-650, Method 2.3.35 Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 Blank , 10 Spread Test (typical): Tested to J-STD-004, IPC-TM-650, Method 2.4.46 Area of Spread mm2
Kester
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Sn63 Flux-pen kester 285 solder wire

J-STD-004 solder wire rom1

Abstract: kester 285 solder wire J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Fail Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Chloride and Bromides: 1.05% Tested to J-STD-004, IPC-TM-650, Method 2.3.35 Performance Characteristics: · Unparalleled , Kester 48 was designed for lead-free alloys. Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 SIR, IPC (typical): Pass Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 Blank Day
Kester
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J-STD-004 solder wire rom1 Kester* 1544 kester 44 rosin 1544 Rosin Solder FLUX

SMD-291AX

Abstract: t io n s: 4 5 0 Kcp s + / - 1 0 % No refrigeration required Tested according to IPC-TM-650 , J-STD-004 (IPC-TM-650) Test Results Test Standard Values Results Flux Designator IPC-TM-650 2.3.35 NA RELO Copper Mirror IPC-TM-650 2.3.32 NA PASS Silver Chromate IPC-TM-650 2.3.33 NA PASS Bono Mirror Test
AMTECH
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SMD-291AX SMD291AX SMD291AX10
Abstract: -004 Conforms to Bellcore GR-78 Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Chloride and Bromides: None Detected Tested to J-STD-004, IPC-TM-650, Method 2.3.35 Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 SIR, IPC (typical): Pass Tested to J-STD-004, IPC-TM-650 Kester
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952-S

sn63pb37 solder wire shelf life

Abstract: kester 44 rosin Corrosion: Moderate Performance Characteristics: Tested to J-STD-004, IPC-TM-650, Method 2.3.35 â , -004, IPC-TM-650, Method 2.3.32 Corrosion Test: Moderate Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Fail Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Chloride and Bromides: 0.44% Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 44 Application Notes
Kester
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