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IPC-SM-786A

Catalog Datasheet MFG & Type PDF Document Tags

ipc-sm-786A

Abstract: EPX780 specified in IPC-SM-786A, Altera is now able to recommend a Level 3 moisture rating for all TQFP products , ) ALL PRODUCTS ALL Level 5 / 24 hours OE RQFP (208, 240, 304) · * Per IPC-SM-786A
Altera
Original
EPF8636 EPF10K20 EPF10K30 EPF10K40 EPX780 altera TQFP 32 PACKAGE RQFP EPX880 EPF81188 EPF81500 EPF8820

G004

Abstract: ipc-sm-786A components to absorb moisture from the environment (Ref. IPC-SM-786A). Rapid thermal expansion of the , moisture absorption. (Ref. IPC-SM-786A) The characterization process is designed to collect information , standard categories (Ref. IPC-SM786A pg. 3). The categories are intended to be used by IC producers to , Package Cracking IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs , IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs IPC
Pulse Engineering
Original
G004 MIL-STD-81075 MIL-D-3464 IPC-4202 JESD22-A113 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE

IPC-SM-780

Abstract: IPC-SM-786 Moisture-/Reflow-Sensitive ICs (IPC-SM-786A), the standard from the Institute for Interconnecting and , -/Reflow-Sensitive ICs (IPC-SM-786A). New York: Institute for Interconnecting and Packaging Electronic Circuits
Altera
Original
IPC-SM-780 IPC-SM-786 BGA and QFP Altera Package mounting moisture sensitive handling and packaging Solder paste floor life ANSI/IPC-SM-780 ANSI/IPC-SM-786 IPC-TM-650 JESD22-A112

ADV9801

Abstract: MP-8000 CUSTOMER ADVISORY FLEX 10K ADDITIONAL SOURCE OF SUPPLY Altera has improved the thermally enhanced QFP package used for the FLEX 10K products to meet a Level 3 moisture rating as specified in JEDEC STD-020 and IPC-SM-786A. This upgrade will take effect in Q2 1998 for all FLEX 10K devices. The dry-pack label for these products will indicate that the product meets the Level 3 moisture rating and can be removed from the moisture barrier bag for 168 hours before surface mounting is required. This
Altera
Original
MP-8000 ADV9801 MP8000 pdf epf8282 EPF8282/A J-STD-020

ipc-sm-786

Abstract: IPC-SM-780 -/Reflow-Sensitive ICs (IPC-SM-786A). New York: Institute for Interconnecting and Packaging Electronic Circuits
Altera
Original
Soldering guidelines 780 AC IPC-TM650 guidelines 100PQFP 84JPLCC

IPC-SM-786A

Abstract: BGA and QFP Altera Package mounting profile Characterizing & Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A), the standard from the Institute for , Characterizing and Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A). New York: Institute for
Altera
Original
BGA and QFP Altera Package mounting profile altera board J-STD-020A EIA/JEP113-A 800-EPLD

IPC-SM-780

Abstract: IPC-SM-786 -/Reflow-Sensitive ICs (IPC-SM-786A), the standard from the Institute for Interconnecting and Packaging Electronic , , Inc. Procedures for Characterizing and Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A). New
Altera
Original
OVEN IPC-SM-780 solder paste

IPC-SM-786

Abstract: Soldering guidelines -/Reflow-Sensitive ICs (IPC-SM-786A). New York: Institute for Interconnecting and Packaging Electronic Circuits
Altera
Original
IPC-SM786AM PCB220

IPC-SM-780

Abstract: Moisture-/Reflow-Sensitive ICs (IPC-SM-786A), the standard from the Institute for Interconnecting and , , Inc. Procedures for Characterizing and Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A). New
Altera
Original

IPC-SM-786A

Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE met the devices must be baked at 24 hours for 125 deg C as per PMC-940101. "ANSI/IPC-SM-786A , Moisture Sensitive Plastic IC Packaged Devices ANSI/IPC-SM-786A Procedures for Characterizing and
PMC-Sierra
Original
PMC-951041 ic packages baxter iv bag A113 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICES

ipc-sm-786A

Abstract: Documents Phone: USA and Canada 800-854-7179, International 1-303792-2181 IPC Standard IPC-SM-786A
Xilinx
Original
Q1-02

TB363

Abstract: Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs) specification were drafted. The more widely accepted includes JEDEC STD22B, Test Method A112-A and IPC-SM-786A
Intersil
Original
TB363 Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs) Plastic Packages EIA-583 mold compound J-STD-033 PCB ISO9000

EIA-583

Abstract: JEP-113 specification were drafted. The more widely accepted includes JEDEC STD 22B, Test Method A112-A and IPC-SM-786A
Intersil
Original
JEP-113 moisture handling JEP113 TB334

G017

Abstract: als244c IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs IPC
Pulse Engineering
Original
G017 als244c hipotted IPC-TP-787 perkin cte table

transport media and packing

Abstract: ic shelf life that the bag was sealed the IPC-SM-786A ``Moisture Sensitivity'' level and maximum floor life is , Conditions Floor Life Intel in line with IPC-SM-786A is classifying surface mount components into six levels
Intel
Original
transport media and packing ic shelf life Ultrasonic cleaner circuit diagram MIL-B-81705 PQFP moisture sensitive handling and packaging PQFP dimension intel

intel packaging handbook 240800

Abstract: Ultrasonic cleaner circuit diagram " label (Figure 8-3) contains the date that the bag was sealed (MM/DD/YY), the IPC-SM-786A "Moisture , IPC-SM-786A (currently in process), is classifying surface mount components into sixseveral levels of
Intel
Original
intel packaging handbook 240800 intel 815 reflow profile Intel Packaging Handbook 240800 solder INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT PQFP die size CH08WIP

lt941

Abstract: 1174H5 of a requirement for Dry Pack, LTC employs as a guideline the methods of IPC-SM-786A, Procedures
Linear Technology
Original
lt941 1174H5 1460d5 121i3 117450 LT1682CMS8 1460DCS3-10 LT1460CIS3-10 LT1460DIS3-10 LT1460CS3-2 LT1460IS3-2 LT1460CS3-3

JEDEC J-STD-020C

Abstract: JESD47 1999 J-STD-020 - October 1996 JEDEC JESD22-A112 IPC-SM-786A - January 1995 IPC-SM-786 - December
-
Original
JEDEC J-STD-020C JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 JESD22-A120 J-STD-020C J-STD-020B IPC-J-STD-020 1-580987-46-X

2 pin crystal oscillator 50mhZ-200mhz

Abstract: Maker Communications . The MXT3010EP is a level 3 IAW IPC-SM-786A or JESD 22-A112 moisture sensitive device. The MXT3010EP
-
Original
2 pin crystal oscillator 50mhZ-200mhz Maker Communications idc 14 pin out CDC586 MXT3010 AGS fuses MXT3010C

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint IPC-SM-786A "Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs". 10
Xilinx
Original
HQ160 PQ160 PQ100 HQ208 PQ208 TQ100 footprint jedec MS-026 TQFP JEDEC MS-026 footprint fine BGA thermal profile qfp 64 0.5 mm pitch land pattern schematic impulse sealer BGA 11x11 junction to board thermal resistance VQ100

SMD Packages

Abstract: Supersedes: IPC/JEDEC J-STD-033 April 1999 JEDEC JEP124 IPC-SM-786A - January 1995 IPC-SM-786 - December
Silicon Standard
Original
SMD Packages J-STD-033A

Reflow

Abstract: JEDEC J-STD-020d.1 October 1996 JEDEC JESD22-A112 IPC-SM-786A - January 1995 IPC-SM-786 - December 1990 Users of this
-
Original
Reflow JEDEC J-STD-020d.1 JEP-140 JEP140 J-STD-035 JESD22-B112 J-STD-020D
Showing first 20 results.