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IPC-A-610-D

Catalog Datasheet MFG & Type PDF Document Tags

IPC-A-610D

Abstract: IPCA610D 3 of 9 Application Note AN:017 IPC-A-610D 132 L Figure 1 , ]1.5 mm [0.0591 in] 1 - IPC-A-610D 2 - IPC-A-610D 3 - IPC-A-610D
Vicor
Original
SMDJEDEC-STD-020C IPC-A-610 IPCA610D ipc 610D IPC-A610D IPC-A-610-D 610D 03-5487-5407R

IPC-A-610D

Abstract: ipc 610D pins is interpreted literally from the standard IPC-A-610D requirements. This application note , component with bottom-only termination, section 8.2.10 of IPC-A-610-D. When the module is attached to the , -side termination from IPC-A-610-D standard since it will allow them to have a larger process window. Figure 7 , of IPC-A-610-D, which does not require a side solder fillet height on all sides of the pin
Lineage Power
Original
IPC-9701 solder joint lineage power ipc 610 ipc 9701 AN09-002

flux ef 2202

Abstract: ipc 610D Protrusion Pin/Lead protrusion guidelines, defined in IPC-A-610D, are necessary to enable a good solder , electronic products as defined in IPC-A-610D · Class 3 ­ High performance electronic products as defined in IPC-A-610D Board Cleaning If water-soluble solder is used, the board can be water washed using
Vicor
Original
flux ef 2202 ipc 610 Class 3 pin protrusion ipc 610 non-wetting ipc 610 Class 3 AN017

ipc 610 Class 3 pin protrusion

Abstract: flux ef 2202 IPC-A-610D, are necessary to enable a good solder connection. Minimum criteria require the lead end to , as defined in IPC-A-610 D · Class 2 ­ Dedicated service electronic products as defined in IPC-A-610D · Class 3 ­ High performance electronic products as defined in IPC-A-610D Board Cleaning If
-
Original
Outgass flux ef 13

jedec footprint MO-220 VHHD-2

Abstract: qfn 44 PACKAGE footprint as defined in international standard IPC-A-610D. Refer to extract in the Appendix. Figure 2 Type , . This is as defined in international standard IPC-A-610D. Refer to extract in the Appendix. Figure 3 , international standard IPC-A-610D; whether fillets are formed or not does not affect the mechanical strength , WAN_0118 APPENDIX: Extract from IPC-A-610D (Copyright IPC, Bannockburn, IL. Used by permission
Wolfson Microelectronics
Original
jedec footprint MO-220 VHHD-2 qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN_0118

MIL-I-46058C

Abstract: Meets requirements of MIL-I-46058C and IPC-A-610D ï'§ Helps prevent static discharge problems on
Chemtronics
Original
CW3300 CW3300C

AN40010

Abstract: assembly standards, the following information is based on the IPC-A-610D Standard, Acceptability of
Mini-Circuits
Original
AN40010 AN-40-010 M150261

M1275

Abstract: AN40010 standards, the following information is based on the IPC-A-610D Standard, Acceptability of Electronics
Mini-Circuits
Original
M1275 AWG 26 copper wire M127523

CSG484

Abstract: XAPP427 solder joints from Sn/Pb solder joints. More detailed information can be found in the latest IPC-A-610D , Xilinx, visit the Pb-free web site at www.xilinx.com/pbfree. References 1. IPC-A-610D
Xilinx
Original
XAPP427 CPG196 CSG324 FFG784 FFG1155 CSG484 FFG676 BGA reflow guide Lead Free reflow soldering profile BGA FTG64 FFG665 FFG1136 FFG1153 FFG1759

Lead Free reflow soldering profile BGA

Abstract: FFG668 solder joints from Sn/Pb solder joints. More detailed information can be found in the latest IPC-A-610D , products from Xilinx, visit the Pb-free web site at www.xilinx.com/pbfree. References 1. IPC-A-610D
Xilinx
Original
FFG1738 FFG668 TQG144 BFG95 BGA PROFILING VOG48 FFG323 FFG324

73507

Abstract: IPC-9701 derived from IPC-A-610D[4]; refer to Appendix D for relevant details. The visual inspection also , issues with leadfree," by Martin Wickham, NPL. [4] IPC-A-610D Criteria for Solder Joint Quality
Vishay Siliconix
Original
AN610 73507 ekra e5 SAC387 tamura tlf tamura solder paste pyramax

ipc 610D

Abstract: IPC-SM-7525A , Silver and Copper," 2005 [6] IPC-A-610-D, "Acceptance of Electronic Assemblies," February 2005 [7
Fairchild Semiconductor
Original
AN-9049 IPC-SM-7525A JESD22-B102D FAN2103MPX FAN21SV06EMPX entek ht plus j-std-001d Fairchild, leadframe materials J-STD001C J-STD-001D

IPC-SM-7525A

Abstract: IPC-7525 Pastes with Alloys of Tin, Silver and Copper," 2005 [6] IPC-A-610-D, "Acceptance of Electronic
Fairchild Semiconductor
Original
AN-9048 IPC-7525 IPC-4101B J-STD-001C JSTD001D IPC-4101 100C FDMF6700 FDMF6704 FDMF6704A FDMF6704V FDMF6730

POWER33

Abstract: IPCA610D , Silver and Copper," 2005 [6] IPC-A-610-D, "Acceptance of Electronic Assemblies," February 2005 [7
Fairchild Semiconductor
Original
FDMC2523P FDMC8554 POWER33 sac 305 IPC610D IPC7525 7525A smt AN-9040 FDM3622 FDM6296 FDMC2610 FDMC2674

ipc 610D

Abstract: IPC-7525 Testing and Analysis of Lead Free Solder Pastes with Alloys of Tin, Silver and Copper," 2005 [6] IPC-A-610-D
-
Original
AN9046 FDMS9600S voids 7525a Intel reflow soldering profile BGA ipc 7525A J-STD-001 FDMS9620S

ipc 610D

Abstract: IPC-SM-7525A of Tin, Silver and Copper," 2005 [6] IPC-A-610-D, "Acceptance of Electronic Assemblies," February
-
Original
FPF1008 ipc 7525 electronic design fpf2202 AN9047 FPF1007 FPF1009 FPF2140 FPF2142

IPC-A-610D

Abstract: JSTD001D . * Congratulations to the following graduates. Certification is valid for two years. IPCA610D Application
Voltage Multipliers
Original
OZ100SG

IPC-7525

Abstract: QFN 52 8x8 footprint Pastes with Alloys of Tin, Silver and Copper," 2005 [6] IPC-A-610-D, "Acceptance of Electronic
-
Original
AN-9037 FDMF8705 QFN 52 8x8 footprint FDMF8700 FDMF8704 FDMF8704V

WLCSP stencil design

Abstract: 7531A 2005 [5] IPC-A-610-D, "Acceptance of Electronic Assemblies," February 2005 [6] IPC J-STD
Fairchild Semiconductor
Original
AN-9045 IPC-7531A FPF1003 FPF1004 FDZ191P WLCSP stencil design 7531A WLCSP SMT FDZ193P

JESD22-B102D

Abstract: J-STD-002 8-5, section 8.2.5 of IPC-A-610D. "Climb" of the solder up the side of the lead or toe is not , the heel fillet. The tables and dimensions in IPC-A-610D are identical to those in J-STD-001D. Stated
Texas Instruments
Original
J-STD-002 ISO 1073-2 SCEA038
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