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IPC 7351/7355

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: . Dimensions of MQFP and LQFP_EP packages If the PCB land pattern is designed per IPC-7351, the center of , equations for land pattern design can be found in detail using the "IPC-7351" section of Generic , for Surface Mount Design and Land Pattern Standard. IPC-7351, February 2005. Document History ... Analog Devices
Original
datasheet

3 pages,
36.03 Kb

ADSP-21371 ADSP21369 EE-notes ee-notes for ADSP-21369 MQFP 28x28 land pattern for MQFP IPC 7351 ADSP-21369 LQFP_EP ipc7351 IPC-7351 EE-313 TEXT
datasheet frame
Abstract: 7351 SMT - Stiftleisten RM 2,00mm - 1-/2-reihig Technische Daten /Technical Data Isolierkörper Thermoplastischer Kunststoff, nach UL94 V-0 Insulator Thermoplastic, rated UL94 V-0 Kontaktmaterial , Contacts * 7351 40 03-40 Einreihig Single row 04-80 Zweireihig Double row Passende Buchsenleisten , Ÿ folgendem Temperatur-Profil in Anlehnung an die IPC/JEDEC J-STD-020C J-STD-020C für bleifreies Löten im , 6°C / second max. Time 25°C to Peak Temperature Items should be soldered according to IPC ... W+P Products
Original
datasheet

2 pages,
228.01 Kb

TEXT
datasheet frame
Abstract: 1.55 Y1 1.95 : 1. 2. 3. 4. (mm) ANSI Y14.5M-1994 5M-1994 IPC-7351 (MMC) 5. (LMC) 0.05 mm (NSMD) 60 μm 6. 7. 8. 0.125 mm 5 1:1 9. 10. 3 JEDEC/IPC JSTD , Y1 1.95 : 1. 2. 3. 4. (mm) ANSI Y14.5M-1994 5M-1994 IPC-7351 (MMC) 5. (LMC) 0.05 mm , 1.35 Y1 1.70 : 1. 2. 3. 4. (mm) ANSI Y14.5M-1994 5M-1994 IPC-7351 (MMC) 5. (LMC , ) 2.60 E 1.27 X1 0.80 Y1 1.70 : 1. 2. 3. 4. (mm) ANSI Y14.5M-1994 5M-1994 IPC-7351 ... Silicon Laboratories
Original
datasheet

25 pages,
530.82 Kb

TEXT
datasheet frame
Abstract: E 5.08 X1 1.55 Y1 1.95 1. 2. 3. 4. (mm) ANSI Y14.5M-1994 5M-1994 IPC-7351 (MMC) 5. (LMC) 0.05 (NSMD) 60 μm 6. 7. 8. 9. 10. 0.125 mm (5 mil) 1:1 3 JEDEC/IPC , . 3. 4. (mm) ANSI Y14.5M-1994 5M-1994 IPC-7351 (MMC) 5. (LMC) 0.05 (NSMD) 60μm 6. 7 , ) ANSI Y14.5M-1994 5M-1994 IPC-7351 (MMC) 5. (LMC) 0.05 (NSMD) 60μm 6. 7. 8. 9. 10 , .5M-1994 5M-1994 IPC-7351 (MMC) 5. (LMC) 0.05 (NSMD) 60 μm 6. 7. 8. 9. 10. 0.125 mm (5 mil) 1 ... Silicon Laboratories
Original
datasheet

25 pages,
599.11 Kb

TEXT
datasheet frame
Abstract: reflect FORTH AT www.vishay.com/doc?91000 in publication IPC-7351. They do not guarantee any supposed , outlined e.g. in standards IEC 61188-5-x, or 4.00 A by many in publication IPC-7351. They do not guarantee ... Vishay Beyschlag
Original
datasheet

2 pages,
269.48 Kb

61188-5-x 0603 ipc-7351 IPC7351 IPC-7351 TEXT
datasheet frame
Abstract: is based on the IPC-7351 guidelines. All dimensions shown are at Maximum Material Condition (MMC). , is based on the IPC-7351 guidelines. All dimensions shown are at Maximum Material Condition (MMC). , is based on the IPC-7351 guidelines. All dimensions shown are at Maximum Material Condition (MMC). , the IPC-7351 guidelines. All dimensions shown are at Maximum Material Condition (MMC). Least Material , . 10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 J-STD-020 specification for Small Body ... Silicon Laboratories
Original
datasheet

22 pages,
210.51 Kb

stencil si516 TEXT
datasheet frame
Abstract: Pattern Design Recommendations per IPC­7351 (Standard Termination) EIA Size Code 01005 0201 0402 0603 , variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC­7351). © KEMET Electronics Corporation · P.O. Box 5928 · Greenville, SC 29606 (864 , Automotive Grade) Table 3B ­ Land Pattern Design Recommendations per IPC­7351 (Flexible Termination) EIA , perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC­7351). ... KEMET
Original
datasheet

19 pages,
793.18 Kb

0402 resistor ipc-7351 TEXT
datasheet frame
Abstract: the IPC-7351 guidelines. All dimensions shown are at Maximum Material Condition (MMC). Least Material , .5M-1994 5M-1994 specification. This Land Pattern Design is based on the IPC-7351 guidelines. All dimensions shown are at Maximum , the IPC-7351 guidelines. All dimensions shown are at Maximum Material Condition (MMC). Least Material , Y14.5M-1994 5M-1994 specification. This Land Pattern Design is based on the IPC-7351 guidelines. All , recommended card reflow profile is per the JEDEC/IPC J-STD-020D J-STD-020D specification for Small Body Components ... Silicon Laboratories
Original
datasheet

22 pages,
221.86 Kb

XO Oscillators MXXXXXX HD-SDI over sdh 510ECB156M250AAG SI510 TEXT
datasheet frame
Abstract: per Bulk Cassette Table 3A ­ Land Pattern Design Recommendations per IPC-7351 (Standard Termination , conditions outlined in IPC standard 7351 (IPC-7351). © KEMET Electronics Corporation · P.O. Box 5928 · , Design Recommendations per IPC-7351 (Flexible Termination) EIA Size Code 0603 0805 1206 1210 1808 1812 , conditions outlined in IPC standard 7351 (IPC-7351). © KEMET Electronics Corporation · P.O. Box 5928 · , recommends following the guidelines outlined in IPC/JEDEC J-STD-020 J-STD-020 Table 4 ­ Performance & Reliability ... KEMET
Original
datasheet

17 pages,
715.44 Kb

1210 capacitor ipc-7351 0402 resistor ipc-7351 10VDC-50VDC AEC-Q200 TEXT
datasheet frame
Abstract: on finished chip thickness specifications. Table 3A ­ Land Pattern Design Recommendations per IPC­7351 , variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC­7351). © KEMET Electronics Corporation · P.O. Box 5928 · Greenville, SC 29606 (864 , Automotive Grade) Table 3B ­ Land Pattern Design Recommendations per IPC­7351 ­ Flexible Termination EIA , conditions outlined in IPC Standard 7351 (IPC­7351). Soldering Process Recommended Soldering Technique ... KEMET
Original
datasheet

19 pages,
772.64 Kb

TEXT
datasheet frame

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Motorola 04/08/1998 1465.58 Kb ZIP 360adssw.zip
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Motorola 03/03/1998 1465.58 Kb ZIP 360adssw.zip
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Xilinx 26/08/2004 30899.35 Kb ZIP xapp775.zip
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Microchip 09/11/2006 11568.47 Kb TGZ mplabalc30v2_05.tgz
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Xilinx 23/08/2004 21918.22 Kb ZIP xapp663.zip