NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS

Datasheet Archive - Datasheet Search Engine

 

Direct from the Manufacturer

Part Manufacturer Description PDF Samples Ordering
TPS73515QDNVRQ1 Texas Instruments 500-mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low-Dropout Linear Regulator 8-VSON ri Buy
TPS73518QDNVTQ1 Texas Instruments 500-mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low-Dropout Linear Regulator 8-VSON -40 to 125 ri Buy
TPS73518QDRBRQ1 Texas Instruments 500-mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low-Dropout Linear Regulator 8-SON -40 to 125 ri Buy

IPC 7351/7355

Catalog Datasheet Results Type PDF Document Tags
Abstract: : Matrix trays Moisture-sensitive Surface Mount Devices are packed according to IPC/JEDEC J-STD-033 J-STD-033 , ). The most commonly applied standard, IPC/JEDEC J-STD033 J-STD033*, defines eight different MSLs (see Table 1 , information about the MSLs of our products. IPC/JEDEC-J-STD-20 specifies the maximum reflow temperature that , Levels (according to IPC/JEDEC J-STD-033 J-STD-033*) Level Floor Life (out of bag) Time Conditions 1 , assembly process. Please refer to IPC/JEDEC J-STD-033 J-STD-033* for details. Baking a package too often can cause ... Original
datasheet

34 pages,
896.72 Kb

solder voids to263 EIA78 IEC6068-2-58 J-STD-033 d marking code dpak transistor JESD22-B106 JESD22B-102 MICA WAFER S2020 IPC-7351 to252 JESD22-A111 IPC 7355 IPC 7351/7355 datasheet abstract
datasheet frame
Abstract: Dimensions of MQFP and LQFP_EP packages If the PCB land pattern is designed per IPC-7351, the center of , equations for land pattern design can be found in detail using the "IPC-7351" section of Generic , for Surface Mount Design and Land Pattern Standard. IPC-7351, February 2005. Document History ... Original
datasheet

3 pages,
36.03 Kb

ADSP-21371 ADSP21369 EE-notes ee-notes for ADSP-21369 MQFP 28x28 LQFP_EP land pattern for MQFP IPC 7351 ADSP-21369 ipc7351 IPC-7351 EE-313 EE-313 abstract
datasheet frame
Abstract: Page 2 of 6 Land pattern design Reference: IPC-7351 Generic Requirements for Surface-Mount Design , : Association Connecting Electronics Industries (IPC) Joint Electronic Device Engineering Council (JEDEC , process design and implementation Reference: IPC-7094 Design and Assembly Process Implementation for , Boards IPC-6011 Generic Performance Specification for Printed Boards IPC-6012 Qualification and Performance Specification for Rigid Printed Boards IPC-6013 Qualification and Performance Specification for ... Original
datasheet

6 pages,
155.07 Kb

WLP 500 APP1891 WLCSP flip chip IPC-A-600 IPC-7094 IPC-2222 IPC-2221 cte table flip chip substrate IPC 6012 IPC-7525 IPC-2226 IPC-6011 ipc 7094 IPC-6013 datasheet abstract
datasheet frame
Abstract: Land Pattern Design Reference: q IPC-7351 Generic Requirements for Surface-Mount Design and Land , q q q q q q q Association Connecting Electronics Industries (IPC) Joint Electronic Device , & Reel Data page. PCB Assembly Process Design and Implementation Reference: q IPC , IPC-6011 Generic Performance Specification for Printed Boards IPC-6012 Qualification and Performance Specification for Rigid Printed Boards IPC-6013 Qualification and Performance Specification for Flexible ... Original
datasheet

7 pages,
111.95 Kb

WLCSP stencil design bga rework cte table ic bga IPC 7351 AN1891 IPC-7525 STD-20C JESD51-9 IPC-A-600 IPC-6016 IPC-2221 IPC-2222 IPC-2226 IPC 6012 datasheet abstract
datasheet frame
Abstract: 2.3 Collector PIN ID 1.7 Emitter 0.75 Solder pad proposal acc. IPC 7351 , ± 0.2 Exposed copper 0.6 0.75 Collector Pin ID Solder pad proposal acc. IPC 7351 ... Original
datasheet

8 pages,
127.41 Kb

VSMB2000X01 VEMT2500 VEMT2000 Silicon NPN Phototransistor 20594 2 pin phototransistor P 250 VEMT2520 npn phototransistor VEMT2020 VEMT2500X01 VEMT2520X01 VEMT2500X01 abstract
datasheet frame
Abstract: Emitter 0.75 Solder pad proposal acc. IPC 7351 Technical drawings according to DIN , Collector Pin ID Solder pad proposal acc. IPC 7351 0.254 2.3 ± 0.2 0.4 0.5 2.3 ± 0.2 ... Original
datasheet

8 pages,
125.14 Kb

VSMB2000X01 20594 VEMD20 VEMT2000 VEMT2520 VEMT2020X01 IPC 7351 2 pin phototransistor P 250 npn phototransistor VEMT2000X01 VEMT2020 VEMT2000X01 abstract
datasheet frame
Abstract: 1.7 0.75 Solder pad proposal acc. IPC 7351 technical drawings according to DIN , specifications 0.75 Solder pad proposal acc. IPC 7351 Not indicated tolerances ± 0.1 2.45 5.15 ... Original
datasheet

8 pages,
144.24 Kb

VEMT2500 VEMD2520X01 J-STD-020D VSMB2000X01 VEMD2500X01 VEMD2500X01 abstract
datasheet frame
Abstract: /doc?91000 in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as , 4.00 A by many in publication IPC-7351. They do not guarantee any supposed thermal properties ... Original
datasheet

2 pages,
269.48 Kb

IPC7351 61188-5-x 0603 ipc-7351 datasheet abstract
datasheet frame
Abstract: specification. This Land Pattern Design is based on the IPC-7351 guidelines. All dimensions shown are at Maximum , Y14.5M-1994 5M-1994 specification. This Land Pattern Design is based on the IPC-7351 guidelines. All dimensions shown , the IPC-7351 guidelines. All dimensions shown are at Maximum Material Condition (MMC). Least Material , Y14.5M-1994 5M-1994 specification. This Land Pattern Design is based on the IPC-7351 guidelines. All dimensions shown , solder paste is recommended. 10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020D J-STD-020D ... Original
datasheet

22 pages,
221.86 Kb

XO Oscillators MXXXXXX HD-SDI over sdh 510ECB156M250AAG SI510 datasheet abstract
datasheet frame
Abstract: is per the ANSI Y14.5M-1994 5M-1994 specification. This Land Pattern Design is based on the IPC-7351 , per the ANSI Y14.5M-1994 5M-1994 specification. This Land Pattern Design is based on the IPC-7351 guidelines. , is per the ANSI Y14.5M-1994 5M-1994 specification. This Land Pattern Design is based on the IPC-7351 , Y14.5M-1994 5M-1994 specification. This Land Pattern Design is based on the IPC-7351 guidelines. All dimensions shown , the JEDEC/IPC J-STD-020 J-STD-020 specification for Small Body Components. (mm) 4.20 2.54 Preliminary Rev. ... Original
datasheet

22 pages,
210.51 Kb

stencil si516 datasheet abstract
datasheet frame

Datasheet Content (non pdf)

Abstract Saved from Date Saved File Size Type Download
Over 1.1 million files (1986-2014): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer.
 
No abstract text available
www.datasheetarchive.com/download/26555896-2732ZC/fulltext.dic
Allied Electronics 31/07/2001 4264.14 Kb DIC fulltext.dic
Answer #458 : PACKAGING: IPC SM-782 SM-782 SM-782 SM-782 information on Xilinx packages is available Xilinx Answer #459
www.datasheetarchive.com/files/xilinx/docs/rp00002/rp00254.htm
Xilinx 29/02/2000 662.64 Kb HTM rp00254.htm
No abstract text available
www.datasheetarchive.com/download/6111223-996050ZC/xapp775.zip (PCS_SYS_TOP.ngd)
Xilinx 26/08/2004 30899.35 Kb ZIP xapp775.zip