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Part Manufacturer Description Datasheet BUY
CC112X-IPC-2L-868RD Texas Instruments CC112x IPC 868/915MHz 2 layer Reference Design visit Texas Instruments
CC112X-IPC-4L-868RD Texas Instruments CC112x IPC 868/915MHz 4 layer Reference Design visit Texas Instruments

IPC 7351/7355

Catalog Datasheet MFG & Type PDF Document Tags

MP 7721

Abstract: IEC6068-2-58 : Matrix trays Moisture-sensitive Surface Mount Devices are packed according to IPC/JEDEC J-STD , ). The most commonly applied standard, IPC/JEDEC J-STD033*, defines eight different MSLs (see Table 1 , information about the MSLs of our products. IPC/JEDEC-J-STD-20 specifies the maximum reflow temperature that , Levels (according to IPC/JEDEC J-STD-033*) Level Floor Life (out of bag) Time Conditions 1 , assembly process. Please refer to IPC/JEDEC J-STD-033* for details. Baking a package too often can cause
Infineon Technologies
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MP 7721 IEC6068-2-58 IPC 7351/7355 IPC-7351 to252 IPC 7355 JEDEC-J-STD-20 IPC/EIA/JEDEC-J-STD-006 IPC/EIA/JEDEC-J-STD-001 J-STD-033/-020 JESD22-B102

IPC-7351

Abstract: ipc7351 . Dimensions of MQFP and LQFP_EP packages If the PCB land pattern is designed per IPC-7351, the center of , equations for land pattern design can be found in detail using the "IPC-7351" section of Generic , for Surface Mount Design and Land Pattern Standard. IPC-7351, February 2005. Document History
Analog Devices
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ADSP-21369 ADSP-21371 ipc7351 LQFP_EP land pattern for MQFP IPC 7351 MQFP 28x28 EE-313
Abstract: 7351 SMT - Stiftleisten RM 2,00mm - 1-/2-reihig Technische Daten /Technical Data Isolierkörper Thermoplastischer Kunststoff, nach UL94 V-0 Insulator Thermoplastic, rated UL94 V-0 Kontaktmaterial , Contacts * 7351 40 03-40 Einreihig Single row 04-80 Zweireihig Double row Passende Buchsenleisten , folgendem Temperatur-Profil in Anlehnung an die IPC/JEDEC J-STD-020C für bleifreies Löten im , 6°C / second max. Time 25°C to Peak Temperature Items should be soldered according to IPC W+P Products
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IEC512-12A 1000VDC 250VAC JSTD-020C
Abstract: 1.55 Y1 1.95 : 1. 2. 3. 4. (mm) ANSI Y14.5M-1994 IPC-7351 (MMC) 5. (LMC) 0.05 mm (NSMD) 60 μm 6. 7. 8. 0.125 mm 5 1:1 9. 10. 3 JEDEC/IPC JSTD , Y1 1.95 : 1. 2. 3. 4. (mm) ANSI Y14.5M-1994 IPC-7351 (MMC) 5. (LMC) 0.05 mm , 1.35 Y1 1.70 : 1. 2. 3. 4. (mm) ANSI Y14.5M-1994 IPC-7351 (MMC) 5. (LMC , ) 2.60 E 1.27 X1 0.80 Y1 1.70 : 1. 2. 3. 4. (mm) ANSI Y14.5M-1994 IPC-7351 Silicon Laboratories
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Abstract: E 5.08 X1 1.55 Y1 1.95 1. 2. 3. 4. (mm) ANSI Y14.5M-1994 IPC-7351 (MMC) 5. (LMC) 0.05 (NSMD) 60 μm 6. 7. 8. 9. 10. 0.125 mm (5 mil) 1:1 3 JEDEC/IPC , . 3. 4. (mm) ANSI Y14.5M-1994 IPC-7351 (MMC) 5. (LMC) 0.05 (NSMD) 60μm 6. 7 , ) ANSI Y14.5M-1994 IPC-7351 (MMC) 5. (LMC) 0.05 (NSMD) 60μm 6. 7. 8. 9. 10 , .5M-1994 IPC-7351 (MMC) 5. (LMC) 0.05 (NSMD) 60 μm 6. 7. 8. 9. 10. 0.125 mm (5 mil) 1 Silicon Laboratories
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IPC-7351

Abstract: IPC7351 reflect FORTH AT www.vishay.com/doc?91000 in publication IPC-7351. They do not guarantee any supposed , outlined e.g. in standards IEC 61188-5-x, or 4.00 A by many in publication IPC-7351. They do not guarantee
Vishay Beyschlag
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61188-5-x 0603 ipc-7351 TFU0603FF04000P500 TFU0603 0603-FF 2002/95/EC VMN-PT0207-1109

si516

Abstract: IPC-7351 is based on the IPC-7351 guidelines. All dimensions shown are at Maximum Material Condition (MMC). , is based on the IPC-7351 guidelines. All dimensions shown are at Maximum Material Condition (MMC). , is based on the IPC-7351 guidelines. All dimensions shown are at Maximum Material Condition (MMC). , the IPC-7351 guidelines. All dimensions shown are at Maximum Material Condition (MMC). Least Material , . 10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Silicon Laboratories
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si516 stencil

0402 resistor ipc-7351

Abstract: ipc7351 Pattern Design Recommendations per IPC­7351 (Standard Termination) EIA Size Code 01005 0201 0402 0603 , variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC­7351). © KEMET Electronics Corporation · P.O. Box 5928 · Greenville, SC 29606 (864 , Automotive Grade) Table 3B ­ Land Pattern Design Recommendations per IPC­7351 (Flexible Termination) EIA , perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC­7351).
KEMET
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0402 resistor ipc-7351 C1034

SI510

Abstract: MXXXXXX the IPC-7351 guidelines. All dimensions shown are at Maximum Material Condition (MMC). Least Material , .5M-1994 specification. This Land Pattern Design is based on the IPC-7351 guidelines. All dimensions shown are at Maximum , the IPC-7351 guidelines. All dimensions shown are at Maximum Material Condition (MMC). Least Material , Y14.5M-1994 specification. This Land Pattern Design is based on the IPC-7351 guidelines. All , recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components
Silicon Laboratories
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SI510 MXXXXXX 510ECB156M250AAG XO Oscillators HD-SDI over sdh

0402 resistor ipc-7351

Abstract: 1210 capacitor ipc-7351 per Bulk Cassette Table 3A ­ Land Pattern Design Recommendations per IPC-7351 (Standard Termination , conditions outlined in IPC standard 7351 (IPC-7351). © KEMET Electronics Corporation · P.O. Box 5928 · , Design Recommendations per IPC-7351 (Flexible Termination) EIA Size Code 0603 0805 1206 1210 1808 1812 , conditions outlined in IPC standard 7351 (IPC-7351). © KEMET Electronics Corporation · P.O. Box 5928 · , recommends following the guidelines outlined in IPC/JEDEC J-STD-020 Table 4 ­ Performance & Reliability
KEMET
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1210 capacitor ipc-7351 10VDC-50VDC C1008
Abstract: on finished chip thickness specifications. Table 3A ­ Land Pattern Design Recommendations per IPC­7351 , variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC­7351). © KEMET Electronics Corporation · P.O. Box 5928 · Greenville, SC 29606 (864 , Automotive Grade) Table 3B ­ Land Pattern Design Recommendations per IPC­7351 ­ Flexible Termination EIA , conditions outlined in IPC Standard 7351 (IPC­7351). Soldering Process Recommended Soldering Technique KEMET
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1210 capacitor ipc-7351

Abstract: 0603 ipc-7351 on finished chip thickness specifications. Table 3A ­ Land Pattern Design Recommendations per IPC­7351 , variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC­7351). © KEMET Electronics Corporation · P.O. Box 5928 · Greenville, SC 29606 (864 , Automotive Grade) Table 3B ­ Land Pattern Design Recommendations per IPC­7351 ­ Flexible Termination EIA , conditions outlined in IPC Standard 7351 (IPC­7351). Soldering Process Recommended Soldering Technique
KEMET
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MLCC crack probability

Abstract: finished chip thickness specifications. Table 3A ­ Land Pattern Design Recommendations per IPC­7351 ­ , variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC­7351). © KEMET Electronics Corporation · P.O. Box 5928 · Greenville, SC 29606 (864 , Automotive Grade) Table 3B ­ Land Pattern Design Recommendations per IPC­7351 ­ Flexible Termination EIA , based on the conditions outlined in IPC Standard 7351 (IPC­7351). Soldering Process Recommended
KEMET
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MLCC crack probability C1012
Abstract: on finished chip thickness specifications. Table 3A ­ Land Pattern Design Recommendations per IPC­7351 , based on the conditions outlined in IPC Standard 7351 (IPC­7351). © KEMET Electronics Corporation · P.O , per IPC­7351 ­ Flexible Termination EIA Size Code 0603 0805 1206 1210 1808 1812 1825 2220 2225 , in IPC Standard 7351 (IPC­7351). Soldering Process Recommended Soldering Technique: · Solder , in IPC/JEDEC J­STD­020 © KEMET Electronics Corporation · P.O. Box 5928 · Greenville, SC 29606 (864 KEMET
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0402 resistor ipc-7351

Abstract: 3A ­ Land Pattern Design Recommendations per IPC­7351 ­ Standard Termination EIA Size Code 0402 , conditions outlined in IPC Standard 7351 (IPC­7351). © KEMET Electronics Corporation · P.O. Box 5928 · , (Commercial & Automotive Grade) Table 3B ­ Land Pattern Design Recommendations per IPC­7351 ­ Flexible , qualification testing based on the conditions outlined in IPC Standard 7351 (IPC­7351). Soldering Process , recommends following the guidelines outlined in IPC/JEDEC J­STD­020 © KEMET Electronics Corporation · P.O
KEMET
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1812 capacitor ipc-7351

Abstract: Capacitors C1812F Kemet thickness specifications. Table 3A ­ Land Pattern Design Recommendations per IPC­7351 ­ Standard , variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC­7351). © KEMET Electronics Corporation · P.O. Box 5928 · Greenville, SC 29606 (864 , ) Table 3B ­ Land Pattern Design Recommendations per IPC­7351 ­ Flexible Termination EIA Size Code 0805 , conditions outlined in IPC Standard 7351 (IPC­7351). Soldering Process Recommended Soldering Technique
KEMET
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1812 capacitor ipc-7351 Capacitors C1812F Kemet

EK 02

Abstract: smd marking gb Recommendations per IPC-7351 (Standard Termination) EIA Size Code 01005 0201 0402 0603 0805 1206 1210 1808 1812 , qualification testing based on the conditions outlined in IPC standard 7351 (IPC-7351). © KEMET Electronics , ) Table 3B ­ Land Pattern Design Recommendations per IPC-7351 (Flexible Termination) EIA Size Code 0603 , qualification testing based on the conditions outlined in IPC standard 7351 (IPC-7351). © KEMET Electronics , Profile: · KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020 Table 4 ­
KEMET
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EK 02 smd marking gb 16VDC-200VDC

0402 resistor ipc-7351

Abstract: on finished chip thickness specifications. Table 3A ­ Land Pattern Design Recommendations per IPC­7351 , based on the conditions outlined in IPC Standard 7351 (IPC­7351). © KEMET Electronics Corporation · P.O , per IPC­7351 (Flexible Termination) EIA Size Code 0603 0805 1206 1210 1808 1812 1825 2220 2225 , in IPC Standard 7351 (IPC­7351). Soldering Process Recommended Soldering Technique: · Solder , in IPC/JEDEC J­STD­020 © KEMET Electronics Corporation · P.O. Box 5928 · Greenville, SC 29606 (864
KEMET
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E4980

Abstract: 0402 resistor ipc-7351 Recommendations per IPC­7351 (Standard Termination) EIA Size Code 01005 0201 0402 0603 0805 1206 1210 1808 1812 , qualification testing based on the conditions outlined in IPC Standard 7351 (IPC­7351). © KEMET Electronics , Pattern Design Recommendations per IPC­7351 (Flexible Termination) EIA Size Code 0603 0805 1206 1210 , based on the conditions outlined in IPC Standard 7351 (IPC­7351). Soldering Process Recommended , following the guidelines outlined in IPC/JEDEC J­STD­020 © KEMET Electronics Corporation · P.O. Box 5928
KEMET
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E4980 01005 land pattern resistor
Abstract: 3A ­ Land Pattern Design Recommendations per IPC­7351 ­ Standard Termination EIA Size Code 0402 , conditions outlined in IPC Standard 7351 (IPC­7351). © KEMET Electronics Corporation · P.O. Box 5928 · , (Commercial & Automotive Grade) Table 3B ­ Land Pattern Design Recommendations per IPC­7351 ­ Flexible , qualification testing based on the conditions outlined in IPC Standard 7351 (IPC­7351). Soldering Process , recommends following the guidelines outlined in IPC/JEDEC J­STD­020 © KEMET Electronics Corporation · P.O KEMET
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