500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Top Results

Part Manufacturer Description Datasheet BUY
LTC2862ACS8-1#PBF Linear Technology LTC2862A - ±60V Fault Protected 3V to 5.5V RS485/RS422 Transceiver with Level 4 IEC ESD; Package: SO; Pins: 8; Temperature Range: 0°C to 70°C visit Linear Technology - Now Part of Analog Devices
LTC2862AHS8-2#PBF Linear Technology LTC2862A - ±60V Fault Protected 3V to 5.5V RS485/RS422 Transceiver with Level 4 IEC ESD; Package: SO; Pins: 8; Temperature Range: -40°C to 125°C visit Linear Technology - Now Part of Analog Devices
LTC2862AMPS8-1#PBF Linear Technology LTC2862A - ±60V Fault Protected 3V to 5.5V RS485/RS422 Transceiver with Level 4 IEC ESD; Package: SO; Pins: 8; Temperature Range: -55°C to 125°C visit Linear Technology - Now Part of Analog Devices

IEC-68-2-20 solderability

Catalog Datasheet MFG & Type PDF Document Tags

IEC-68-2-20 solderability

Abstract: x7r 1210 Barrier Termination Material IEC 68-2-20 Solderability .035" "A" .035" Available Range
Syfer Technology
Original

Film Capacitors

Abstract: 250v 105j capacitor '¢ LEAD MATERIAL: Tinned solid copper meets requirements of IEC 384-1, IEC 68-2-20 Solderability Test. â
Tecate Group
Original

IEC-68-2-20 solderability

Abstract: 105j 250v requirements of IEC 384-1, IEC 68-2-20 Solderability Test. · PULL TEST: Follows IEC 384-1 4.13 (IEC 68-2-21
Tecate Group
Original

IEC-68-2-20 solderability

Abstract: GFR polyterephthalate ), color code black Solderability: to IEC 68-2-20, test Ta, method 1 (aging 3): 235 °C, 2 s Resistance to , ), color code black Solderability: to IEC 68-2-20, test Ta, method 1 (aging 3): 235 °C, 2 s Resistance to , Solderability: to IEC 68-2-20, test Ta, method 1 (aging 3): 235 °C, 2 s Resistance to soldering heat: to IEC , temperature 155 °C), color code black Solderability: to IEC 68-2-20, test Ta, method 1 (aging 3): 235 °C, 2 s , temperature 155 °C), color code black Solderability: to IEC 68-2-20, test Ta, method 1 (aging 3): 235 °C, 2 s
Siemens Matsushita Components
Original

WBC3

Abstract: WBC2.5/R-3S4 .2 SPECIFICATION GRADE Wire material copper (Cu), tin-lead (SnPb) plated Solderability "IEC 68-2-20", Part , .4 SPECIFICATION GRADE Wire material copper (Cu), tin-lead (SnPb) plated Solderability "IEC 68-2-20", Part , GRADE Wire material copper (Cu), tin-lead (SnPb) plated Solderability "IEC 68-2-20", Part 2, Test , GRADE ITEM SPECIFICATION Wire material copper (Cu), tin-lead (SnPb) plated Solderability "IEC 68-2-20", Part 2, Test Ta, method 1 TYPE NUMBER Note 1. Minimum guaranteed impedance is Ztyp -20%.
-
Original

TB PCB V2 SERIES

Abstract: 0040.1101 current at rated current Solderability Resistance to soldering heat Surface of contacts (average , up to + 100 °C ­25 °C up to + 70 °C 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 > 2 kV 3 , . contact to contact Contact/mounting plate Temperature at no current at rated current Solderability , > 3 kV > 1 kV ­25 °C up to +100 °C ­25 °C up to +70 °C 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 5 sec., 260 °C IEC 68-2-20 test Tb, test method 1 A > 0.5 kV 0.5 um Au Polycarbonate UL 94
SCHURTER
Original

CPHS-EFD20-1S-10P

Abstract: EFD20-3F3-A100-S "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20" , Part 2 , soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20 , temperature 155 °C, "IEC 85" class F Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20" , Part 2, Test Ta, method 1: 235 °C, 2 s
-
Original

CPHS-EFD15-1S-8P

Abstract: EFD15-3F3-A63S heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20 , soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20 , " class F Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20" , Part 2, Test Ta, method 1: 235 °C, 2 s handbook, full pagewidth 2
-
Original

IEC-68-2-20 solderability

Abstract: Contact/mounting plate Temperature at no current at rated current Solderability Resistance to soldering , + 70 ¡C 2 sec., 235 ¡C IEC 68-2-20 test Ta, test method 1 3 sec., 350 ¡C > 2 kV > 1 kV > 0,5 kV Ð25 ¡C up to +100 ¡C Ð25 ¡C up to +70 ¡C > 2 kV > 2 kV 2 sec., 235 ¡C IEC 68-2-20 test Ta, test method 1 5 sec., 260 ¡C IEC 68-2-20 test Tb, test method 1 A 0,5 um Au 0,5 um Au 0 , Temperature at no current at rated current Solderability Resistance to soldering heat Surface of contacts
SCHURTER
Original

SMD Coil Formers and Cores

Abstract: philips EFD core EFD10 oC, IEC 85 class F "IEC 68-2-20" part2, test Tb, method 1B: 350 oC, 3.5s. "IEC 68-2-20" part2, test , soldering heat Solderability Clip data Clip material Clamping force Type number 6 5.8 1.5 , ), tin-lead alloy (SnPb) plated 155 oC, IEC 85 class F "IEC 68-2-20" part2, test Tb, method 1B: 350 oC, 3.5s. "IEC 68-2-20" part2, test Ta, method 1: 235 oC, 2s Solder pad material Maximum operating temperature Resistance to soldering heat Solderability Cover data 7.7 max Cover material 5.1 max
Philips Semiconductors
Original

rm14

Abstract: RM14* 3C8 180 °C, IEC 85 class H Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2, Test Ta, method 1 handbook, full pagewidth , Maximum operating temperature 155 °C, IEC 85 class F Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2, Test Ta, method 1 , ) Solderability "IEC 68-2-20", Part 2, Test Ta, method 1 Type number 8 stainless steel Clip
-
Original

EP7-3E27

Abstract: EP7-3C81-E25 180 °C, "IEC 85" class H Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2, Test Ta, method 1, 235 °C, 2 s handbook , " class H Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2, Test Ta, method 1, 235 °C, 2 s handbook, full pagewidth 7 0 -0.1 , "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2
Philips Components
Original

din IEC 68-2-20

Abstract: S1A60 max 5 N cm 30° 10 - Solderability Bit soldering Dip soldering DIN/IEC 68-2-20 i 260° C s 260° C DIN/IEC 68-2-20 DIN/IEC 68-2-20 , / 2 um Ni / 0.5 um Au PC black PC black max 5 N Solderability Bit soldering Dip soldering DIN/IEC 68-2-20
-
OCR Scan
Abstract: Nennstrom Solderability / derability / Solderability Lötbarkeit / tbarkeit Lötbarkeit Resistance to , 68-2-20 test Ta, test method 1 2 sec., 235 °C IEC 2Sek., sec.,235 235 test °C Ta, IEC test 68-2-20 method test 1 Ta,Test testMethode method 1 268-2-20 °C IEC 68-2-20 Test Ta, 1 2 Sek., 235 °C IEC 2 68-2-20 Sek., 235 Test °C Ta, IEC Test 68-2-20 Methode Test 1 Ta, Test Methode 1 3 sec., 350 °C 3 sec., 350 °C sec SCHURTER
Original

CBW123

Abstract: E83005 " class F Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2, Test Ta, method 1 0 7.85 - 0.15 + 0.1 4.9 0 + 0.1 4 0 , temperature 155 °C, "IEC 85" class F Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2, Test Ta, method 1 handbook, full , ) Solderability ``IEC 68-2-20'', Part 2, Test Ta, method 1 Type number CLI/P-RM4/5/I 9.8 8.3
-
Original

IEC-68-2-20 solderability

Abstract: 0040.1151.2 Temperatu re at no cur rent Temperature at no current at rated cur rent at rated current Solderability Solderability Resistance to soldering heat Resistance to soldering heat Surface of contacts Surface of contacts , M > 10 4 M > 10 4 M > 10 4 M > 2 kV > 2 kV > 2 kV > 2 kV 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 5 sec., 260 °C IEC 68-2-20 test Tb, test method 1 A 5 sec., 260 °C IEC 68-2-20 test Tb, test method 1 A 0,5 um Au 0,5 um Au 2,0 um Au
SCHURTER
Original

0040.1101

Abstract: 0040.1024 current ­25 °C up to + 70 °C Solderability 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 , °C Solderability 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 Resistance to soldering , ­25 °C up to +100 °C at rated current > 0.5 kV ­25 °C up to +70 °C Solderability 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 Resistance to soldering heat 5 sec., 260 °C IEC 68-2-20 test Tb, test method 1 A Surface of contacts (average thickness of gold) 0.5 um Au 0.5
SCHURTER
Original

1108T1

Abstract: B66202-J1106-T1 . operating tem perature 155 *C), color code black Solderability: to IEC 68-2-20, test Ta, method 1 (aging 3): 235 'C, 2 s R esistance to soldering heat: to IEC 68-2-20, test Tb, method 1B: 350 ` C, 3,5 s W inding , i max. operating tem perature 155 'C ), color code black Solderability: to IEC 68-2-20, test Ta, method 1 (aging 3): 235 'C, 2 s Resistance to soldering heat: to IEC 68-2-20, test Tb, method 1B: 350 'C
-
OCR Scan

philips RM5 3C85

Abstract: philips 3b8 heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20 , Maximum operating temperature 155 °C, "IEC 85" class F Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2, Test Ta, method 1 , ) Solderability ``IEC 68-2-20'', Part 2, Test Ta, method 1 Type number CLI/P-RM4/5/I 9.8 R22
-
Original

IEC-68-2-20 solderability

Abstract: 0040.1024 Temperature at no current Temperature at no current at rated current at rated current Solderability Solderability Resistance to soldering heat Resistance to soldering heat Surface of contacts Surface of contacts , to ­25 °C up to +100 °C +100 °C +70 °C +70 °C > 2 kV > 2 kV 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 5 sec., 260 °C IEC 68-2-20 test Tb, test method 1 A 5 sec., 260 °C IEC 68-2-20 test Tb, test method 1 A 0,5 um Au 0,5 um Au 2,0 um Au 2,0
SCHURTER
Original
Showing first 20 results.