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Part Manufacturer Description Datasheet BUY
PCRJ11-1 Coilcraft Inc Telecom and Datacom Connector, 2 Contact(s), Female, Right Angle, Solder Terminal, Jack visit Coilcraft
PCRJ14-2 Coilcraft Inc Telecom and Datacom Connector, 4 Contact(s), Female, Right Angle, Solder Terminal, Jack visit Coilcraft
PCRJ11-2 Coilcraft Inc Telecom and Datacom Connector, 2 Contact(s), Female, Right Angle, Solder Terminal, Jack visit Coilcraft
PCRJ454-2 Coilcraft Inc Telecom and Datacom Connector, 4 Contact(s), Female, Right Angle, Solder Terminal, Jack visit Coilcraft
PCRJ458-1 Coilcraft Inc Telecom and Datacom Connector, 8 Contact(s), Female, Right Angle, Solder Terminal, Jack visit Coilcraft
PCRJ458-2 Coilcraft Inc Telecom and Datacom Connector, 8 Contact(s), Female, Right Angle, Solder Terminal, Jack visit Coilcraft

IEC-68-2-20 solderability

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Barrier Termination Material IEC 68-2-20 Solderability .035" "A" .035" Available Range Syfer Technology
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x7r 1210 capacitors .1 600 volts syfer 1206
Abstract: '¢ LEAD MATERIAL: Tinned solid copper meets requirements of IEC 384-1, IEC 68-2-20 Solderability Test. â Tecate Group
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250v 105j capacitor 105j 250v 105j 250v capacitor 914-250/104K10B1/5 914-250/104K10B5/5 92/92M 100VDC 30000M 10000M
Abstract: requirements of IEC 384-1, IEC 68-2-20 Solderability Test. · PULL TEST: Follows IEC 384-1 4.13 (IEC 68-2-21 Tecate Group
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6800 microfarad capacitor 22000 microfarad capacitor capacitor, 22 microfarad 250v 1754 2700 microfarad capacitor 15000 microfarad capacitor EIA-296
Abstract: ), color code black Solderability: to IEC 68-2-20, test Ta, method 1 (aging 3): 235 °C, 2 s Resistance to , ), color code black Solderability: to IEC 68-2-20, test Ta, method 1 (aging 3): 235 °C, 2 s Resistance to , Solderability: to IEC 68-2-20, test Ta, method 1 (aging 3): 235 °C, 2 s Resistance to soldering heat: to IEC , temperature 155 °C), color code black Solderability: to IEC 68-2-20, test Ta, method 1 (aging 3): 235 °C, 2 s , temperature 155 °C), color code black Solderability: to IEC 68-2-20, test Ta, method 1 (aging 3): 235 °C, 2 s Siemens Matsushita Components
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B65808 B65808-E1508-T1 B65812-C1512-T1 B65888-C1512-T1 GFR polyterephthalate UL-94-V-0 B65814-C1512-T1 siemens 350 RM-14 coil former 68-2-20 B65812 D-81617
Abstract: .2 SPECIFICATION GRADE Wire material copper (Cu), tin-lead (SnPb) plated Solderability "IEC 68-2-20", Part , .4 SPECIFICATION GRADE Wire material copper (Cu), tin-lead (SnPb) plated Solderability "IEC 68-2-20", Part , GRADE Wire material copper (Cu), tin-lead (SnPb) plated Solderability "IEC 68-2-20", Part 2, Test , GRADE ITEM SPECIFICATION Wire material copper (Cu), tin-lead (SnPb) plated Solderability "IEC 68-2-20", Part 2, Test Ta, method 1 TYPE NUMBER Note 1. Minimum guaranteed impedance is Ztyp -20%. -
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CBW211 CBW212 WBC3 WBC2.5/R-3S4 wbc2.5 WBC2.5/A-4B1 WBC2.5/A-3s4 A4S2 MGC282 MGC284 MGC287
Abstract: current at rated current Solderability Resistance to soldering heat Surface of contacts (average , up to + 100 °C ­25 °C up to + 70 °C 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 > 2 kV 3 , . contact to contact Contact/mounting plate Temperature at no current at rated current Solderability , > 3 kV > 1 kV ­25 °C up to +100 °C ­25 °C up to +70 °C 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 5 sec., 260 °C IEC 68-2-20 test Tb, test method 1 A > 0.5 kV 0.5 um Au Polycarbonate UL 94 SCHURTER
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TB PCB V2 SERIES 0040.1101 0040.1024 0040.1071
Abstract: "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20" , Part 2 , soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20 , temperature 155 °C, "IEC 85" class F Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20" , Part 2, Test Ta, method 1: 235 °C, 2 s -
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EFD20 EFD20-3C85 EFD20-3F3-E63-S EFD20-3F3-A100-S EFD20-3F3-A250-S EFD20-3F3-A315-S CPHS-EFD20-1S-10P CSH-EFD20-1S-8P CLM-EFD20 MGC345 EFD20-3C30 EFD20-3C90
Abstract: heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20 , soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20 , " class F Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20" , Part 2, Test Ta, method 1: 235 °C, 2 s handbook, full pagewidth 2 -
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EFD15 EFD15-3F4-A100-S EFD15-3E4-S EFD15-3E5-S CPHS-EFD15-1S-8P CLI-EFD15 EFD15-3F3-A63S CSH-EFD15-1S-8P SMD 3f4 MGC350 EFD15-3F3-A63-S EFD15-3F3-A100-S EFD15-3F3-A160-S EFD15-3F3-S
Abstract: Contact/mounting plate Temperature at no current at rated current Solderability Resistance to soldering , + 70 ¡C 2 sec., 235 ¡C IEC 68-2-20 test Ta, test method 1 3 sec., 350 ¡C > 2 kV > 1 kV > 0,5 kV Ð25 ¡C up to +100 ¡C Ð25 ¡C up to +70 ¡C > 2 kV > 2 kV 2 sec., 235 ¡C IEC 68-2-20 test Ta, test method 1 5 sec., 260 ¡C IEC 68-2-20 test Tb, test method 1 A 0,5 um Au 0,5 um Au 0 , Temperature at no current at rated current Solderability Resistance to soldering heat Surface of contacts SCHURTER
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Abstract: oC, IEC 85 class F "IEC 68-2-20" part2, test Tb, method 1B: 350 oC, 3.5s. "IEC 68-2-20" part2, test , soldering heat Solderability Clip data Clip material Clamping force Type number 6 5.8 1.5 , ), tin-lead alloy (SnPb) plated 155 oC, IEC 85 class F "IEC 68-2-20" part2, test Tb, method 1B: 350 oC, 3.5s. "IEC 68-2-20" part2, test Ta, method 1: 235 oC, 2s Solder pad material Maximum operating temperature Resistance to soldering heat Solderability Cover data 7.7 max Cover material 5.1 max Philips Semiconductors
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EFD10 EFD12 philips EFD core EFD10 philips ferrite core rm4 3f3 ferrite power indiana general ferrites 95025 Indiana general ferrite core
Abstract: 180 °C, IEC 85 class H Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2, Test Ta, method 1 handbook, full pagewidth , Maximum operating temperature 155 °C, IEC 85 class F Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2, Test Ta, method 1 , ) Solderability "IEC 68-2-20", Part 2, Test Ta, method 1 Type number 8 stainless steel Clip -
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MGC106 E45329 rm14 RM14* 3C8 RM14I RM14 3b8 philips 3b8 RM14/I RM14/I-3B8-A250 RM14/I-3B8-A315 RM14/I-3B8-A400 RM14/I-3B8-A630
Abstract: 180 °C, "IEC 85" class H Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2, Test Ta, method 1, 235 °C, 2 s handbook , " class H Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2, Test Ta, method 1, 235 °C, 2 s handbook, full pagewidth 7 0 -0.1 , "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2 Philips Components
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EP7-3H1-E63 EP7-3H1-A160 EP7-3C81-E25 EP7-3C85-A100 EP7-3C85 EP7-3E27 philips 3C85 material E46770 core 3E1 MGC333 EP7-3H1-A100 EP7-3C81-A40
Abstract: max 5 N cm 30° 10 - Solderability Bit soldering Dip soldering DIN/IEC 68-2-20 i 260° C s 260° C DIN/IEC 68-2-20 DIN/IEC 68-2-20 , / 2 um Ni / 0.5 um Au PC black PC black max 5 N Solderability Bit soldering Dip soldering DIN/IEC 68-2-20 -
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din IEC 68-2-20 S1A60
Abstract: Nennstrom Solderability / derability / Solderability Lötbarkeit / tbarkeit Lötbarkeit Resistance to , 68-2-20 test Ta, test method 1 2 sec., 235 °C IEC 2Sek., sec.,235 235 test °C Ta, IEC test 68-2-20 method test 1 Ta,Test testMethode method 1 268-2-20 °C IEC 68-2-20 Test Ta, 1 2 Sek., 235 °C IEC 2 68-2-20 Sek., 235 Test °C Ta, IEC Test 68-2-20 Methode Test 1 Ta, Test Methode 1 3 sec., 350 °C 3 sec., 350 °C sec SCHURTER
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Abstract: " class F Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2, Test Ta, method 1 0 7.85 - 0.15 + 0.1 4.9 0 + 0.1 4 0 , temperature 155 °C, "IEC 85" class F Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2, Test Ta, method 1 handbook, full , ) Solderability ``IEC 68-2-20'', Part 2, Test Ta, method 1 Type number CLI/P-RM4/5/I 9.8 8.3 -
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CBW123 E83005 MBE102 RM4/I-3F3-A100 RM4/I-3F3-A160 RM4/I-3F3-A250 RM4/I-3F4-A100 RM4/I-3F4-A160
Abstract: Temperatu re at no cur rent Temperature at no current at rated cur rent at rated current Solderability Solderability Resistance to soldering heat Resistance to soldering heat Surface of contacts Surface of contacts , M > 10 4 M > 10 4 M > 10 4 M > 2 kV > 2 kV > 2 kV > 2 kV 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 5 sec., 260 °C IEC 68-2-20 test Tb, test method 1 A 5 sec., 260 °C IEC 68-2-20 test Tb, test method 1 A 0,5 um Au 0,5 um Au 2,0 um Au SCHURTER
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0040.1151.2
Abstract: current ­25 °C up to + 70 °C Solderability 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 , °C Solderability 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 Resistance to soldering , ­25 °C up to +100 °C at rated current > 0.5 kV ­25 °C up to +70 °C Solderability 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 Resistance to soldering heat 5 sec., 260 °C IEC 68-2-20 test Tb, test method 1 A Surface of contacts (average thickness of gold) 0.5 um Au 0.5 SCHURTER
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0040.1102 0040.1104 0040.1151 41649
Abstract: . operating tem perature 155 *C), color code black Solderability: to IEC 68-2-20, test Ta, method 1 (aging 3): 235 'C, 2 s R esistance to soldering heat: to IEC 68-2-20, test Tb, method 1B: 350 ` C, 3,5 s W inding , i max. operating tem perature 155 'C ), color code black Solderability: to IEC 68-2-20, test Ta, method 1 (aging 3): 235 'C, 2 s Resistance to soldering heat: to IEC 68-2-20, test Tb, method 1B: 350 'C -
OCR Scan
B66202-J1106-T1 1108T1 B66202A2010 B66202 1108-T1 B66202-A2010 B66306 B66414
Abstract: heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20 , Maximum operating temperature 155 °C, "IEC 85" class F Resistance to soldering heat "IEC 68-2-20" , Part 2, Test Tb, method 1B, 350 °C, 3.5 s Solderability "IEC 68-2-20", Part 2, Test Ta, method 1 , ) Solderability ``IEC 68-2-20'', Part 2, Test Ta, method 1 Type number CLI/P-RM4/5/I 9.8 R22 -
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MGC121 philips RM5 3C85 philips 3e4 1 a250 philips coil former RM5 material grade 3e25 MGC050 RM5/I-3B8-A100 RM5/I-3B8-A160 RM5/I-3B8-A250 RM5/I-3C85-A63 RM5/I-3C85-A100
Abstract: Temperature at no current Temperature at no current at rated current at rated current Solderability Solderability Resistance to soldering heat Resistance to soldering heat Surface of contacts Surface of contacts , to ­25 °C up to +100 °C +100 °C +70 °C +70 °C > 2 kV > 2 kV 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 2 sec., 235 °C IEC 68-2-20 test Ta, test method 1 5 sec., 260 °C IEC 68-2-20 test Tb, test method 1 A 5 sec., 260 °C IEC 68-2-20 test Tb, test method 1 A 0,5 um Au 0,5 um Au 2,0 um Au 2,0 SCHURTER
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din41649
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