NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| MFRC52201HN1,151 | NXP Semiconductors | IC SPECIALTY INTERFACE CIRCUIT, PQCC32, 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT617-1, HVQFN-32, Interface IC:Other | 
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| MFRC52201HN1,157 | NXP Semiconductors | IC SPECIALTY INTERFACE CIRCUIT, PQCC32, 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT617-1, HVQFN-32, Interface IC:Other |
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| NE58633BS,115 | NXP Semiconductors | IC 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC32, 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT617-1, HVQFN-32, Audio/Video Amplifier |
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| NE58633BS,157 | NXP Semiconductors | IC 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC32, 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT617-1, HVQFN-32, Audio/Video Amplifier |
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| SC16C850SVIBS,157 | NXP Semiconductors | IC SERIAL COMM CONTROLLER, PDSO32, 5 X 5 MM, 0.85 MM PITCH, ROHS COMPLIANT, MO-220, HVQFN-32, Serial IO/Communication Controller |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: , acc. to FIPS 140-2 / AIS 31 (Class P2) yes sawn Contact HVQFN32 SSOP20 SSOP20, HVQFN32 HVQFN32 HVQFN32 SSOP20 SSOP20, HVQFN32 HVQFN32 HVQFN32 SSOP20 SSOP20, HVQFN32 yes yes 1.62 . 5.5 1 . 10 , HVQFN32 yes yes 1.62 . 5.5 1 . 10 (13,56) 1 . 30 -25 . +85 1.64, 1.128 2 yes, acc. , 31 (Class P2) yes sawn Contact HVQFN32 yes yes 1.62 . 5.5 1 . 10 (13,56) 1 . 30 , Contact, Dual Interface, Contactless - HVQFN32 SSOP20 SSOP20, HVQFN32 yes yes 1.62 . 5.5 1 . 10 ... | Original |
1 pages, |
7816 smd MS 20 fips P5CC020 P5CN080 SSOP20 P5CC080 p5cc012 p5cd080 HVQFN32 P5CC012 P5SC020 P5CC021 P5CD020 P5CC024 P5CC012 abstract |
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| Abstract: Philips Semiconductors PC board footprint Footprint information for reflow soldering of HVQFN32 package SOT617-3 Hx Gx D P C (0.105) SPx nSPx SPy Hy Gy SPy tot SLy By Ay nSPy SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste nSPx 3 DIMENSIONS in mm P 0.500 Ax 6.000 Ay 6.000 Bx 4.200 By 4.200 C 0.900 D 0.290 SLx 3.500 SLy 3.500 SPx tot 2.100 SPy tot ... | Original |
1 pages, |
hvqfn32 HVQFN32 HVQFN32 abstract |
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| Abstract: ISO14443 . 3.6 1 1000 -25 . +85 HVQFN32 2.5 . 3.6 2.5 . 3.6 1 1000 -25 . +85 HVQFN32 5 ... | Original |
1 pages, |
RC400 rc500 EV700 RC522 antenna RC530 SO32 MF EV700 CL RC632 HVQFN32 MF EV800 CL RD 701 MF RC 523 SPI to RS232 MF RC531 application notes rc531 RC500 RC500 abstract |
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| Abstract: NXP HDMI signal-conditioning IC IP4786CZ32 IP4786CZ32 Increased reliability for HDMI transmitters This signal-conditioning device, designed to enhance the stability of HDMI transmission, combines level shifting with EMI/ESD protection. The small footprint (5 x 5 mm) and very low standby modes support mobile applications. Key features `` Compact HVQFN32 package (5 x 5 mm) `` Clean interface, requiring only one capacitor `` , the full HDMI signal speed of 3.4 Gbps. Housed in a small HVQFN32 package that measures only ` 5 x 5 ... | Original |
2 pages, |
IP4786CZ32 HDMI type A plug HDMI cable CONNECTOR HVQFN32 IP4786CZ32 abstract |
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| Abstract: range -25°C/+85°C -25°C/+85°C Package HVQFN32 (5mmx5mm) Software Source code and examples (C, C ) for the host controller NFC Forum reference implementation can be provided HVQFN32 , Sales description PN5110A0HN1 PN5110A0HN1 PN5120A0HN1 PN5120A0HN1 Package HVQFN32 HVQFN32 Status Available ... | Original |
4 pages, |
PN5120A0HN1 NXP Bluetooth IC NXP antenna design guide NFC topaz PN511 NFC Tags PN512 PN511 Antenna and RF Design Guide PN51x NFC technology felica NXP s2c HVQFN32 PN511 abstract |
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| Abstract: - C I C I C I C I C I C I C I C I - - I HVQFN32 SC16C650BIBS SC16C650BIBS , TL16C750IPM TL16C750IPM - - C I LQFP64 LQFP64 SC16C750BIB64 SC16C750BIB64 HVQFN32 SC16C750BIBS SC16C750BIBS DIP40 DIP40 SC16C2550BIN40 SC16C2550BIN40 , HVQFN32 LQFP48 LQFP48 HVQFN32 SC16C652BIB48 SC16C652BIB48 SC16C652BIBS SC16C652BIBS SC16C752BIB48 SC16C752BIB48 SC16C752BIBS SC16C752BIBS PLCC68 PLCC68 ... | Original |
2 pages, |
PC16550DV LQFP48 HVQFN32 dil40 SC28L92 SCC2681 SCC2681AC1N28 TL16C450FN ST16C654DIQ64 ST16C554IJ68 ST16C554DIQ64 ST16C554 ST16C2552IJ44 scc2698bc1a84 DIL24 SCC2691 DIL24 abstract |
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| Abstract: up to 848 Kbit/s } SO32 and HVQFN32 packages Key benefits } Proven solutions from an industry , SO32 HVQFN32 HVQFN32 - - - - - EMC n.a. n.a. n.a. n.a. n.a. ... | Original |
2 pages, |
smartmx RC500 RC400 nxp i2C 15693 USB Interface IC NXP MF RC530 nxp mifare MiFare DESFIre Mifare Desfire protocol Mifare plus RX852 nxp nfc MiFare DESFire 4k SO32 HVQFN32 HVQFN32 abstract |
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| Abstract: 31 (Class P2) yes sawn/unsawn Contact SSOP20 SSOP20 SSOP20 SSOP20, HVQFN32 - SSOP20 SSOP20 yes yes , ) yes yes, 1K or 4K sawn/unsawn Contact, Dual Interface, Contactless SSOP20 SSOP20 SSOP20 SSOP20, HVQFN32 , , HVQFN32 yes CC EAL5+ VISA, CAST yes CC EAL5+ VISA, CAST yes VISA, CAST yes CC EAL5+ ... | Original |
1 pages, |
P5CC018 P5CC009 P5CD009 mifare class 4k HVQFN32 P5CT072 P5CU036 7816 NxP P5Cn072 SSOP20 128 k rom datasheets P5CD036 P5CD072 P5CN072 P5CC009 abstract |
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| Abstract: ISP1507A1HNTM ISP1507A1HNTM ISP1507B1HNTM ISP1507B1HNTM ISP1507D1HNTM ISP1507D1HNTM A1HNTM :HVQFN32 B1HNTM :HVQFN32 D1HNTM :HVQFN24 HVQFN24 A1HNTM :5 x 5 x , range of package options supporting HVQFN32 and HVQFN24 HVQFN24, ISP1507X1 ISP1507X1 is the best fit for above ... | Original |
2 pages, |
ISP1703AUKTS ISP1703BUKTS ISP1704 ISP1704A ISP1704AETTTM ISP1715A "USB Transceivers" ISP1716A ISP1507B 1715 ISP1716A0ETTM HVQFN32 ISP1507A1HN ISP1507B1HNTM WLCSP25 TFBGA36 WLCSP25 abstract |
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| Abstract: HVQFN32 5.0 x 5.0 x 0.85 SC16C852LIBS SC16C852LIBS 1.8-V, 5-Mbps, low-power, dual-channel UART with Intel/Motorola interface HVQFN32 5.0 x 5.0 x 0.85 SC16C852LIB48 SC16C852LIB48 1.8-V, 5-Mbps, low-power , VLIO interface HVQFN32 5.0 x5.0 x 0.85 www.nxp.com © 2006 NXP N.V. All rights reserved. ... | Original |
2 pages, |
SC16C852VIET SC16C852V SC16C852LIBS SC16C850LIET SC16C850LIBS marvell uart module RS232 HVQFN32 PXA32x RS-485 RS-232 RS-485 abstract |
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| Abstract: PDF: 2002 Oct 22 Philips Semiconductors Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-3 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 9 y1 C v M C A B w M C b 16 y L 17 8 e e2 Eh 1/2 e 24 1 terminal 1 index area 32 25 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. ... | Original |
1 pages, |
MO-220 HVQFN32 HVQFN32 abstract |
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| Abstract: Package outline Philips Semiconductors HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm D B SOT865-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 M M y1 C C A B C y L 17 8 e e2 Eh 1/2 e 1 24 terminal 1 index area 32 25 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 ... | Original |
1 pages, |
Thin Quad flat package 44 mo-220 MO-220 HVQFN32 HVQFN32 abstract |
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| Abstract: Package outline Philips Semiconductors HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 6 x 6 x 0.85 mm D B SOT866-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 M M y1 C C A B C y L 17 8 e e2 Eh 1/2 e 1 24 terminal 1 index area 32 25 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 ... | Original |
1 pages, |
MO-220 HVQFN32 HVQFN32 abstract |
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| Abstract: PDF: 2002 Oct 18 Philips Semiconductors Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-1 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 9 16 y y1 C v M C A B w M C b L 17 8 e e2 Eh 1/2 e 1 terminal 1 index area 24 32 25 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1 ... | Original |
1 pages, |
MO-220 HVQFN32 SOT617-1 HVQFN32 abstract |
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| Abstract: PDF: 2003 May 02 Philips Semiconductors Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm SOT617-2 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e 1/2 v M C A B w M C b e 9 y1 C y 16 L 17 8 e e2 Eh 1/2 1 e 24 terminal 1 index area 25 32 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original ... | Original |
1 pages, |
SOT617-2 MO-220 HVQFN32 HVQFN32 abstract |
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| Abstract: PDF: 2001 Aug 14 Philips Semiconductors Package outline HVQFN32: plastic, heatsink very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-1 terminal 1 index area A A4 E detail X C e1 e 1/2 e 9 y y1 C v M C A B b w M C 16 L 17 8 e e2 Eh 1/2 e pin 1 index 1 24 32 25 X Dh 0 2.5 scale DIMENSIONS (mm are the original dimensions) A UNIT max. mm 5 mm A4 max. b ... | Original |
1 pages, |
SOT617-1 MO-220 HVQFN32 HVQFN32 abstract |
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| Abstract: 0.85 mm 5x5 or 6x6 mm² HVQFN32 or HVQFN40 HVQFN40 OM5561 OM5561 60 -25 / +85 0.85 mm 5x5 or 6x6 mm² HVQFN32 ... | Original |
1 pages, |
14443-A PN512 k 1356 JCOP 30 nfc smart card nfc passive HVQFN32 14443 PN532 OM5561 NFC I2C classic P5CN072 PN65L ISO 18092 PN511 PN512 PN511 abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| Packages SOT617-1 ; plastic, heatsink very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm SOT617-1 HVQFN32 plastic, heatsink very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm 01-08-08 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot617-1-v2.html |
Philips | 05/02/2002 | 5.01 Kb | HTML | sot617-1-v2.html |
| .2 3.0 SC16IS752 SC16IS752 SC16IS752 SC16IS752 HVQFN-32 May 27, 2011 3.2 3.0 SC16IS760 SC16IS760 SC16IS760 SC16IS760 TSSOP-24 TSSOP-24 TSSOP-24 TSSOP-24 May 27, 2011 3.2 3.0 SC16IS760 SC16IS760 SC16IS760 SC16IS760 HVQFN-24 HVQFN-24 HVQFN-24 HVQFN-24 May 27, 2011 3.2 3.0 SC16IS762 SC16IS762 SC16IS762 SC16IS762 TSSOP-28 TSSOP-28 TSSOP-28 TSSOP-28 May 27, 2011 3.2 3.0 SC16IS762 SC16IS762 SC16IS762 SC16IS762 HVQFN-32 May www.datasheetarchive.com/files/nxp/misc/support/models/sc16/index.htm |
NXP | 22/10/2012 | 9.45 Kb | HTM | index.htm |
| Packages Information on package SOT866-1 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 6 x 6 x 0.85 mm Outline drawing Package version Package name Package description Drawing issue date SOT866-1 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 6 x 6 x 0.85 mm 9 www.datasheetarchive.com/files/philips/packages/sot866-1.html |
Philips | 16/06/2005 | 1.97 Kb | HTML | sot866-1.html |
| Packages Information on package SOT617-1 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm Outline drawing Package version Package name Package description Drawing issue date SOT617-1 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm 02-10-18 General package www.datasheetarchive.com/files/philips/packages/sot617-1.html |
Philips | 24/04/2003 | 1.86 Kb | HTML | sot617-1.html |
| Packages Information on package SOT865-1 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm Outline drawing Package version Package name Package description Drawing issue date SOT865-1 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm 9 www.datasheetarchive.com/files/philips/packages/sot865-1.html |
Philips | 16/06/2005 | 1.97 Kb | HTML | sot865-1.html |
| Packages Information on package SOT617-3 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm Outline drawing Package version Package name Package description Drawing issue date SOT617-3 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm 10 www.datasheetarchive.com/files/philips/packages/sot617-3-v2.html |
Philips | 17/06/2005 | 1.97 Kb | HTML | sot617-3-v2.html |
| Packages Information on package SOT617-3 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm Outline drawing Package version Package name Package description Drawing issue date SOT617-3 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm 02-10-22 General package www.datasheetarchive.com/files/philips/packages/sot617-3.html |
Philips | 24/04/2003 | 1.86 Kb | HTML | sot617-3.html |
| Packages Information on package SOT617-1 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm Outline drawing Package version Package name Package description Drawing issue date SOT617-1 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm 10 www.datasheetarchive.com/files/philips/packages/sot617-1-v1.html |
Philips | 17/06/2005 | 1.97 Kb | HTML | sot617-1-v1.html |
| Packages Information on package SOT617-2 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm Outline drawing Package version Package name Package description Drawing issue date SOT617-2 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm 5 www.datasheetarchive.com/files/philips/packages/sot617-2-v1.html |
Philips | 17/06/2005 | 1.96 Kb | HTML | sot617-2-v1.html |
| -1 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm - (EIAJ) MO-220 MO-220 MO-220 MO-220 (JEDEC) - (IEC) 10/18/2002 - SOT617-2 HVQFN32 - (EIAJ) MO-220 MO-220 MO-220 MO-220 (JEDEC) - (IEC) 5/2/2003 - SOT617-3 HVQFN32 plastic thermal (JEDEC) - (IEC) 10/22/2002 - SOT866-1 HVQFN32 plastic thermal enhanced very thin ) 9/20/2004 - SOT865-1 HVQFN32 plastic thermal enhanced very thin quad flat package www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/quad/thermalenhanced/hvqfn-v2.html |
Philips | 16/06/2005 | 24.28 Kb | HTML | hvqfn-v2.html |