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Part : PSR500HTQFC0L20 Supplier : ROHM Manufacturer : Avnet Stock : 4,000 Best Price : $0.4575 Price Each : $0.7059
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Part : 3HTQF5761-D-50.000 Supplier : Mercury Electronic Ind Manufacturer : Component Distributors Stock : 5 Best Price : - Price Each : -
Part : PSR500HTQFD0L30 Supplier : ROHM Manufacturer : element14 Asia-Pacific Stock : 19 Best Price : $0.88 Price Each : $2.0720
Part : PSR500HTQFD0L30 Supplier : ROHM Manufacturer : element14 Asia-Pacific Stock : 19 Best Price : $0.88 Price Each : $2.0720
Part : PSR500HTQFE0L40 Supplier : ROHM Manufacturer : element14 Asia-Pacific Stock : 29 Best Price : $0.88 Price Each : $2.0720
Part : PSR500HTQFE0L40 Supplier : ROHM Manufacturer : element14 Asia-Pacific Stock : 29 Best Price : $0.88 Price Each : $2.0720
Part : PSR500HTQFF0L50 Supplier : ROHM Manufacturer : element14 Asia-Pacific Stock : 1,965 Best Price : $0.88 Price Each : $2.0720
Part : PSR500HTQFF0L50 Supplier : ROHM Manufacturer : element14 Asia-Pacific Stock : 1,965 Best Price : $0.88 Price Each : $2.0720
Part : PSR500HTQFH1L00 Supplier : ROHM Manufacturer : element14 Asia-Pacific Stock : 1,992 Best Price : $1.24 Price Each : $2.0720
Part : PSR500HTQFH1L00 Supplier : ROHM Manufacturer : element14 Asia-Pacific Stock : 1,992 Best Price : $1.24 Price Each : $2.0720
Part : PSR500HTQFC0L20 Supplier : ROHM Manufacturer : Farnell element14 Stock : - Best Price : £0.6770 Price Each : £1.76
Part : PSR500HTQFD0L30 Supplier : ROHM Manufacturer : Farnell element14 Stock : 19 Best Price : £0.4150 Price Each : £0.7260
Part : PSR500HTQFE0L40 Supplier : ROHM Manufacturer : Farnell element14 Stock : 34 Best Price : £0.6520 Price Each : £1.50
Part : PSR500HTQFF0L50 Supplier : ROHM Manufacturer : Farnell element14 Stock : 1,965 Best Price : £0.5810 Price Each : £1.06
Part : PSR500HTQFH1L00 Supplier : ROHM Manufacturer : Farnell element14 Stock : 1,992 Best Price : £0.7440 Price Each : £1.49
Part : PSR500HTQFJ2L00 Supplier : ROHM Manufacturer : Farnell element14 Stock : - Best Price : £0.6520 Price Each : £1.39
Part : IC-HT QFN28 5X5 Supplier : iC-Haus Manufacturer : Symmetry Electronics Stock : 1 Best Price : $11.55 Price Each : $11.55
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HTQFP100

Catalog Datasheet MFG & Type PDF Document Tags

HTQFP100

Abstract: AD9788 dBc 81 dBc AD9788 AD9779A DAC5688 DAC5687 HTQFP100 DAC1205D650 12-bit 83 dBc 80 dBc AD9787 AD9778A HTQFP100 DAC1005D650 10-bit 81 dBc 78 dBc AD9785 AD9776A HTQFP100 DAC1405 Demo Board www.nxp.com © 2009 NXP B.V. All rights reserved. Reproduction in
NXP Semiconductors
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05D650 DAC1405D650

HTQFP100

Abstract: LQFP48 30-3250 30-3250 QFP64 HLQFP100 HLQFP100 HTQFP100 HTQFP100 TZA3015 Notes: X X X 50 , HTQFP100 Status January-01 116 95 112 86 125 300 1500 BiCMOS BiCMOS BiCMOS BiCMOS
Philips Semiconductors
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TZA3033 TZA3023 TZA3043 TZA3013 CGY2110 LQFP48 DB4042 HBCC32 BICMOS msd818 tza3047 MSD818 CGY2102

8 bit ttl ADC

Abstract: CAR alarm INTEGRATED CIRCUIT /parallel CMOS HTQFP100 14x14 DAC1201D125 Dual 12-bits DAC 125 Msps 3.3V 185 mW 79 dB - , 950 mW 83 dB 2x, 4x, 8x Interleaved /parallel CMOS HTQFP100 14x14 DAC1401D125 Dual , /parallel CMOS HTQFP100 14x14 Package Imaging Front End Selection Table Type Description
NXP Semiconductors
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8 bit ttl ADC CAR alarm INTEGRATED CIRCUIT ADC0801S040 ADC1002S020 TDA8783 TDA8784 TDA8787A TDA9965 284MH TDA9965A

HVQFN64

Abstract: HVQFN40 64 · 1.8 / 3.3 550 77 2x., 4x., 8x HTQFP100 14x14 Dual 10-bit DAC 650 Msps · 1.8 / 3.3 550 77 2x., 4x., 8x HTQFP100 14x14 DAC1003D160 Dual 10-bit DAC 160 Msps , HTQFP100 14x14 Dual 14-bit DAC 650 Msps · 1.8 / 3.3 550 77 2x., 4x., 8x HTQFP100 14x14 , 2x., 4x., 8x HTQFP100 14x14 Dual 12-bit DAC 650 Msps · 1.8 / 3.3 550 80 2x., 4x., 8x HTQFP100 14x14 NXP Semiconductors
NXP Semiconductors
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ADC1215S ADC1215S065 ADC1215S080 ADC1215S105 ADC1215S125 ADC1410S065 HVQFN64 HVQFN40 HVQFN56 HVQFN-56 ADC1215S065/DB ADC1215S080/DB ADC1215S105/DB

SnPb36Ag2

Abstract: J-STD-020B 205 200 150 FQFP208 HVQFN48 VSO56 HTQFP100 SO28 100 50 0 Temperature in degree C , FQFP208 HVQFN48 VSO56 100 50 HTQFP100 SO28 0 0 100 200 300 400 0 60 , test (-40/+125 oC) lead-free and lead-containing reflow solder Sn plated HTQFP100 components (Cu-based leadframe) HTQFP100, reflow ln[1/(1-f)] 10 1 SnPb SnAgCu 0,1 0,01 100 1000 N
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SnPb36Ag2 J-STD-020B Lead Free reflow soldering profile BGA lead-free solder joint reliability thermal cycle Infineon diffusion solder FeNi42-leadframe 2002/95/EC 3Q-4Q03 4Q03-2Q04 3Q03-4Q04 1Q03-1Q04 2Q03-2Q04

LQFP48

Abstract: cgy2141 HLQFP100 HTQFP100 HTQFP100 X X X X -38 -32 -28 -24 -28 -22,4 -16 EAM [Vppse] E.R
Philips Semiconductors
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LQFP32 TZA3012 CGY2151 cgy2141 CGY2140 TZA3034 TZA3044 TZA3014 TZA3019

samtec connector

Abstract: ADC0808D250 1.8 / 3.0 630 87 71.4 HVQFN64 9x9 · 1.8 / 3.3 435 80 2x, 4x, 8x HTQFP100 14x14 Dual 12-bit DAC 650 Msps · 1.8 / 3.3 435 80 2x, 4x, 8x HTQFP100 14x14 , · 1.8 / 3.3 435 77 2x, 4x, 8x HTQFP100 14x14 DAC1005D650 Dual 10-bit DAC 650 Msps · 1.8 / 3.3 435 77 2x, 4x, 8x HTQFP100 14x14 DAC1003D160 Dual 10-bit DAC , 2x, 4x, 8x HTQFP100 14x14 DAC1405D650 Dual 14-bit DAC 650 Msps · 1.8 / 3.3 435
NXP Semiconductors
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ADC1415S080 samtec connector ADC0808D250 ADC0808D ADC1010S080 LVDS connector ADC1207S080 ADC1207S080/DB ADC1210S ADC1210S065/DB ADC1210S065 ADC1210S065F1/DB

SnPb36Ag2

Abstract: Lead Free reflow soldering profile BGA 260 250 205 200 150 FQFP208 HVQFN48 VSO56 HTQFP100 SO28 100 50 0 Temperature in , 235 200 150 FQFP208 HVQFN48 100 VSO56 50 HTQFP100 SO28 0 0 100 200 , plated HTQFP100 components (Cu-based lead-frame) HTQFP100, reflow ln[1/(1-f)] 10 1 SnPb
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semiconductors cross reference philips pb-free products BGA Ball Crack FeNi42 P-DSO-12 BGA 40 x 40 mm St

HTQFP100

Abstract: PDF: 2001 Mar 30 Philips Semiconductors Package outline HTQFP100: plastic, heatsink thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT638-1 c y heatsink side X Dh A 75 51 76 50 ZE e E HE Eh A2 A (A3) A1 w M bp Lp pin 1 index L detail X 26 100 1 25 w M bp e ZD v M A D B HD v M B 0 10 mm scale DIMENSIONS (mm are the original dimensions) A UNIT max. mm 1.2 A1 A2
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Abstract: HTQFP100 14x14 HVQFN56 8x8 DAC1408D series ADC1213D065 1.8 / 3.0 445 86 70.0 , Dual 14-bit DAC 650 Msps â'¢ 1.8 / 3.3 435 77 2x, 4x, 8x HTQFP100 14x14 , 2x, 4x, 8x HTQFP100 14x14 ADC1212D105 Dual 12-bit ADC up to 105 Msps â'¢ â'¢ 1.8 , -bit DAC 650 Msps â'¢ 1.8 / 3.3 435 80 2x, 4x, 8x HTQFP100 14x14 DAC1203D160 , -bit DAC 750 Msps â'¢ 1.8 / 3.3 435 77 2x, 4x, 8x HTQFP100 14x14 â'¢ â'¢ 1.8 Integrated Device Technology
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DAC1001D125 DAC1001D125-DB DAC1003D160-DB DAC1005D650-DB DAC1005D750-DB DAC1005D750

philips l 6.1

Abstract: sot638 Package outline Philips Semiconductors HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 (A3) A1 w M bp Lp pin 1 index L detail X 26 100 1 25 bp e w M ZD v M A D B HD v M B 0 10 mm scale DIMENSIONS (mm are the original dimensions) A UNIT max. mm 1.2 A1
Philips Semiconductors
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MS-026 philips l 6.1 sot638

HTQFP100

Abstract: a7551 PDF: 2003 Apr 07 Philips Semiconductors Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 (A3) A1 w M bp Lp pin 1 index L detail X 26 100 1 25 bp e w M ZD v M A D B HD v M B 0 10 mm scale DIMENSIONS (mm are the original dimensions) A UNIT
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a7551
Abstract: PC board footprint NXP Semiconductors Footprint information for reflow soldering of HTQFP100 package SOT638-2 Hx Gx P2 (0.125) P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste nSPx nSPy 3 occupied area 3 DIMENSIONS in mm P1 P2 Ax Ay Bx By C D1 D2 Gx Gy Hx NXP Semiconductors
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4433619 crystal

Abstract: saf7115 HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 × 14 × 1 mm; exposed die , Transparent top view 001aag269 a. HTQFP100 Fig 2. b. TFBGA160 Pin configuration Table 2. Pin allocation table (HTQFP100) Pin Symbol Pin Symbol Pin Symbol Pin Symbol 1 VDDD , . Pin allocation table (HTQFP100) .continued Pin Symbol Pin Symbol Pin Symbol Pin , description Type[1] Pin HTQFP100 Description TFBGA160 Supplies (analog) VDDA0 23 M2 P
NXP Semiconductors
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ITU-601 4433619 crystal saf7115 4433619 oscillator SAF7115HW 3579545 crystal oscillator SAF7115
Abstract: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HTQFP100 package SOT638-1 Hx Gx P2 (0.125) P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste nSPx nSPy 5 occupied area 5 DIMENSIONS in mm P1 P2 Ax Philips Semiconductors
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Abstract: '¢ 1.8 / 3.3 435 77 2x, 4x, 8x HTQFP100 14x14 DAC1405D650 Dual 14-bit DAC 650 Msps â'¢ 1.8 / 3.3 435 77 2x, 4x, 8x HTQFP100 14x14 DAC1403D160 DAC1403D160 Dual 14 , '¢ 1.8 / 3.3 435 80 2x, 4x, 8x HTQFP100 14x14 DAC1205D650 Dual 12-bit DAC 650 Msps â'¢ 1.8 / 3.3 435 80 2x, 4x, 8x HTQFP100 14x14 DAC1203D160 Dual 12-bit DAC 160 Msps â , HTQFP100 14x14 DAC1005D650 Dual 10-bit DAC 650 Msps â'¢ 1.8 / 3.3 435 77 2x, 4x, 8x NXP Semiconductors
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JESD204A/JESD204B JESD204A JESD204B HSDC-EXTMOD01/DB HSDC-EXTMOD02A/DB DAC1627D

sot638

Abstract: HTQFP100 Package outline Philips Semiconductors HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-2 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh (A3) A A2 w M bp pin 1 index A1 Lp L detail X 26 100 1 25 bp e w M ZD v M A D B HD v M B 0 10 mm scale DIMENSIONS (mm are the original dimensions) A UNIT max. mm 1.2 A1
Philips Semiconductors
Original
Abstract: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 (A3) A1 w M θ bp Lp L pin 1 index detail X 26 100 1 25 w M bp e ZD v M A D B HD v M B 0 10 mm scale DIMENSIONS (mm are the original dimensions) A UNIT max. 1.2 mm A1 A2 A3 bp c D(1 NXP Semiconductors
Original

saf7115

Abstract: ITU-601 PPAL Level 3 AEC-Q100 HTQFP100, TFBGA160 Q3/2008 Package QFP44 Availability
NXP Semiconductors
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SAF7118 SAF7129A Video Decoders ycbcr 16bit 8bit NTSC color bar generator color bar generator PAL color bar GENERATOR SAF7113 HBGA156 QFP160
Abstract: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-2 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh (A3) A A2 w M θ bp pin 1 index A1 Lp L detail X 26 100 1 25 w M bp e ZD v M A D B HD v M B 0 10 mm scale DIMENSIONS (mm are the original dimensions) A UNIT max. 1.2 mm A1 A2 A3 bp c D(1 NXP Semiconductors
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controlstick

Abstract: TMDX28069USB 30-3250 30-3250 QFP64 HLQFP100 HLQFP100 HTQFP100 HTQFP100 TZA3015 Notes: X X X 50 , HTQFP100 Status January-01 116 95 112 86 125 300 1500 BiCMOS BiCMOS BiCMOS BiCMOS
Texas Instruments
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F28069 controlstick TMDX28069USB TMS320x piccolo TMS320c2000 mcu controlstick F2806x TMS320F2806 C2000TM F2806 256KB 100KB

CGY2144

Abstract: CGY2141 -bit DAC upto 650/750 Msps 1.8 / 3.3 550 77 2x. 4x. 8x HTQFP100 14x14 DAC1403D160 Dual , 1.8 / 3.3 550 80 2x. 4x. 8x HTQFP100 14x14 HTQFP80 12x12 DAC1203D160 Dual 12 , 77 2x. 4x. 8x HTQFP100 14x14 DAC1003D160 Dual 10-bit DAC 160 Msps 3.3 210 80
Philips Semiconductors
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CGY2144 MSD828 Ultrafast Photodiode InGaAs TZA3005 photodiode germanium STM-64 for FTTH

BGA7133

Abstract: BGA7130 PC board footprint NXP Semiconductors Footprint information for reflow soldering of HTQFP100 package SOT638-2 Hx Gx P2 (0.125) P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste nSPx nSPy 3 occupied area 3 DIMENSIONS in mm P1 P2 Ax Ay Bx By C D1 D2 Gx Gy Hx
NXP Semiconductors
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BGA7133 BGA7130 BGA7203 qubic4 BLF7G22-130 SOT502 DAC1208D DAC1205D DAC1008D DAC1005D
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