NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Type | Ordering |
| HSON8 | ROHM Electronics | LSI Assembly |
2 pages, |
Original |  |
|
|||||
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: to 1.5 m W · Small HSON-8 package · Popular THD and SMD packages · Standard maximum TCH = 175 °C , significantly keeping the ultra-low on-resistance already known from UMOS-4 trench technology. The new HSON-8 , HSON-8 TO-220M TO-262N NP55N03SUG NP55N03SUG NP60N03KUG NP60N03KUG NP60N03SUG NP60N03SUG NP90N03VUG NP90N03VUG NP82N03PUG NP82N03PUG NP88N03KDG NP88N03KDG , 37 36Note 22 SMD TO-252ZK/ZP TO-263ZK/ZP TO-263-7pin HSON-8 NP33N075YDF NP33N075YDF , 288 88 120 SMD TO-252ZK TO-263ZK Through Hole Mount HSON-8 TO-251 NP22N055SHE NP22N055SHE ... | Original |
6 pages, |
NP110N03PUG NP60N03KUG NP60N03SUG NP100N055MUH NP82N03PUG NP82N04PUG NP82N055MUG NP88N03KDG NP88N03KUG NP90N03VUG NP90N04PUH NP22N055SLE NP23N06YLG np28n10sde AEC-Q101 AEC-Q101 abstract |
|
|||
| Abstract: RDS(on) down to 1.5 m · Small HSON-8 package · Popular THD and SMD packages · , trench technology. The new HSON-8 package follows the trend to provide highest electrical and thermal , TO-263-7pin THD HSON-8 TO-220M TO-262N NP60N03KUG NP60N03KUG NP60N03SUG NP60N03SUG NP90N03VUG NP90N03VUG NP90N03VHG NP90N03VHG NP90N03VLG NP90N03VLG , tbd tbd 120 150 SMD TO-252ZK/ZP TO-263ZK/ZP TO-263-7pin HSON-8 NP33N075YDF NP33N075YDF , -83 -100 -100 SMD TO-252ZK TO-263ZK / ZP HSON-8 NP50P03YDG NP50P03YDG NP75P03YDG NP75P03YDG NP15P04SLG NP15P04SLG ... | Original |
6 pages, |
NP15P04SLG NP110N03PUG NP100N055MUH NP60N03SUG NP70N10KUF NP90N04PUH NP90N04PDH NP90N03VUG NP90N03VLG NP88N03KUG NP88N03KDG NP82N04PUG NP82N03PUG NP80N055NDG AEC-Q101 AEC-Q101 abstract |
|
|||
| Abstract: HSON8 LSI Assembly (Units : mm) · HSON8 2.90 3.00 2.80 8 7 6 5 1 2 3 4 H=0.6Max. The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use ... | Original |
2 pages, |
HSON8 datasheet abstract |
|
|||
| Abstract: HSON8 LSI Assembly Jisso Information · HSON8 1 2 3 4 +0.03 0.6MAX 0.02 -0.02 1PIN MARK 4 3 2 1 (0.3) (0.15) (0.45) 5 6 7 8 (0.2) (1.8) 2.8± 0.1 3.0± 0.2 8 7 6 5 (2.2) (0.05) (0.2) 2.9± 0.1 (MAX 3.1 include BURR) 0.475 +0.1 0.13 -0.05 S 0.1 S 0.65 0.32±0.1 0.08 M The contents described herein are subject to change without notice. (Units : mm) Appendix Notes No technical content pages of this document may be ... | Original |
2 pages, |
HSON8 datasheet abstract |
|
|||
| Abstract: HSON8 LSI Assembly · HSON8 1 2 3 4 +0.03 0.6MAX 0.02 -0.02 1PIN MARK 4 3 2 1 (0.3) (0.15) (0.45) 5 6 7 8 (0.2) (1.8) 2.8± 0.1 3.0± 0.2 8 7 6 5 (2.2) (0.05) (0.2) 2.9± 0.1 (MAX 3.1 include BURR) 0.475 +0.1 0.13 -0.05 S 0.1 S 0.65 0.32±0.1 0.08 M The contents described herein are subject to change without notice. (Units : mm) Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted ... | Original |
2 pages, |
HSON8 datasheet abstract |
|
|||
| Abstract: C02S Fast Transient Response High Efficiency HSON8 (2.9Ã-3.0) Start-up Sequence Pch Switch Control , 4.0±0.1 5.0±0.15 (1.8) [Unit : mm] 4.0±0.1 HSON8 (0.2) VQFN020V4040 VQFN020V4040 2 BOTTOM ... | Original |
7 pages, |
VQFN020V4040 in mm BD9102FVM BD9106FVM BD9109FVM bd911 BD9122GUL BD9130 BD9132 4040 cmos BD9180GUL BD9150MUV bd9139muv BD9141 BD9137 datasheet abstract |
|
|||
| Abstract: ) Incorporates an undervoltage lockout (UVLO) 5) Employs SOP8 package 6) Employs HSON8 package 7) Incorporates , 0.5 (A) = 0.4 (W) Power Dissipation SOP8 HSON8 2.0 800 (1) 690mW 600 (1) 1.75W , 5 3 8 Part No. H F N - Package F : SOP8 HFN : HSON8 T R Packaging and forming specification E2: Embossed tape and reel (SOP8) TR: Embossed tape and reel (HSON8 , ) Order quantity needs to be multiple of the minimum quantity. HSON8 Tape ... | Original |
11 pages, |
GRM21 BD3538HFN BD3538F 2R5TPE220MF HSON8 10030EAT33 BD3538F abstract |
|
|||
| Abstract: qualified for automotive applications are marked Tape & Reel: HSON-8, HSOP-8, HVSON-8, mini-HVSON-8 , 14 1.1 SOP-8 2500 25 13 43 HSON-8 2500 1.5 35 UPA2723UT1A-E1/E2 UPA2723UT1A-E1/E2 , HSON-8 2500 NP35N04YUG-E1/E2 NP35N04YUG-E1/E2 35 10 9.5 77 HSON-8 2500 NP35N04YLG-E1 NP35N04YLG-E1 , NP60N04KUG-E1/E2 NP60N04KUG-E1/E2 NP74N04YUG-E1/E2 NP74N04YUG-E1/E2 6.1 2SK3716 2SK3716 75 120 HSON-8 2500 5.6 8.9 83 , 138 HSON-8 2500 NP75N04YUG-E1/E2 NP75N04YUG-E1/E2 5 70 115 TO-220M 50 NP70N04MUG-S18 NP70N04MUG-S18 ... | Original |
32 pages, |
transistor 2sj449 2SK4147-T1B HSON-8 uPA2749UT1A 2SK3353 uPA2591T1H 2sk3919 uPA2211 NP28N10 2SK4147 TO-263-7P nec 2sk4202 2SK4145-S19 UPA2721GR datasheet abstract |
|
|||
| Abstract: Devices qualified for automotive applications are marked Tape & Reel: HSON-8, HSOP-8, HVSON-8 , 13 43 HSON-8 2500 20 35 20 20 TO-252ZK 2500 2SK4077-ZK-E1/E2 2SK4077-ZK-E1/E2 16 , 2SK3755 2SK3755 35 77 HSON-8 2500 NP35N04YUG-E1/E2 NP35N04YUG-E1/E2 NP35N04YLG-E1/E2 NP35N04YLG-E1/E2* 10 9.5 14 NP13N04YUG-E1/E2 NP13N04YUG-E1/E2* 35 77 HSON-8 2500 8.5 14 50 42 TO-263ZK 800 2SK4184 2SK4184 8.5 , 88 TO-263ZK 800 NP60N04KUG-E1/E2 NP60N04KUG-E1/E2 6 75 120 HSON-8 2500 ... | Original |
32 pages, |
uPA2560 NP80N06MLG-s18 NP100N055MDH-S18 np100n04mdh SOT 213 transistor 2sj449 2SK4069-ZK 2SK4212 2SJ601-Z uPA2719AGR uPA2804T1L 2SK4184 UPA1914TE-T1 2sk4080 datasheet abstract |
|
|||
| Abstract: ) 10) High-power package HSON8 : 2.9mm�0mm�6mm 11) Tracking function Applications Notebook , Package HSON8 1/20 Product name BD3523HFN BD3523HFN BD35230HFN BD35230HFN BD35231HFN BD35231HFN 2009.04 - Rev.B Technical , Reference values j-a: HSON8 198.4/W 1-layer substrate (copper foil area : below 0.2%) 92.4/W 1-layer , (A) = 1.0(W) Heat Dissipation Characteristics HSON8 Power Dissipation [Pd] [W] 2.0 (3 , - Package HFN : HSON8 T R Packaging and forming specification TR: Embossed tape and ... | Original |
21 pages, |
HSON8 BD3523HFN BD35230HFN BD35231HFN 09030EBT01 BD3523HFN abstract |
|
|||
| Abstract: HSON-8 E1/E2-AY 27 38 tbd 55 2400 tbd tbd tbd 175 TO-263ZK E1/E2-AY , 55 2400 tbd tbd tbd 175 HSON-8 E1/E2-AY 70 20 - 120 50 2500 , TO-263ZP E1/E2-AY 43 tbd tbd tbd tbd tbd 175 HSON-8 E1/E2-AY 77 34 1900 1.95 150 48 175 HSON-8 E1/E2-AY 77 36 1900 1.95 150 48 175 HSON-8 E1/E2-AY NP110N03PUG NP110N03PUG 110 1.5 NP13N04YUG NP13N04YUG* 13 25 NP35N04YUG NP35N04YUG 35 10 ... | Original |
6 pages, |
V850E2/pj4 uPD70F3526 78k0r/fe3 uPD78F0855 uPD70f3550 uPD70F3529 v850e2/fg4 uPD166011 uPD70F3508 V850E2 uPD70F3526 uPD70F3592 uPD78F0847 UPD78F0841 uPD70F3506 datasheet abstract |
|
|||