NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: IC Package Line-up As of July, 2009 : In mass production : Under development Package name DIP SDIP Package dimensions mm (mil) 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 , 5.06 4.50 5.06 5.08 5.70 1.778/1.78 4.50 5.08 5.50 Package dimensions mm (mil) Terminal Mounting height pitch Max.mm mm 2.54 6.1 8.3 1.27 17.0 Package name SIP HSIP 4x11.7 6.4x19 14.3x19.66 Package dimensions mm (mil) Package name ZIP 6.3x19 Terminal count 8 ... | Original |
8 pages, |
VFBGA 120 TSOP 14X20 tqfp 7x7 TQFP 14X20 hssop HLQFP 176 Package 45x45 bga 23X23 FBGA Package 14x14 datasheet abstract |
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| Abstract: MSM Package Dual type Quad type Non-lead package LQFP, TQFP, QFP, HQFP, HLQFP Flash , improved reliability has been increasing. By utilizing Package Mounting Height vs. Pin Count 3 Package Mounting Area vs. Pin Count Line-up 4 the strengths of both partners to the merger, Renesas 5 Package Technology is able to supply package solutions more 6 7 S-CSP 8 FC-BGA New Technology MSM MCP/POP rapidly than ever before. 9 WPP Package Mounting ... | Original |
21 pages, |
sandisk ultra ii HLQFP 144 HLQFP 176 Package LFPAK footprint Renesas lga 4x4 footprint MO-235 pin diode do34 QFP Package 80 lead Sandisk TSOP renesas mosfet 1000-pin bga 0,8 mm footprint WSON "General Catalog" datasheet abstract |
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| Abstract: TSOP, SSOP, SOP, HSOP Quad type J-lead package Dual type LQFP, TQFP, QFP, HQFP, HLQFP , TSOP, SSOP, SOP, HSOP Quad type J-lead package Dual type LQFP, TQFP, QFP, HQFP, HLQFP , www.renesas.com Package solutions doubled at a stroke Package Mounting Height vs. Pin Count up 3 Package Mounting Area vs. Pin Count Line 4 5 package New Te c h n o l o g y HQFP 10 , right package for any application. At the same time, the combination of technological expertise has ... | Original |
20 pages, |
"General Catalog" 784-pin HQFP1414-64 LFPAK footprint LFPAK footprint Renesas mitsubishi ecu QFP PACKAGE thermal resistance Sandisk TSOP exposed QFP 128 SMD Transistor diagrams hitachi ecu datasheet abstract |
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| Abstract: 31 64 240 kHz, 8 MHz 24 x 10-bit/- 4.5.5.5 176 HLQFP A, A1, A2 BUR, DMA , 12-bit/- 3.0.5.5 176 HLQFP A, A1, A2 BUR, DMA, POC, SPF /32/8 84 80 240 , MHz 240 kHz 36 x 12-bit/- 3.0.5.5 10 x 10-bit/- 3.0.3.6 176 144 HLQFP A, A1, A2 , 64 HLQFP A, A1, A2 BUR, DMA, POC, SPF 32 57 2/2 (2) 1 1 /16/4 18 48 240 kHz, 8 MHz 14 x 10-bit/- 4.5.5.5 80 HLQFP A, A1, A2 BUR, DMA, POC, SPF ... | Original |
6 pages, |
78k0r/fe3 uPD70F3551 uPD78F1823 uPD78F0855 uPD70f3550 uPD70F3529 v850e2/fg4 uPD166011 V850E2 uPD70F3526 uPD70F3508 uPD70F3592 uPD78F0847 UPD78F0841 uPD70F3506 datasheet abstract |
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| Abstract: applications (single-ended). · Suited for handling PWM signals up to 176 kHz · ESD protected on all pins. , cut-off frequency - 1.5 - MHz VP = 5 V; RL = -3 dB ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION TDA7073A TDA7073A DIP16 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 TDA7073AT TDA7073AT SO16 plastic small outline package; 16 leads , signals up to 176 kHz. The TDA7073A/AT TDA7073A/AT are dual power driver circuits in a BTL configuration, intended ... | Original |
15 pages, |
TDA7073AT TDA7073A tda7073 TDA7073A abstract |
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| Abstract: The circuit topology enables a broad range of backlight inverters. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION UBA2070T UBA2070T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 UBA2070P UBA2070P DIP16 DIP16 plastic dual in-line package; 16 leads (300 , 1.31 V VLVS(max) maximum voltage level 1.67 1.76 1.85 V Average current sensor , voltage 1.67 1.76 1.85 V Io(sink) output sink current VCSW = 2 V 2.8 3.2 3.6 ... | Original |
20 pages, |
UBA2070P UBA2070 SMD footprint design ccfl driver Ignition Driver IC UBA2070T UBA2070 abstract |
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| Abstract: enables a broad range of backlight inverters. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION UBA2070T UBA2070T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 UBA2070P UBA2070P DIP16 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 , at pin LVS - 1.25 - V VLVS(max) maximum lamp voltage at pin LVS - 1.76 - , VLVS(max) maximum lamp voltage at pin LVS 1.67 1.76 1.85 V Io(sink)(CSW) output ... | Original |
20 pages, |
UBA2070T UBA2070P UBA2070 ignition stroke ccfl driver UBA2070 abstract |
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| Abstract: allows for headphone applications (single-ended). · Suited for handling PWM signals up to 176 kHz · , ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION TDA7073A TDA7073A DIP16 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 TDA7073AT TDA7073AT SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 1999 Aug 30 2 Philips Semiconductors , rate. Due to the large bandwidth, they can handle PWM signals up to 176 kHz. The TDA7073A/AT TDA7073A/AT are ... | Original |
16 pages, |
TDA7073AT TDA7073A TDA7073A abstract |
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| Abstract: are required. · Low cost SSOP16 SSOP16 plastic package. APPLICATIONS The application board might need , CGY2106TS CGY2106TS PACKAGE NAME DESCRIPTION VERSION SSOP16 SSOP16 plastic shrink small outline package; 16 , - 920 MHz G small signal gain 14.6 16.1 17.6 dB G800 small signal gain at f = 800 MHz 15.8 16.7 17.6 dB ISOr reverse isolation 18 20 - dB , High dynamic range dual LNA MMIC CGY2106TS CGY2106TS PACKAGE OUTLINE SSOP16 SSOP16: plastic shrink small outline ... | Original |
16 pages, |
SSOP16 Philips npo 0805 CGY2106TS CGY2106TS abstract |
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| Abstract: cost SSOP16 SSOP16 plastic package. APPLICATIONS · DCS1800 DCS1800 A redesign of the application board might be necessary for optimum performance. · PCS1900 PCS1900. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION CGY2105ATS CGY2105ATS SSOP16 SSOP16 plastic shrink small outline package; 16 leads; body width , 16.7 17.6 dB 14.6 16.1 17.6 dB -40 °C < Tamb < +85 °C - ±0.45 - dB , specification High dynamic range dual LNA MMIC CGY2105ATS CGY2105ATS PACKAGE OUTLINE SSOP16 SSOP16: plastic shrink small ... | Original |
16 pages, |
SSOP16 PCS1900 Decoupling capacitor philips DCS1800 CGY2105ATS CGY2105 CGY2105ATS abstract |
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| ) HLQFP (5) Package version Package name Package description Reference codes Issue date SOT792-1 HLQFP44 plastic thermal enhanced low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm /20/2003 - SOT848-1 HLQFP128 plastic thermal enhanced low profile quad flat package; 128 leads; body 14 MS-026 MS-026 MS-026 MS-026 (EIAJ) 4/24/2002 - SOT766-1 HLQFP176 plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad MS-026 MS-026 MS-026 MS-026 (JEDEC) 6 www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/quad/thermalenhanced/hlqfp-v2.html |
Philips | 16/06/2005 | 10.88 Kb | HTML | hlqfp-v2.html |
| -06-13 SOT766-2 HLQFP176 plastic thermal enhanced low profile quad flat package; 176 leads; body 24 (112) Thermal enhanced (44) DHVQFN (3) HBCC (4) HLQFP (7) Package version Package name Package description Reference codes Issue date SOT792-1 HLQFP44 plastic thermal enhanced low -11-15 SOT470-1 HLQFP100 plastic heat-dissipating low profile quad flat package; 100 leads; body 14 -04-24 SOT612-2 HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/quad/thermalenhanced/hlqfp.html |
Philips | 15/04/2003 | 10.71 Kb | HTML | hlqfp.html |
| Packages Information on package SOT766-2 plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad Outline drawing Package version Package name Package description Drawing issue date SOT766-2 HLQFP176 plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad 02-05-29 General package www.datasheetarchive.com/files/philips/packages/sot766-2.html |
Philips | 24/04/2003 | 1.87 Kb | HTML | sot766-2.html |
| Packages Information on package SOT766-1 plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad Outline drawing Package version Package name Package description Drawing issue date SOT766-1 HLQFP176 plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad 02-06-13 General package www.datasheetarchive.com/files/philips/packages/sot766-1.html |
Philips | 24/04/2003 | 1.88 Kb | HTML | sot766-1.html |
| Packages Information on package SOT766-1 plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad Outline drawing Package version Package name Package description Drawing issue date SOT766-1 HLQFP176 plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad www.datasheetarchive.com/files/philips/packages/sot766-1-v1.html |
Philips | 16/06/2005 | 1.98 Kb | HTML | sot766-1-v1.html |
| .75 mm 97-08-01 37 SOT470-1 HLQFP100 plastic heat-dissipating low profile quad flat package; 100 leads SOT612-1 HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1 14 x 2.2 mm 99-12-27 119 SOT612-2 HLQFP144 plastic thermal enhanced low profile quad flat package leads; body width 5.3 mm 99-12-27 154 SOT176-1 SO8 plastic small outline package; 8 leads; body width 7 profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm 02-01-21 176 SOT541A LDMOST www.datasheetarchive.com/files/philips/packages/package-v1.html |
Philips | 05/02/2002 | 119.94 Kb | HTML | package-v1.html |
| /13/2002 176 SOT799-1 HBGA564 HBGA564 HBGA564 HBGA564 plastic thermal enhanced ball grid array package; 564 balls; body 40 x 40 x 1 /19/2003 336 SOT176-1 SO8 plastic small outline package; 8 leads; body width 7.5 mm 2/19/2003 337 SOT137-1 SO leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm 1/27/2003 429 SOT766-1 HLQFP176 plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad 6/13/2002 430 SOT792-1 HLQFP44 plastic thermal enhanced low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm www.datasheetarchive.com/files/philips/packages/package-v2.html |
Philips | 16/06/2005 | 169.96 Kb | HTML | package-v2.html |
| /571 SA571 SA571 SA571 SA571 1997-08-20 AN176: Compandor cookbook 29 1 0 /catalog/appnotes/27130.html Applicationnotes for Applicationnotes for Compandors Title Date AN174 AN174 AN174 AN174: Applications for compandors SA570/571 SA570/571 SA570/571 SA570/571 SA571 SA571 SA571 SA571 1997-08-20 AN176 174: Applications for compandors SA570/571 SA570/571 SA570/571 SA570/571 SA571 SA571 SA571 SA571 1997-08-20 AN176: Compandor cookbook 1997-08-20 167 1 node galvanic isolation and power supply design 2000-09-11 AN2456 AN2456 AN2456 AN2456 1: IEEE 1394 Audio Applications 176 1 -Tacs Software User Guide 1996-11-26 AN174 AN174 AN174 AN174: Applications for compandors SA570/571 SA570/571 SA570/571 SA570/571 SA571 SA571 SA571 SA571 1997-08-20 AN176 www.datasheetarchive.com/files/philips/search/docindex.txt |
Philips | 25/04/2003 | 954.24 Kb | TXT | docindex.txt |
| Logic Switching Levels TTL Package Material Plastic Bit Width Other 14 1 0 /catalog/parametrics/24.html ; 3.: GATE 2; 4.: GATE 176 1 0 /models/bf992_3.html Model : BF992 BF992 BF992 BF992 3 BF992 BF992 BF992 BF992 BF992 BF992 BF992 BF992 SPICE MODEL JANUARY -parameters available BFG10W/X BFG10W/X BFG10W/X BFG10W/X BFG10W/X BFG10W/X BFG10W/X BFG10W/X SPICE MODEL PHILIPS SEMICONDUCTORS Date : September 1995 PACKAGE 185 1 0 /models 11W/X BFG11W/X BFG11W/X BFG11W/X BFG11W/X SPICE MODEL PHILIPS SEMICONDUCTORS Date : September 1995 PACKAGE 187 1 0 /models/bfg11 1995 PACKAGE 218 1 0 /models/bfq18a_cnv_2.html Model : BFQ18A BFQ18A BFQ18A BFQ18A CNV 2 BFQ18A BFQ18A BFQ18A BFQ18A common emitter, 10V, 20m www.datasheetarchive.com/files/philips/search/docindex-v2.txt |
Philips | 14/02/2002 | 998.47 Kb | TXT | docindex-v2.txt |
| Radio System CCR520S CCR520S CCR520S CCR520S V2.5 176 1 0 /catalog/appnotes/29313.html Applicationnotes for Buffers www.datasheetarchive.com/files/philips/search/docindex-v1.txt |
Philips | 16/06/2005 | 2589.32 Kb | TXT | docindex-v1.txt |