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HLQFP+176+Package

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Abstract: 31 64 240 kHz, 8 MHz ­ 24 x 10-bit/- 4.5.5.5 176 HLQFP A, A1, A2 BUR, DMA , 12-bit/- 3.0.5.5 176 HLQFP A, A1, A2 BUR, DMA, POC, SPF ­/32/8 84 ­ 80 , FlexRay, Ethernet ­/48/8 67 160 240 kHz, 8 MHz 40 x 12-bit/- 3.0.5.5 176 QFP A , kHz, 8 MHz 240 kHz 36 x 12-bit/- 3.0.5.5 10 x 10-bit/- 3.0.3.6 176 144 HLQFP A , , GJ-GBG-G 80 240 kHz, 8 MHz 12 x 12-bit/- 3.0.5.5 176 GM-GAR-G A POC, DMA, SMC NEC
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UPD70F3524 uPD70F3525 uPD70F3526 uPD70F3529 uPD70F3508 upd70f3523 X19136EE4V0PF00 78K0/KB2 PD78F0513AD 78K0/KC2 78K0/KD2 78K0/KE2
Abstract: densities and improved reliability has been increasing. By utilizing Package Mounting Height vs. Pin Count 3 Package Mounting Area vs. Pin Count Line-up 4 the strengths of both partners to the merger, Renesas 5 Package Technology is able to supply package solutions more 6 7 S-CSP 8 FC-BGA New Technology MSM MCP/POP rapidly than ever before. 9 WPP Package Mounting Height (mm) QFP HQFP Package Mounting Height (mm) Quad Flat Package Quad Flat Renesas Technology
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1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package HLQFP1414-100 BGA and QFP Package mounting MO-235 FOOTPRINT REJ01K0003-0300
Abstract: -0200Z www.renesas.com Package solutions doubled at a stroke Package Mounting Height vs. Pin Count up 3 Package Mounting Area vs. Pin Count Line 4 5 package New Te c h n o l o g y HQFP 10 , right package for any application. At the same time, the combination of technological expertise has , like. 6 Products 18 Package Mounting Height (mm) WEB site 2.5 QFP HQFP Package Mounting Height (mm) Quad Flat Package Quad Flat Package Quad Flat Package Quad Flat Renesas Technology
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diagrams hitachi ecu SMD Transistor exposed QFP 128 784-pin Sandisk TSOP QFP PACKAGE thermal resistance D-85622 REJ01K0003-0200Z
Abstract: IC Package Line-up As of July, 2009 : In mass production : Under development Package name DIP SDIP Package dimensions mm (mil) 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 , 5.06 4.50 5.06 5.08 5.70 1.778/1.78 4.50 5.08 5.50 Package dimensions mm (mil) Terminal Mounting height pitch Max.mm mm 2.54 6.1 8.3 1.27 17.0 Package name SIP HSIP 4x11.7 6.4x19 14.3x19.66 Package dimensions mm (mil) Package name ZIP 6.3x19 Terminal count 8 -
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FBGA Package 14x14 121 bga 10x10 lfbga 12X12 BGA 27X27 pitch 23X23 TSOP 14X20 JEDEC150 JEDEC300
Abstract: HLQFP package.) 28377D 337-Ball ZWT 28376D 176-Pin PTP 337-Ball ZWT 28375D 176 , Libraries Package Options: â'" Lead-Free, Green Packaging â'" 337-Ball New Fine Pitch Ball Grid Array (nFBGA) [ZWT Suffix] â'" 176-Pin PowerPADâ"¢ Thermally Enhanced LowProfile Quad Flatpack (HLQFP) [PTP , USB connectivity to their application. Device Information (1) PART NUMBER PACKAGE BODY SIZE TMS320F28377DZWT nFBGA (337) 16,0 mm x 16,0 mm TMS320F28377DPTP HLQFP (176) 24,0 mm x 24,0 mm Texas Instruments
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TMS320F28377D TMS320F28376D TMS320F28375D TMS320F28374D SPRS880A TMS320F2837
Abstract: features of the TMS320F2837xD devices. Table 2-1. TMS320F2837xD Hardware Features FEATURE(1) Package Type (ZWT is an nFBGA package. PTP is an HLQFP package.) 28377D 337-Ball ZWT 28376D 176-Pin PTP Processor speed (MHz) 337-Ball ZWT 176-Pin PTP 200 Instruction cycle (ns) 5 , Motor Control and Digital Power Libraries Package Options: â'" Lead-Free, Green Packaging â'" 337-Ball New Fine Pitch Ball Grid Array (nFBGA) [ZWT Suffix] â'" 176-Pin PowerPADâ"¢ Thermally Enhanced Texas Instruments
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SPRS880 TMS320C28 204KB 40-MH ISO/TS16949
Abstract: for EMI · 9×9 mm PowerPADTM Quad Flatpack Package 2 The DRV593 and DRV594 are high-efficiency , °C (1) (2) DRV594VFP (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com This package is , PACKAGE DISSIPATION RATINGS PACKAGE 2 JC (°C/W) TA=25C POWER RATING VFP (1) JA (1) (°C , . www.ti.com PIN ASSIGNMENTS FREQ INT/EXT PVDD PVDD PVDD PWM PWM PWM VFP PACKAGE (TOP VIEW Texas Instruments
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DRV591 CDRH104R DRV593VFP DRV593VFPR DRV594VFPR SLOS401B
Abstract: Quad Flatpack Package APPLICATIONS D Thermoelectric Cooler (TEC) Driver D Laser Diode Biasing PWM , ) This package is available taped and reeled. To order this packaging option, add an R suffix to the part , CONDITIONS PACKAGE DISSIPATION RATINGS PACKAGE VFP (1) JA(1) (°C/W) 29.4 JC (°C/W) 1.2 TA = 25 , SEPTEMBER 2002 REVISED - OCTOBER 2002 www.ti.com PIN ASSIGNMENTS VFP PACKAGE (TOP VIEW) 32 31 30 , Figure 3 DRAIN-SOURCE ON-STATE RESISTANCE vs FREE-AIR TEMPERATURE VDD = 5 V IO = 1 A VFP Package 250 Texas Instruments
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SLOS401A
Abstract: for EMI · 9×9 mm PowerPADTM Quad Flatpack Package 2 The DRV593 and DRV594 are high-efficiency , °C (1) (2) DRV594VFP (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com This package is , PACKAGE DISSIPATION RATINGS PACKAGE 2 JC (°C/W) TA=25C POWER RATING VFP (1) JA (1) (°C , . www.ti.com PIN ASSIGNMENTS FREQ INT/EXT PVDD PVDD PVDD PWM PWM PWM VFP PACKAGE (TOP VIEW Texas Instruments
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Abstract: for EMI 9×9 mm PowerPAD Quad Flatpack Package APPLICATIONS The PWM switching frequency may be , ) DRV593VFP(1) -40°C to 85°C 40°C (1) DRV594VFP(1) This package is available taped and reeled. To , voltage, VIL FREQ, INT/EXT, SHUTDOWN, COSC Operating free-air temperature, TA PACKAGE JA(1 , in × 3 in PCB. V V 0.8 - 40 PACKAGE DISSIPATION RATINGS 5.5 2 V 85 °C , OCTOBER 2002 PIN ASSIGNMENTS FREQ INT/EXT PVDD PVDD PVDD PWM PWM PWM VFP PACKAGE (TOP Texas Instruments
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Abstract: Internal or External Clock Sync PWM Scheme Optimized for EMI 9×9 mm PowerPADâ"¢ Quad Flatpack Package , current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com This package is available taped and reeled. To order this packaging , MAX 2.8 AVDD, PVDD 2 UNIT V V 0.8 â'"40 V 85 ° C PACKAGE DISSIPATION RATINGS PACKAGE VFP (1) 2 qJA (1) (° C/W) 29.4 qJC (° C/W) 1.2 TA=25° C POWER Texas Instruments
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SLOS401C
Abstract: Package 2 DESCRIPTION The DRV593 and DRV594 are high-efficiency, high-current power amplifiers , ) DRV594VFP (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com This package is available taped and , FREQ, INT/EXT, SHUTDOWN, COSC ­40 2.8 2 0.8 85 MAX 5.5 UNIT V V V °C PACKAGE DISSIPATION RATINGS PACKAGE VFP (1) qJA (1) (°C/W) 29.4 qJC (°C/W) 1.2 TA=25°C POWER RATING 4.1 W This data was taken using Texas Instruments
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Abstract: Package 2 DESCRIPTION The DRV593 and DRV594 are high-efficiency, high-current power amplifiers , ) DRV594VFP (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com This package is available taped and , FREQ, INT/EXT, SHUTDOWN, COSC ­40 2.8 2 0.8 85 MAX 5.5 UNIT V V V °C PACKAGE DISSIPATION RATINGS PACKAGE VFP (1) qJA (1) (°C/W) 29.4 qJC (°C/W) 1.2 TA=25°C POWER RATING 4.1 W This data was taken using Texas Instruments
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Abstract: for EMI 9×9 mm PowerPAD Quad Flatpack Package APPLICATIONS The PWM switching frequency may be , ) DRV593VFP(1) -40°C to 85°C 40°C (1) DRV594VFP(1) This package is available taped and reeled. To , voltage, VIL FREQ, INT/EXT, SHUTDOWN, COSC Operating free-air temperature, TA PACKAGE JA(1 , in × 3 in PCB. V V 0.8 - 40 PACKAGE DISSIPATION RATINGS 5.5 2 V 85 °C , OCTOBER 2002 PIN ASSIGNMENTS FREQ INT/EXT PVDD PVDD PVDD PWM PWM PWM VFP PACKAGE (TOP Texas Instruments
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Panasonic VFP electrolytic
Abstract: Package 2 DESCRIPTION The DRV593 and DRV594 are high-efficiency, high-current power amplifiers , ) DRV594VFP (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com This package is available taped and , FREQ, INT/EXT, SHUTDOWN, COSC ­40 2.8 2 0.8 85 MAX 5.5 UNIT V V V °C PACKAGE DISSIPATION RATINGS PACKAGE VFP (1) qJA (1) (°C/W) 29.4 qJC (°C/W) 1.2 TA=25°C POWER RATING 4.1 W This data was taken using Texas Instruments
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Abstract: Quad Flatpack Package APPLICATIONS D Thermoelectric Cooler (TEC) Driver D Laser Diode Biasing PWM , ) This package is available taped and reeled. To order this packaging option, add an R suffix to the part , CONDITIONS PACKAGE DISSIPATION RATINGS PACKAGE VFP (1) JA(1) (°C/W) 29.4 JC (°C/W) 1.2 TA = 25 , SEPTEMBER 2002 REVISED - OCTOBER 2002 www.ti.com PIN ASSIGNMENTS VFP PACKAGE (TOP VIEW) 32 31 30 , Figure 3 DRAIN-SOURCE ON-STATE RESISTANCE vs FREE-AIR TEMPERATURE VDD = 5 V IO = 1 A VFP Package 250 Texas Instruments
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Abstract: ) This package is available taped and reeled. To order this packaging option, add an R suffix to the , temperature, TA PACKAGE JA(1) (°C/W) JC (°C/W) TA = 25°C POWER RATING VFP 29.4 1.2 4.1 W , standard 4-layer 3 in × 3 in PCB. 2 2 V V 0.8 ­40 PACKAGE DISSIPATION RATINGS 5.5 , PVDD PVDD PVDD OUT+ OUT+ OUT+ VFP PACKAGE (TOP VIEW) 32 31 30 29 28 27 26 25 1 24 2 , V IO = 1 A VFP Package 200 Total 150 Low Side 100 High Side 50 0 ­40 ­15 10 Texas Instruments
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DRV591VFP DRV591VFPR MS-026 S-PQFP-G32 SLMA002 TEC Driver SLOS389A
Abstract: ) This package is available taped and reeled. To order this packaging option, add an R suffix to the , temperature, TA PACKAGE JA(1) (°C/W) JC (°C/W) TA = 25°C POWER RATING VFP 29.4 1.2 4.1 W , standard 4-layer 3 in × 3 in PCB. 2 2 V V 0.8 ­40 PACKAGE DISSIPATION RATINGS 5.5 , PVDD PVDD PVDD OUT+ OUT+ OUT+ VFP PACKAGE (TOP VIEW) 32 31 30 29 28 27 26 25 1 24 2 , V IO = 1 A VFP Package 200 Total 150 Low Side 100 High Side 50 0 ­40 ­15 10 Texas Instruments
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DRV591VFPG4 DRV591VFPRG4
Abstract: Quad Flatpack Package APPLICATIONS D Thermoelectric Cooler (TEC) Driver D Laser Diode Biasing PWM , ) This package is available taped and reeled. To order this packaging option, add an R suffix to the part , CONDITIONS PACKAGE DISSIPATION RATINGS PACKAGE VFP (1) JA(1) (°C/W) 29.4 JC (°C/W) 1.2 TA = 25 , SEPTEMBER 2002 REVISED - OCTOBER 2002 www.ti.com PIN ASSIGNMENTS VFP PACKAGE (TOP VIEW) 32 31 30 , Figure 3 DRAIN-SOURCE ON-STATE RESISTANCE vs FREE-AIR TEMPERATURE VDD = 5 V IO = 1 A VFP Package 250 Texas Instruments
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Abstract: Quad Flatpack Package APPLICATIONS D Thermoelectric Cooler (TEC) Driver D Laser Diode Biasing PWM , ) This package is available taped and reeled. To order this packaging option, add an R suffix to the part , CONDITIONS PACKAGE DISSIPATION RATINGS PACKAGE VFP (1) JA(1) (°C/W) 29.4 JC (°C/W) 1.2 TA = 25 , SEPTEMBER 2002 REVISED - OCTOBER 2002 www.ti.com PIN ASSIGNMENTS VFP PACKAGE (TOP VIEW) 32 31 30 , Figure 3 DRAIN-SOURCE ON-STATE RESISTANCE vs FREE-AIR TEMPERATURE VDD = 5 V IO = 1 A VFP Package 250 Texas Instruments
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