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HLQFP 176 Package

Catalog Datasheet Results Type PDF Document Tags
Abstract: IC Package Line-up As of July, 2009 : In mass production : Under development Package name DIP SDIP Package dimensions mm (mil) 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 , 5.06 4.50 5.06 5.08 5.70 1.778/1.78 4.50 5.08 5.50 Package dimensions mm (mil) Terminal Mounting height pitch Max.mm mm 2.54 6.1 8.3 1.27 17.0 Package name SIP HSIP 4x11.7 6.4x19 14.3x19.66 Package dimensions mm (mil) Package name ZIP 6.3x19 Terminal count 8 ... Original
datasheet

8 pages,
73.87 Kb

VFBGA 120 45x45 bga 6.3X24.5 hssop TQFP 14X20 tqfp 7x7 TSOP 14X20 lfbga 12X12 23X23 HLQFP 176 Package FBGA Package 14x14 datasheet abstract
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Abstract: MSM Package Dual type Quad type Non-lead package LQFP, TQFP, QFP, HQFP, HLQFP Flash , improved reliability has been increasing. By utilizing Package Mounting Height vs. Pin Count 3 Package Mounting Area vs. Pin Count Line-up 4 the strengths of both partners to the merger, Renesas 5 Package Technology is able to supply package solutions more 6 7 S-CSP 8 FC-BGA New Technology MSM MCP/POP rapidly than ever before. 9 WPP Package Mounting ... Original
datasheet

21 pages,
3787.99 Kb

pin diode do34 qfn 44 7x7 PACKAGE footprint qfn 44 PACKAGE footprint 7x7 Sandisk TSOP renesas mosfet HLQFP 176 Package QFP Package 80 lead BGA 441 footprint WSON HLQFP 144 FCBGA 1936 lga 4x4 footprint datasheet abstract
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Abstract: TSOP, SSOP, SOP, HSOP Quad type J-lead package Dual type LQFP, TQFP, QFP, HQFP, HLQFP , TSOP, SSOP, SOP, HSOP Quad type J-lead package Dual type LQFP, TQFP, QFP, HQFP, HLQFP , www.renesas.com Package solutions doubled at a stroke Package Mounting Height vs. Pin Count up 3 Package Mounting Area vs. Pin Count Line 4 5 package New Te c h n o l o g y HQFP 10 , right package for any application. At the same time, the combination of technological expertise has ... Original
datasheet

20 pages,
3096.75 Kb

"General Catalog" 784-pin do-34 hitachi HQFP1414-64 LFPAK footprint LFPAK footprint Renesas mitsubishi ecu MITSUBISHI GATE ARRAY MO-235 QFP PACKAGE thermal resistance Sandisk TSOP exposed QFP 128 SMD Transistor datasheet abstract
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Abstract: 31 64 240 kHz, 8 MHz ­ 24 x 10-bit/- 4.5.5.5 176 HLQFP A, A1, A2 BUR, DMA , 12-bit/- 3.0.5.5 176 HLQFP A, A1, A2 BUR, DMA, POC, SPF ­/32/8 84 ­ 80 240 , MHz 240 kHz 36 x 12-bit/- 3.0.5.5 10 x 10-bit/- 3.0.3.6 176 144 HLQFP A, A1, A2 , 64 HLQFP A, A1, A2 BUR, DMA, POC, SPF 32 57 2/2 (2) 1 1 ­ ­ ­/16/4 18 48 240 kHz, 8 MHz ­ 14 x 10-bit/- 4.5.5.5 80 HLQFP A, A1, A2 BUR, DMA, POC, SPF ... Original
datasheet

6 pages,
4391.45 Kb

uPD70F3551 uPD78F0847 uPD70F3585 uPD70f3550 uPD70F3564 uPD70F3554 uPD70F3561 V850E2 uPD70F3526 uPD70F3592 uPD70F35 V850E2 FK4 V850E2/Fx4 uPD70F3508 uPD70F3526 datasheet abstract
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Abstract: ) I Available in 176-ball 6 mm - 15 mm, 0.65 mm ball pitch TFBGA package 3. Applications I 400 MT , (SnAgCu solder ball TFBGA176 TFBGA176 plastic thin fine-pitch ball grid array package; SOT932-1 compound) 176 balls , package; SOT932-1 compound) 176 balls; body 6 - 15 - 0.7 mm 4.1 Ordering options Table 2. Ordering , parity 12. Package outline TFBGA176 TFBGA176: plastic thin fine-pitch ball grid array package; 176 balls; body , package, thereby freeing up board real-estate and facilitating routing to accommodate high-density Dual ... Original
datasheet

29 pages,
153.67 Kb

TFBGA176 sot932 Q5A H7 SSTUB32868 DDR2-800 SSTUB32868 abstract
datasheet frame
Abstract: 176-ball, 8 - 22 grid, 0.65 mm ball pitch, thin profile fine-pitch ball grid array (TFBGA) package, which , 176-ball 6 mm - 15 mm, 0.65 mm ball pitch TFBGA package 3. Applications I 400 MT/s to 800 MT/s , TFBGA176 TFBGA176 plastic thin fine-pitch ball grid array package; SOT932-1 compound) 176 balls; body 6 - 15 - 0.7 , parity 12. Package outline TFBGA176 TFBGA176: plastic thin fine-pitch ball grid array package; 176 balls; body , package, thereby freeing up board real-estate and facilitating routing to accommodate high-density Dual ... Original
datasheet

29 pages,
151.81 Kb

SSTUM32868 DDR2-800 SSTUM32868 abstract
datasheet frame
Abstract: applications (single-ended). · Suited for handling PWM signals up to 176 kHz · ESD protected on all pins. , cut-off frequency - 1.5 - MHz VP = 5 V; RL = -3 dB ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION TDA7073A TDA7073A DIP16 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 TDA7073AT TDA7073AT SO16 plastic small outline package; 16 leads , signals up to 176 kHz. The TDA7073A/AT TDA7073A/AT are dual power driver circuits in a BTL configuration, intended ... Original
datasheet

15 pages,
98.82 Kb

TDA7073AT TDA7073A tda7073 TDA7073A abstract
datasheet frame
Abstract: 128-Lead HLQFP See NNB0128A NNB0128A Package NC DR GND NC NC NC NC NC NC NC NC VDR VA NC FSR NC NC NC NC VDR , ) Package 128-Lead HLQFP (1) J-C (Top of Package) 10°C / W J-PAD (Thermal Pad) 2.8°C / W Soldering , 128-lead HLQFP and operates over the industrial (­40°C TA +85°C) temperature range. · · · · · 2 , 23 24 25 26 27 28 29 30 31 32 VA ADC081000 ADC081000 * * Exposed pad on back of package must be , Mode) Ground Difference: |GND - DR GND| Input Current at Any Pin (3) Package Input Current (3) Power ... Original
datasheet

40 pages,
979.08 Kb

HLQFP 176 Package drawing ADC081000 SNAS209G ADC081000 abstract
datasheet frame
Abstract: enables a broad range of backlight inverters. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION UBA2070T UBA2070T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 UBA2070P UBA2070P DIP16 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 , at pin LVS - 1.25 - V VLVS(max) maximum lamp voltage at pin LVS - 1.76 - , VLVS(max) maximum lamp voltage at pin LVS 1.67 1.76 1.85 V Io(sink)(CSW) output ... Original
datasheet

20 pages,
104.92 Kb

UBA2070T UBA2070P UBA2070 ignition stroke ccfl driver UBA2070 abstract
datasheet frame
Abstract: The circuit topology enables a broad range of backlight inverters. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION UBA2070T UBA2070T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 UBA2070P UBA2070P DIP16 DIP16 plastic dual in-line package; 16 leads (300 , 1.31 V VLVS(max) maximum voltage level 1.67 1.76 1.85 V Average current sensor , voltage 1.67 1.76 1.85 V Io(sink) output sink current VCSW = 2 V 2.8 3.2 3.6 ... Original
datasheet

20 pages,
105.36 Kb

UBA2070P UBA2070 SMD footprint design CCFL FULL BRIDGE ccfl driver Ignition Driver IC UBA2070T UBA2070 abstract
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Datasheet Content (non pdf)

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Over 1.1 million files (1986-2014): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer.
 
package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad MS-026 MS-026 MS-026 MS-026 (JEDEC) 6/13/2002 - Package information To find a package you can browse the package tree. Ceramic (98) Glass (47) Metal (2) Plastic (608 (131) Quad (154) Thermal enhanced (70) DHVQFN (3) HBCC (4) HLQFN (2) HLQFP (5) Package version Package name Package description Reference codes Issue date SOT792-1 HLQFP44 HLQFP44 HLQFP44 HLQFP44
www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/quad/thermalenhanced/hlqfp-v2.html
Philips 16/06/2005 10.88 Kb HTML hlqfp-v2.html
) DHVQFN (3) HBCC (4) HLQFP (7) Package version Package name Package description Reference codes package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad MS-026 MS-026 MS-026 MS-026 (JEDEC) 2002-06-13 SOT766-2 HLQFP176 HLQFP176 HLQFP176 HLQFP176 plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 Packages To find a package you can browse the package tree. Ceramic (97) Glass (47) Metal (2) Plastic (473) Flange mount (22) Heatsink
www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/quad/thermalenhanced/hlqfp.html
Philips 15/04/2003 10.71 Kb HTML hlqfp.html