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934068722147 Nexperia TRANS 2NPN 45V 0.1A DFN1010B-6 visit Digikey Buy
934068723147 Nexperia TRANS 2PNP 45V 0.1A DFN1010B-6 visit Digikey Buy

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Part : CDDFN10-3324P Supplier : Bourns Manufacturer : Farnell element14 Stock : 7,022 Best Price : £0.3590 Price Each : £0.7860
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DFN1010B-6

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: DFN1010B-6 (SOT1216) Surface-Mounted Device (SMD) plastic package. NPN/NPN complement: BC847QAS. NPN/PNP , C1 collector TR1 DFN1010B-6 (SOT1216) 8 C2 collector TR2 7 2 3 8 TR2 , Type number Package Name Version DFN1010B-6 BC857QAS Description DFN1010B-6: plastic , 10 Fig. 1. YEAR DATE CODE aaa-007665 DFN1010B-6 (SOT1216) binary marking code description , 4 0.32 0.40 0.275 0.275 1.05 1.15 13-03-05 Fig. 10. Package outline DFN1010B-6 (SOT1216 NXP Semiconductors
Original
BC847QAPN AEC-Q101
Abstract: Transistors (RET) in a leadless ultra small DFN1010B-6 (SOT1216) Surface-Mounted Device (SMD) plastic package , Transparent top view 7 O1 output (collector) TR1 DFN1010B-6 (SOT1216) 8 O2 output , DFN1010B-6 PQMD12 Description plastic thermal enhanced ultra thin small outline package; no leads , -007665 DFN1010B-6 (SOT1216) binary marking code description PQMD12 Product data sheet All information , . Package outline DFN1010B-6 (SOT1216) PQMD12 Product data sheet All information provided in this NXP Semiconductors
Original

NXP SMD TRANSISTOR MARKING CODE s1

Abstract: MOSFET TRANSISTOR SMD MARKING CODE 11 ) in a leadless ultra small DFN1010B-6 (SOT1216) Surface-Mounted Device (SMD) plastic package using , view 7 D1 drain TR1 DFN1010B-6 (SOT1216) 8 D2 drain TR2 7 2 3 G1 5 8 , number Package Name Version DFN1010B-6 PMDXB600UNE Description plastic thermal enhanced , . 1. YEAR DATE CODE aaa-007665 DFN1010B-6 (SOT1216) binary marking code description , . Package outline DFN1010B-6 (SOT1216) PMDXB600UNE Product data sheet All information provided in
NXP Semiconductors
Original
NXP SMD TRANSISTOR MARKING CODE s1 MOSFET TRANSISTOR SMD MARKING CODE 11
Abstract: ) in a leadless ultra small DFN1010B-6 (SOT1216) Surface-Mounted Device (SMD) plastic package using , view 7 D1 drain TR1 DFN1010B-6 (SOT1216) 8 D2 drain TR2 7 2 3 G1 5 8 , number Package Name Version DFN1010B-6 PMDXB950UPE Description plastic thermal enhanced , . 1. YEAR DATE CODE aaa-007665 DFN1010B-6 (SOT1216) binary marking code description , . Package outline DFN1010B-6 (SOT1216) PMDXB950UPE Product data sheet All information provided in NXP Semiconductors
Original
Abstract: DFN1010D-3 (SOT1215) DFN1010B-6 (SOT1216) Size (mm) 1.1 x 1.0 x 0.37 1.1 x 1.0 x 0.37 Ptot , guide: General-purpose transistors DFN1010B-6 (SOT1216) Package Size 1.0 x 1.0 x 0.37 Ptot , 100 BC847QAPN BC847QAS * BC857QAS * Selection guide: Resistor-equipped transistor DFN1010B-6 , values Dual types: SOT963 Dual DFN1010B-6 package 2 x Single types: DFN0806 www.nxp.com  NXP Semiconductors
Original
DFN1010 PMXB56EN
Abstract: Transistor (FET) in a leadless ultra small DFN1010B-6 (SOT1216) Surface-Mounted Device (SMD) plastic , gate TR2 6 D1 drain TR1 Transparent top view 7 D1 drain TR1 DFN1010B-6 (SOT1216 , Product data sheet Description Version DFN1010B-6 DFN1010B-6: plastic thermal enhanced ultra , EXAMPLE: 11 01 10 Fig. 1. YEAR DATE CODE aaa-007665 DFN1010B-6 (SOT1216) binary marking code , 0.40 0.275 0.275 1.05 1.15 13-03-05 Fig. 31. Package outline DFN1010B-6 (SOT1216 NXP Semiconductors
Original
PMCXB900UE
Abstract: ) in a leadless ultra small DFN1010B-6 (SOT1216) Surface-Mounted Device (SMD) plastic package using , DFN1010B-6 (SOT1216) 8 D2 drain TR2 7 2 3 G1 5 8 G2 4 S1 S2 017aaa256 , DFN1010B-6 NX7002BKXB Description DFN1010B-6: plastic thermal enhanced ultra thin small outline , aaa-007665 DFN1010B-6 (SOT1216) binary marking code description NX7002BKXB Product data sheet , MOSFET 12. Package outline DFN1010B-6: plastic thermal enhanced ultra thin small outline package; no NXP Semiconductors
Original
Abstract: DFN1010B-6 (SOT1216) Surface-Mounted Device (SMD) plastic package. PNP/PNP complement: BC857QAS. NPN/PNP , C1 collector TR1 DFN1010B-6 (SOT1216) 8 C2 collector TR2 7 2 3 8 TR2 , Type number Package Name Version DFN1010B-6 BC847QAS Description DFN1010B-6: plastic , 10 Fig. 1. YEAR DATE CODE aaa-007665 DFN1010B-6 (SOT1216) binary marking code description , . Package outline DFN1010B-6 (SOT1216) BC847QAS Product data sheet All information provided in this NXP Semiconductors
Original
Abstract: DFN1010B-6 (SOT1216) Surface-Mounted Device (SMD) plastic package. 2. Features and benefits â'¢ â , Transparent top view 7 C1 collector TR1 DFN1010B-6 (SOT1216) 8 C2 collector TR2 7 2 , . Ordering information Type number Package Name Version DFN1010B-6 BC847QAPN Description , EXAMPLE: 11 01 10 Fig. 1. YEAR DATE CODE aaa-007665 DFN1010B-6 (SOT1216) binary marking code , 0.40 0.275 0.275 1.05 1.15 13-03-05 Fig. 16. Package outline DFN1010B-6 (SOT1216 NXP Semiconductors
Original
Abstract: Package outline DFN1010B-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body: 1.1 x 1.0 x 0.37 mm pin 1 index area SOT1216 visible depend upon used manufacturing technology (6x) e e b (6x) 1 2 3 L (6x) E1 (2x) E D 6 A1 e1 A 0 A A1 b D D1 4 D1 (2x) e1 1 mm scale Dimensions (mm are the original dimensions) Unit 5 E E1 e e1 L 0.15 1.05 0.32 0.95 0.22 min 0.34 0.125 NXP Semiconductors
Original

SOD962

Abstract: DFN1410-6 mechanical robustness 6-8 Pins DFN1010B-6 (SOT1202) 1.0 x 1.0 x 0.35 DFN1010-6 (SOT891) 1.0 x
-
Original
DFN1608D-2 DFN1006B-3 DFN1410-6 DFN1712-8 DFN2626-10 SOD962 SOT1157 DFN1006 DSN0603-2 DFN1006D-2 DFN1006-2 DFN1006-3
Abstract: Reflow soldering footprint Footprint information for reflow soldering of DFN1010B-6 package SOT1216 0.9 0.35 0.35 0.15 0.2 (6x) 0.15 0.35 0.5 1.2 0.6 0.35 1.3 0.25 0.25 1.1 0.3 (6x) 1 1.35 solder land solder land plus solder paste occupied area solder resist Dimensions in mm Issue date www.nxp.com 12-11-23 13-03-06 © 2010 NXP B.V. sot1216_fr All rights reserved. Reproduction in whole or in part is prohibited without prior consent of NXP Semiconductors
Original
Abstract: ) > 8 Pins 1.0 x 1.0 x 0.33 DFN1010B-6 (SOT1216) 1.0 x 1.0 x 0.37 WLCSP9* 1.16 x 1.16 x NXP Semiconductors
Original
DFN2020-3 DFN1010C-4 LFPAK33 LFPAK56D DFN1010E-6 DFN2020

sot663 sot23

Abstract: WLCSP24 4.9 x 3.95 x 1.0 6/8 Pins SOT1202 (DFN1010B-6) 1.0 x 1.0 x 0.35 SOT891 (DFN1010-6) 1.0 x
-
Original
WLCSP24 sot663 sot23 SOT886 DFN5050 SOD-128 sot1194 DFN2020MD-6 DFN2020-6 DFN3333-8 DFN1714U-8 WLCSP16 DFN2110-9

NX3008NBKMB

Abstract: DFN1010D-3 and DFN1010B-6: } #7;#7; x 1.0 x 0.37 mm 1.1 } #7;#7; Single die, with heatsink and dual die, with , a 1 x 1 mm package The first double bipolar transistors in DFN1010B-6 offering tremendous package , DFN1010B-6 (SOT1202) 1.0 x 1.0 x 0.33 DFN1010E-6 (SOD882D) 1.0 x 0.6 x 0.37 (SOD962) 0.6 x
NXP Semiconductors
Original
NX3008NBKMB PESD18VF1BL PESD24VF1BL PESD18VF1BSF PESD24VF1BSF DSN0603 DFN2520

circuit diagram wireless spy camera

Abstract: 3267 tsop6 mm outline  Only 0.3 mm height DFN1010E-6 (SOT1202) / DFN1006B-3 (SOT883B) DFN1010B-6 , DFN1010E-6 (SOT1202) (SOT891) 1.0 x 1.0 x 0.48 DFN1010B-6 DFN1410-6 (SOT1216) 1.1 x 1.0
NXP Semiconductors
Original
circuit diagram wireless spy camera 3267 tsop6 dual cc BAW62 CFP15 LFPAK56/56D OD323F PTVS16VP1UP PUSBM15VX4-TL PUMB20

NX3008NBKMB

Abstract: DFN1714U-8 (SOT1216) 1.0 x 1.0 x 0.37 DFN1010B-6 (SOD882D) 1.0 x 0.6 x 0.37 DFN1006D
NXP Semiconductors
Original
DFN4020 IP4369CX4 IP4303CX4 IP4282CZ6 PUSB3F96 DFN2510