NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: CuZn10 CTE mismatch! whisker! Sn deposit Cu6Sn5/Cu3Sn Cu based LF Morphology of the , Characteristics и Postbake results in double layer of Cu3Sn and Cu6Sn5 и The average layer thickness of the ... | Original |
19 pages, |
whisker Sn C19400 olin 7025 Olin-194 ST-300 Cu6Sn5 FeNi42 C18090 Cu3Sn olin 194 CuCrSiTi Atotech c14415 C18070 datasheet abstract |
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| Abstract: intermetallic compound (IMC) can be found between the Cu and SnCu. No Cu3Sn was detected, which indicates that , of Cu3Sn should have formed in between the Cu and Cu6Sn5 [1]. A brief review of Sn whisker growth , minutes forms both Cu6Sn5 and Cu3Sn at the interface between Sn and Cu. Since the Cu3Sn does not form ... | Original |
6 pages, |
sncu0.7 Cu6Sn5 Cu3Sn DE-AC03-76SF00098 datasheet abstract |
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| Abstract: intermetallic compound (IMC) can be found between the Cu and SnCu. No Cu3Sn was detected, which indicates that , of Cu3Sn should have formed in between the Cu and Cu6Sn5 [1]. Fig. 1: SEM image of Sn whiskers , heat-treatment of the leadframe at 100 to 150 °C for 10 to 30 minutes forms both Cu6Sn5 and Cu3Sn at the interface between Sn and Cu. Since the Cu3Sn does not form between Sn and Cu near room temperature, it is a ... | Original |
6 pages, |
Cu6Sn5 sncu0.7 Cu3Sn datasheet abstract |
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| Abstract: , for example, there will be layers of Cu3Sn, Cu6Sn5, and finally solder, on top of the Cu. The top layer of solder is easily solderable. normal too hot for too long solder Cu6Sn5 Cu3Sn Cu3Sn Cu Cu 001aac848 Fig 20. Overheating and Cu3Sn formation If, however, the pad is , layers will also be converted into Cu3Sn; in that case, there will only be the Cu3Sn intermetallic layer on top of the Cu. Unfortunately, Cu3Sn is hardly wettable. As a result, it will become very ... | Original |
24 pages, |
SSOP20 J-STD-020D HVQFN48 Cu6Sn5 Cu3Sn AN10365 AN10365 abstract |
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| Abstract: of Cu boards, for example, there will be layers of Cu3Sn, Cu6Sn5, and finally solder, on top of the , Cu3Sn Cu3Sn Cu Cu 001aac848 Fig 21. Overheating and Cu3Sn formation If, however, the , top two layers will also be converted into Cu3Sn; in that case, there will only be the Cu3Sn intermetallic layer on top of the Cu. Unfortunately, Cu3Sn is hardly wettable. As a result, it will become very ... | Original |
26 pages, |
SSOP20 Solder Paste, Indium, Type 3 HVQFN48 Cu3Sn AN10365 AN10365 abstract |
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| Abstract: converted into Cu3Sn. In this case there will only be the Cu3Sn intermetallic layer on top of the Cu. Unfortunately, Cu3Sn is hardly wettable, as a result, it will become very difficult to solder the replacement , , there will be layers of Cu3Sn, Cu6Sn5 and finally solder, on top of the Cu. The top layer of solder is , description normal too hot for too long solder Cu6Sn5 Cu3Sn Cu3Sn Cu Cu 001aac848 Fig 22. Overheating and Cu3Sn formation If however, the pad is heated too much during removal of ... | Original |
29 pages, |
7450 AOI Solder Paste, Indium, Type 3 HVQFN48 J-STD-020D SSOP20 ipc 610 non-wetting Cu3Sn J-STD-033b.1 JEDEC J-STD-033b JEDEC J-STD-033b.1 SSOP20 LAND PATTERN AN10365 ipc 610D AN10365 abstract |
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| Abstract: the case of Cu boards, for example, there will be layers of Cu3Sn, Cu6Sn5, and finally solder, on top , Cu6Sn5 Cu3Sn Cu3Sn Cu Cu 001aac848 Fig 21. Overheating and Cu3Sn formation If , preparation, the top two layers will also be converted into Cu3Sn; in that case, there will only be the Cu3Sn intermetallic layer on top of the Cu. Unfortunately, Cu3Sn is hardly wettable. As a result, it will become very ... | Original |
26 pages, |
SSOP20 Solder Paste, Indium 5.1, Type 3 HVQFN48 Cu3Sn Solder Paste, Indium, Type 3 AN10365 AN10365 abstract |
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| Abstract: AN10896 AN10896 Mounting and Soldering of RF transistors Rev. 01 - 17 May 2010 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP's RF transistor packages AN10896 AN10896 NXP Semiconductors Mounting and Soldering of RF transistors Revision history Rev Date Description 01 Initial release 20100517 Contact information For additio ... | Original |
49 pages, |
J-STD-020D HVQFN48 finger print sensor pcb with circuit AN10896 ipc 610D heller 1700 AN10896 abstract |
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| Abstract: two layers will also be converted into Cu3Sn. In this case there will only be the Cu3Sn intermetallic layer on top of the Cu. Unfortunately, Cu3Sn is hardly wettable, as a result, it will become very , of Cu3Sn, Cu6Sn5 and finally solder, on top of the Cu. The top layer of solder is easily soldered. , AN10365 AN10365 Surface mount reflow soldering description normal solder Cu6Sn5 Cu3Sn too hot for too long Cu3Sn Cu Cu 001aac848 Fig 25. Overheating and Cu3Sn formation If however, the pad is ... | Original |
31 pages, |
Cu3Sn AN10365 AN10365 abstract |
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| Abstract: diffusion at this increased temperature a much more regular intermetallic layer, consisting of Cu3Sn and ... | Original |
6 pages, |
whisker Cu6Sn5 CuSn0,15 FeNi42 leadframe Cu C7025 C7025 c14415 Cu3Sn leadframe C7025 C18070 leadframe materials C19400 ALLOY leadframe C7025 ALLOY leadframe C7025 material property D-93009 C19400 D-93009 abstract |
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| Abstract: NT Features PL IA *R oH S CO M Applications Radial leaded devices Aids compliance with: - ITU-T K.20/21/45 - Telcordia GR-1089-CORE GR-1089-CORE - UL 60950, 3rd Ed. Narrow resistance tolerance RoHS compliant* Agency recognition: Used as a secondary overcurrent protection device in: Customer Premise Equipment (CPE) Central Office (CO) Access equipment CMF-RL Series - Telecom CPTC Resettable Fuses Electrical Characteristics Rated Voltage V ... | Original |
2 pages, |
GR-1089-CORE datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
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| solder Cu 3 Sn adjacent to the copper Intermetallic growth of www.datasheetarchive.com/files/intel/design/quality/icstor~1/interm~1-v1.htm |
Intel | 31/10/1998 | 3.42 Kb | HTM | interm~1-v1.htm |
| solder Cu 3 Sn adjacent to the copper Intermetallic growth of www.datasheetarchive.com/files/intel/design/quality/icstor~1/interm~1-v2.htm |
Intel | 01/08/1998 | 3.41 Kb | HTM | interm~1-v2.htm |
| solder Cu 3 Sn adjacent to the copper Intermetallic growth of www.datasheetarchive.com/files/intel/design/quality/icstor~1/interm~1.htm |
Intel | 30/04/1998 | 3.41 Kb | HTM | interm~1.htm |
| solder Cu 3 Sn adjacent to the copper Intermetallic growth of www.datasheetarchive.com/files/intel/design/quality/icstor~1/interm~1-v3.htm |
Intel | 01/02/1999 | 3.4 Kb | HTM | interm~1-v3.htm |
| solder Cu 3 Sn adjacent to the copper Intermetallic growth of www.datasheetarchive.com/files/intel/products one/design/quality/icstor~1/interm~1.htm |
Intel | 01/05/1999 | 3.4 Kb | HTM | interm~1.htm |