Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 8200pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: Solder Coated SnPb; Body Dimensions: 0.180" x 0.050" x 0.055" Container: Bag; Features: MIL-PRF-55681: R Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 8200pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: Solder Coated SnPb; Body Dimensions: 0.180" x 0.050" x 0.055" Container: Bag; Features: MIL-PRF-55681: S Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 8200pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.180" x 0.050" x 0.055" Container: Bag; Features: MIL-PRF-55681: M Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 8200pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.180" x 0.050" x 0.055" Container: Bag; Features: MIL-PRF-55681: R Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 8200pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.180" x 0.050" x 0.055" Container: Bag; Features: MIL-PRF-55681: S Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 8200pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: Base Metalization - Barrier Metal - 100% Tin; Body Dimensions: 0.180" x 0.050" x 0.055" Container: Bag; Features: MIL-PRF-55681: M Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 8200pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: Base Metalization - Barrier Metal - 100% Tin; Body Dimensions: 0.180" x 0.050" x 0.055" Container: Bag; Features: MIL-PRF-55681: R Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 8200pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: Base Metalization - Barrier Metal - 100% Tin; Body Dimensions: 0.180" x 0.050" x 0.055" Container: Bag; Features: MIL-PRF-55681: S Failure Rate