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BGA432

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Abstract: Package outline BGA432: plastic ball grid array package; 432 balls; body 35 x 35 x 1.75 mm B A E1 D ball A1 index area SOT952-1 E D1 A A2 A1 detail X e1 e AF AD AB Y V T P M K H F D B âv âw b 1/2 e M M C C A B C y y1 C AE AC AA e W U R e2 N L 1/2 e J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25 shape 2 4 6 8 10 12 14 16 18 20 22 24 26 optional (4×) X 0 10 20 mm scale NXP Semiconductors
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MS-034 GA432
Abstract: , PQFP240, BGA352 PQFP208, PQFP240, BGA432 PQFP240, BGA432 PQFP240 BGA560 BGA560 BGA560 16 AMI Semiconductor
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PQFP208 lattice ZyMOS AMI 602 United Technologies Mostek PQFP160 XILINX MOSTEK ROM GA00011 CX3/00
Abstract: Group HQFP-240, 304, BGA-432 T = 121C; 2 atm. sat. steam XC4062XL Period: XC4000XL April 1 Xilinx
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XC2018 PC84 XC1765D XC4020 HQFP208 HQFP34 xc4300 XC4005E PHYSICAL PQ100 PQ120 PQFP-100 MQFP-208 PPGA-175 PQ160
Abstract: receiver in the BGA432 package with long (5 ns) transmission lines. Voltages are measured at the on-die Xilinx
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XAPP233 XAPP230 XAPP232 CAT16-LV4F12 CAT16-PT4F4 CK311 X23310 APP233
Abstract: receiver in the BGA432 package with long (5 ns) transmission lines. Voltages are measured at the on-die Xilinx
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cc8cled
Abstract: D Package Code: BGA432B C See BGA pattern code to the right for actual pattern layout Y 0.025" dia. pad .0225 dia. tooling holes (X2) non plated (optional) 38.1mm X 1.27mm [0.050"] Top View (reference only) 2 9.119mm 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 1.27mm 9.169mm 38.1mm B 1 Top View: Recommended Target PCB layout Scale: 2:1 3 Side View (reference only) 1 Note: SMT foot is independent of actual BGA package thickness -
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XC95XXXL XC95XXX A9903 C17S XCV1000E FG xc9536 XC17XXX PLCC-20 XC17256D XC4005XL PQFP-160 PLCC-84
Abstract: A BGA CHIP PACKAGE SPECIFICATIONS Ironwood Package Code BGA432A3 BGA432A4 BGA432A5 BGA432B1 BGA432C1 BGA432C2 BGA436A1 BGA440A1 BGA441A1 BGA441B1 BGA444A1 BGA448A1 BGA448A2 , BGA432A1 BGA432A2 * PLEASE Pin Array Count Size 384 22X22 384 28X28 384 20X20 384 22X22 Digital Signal Processing Architectures
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DSP24 radix-8 FFT yswa 24PORTB 64 point radix 4 FFT CI23 DR17 DSP24-Y-100-C 432-L DSPA-DSP24DS
Abstract: BGA400F1 BGA413A BGA420B1 BGA432A1 BGA432A2 BGA432A3 BGA432A4 BGA432A5 BGA432B BGA432B1 BGA432B1 Digital Signal Processing Architectures
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dsp24s radix1024 A28AD br09 DR01
Abstract: Package outline BGA432: plastic ball grid array package; 432 balls; body 35 x 35 x 1.75 mm B A E1 D ball A1 index area SOT952-1 E D1 A A2 A1 detail X e1 e AF AD AB Y V T P M K H F D B âv âw b 1/2 e M M C C A B C y y1 C AE AC AA e W U R e2 N L 1/2 e J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25 shape 2 4 6 8 10 12 14 16 18 20 22 24 26 optional (4×) X 0 10 20 mm scale MSA Components
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he804 ati connector HE809 smd diode ED MMSD32032602S-C-xx he807 eurofarad TCN30
Abstract: Group HQFP-240, 304, BGA-432 T = 121C; 2 atm. sat. steam XC4062XL Period: XC4000XL April 1 Ironwood Electronics
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31X31 SF-BGA432B-B-11 BGA 31X31 PCB DRAWING FR4/G10