NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| LS-BGA208A-05 | Ironwood Electronics | BGA-05 Thru Hole Adapters for GHz Sockets; Top Pitch (mm): 1.27; IC Size X (mm): 23; IC Size Y (mm): 23; IC Array X: 17; IC Array Y: 17; Compatible Part 1: SG-BGA-6024; Compatible Part 2: N/A; Compatible Part 3: N/A; Compatible Part 4: N/A; Compatible Part 5: N/A; Part Description: GHz Socket SMT Adapter; | 
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| LS-BGA208C-41 | Ironwood Electronics | BGA-01 Land Socket Adapters (Male); Top Package Code: 208C; Bottom Package Code: 208C; Top Pitch (mm): 1; Bottom Pitch (mm): 1; Top Pin Count: 208; Bottom Pin Count: 208; Top Array Size: 16 x 16; Bottom Array Size: 16 x 16; Top Interface: SMT Lands; Bottom Interface: Machined Pins; Compatible Part 1: SF-BGA208C-B-42; Part Description: BGA Land Socket; |
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| LS-BGA208A-31 | Ironwood Electronics | BGA-01 Land Socket Adapters (Male); Top Package Code: 208A; Bottom Package Code: 208A; Top Pitch (mm): 1.27; Bottom Pitch (mm): 1.27; Top Pin Count: 208; Bottom Pin Count: 208; Top Array Size: 17 x 17; Bottom Array Size: 17 x 17; Top Interface: SMT Lands; Bottom Interface: Machined Pins; Compatible Part 1: SF-BGA208A-B-32; Part Description: BGA Male SMT Foot -- LIF; |
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| SF-BGA208A-B-05 | Ironwood Electronics | GHz Socket SMT Adapter; Top Pitch (mm): 1.27; IC Size X (mm): 23; IC Size Y (mm): 23; IC Array X: 17; IC Array Y: 17; Compatible Part 1: SG-BGA-6024; Compatible Part 2: N/A; Compatible Part 3: N/A; Compatible Part 4: N/A; Part Description: GHz Socket SMT Adapter; |
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| SF-BGA208B-B-11 | Ironwood Electronics | Surface Mount Feet: BGA (Male); Part Description: BallOnPinFoot; Top Pin Count: 208; Top Pitch (mm): 1.27; Top Array Size: 20 x 20; Compatible Part 1: SK-MGA20/208B-01; Bottom Package Code: BGA208B; |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA208: plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm SOT595-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 v M C A B b 1/2 e e y y1 C w M C T e R P N M L K J e2 H G 1/2 e F E D C B A 1 shape optional (4x) 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 X 0 5 10 mm scale ... | Original |
1 pages, |
MS-034 SOT-595 BGA208 package outline bga208 BGA208 abstract |
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| Abstract: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA208: plastic ball grid array package; 208 balls; body 17 x 17 x 1.20 mm SOT595-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X k k e1 b e C v M B w M y y1 C v M A T R e P N M L K J e1 H G F E D C B A 2 1 4 3 6 5 8 7 10 9 12 11 14 13 16 15 X 0 5 10 mm scale DIMENSIONS (mm are the original dimensions ... | Original |
1 pages, |
package outline bga208 bga208 BGA208 BGA208 abstract |
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| Abstract: is a single package solution in BGA208 (cost effective solution) embedding two chips, the secure , AT91SO50 AT91SO50 is available using the same package (BGA208) pin to pin compatible with the AT91SO51 AT91SO51 but without , 6514BS 6514BSSPD10 May 07 AT91SO100 AT91SO100 Figure 3. BGA208 (AT91SO50/51 AT91SO50/51) 5 6514BS 6514BSSPD10 May 07 Figure 4. ... | Original |
7 pages, |
SHA-256 AT83C26 AT91SO101 AES chips BGA208 hardware AES CRC-16 and CRC-32 hardware AES 256 controller ARM SC100 ARM SC100 7816 AES RSA chips AT91SO51 at91so100 AT91SO25 -SC100TM -SC100TM abstract |
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| Abstract: No Yes No BGA208 AT91SO50 AT91SO50 256K 32K 100K Yes 2.7-3.3V No No No BGA208 AT91SO25 AT91SO25 256K 32K 100K Yes 2.7-3.3V No No No BGA144 BGA144 www.atmel.com ... | Original |
2 pages, |
SHA-256 Cryptographic Accelerator ARM SC100 AT83C26 AT91S0 AT91SO AT91SO100 AT91SO101 AT91SO51 RSA 2048-bit SC100 AT91SO111 AES RSA chips AT91SO abstract |
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| Abstract: : EVTI not functional on QFP176 QFP176 and BGA208 packages , e8752 PS: Pad Ring: VDDEH1 and VDDEH6 I/O power segments shorted together in BGA208 and CSP496 CSP496 packages , e8431 PS: NEXUS: EVTI not functional on QFP176 QFP176 and BGA208 packages Description: Event In (EVTI) is , functionality is needed, CSP496 CSP496 package can also be used to emulate the 176QFP 176QFP or the BGA208 packages. e8715 , Functional problems e8752 PS: Pad Ring: VDDEH1 and VDDEH6 I/O power segments shorted together in BGA208 ... | Original |
25 pages, |
"microsecond bus" EmbAlgo LBGA208 LQFP144 LQFP176 NEXUS FLASH ERASE QFP176 SPC563M SPC563M64 ADC ARCHITECTURE RM0015 QFP-176 FlexCAN SPC563M64L5 SPC563M64L7 SPC563M64 SPC563M64 SPC563M64 abstract |
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| Abstract: Packages: TQFP100 TQFP100, T(P)QFP144 QFP144, BGA208 I Operating temperature range: -40 to 125°C I Mask ROM is ... | Original |
2 pages, |
180NM st bga208 ST10F273 ST10F276 ST10F252 ST10 ST10F2xx embflash ST10F296 ST10F275 832KB 832KB abstract |
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| Abstract: BGA208 (ball grid array) ASEKH Sn-Ag3.5 MSL3/260 MSL3/260 Currently available GEO SC1100 SC1100 , BGD368 BGD368 BGD368 BGD368 BGD368 BGD368 BGD368 BGD368 BGD368 BGD368 BGD368 BGD368 BGU396 BGU396 BGU396 BGU396 BGA208 BGA388 BGA388 BGA388 BGA388 BGU481 BGU481 BGU481 BGU481 ... | Original |
8 pages, |
AM79C973BVD/W SC1200Ufh-266 AM79C973BVD AU1550-333MBF AU1500-333MBC AGXD533 AGXD500EEXE0BD AM79C874VF AU1100-500MBD AGXD533AAXF0CC ElanSC520-133AD 8A AGXD533AAXF0TD AU1500-400MBD 2002/95/EC 2002/95/EC abstract |
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| Abstract: BGA208 packages . 6 1.5 e6865252 PDM , SPC563M64 SPC563M64 e8431 PS: NEXUS: EVTI not functional on QFP176 QFP176 and BGA208 packages Description: Event In , the BGA208 packages. e6865252 PDM : Pad Ring: Leakage if VDDE is greater than VDD33 VDD33 Description , Yes PS8431 PS8431 NEXUS: EVTI not functional on QFP176 QFP176 and BGA208 packages Yes Yes Yes Yes , : VDDEH1 and VDDEH6 I/O power segments shorted together in BGA208 and CSP496 CSP496 packages Yes Yes Yes ... | Original |
24 pages, |
BGA208 LQFP144 LQFP176 NEXUS FLASH ERASE PS4890 ps5060 PS5900 QFP176 SPC563M SPC563M64L5 ps4127 SPC563M64 RM0015 SPC563M64 abstract |
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| Abstract: Flash/12K RAM 100-pin TQFP 144-pin T(P)QFP Up to 832KB 832KB Flash I 128K QFP100 QFP100, 144/BGA208 ... | Original |
4 pages, |
TQFP100 Gasoline direct injection ST10 ST10F252 ST10F273 ST10F2xx ST10F276 st10 family 180NM ST10F296 ST10F275 datasheet abstract |
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| Abstract: the watchdog can be re-enabled. e9817PS : BGA208 package pinout is incorrect Description The , affect the connection of an external clock signal. When the device is in the BGA208 package it has the ... | Original |
18 pages, |
SPC563M NEXUS FLASH ERASE mpc560xb errata MPC5606S e7810 BGA208 00FF bga 208 PACKAGE linflex uart example MPC5606S0M25V MPC5606S0M25V abstract |
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| Abstract: Introduction to ispLSI ® 5000V Family User Selectable 3.3V/2.5V I/O SuperWIDE 68-Input/ 32-Macrocell Generic Logic Block for Optimum Performance 180MHz System Performance 5.0ns Pin-to-Pin Delay High Density (6,000-24,000 PLD Gates) Fine Pitch Ball Grid Array (fpBGA) Package Options Flexible, Easy-to-Use Architecture In-System Programmable 3.3V Power Supply Boundary Scan Test (IEEE 1149.1) The ispLSI 500 ... | Original |
3 pages, |
TQFP 144 PACKAGE lattice 5000VA 5256VA 5384VA 5384VE 5512VA 5kva bga 208 PACKAGE bga 388 e2cmos technology FPBGA 24.000 mhz datasheet abstract |
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| Abstract: R E A L W O R L D S I G N A L P R O C E S S I N G Connectivity Solutions: 1394 and USB 4Q 2003 1394 Integrated Devices Family/ Name iOHCI-Lynx iOHCI-Lynx iOHCI-Lynx iOHCI-Lynx Voltage (V) 3.3 3.3 3.3 3.3 TSB43CA42 TSB43CA42 iceLynx-Micro 3.3 up to 400 16.5 TSB43CA43A TSB43CA43A iceLynx-Micro 3.3 up to 400 16.5 TSB43CB43A TSB43CB43A iceLynx-Micro 3.3 up to 400 16.5 Part No. TSB43AA22 TSB43AA22 TSB43AB21A TSB43AB21A TSB43AB22A TSB43AB22A TSB43AB23 TSB43AB23 Data Rate (Mbp ... | Original |
3 pages, |
TSB12LV26 TL16C452 TSB12C01A TSB12LV01B TSB12LV21B LQFP 128 pin Socket TSB43AA22 TSB43AB21A TSB43AB22A TSB43AB23 TSB43CA42 TSB43CA43A RS-232 to i2c converter TSB43CB43A datasheet abstract |
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| Abstract: ST50160 ST50160 ADSL RESIDENTIAL COMBO GATEWAY PROCESSOR DATA BRIEF 1 GENERAL FEATURES Figure 1. Package WAN modem feature set Embedded ADSL transceiver ANSI T1.413, ITU G.dmt Annex A, B, C and Deutsche Telecom UR-2 compliant, splitterless ITU G.Lite Compatibility: MTC20174 MTC20174, ADSL front end, 7th generation, integrated line driver, DCXO 1.1 Session Control PPPoE point to point protocol over Ethernet PPPoA point to point protocol over ATM PPPoA relay via PPP session c ... | Original |
18 pages, |
ST50160PF d 1680 PRUW08DGZ PRDW08DGZ MTC20174 generation scan codes LBGA208 C184 mtc-20174 RFC2684 BD 669 circuit diagram of wifi wireless router relay ras 1210 ST50160 ST50160 ST50160 abstract |
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| Abstract: Product Bulletin April 1999 #PB1108 PB1108 Lattice Completes Release of SuperFASTTM 3.3V ispLSI® 2000VE 2000VE Family Introduction Lattice Semiconductor has completed the release of its 3.3V SuperFAST ispLSI 2000VE 2000VE Family with the introduction of the ispLSI 2064VE 2064VE, 2096VE 2096VE and 2192VE 2192VE. These three family members follow the previously released ispLSI 2032VE 2032VE and 2128VE 2128VE, which have been available since the beginning of the year. The ispLSI 2000VE 2000VE Family provides industryleading performance suppor ... | Original |
2 pages, |
2192VE 2128VE 2096VE 2064VE 2032VE 100BGA PB1108 2000VE PB1108 abstract |
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| Abstract: Product Bulletin December 1998 #PB1106 PB1106 Lattice Releases The World's Fastest 3.3-Volt High-Density ISPTM PLDs Introduction Lattice Semiconductor has just released a new family of true 3.3-volt high-density programmable logic devices that combine both high performance and low voltage operation. The new ispLSI 2000VE 2000VE devices are based on the advanced architecture of Lattice's recently TM released SuperFAST ispLSI 2000E 2000E family, making them the world's fastest low-voltage programmab ... | Original |
2 pages, |
2192VE 2128VE 2064VE 2032VE 49-BGA PB1106 PB1106 abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| PQFP-208 PQFP-208 PQFP-208 PQFP-208, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 PQFP-208 PQFP-208 PQFP-208 PQFP-208, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 TQFP-128 TQFP-128 TQFP-128 TQFP-128, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 TQFP-128 TQFP-128 TQFP-128 TQFP-128, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 ) 10 PQFP-208 PQFP-208 PQFP-208 PQFP-208, fp BGA-208 www.datasheetarchive.com/files/idt/docs/rp00000/rp000e1.htm |
IDT | 06/10/2000 | 60.92 Kb | HTM | rp000e1.htm |
| Packages SOT595-1 ; plastic ball grid array package; 208 balls; body 17 x 17 x 1.20 mm SOT595-1 BGA208 plastic ball grid array package; 208 balls; body 17 x 17 x 1.20 mm 00-03-04 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot595-1-v1.html |
Philips | 05/02/2002 | 4.96 Kb | HTML | sot595-1-v1.html |
| Packages Information on package SOT595-1 plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm Outline drawing Package version Package name Package description Drawing issue date SOT595-1 BGA208 plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm 1/24/2003 General package information Soldering www.datasheetarchive.com/files/philips/packages/sot595-1-v2.html |
Philips | 16/06/2005 | 1.9 Kb | HTML | sot595-1-v2.html |
| Packages Information on package SOT595-1 plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm Outline drawing Package version Package name Package description Drawing issue date SOT595-1 BGA208 plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm 03-01-24 General package information Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot595-1.html |
Philips | 24/04/2003 | 1.8 Kb | HTML | sot595-1.html |
| .8-1.2 Yes Yes 182 Mini-BGA, 208 Sparse MiniBGA 182 Mini-BGA~,~208 Sparse Mini Yes 0.8-1.2 0.8-1.2 Yes Yes 182 Mini-BGA, 208 Sparse MiniBGA 182 Mini-BGA~,~208 Sparse MiniBGA ADSP-BF537 ADSP-BF537 ADSP-BF537 ADSP-BF537 ADSP-BF537 ADSP-BF537 ADSP-BF537 ADSP-BF537 http .8-1.2 Yes Yes 182 Mini-BGA, 208 Sparse MiniBGA 182 Mini-BGA~,~208 Sparse Mini 176 LQFP 176 LQFP 182 Mini-BGA 182 Mini-BGA 208 Sparse MiniBGA 208 Sparse www.datasheetarchive.com/download/91891688-29665ZC/31-v1.xml |
Analog Devices | 12/04/2005 | 23.01 Kb | XML | 31-v1.xml |
| (JEDEC) 144E (IEC) 2003-01-22 SOT595-1 BGA208 plastic ball grid array package; 208 www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/array/zzz_other/bga.html |
Philips | 15/04/2003 | 19.35 Kb | HTML | bga.html |
| -03-04 SOT595-1 BGA208 plastic ball grid array package; 208 balls; body 17 x 17 x 1.20 mm www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/array/zzz_other/bga-v1.html |
Philips | 05/02/2002 | 17.92 Kb | HTML | bga-v1.html |
| - (EIAJ) MS-034 MS-034 MS-034 MS-034 (JEDEC) 144E (IEC) 1/22/2003 - SOT595-1 BGA208 plastic ball grid www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/array/zzz_other/bga-v2.html |
Philips | 16/06/2005 | 24.32 Kb | HTML | bga-v2.html |
| -1999 Package options: 44-pin PLCC; 100-pin and 144-pin TQFP; 352-pin BGA; 208-pin PQFP; 48-pin www.datasheetarchive.com/files/xilinx/docs/rp0006e/rp06ebc.htm |
Xilinx | 29/02/2000 | 8.74 Kb | HTM | rp06ebc.htm |
| 208-pin LQFP 256 mBGA 208-pin LQFP 256 m 208-pin LQFP 256 mBGA 208-pin LQFP 256 m www.datasheetarchive.com/files/intel/design/strong/sa1100-v1.htm |
Intel | 03/02/1999 | 26.91 Kb | HTM | sa1100-v1.htm |