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BGA208

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Abstract: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA208: plastic ball grid array package; 208 balls; body 17 x 17 x 1.20 mm SOT595-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X k k e1 b e C v M B w M y y1 C v M A T R e P N M L K J e1 H G F E D C B A 2 1 4 3 6 5 8 7 10 9 12 11 14 13 16 15 X 0 5 10 mm scale DIMENSIONS (mm are the original dimensions ... Original
datasheet

1 pages,
28.64 Kb

sot595 package outline bga208 bga208 BGA208 BGA208 abstract
datasheet frame
Abstract: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA208: plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm SOT595-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 v M C A B b 1/2 e e y y1 C w M C T e R P N M L K J e2 H G 1/2 e F E D C B A 1 shape optional (4x) 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 X 0 5 10 mm scale ... Original
datasheet

1 pages,
19.23 Kb

MS-034 BGA208 SOT-595 package outline bga208 BGA208 abstract
datasheet frame
Abstract: is a single package solution in BGA208 (cost effective solution) embedding two chips, the secure , AT91SO50 AT91SO50 is available using the same package (BGA208) pin to pin compatible with the AT91SO51 AT91SO51 but without , 6514BS 6514BS­SPD­10 May 07 AT91SO100 AT91SO100 Figure 3. BGA208 (AT91SO50/51 AT91SO50/51) 5 6514BS 6514BS­SPD­10 May 07 Figure 4. ... Original
datasheet

7 pages,
280.46 Kb

SHA-256 ARM SC100 Architecture AT83C26 AT91SO101 AES chips BGA208 hardware AES hardware AES 256 controller CRC-16 and CRC-32 ARM SC100 7816 ARM SC100 AES RSA chips AT91SO51 -SC100TM -SC100TM abstract
datasheet frame
Abstract: No Yes No BGA208 AT91SO50 AT91SO50 256K 32K 100K Yes 2.7-3.3V No No No BGA208 AT91SO25 AT91SO25 256K 32K 100K Yes 2.7-3.3V No No No BGA144 BGA144 www.atmel.com ... Original
datasheet

2 pages,
333.63 Kb

AT91SO AT91SO100 AT91SO101 AT91S0 AT83C26 ARM SC100 AT91SO51 pci ped SC100 RSA 2048-bit AT91SO110 SHA-256 Cryptographic Accelerator AT90SO AT91SO25 AT91SO abstract
datasheet frame
Abstract: : EVTI not functional on QFP176 QFP176 and BGA208 packages , e8752 PS: Pad Ring: VDDEH1 and VDDEH6 I/O power segments shorted together in BGA208 and CSP496 CSP496 packages , e8431 PS: NEXUS: EVTI not functional on QFP176 QFP176 and BGA208 packages Description: Event In (EVTI) is , functionality is needed, CSP496 CSP496 package can also be used to emulate the 176QFP 176QFP or the BGA208 packages. e8715 , Functional problems e8752 PS: Pad Ring: VDDEH1 and VDDEH6 I/O power segments shorted together in BGA208 ... Original
datasheet

25 pages,
176.39 Kb

"microsecond bus" LQFP176 QFP176 LQFP144 LBGA208 SPC563M SPC563M64 ADC ARCHITECTURE EmbAlgo NEXUS FLASH ERASE FlexCAN QFP-176 RM0015 SPC563M64L5 SPC563M64L7 SPC563M64 SPC563M64 SPC563M64 abstract
datasheet frame
Abstract: Packages: TQFP100 TQFP100, T(P)QFP144 QFP144, BGA208 I Operating temperature range: -40 to 125°C I Mask ROM is ... Original
datasheet

2 pages,
65.94 Kb

180NM st bga208 ST10F273 ST10F276 ST10F252 ST10 ST10F2xx embflash ST10F296 ST10F275 832KB 832KB abstract
datasheet frame
Abstract: BGA208 (ball grid array) ASEKH Sn-Ag3.5 MSL3/260 MSL3/260 Currently available GEO SC1100 SC1100 , BGD368 BGD368 BGD368 BGD368 BGD368 BGD368 BGD368 BGD368 BGD368 BGD368 BGD368 BGD368 BGU396 BGU396 BGU396 BGU396 BGA208 BGA388 BGA388 BGA388 BGA388 BGU481 BGU481 BGU481 BGU481 ... Original
datasheet

8 pages,
55.32 Kb

AU1100 AU1550-333MBF ELANSC520-100AF AGXD500EEXE0BD AM79C973BVD AU1100-500MBD AU1100-333MBD AGXD533AAXF0CC AM79C874VF ElanSC520-133AD 8A AU1500-400MBD AGXD533AAXF0TD AU1100-333MBF ElanSC520-133AD 2002/95/EC 2002/95/EC abstract
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Abstract: BGA208 packages . 6 1.5 e6865252 PDM , SPC563M64 SPC563M64 e8431 PS: NEXUS: EVTI not functional on QFP176 QFP176 and BGA208 packages Description: Event In , the BGA208 packages. e6865252 PDM : Pad Ring: Leakage if VDDE is greater than VDD33 VDD33 Description , Yes PS8431 PS8431 NEXUS: EVTI not functional on QFP176 QFP176 and BGA208 packages Yes Yes Yes Yes , : VDDEH1 and VDDEH6 I/O power segments shorted together in BGA208 and CSP496 CSP496 packages Yes Yes Yes ... Original
datasheet

24 pages,
143.18 Kb

BGA208 LQFP144 LQFP176 NEXUS FLASH ERASE PS4890 ps5060 PS5900 PS8715 QFP176 SPC563M SPC563M64L5 ps4127 SPC563M64 RM0015 SPC563M64 abstract
datasheet frame
Abstract: Flash/12K RAM 100-pin TQFP 144-pin T(P)QFP Up to 832KB 832KB Flash I 128K QFP100 QFP100, 144/BGA208 ... Original
datasheet

4 pages,
796.65 Kb

TQFP100 Electrohydraulic Power Steering Gasoline direct injection ST10 ST10F252 st10f271 ST10F272 ST10F2xx ST10R271 ST10F273 ST10F251 st10 family 180NM datasheet abstract
datasheet frame
Abstract: the watchdog can be re-enabled. e9817PS : BGA208 package pinout is incorrect Description The , affect the connection of an external clock signal. When the device is in the BGA208 package it has the ... Original
datasheet

16 pages,
33.72 Kb

NEXUS FLASH ERASE MPC5606S LINFBRR BGA208 bga 208 PACKAGE MPC5606S1M25V MPC5606S1M25V abstract
datasheet frame
Abstract: Managed Switches PACKET PROCESSING AND SWITCHING/ETHERNET SWITCHING VOICE/DATA Part # Full Wire Speed Packet Forwarding Million Packets per Second (typical) 10/100Mbps 1Gbps Features IEEE 802.1S per VLAN Spanning Tree* IEEE 802.1d Spanning Tree Algorithm* Private VLAN Edge (Protected Ports) Packaging IEEE 802.3ad Link Aggregation (Port Trunking) IP Multicast Switching (IGMP Snooping)* Layer 2 CoS using VLAN Tag (IEEE 802.1p) Layer 3 CoS using DS/TOS Field in IP Header Layer ... Original
datasheet

1 pages,
46.2 Kb

datasheet abstract
datasheet frame
Abstract: Unmanaged Switches PACKET PROCESSING AND SWITCHING/ETHERNET SWITCHING VOICE/DATA Part # Full Wire Speed Packet Forwarding Million Packets per Second (typical) Features 10/100Mbps 1Gbps PCS Block with TBI Interface (Optical Fibre) Layer 2 CoS using VLAN Tag (IEEE 802.1p) Layer 3 CoS using DS/TOS Field in IP Header Packaging Layer 4 CoS using logical port in UDP/TCP Header Ethernet Maximum Frame Size Serial Interface (GPSI/7WS) MII (10/100Mbps) Interface Supported MAC ... Original
datasheet

1 pages,
41 Kb

ZL50415 datasheet abstract
datasheet frame
Abstract: Com m ercial/Industrial D ev ice s PLCC 44 68 84 PQFP 100 144 160 208 240 RQFP VQFP TQFP BGA 208 240 80 100 144 176 225 272 313 329 84 100 132/133 175/176 207 257 CPGA CQFP 84 132 172 196 208 256 HiRel/Space D evice RadTolerant < o o 5 (A x CM CO ... OCR Scan
datasheet

2 pages,
522.35 Kb

datasheet abstract
datasheet frame
Abstract: Macro-Embedded Type Cell Arrays CE51 Series Features High integration: Maximum 753,768 BCs (on chip) High speed: Gate delay time: 210 ps (High-Speed type: 2-input NAND f/o=2 standard load) Input level: LVTTL, 3V-CMOS, Mixed 3V/5V, and high-speed I/O Supply voltage: +3.3 V±0.3 V (standard specifications), +5.0 V ± 0.5 V (standard specifications) Junction temperature range: 0°C to +100°C (standard specifications) High drive capability: I o l = 2mA/4mA/8mA/12mA/24mA mixable Output buffer cells ... OCR Scan
datasheet

1 pages,
54.24 Kb

datasheet abstract
datasheet frame
Abstract: Introduction to ispLSI ® 5000V Family User Selectable 3.3V/2.5V I/O SuperWIDE 68-Input/ 32-Macrocell Generic Logic Block for Optimum Performance 180MHz System Performance 5.0ns Pin-to-Pin Delay High Density (6,000-24,000 PLD Gates) Fine Pitch Ball Grid Array (fpBGA) Package Options Flexible, Easy-to-Use Architecture In-System Programmable 3.3V Power Supply Boundary Scan Test (IEEE 1149.1) The ispLSI 500 ... Original
datasheet

3 pages,
30.56 Kb

TQFP 144 PACKAGE lattice 32-Macrocell 5000VA 5256VA 5384VA 5384VE 5512VA 5kva bga 208 PACKAGE bga 388 e2cmos technology FPBGA 24.000 mhz datasheet abstract
datasheet frame
Abstract: R E A L W O R L D S I G N A L P R O C E S S I N G Connectivity Solutions: 1394 and USB 4Q 2003 1394 Integrated Devices Family/ Name iOHCI-Lynx iOHCI-Lynx iOHCI-Lynx iOHCI-Lynx Voltage (V) 3.3 3.3 3.3 3.3 TSB43CA42 TSB43CA42 iceLynx-Micro 3.3 up to 400 16.5 TSB43CA43A TSB43CA43A iceLynx-Micro 3.3 up to 400 16.5 TSB43CB43A TSB43CB43A iceLynx-Micro 3.3 up to 400 16.5 Part No. TSB43AA22 TSB43AA22 TSB43AB21A TSB43AB21A TSB43AB22A TSB43AB22A TSB43AB23 TSB43AB23 Data Rate (Mbp ... Original
datasheet

3 pages,
44.28 Kb

TSB12LV21B RS-232 to i2c converter SMARTCARD directv TL16C452 TSB12C01A TSB12LV01B 21152AB TSB12LV26 TSB43AA22 TSB43AB21A TSB43AB22A TSB43AB23 TSB43CA42 datasheet abstract
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PQFP-208 PQFP-208 PQFP-208 PQFP-208, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 PQFP-208 PQFP-208 PQFP-208 PQFP-208, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 TQFP-128 TQFP-128 TQFP-128 TQFP-128, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 TQFP-128 TQFP-128 TQFP-128 TQFP-128, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 ) 10 PQFP-208 PQFP-208 PQFP-208 PQFP-208, fp BGA-208
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IDT 27/06/2001 56.59 Kb HTM rp001b5.htm
PQFP-208 PQFP-208 PQFP-208 PQFP-208, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 PQFP-208 PQFP-208 PQFP-208 PQFP-208, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 TQFP-128 TQFP-128 TQFP-128 TQFP-128, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 TQFP-128 TQFP-128 TQFP-128 TQFP-128, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 ) 10 PQFP-208 PQFP-208 PQFP-208 PQFP-208, fp BGA-208
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PQFP-208 PQFP-208 PQFP-208 PQFP-208, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 PQFP-208 PQFP-208 PQFP-208 PQFP-208, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 TQFP-128 TQFP-128 TQFP-128 TQFP-128, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 TQFP-128 TQFP-128 TQFP-128 TQFP-128, fp BGA-208, BGA-256 BGA-256 BGA-256 BGA-256 ) 10 PQFP-208 PQFP-208 PQFP-208 PQFP-208, fp BGA-208
www.datasheetarchive.com/files/idt/docs/rp00000/rp000e1.htm
IDT 06/10/2000 60.92 Kb HTM rp000e1.htm
SOT595-1 ; plastic ball grid array package; 208 balls; body 17 x 17 x 1.20 mm SOT595-1 BGA208 plastic ball grid array package; 208 balls; body 17 x 17 x 1.20 mm 00-03-04 Soldering Information Thermal considerations
www.datasheetarchive.com/files/philips/packages/sot595-1-v1.html
Philips 05/02/2002 4.96 Kb HTML sot595-1-v1.html
Information on package SOT595-1 plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm Outline drawing Package version Package name Package description Drawing issue date SOT595-1 BGA208 plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm 03-01-24 General package information Soldering Information Thermal considerations
www.datasheetarchive.com/files/philips/packages/sot595-1.html
Philips 24/04/2003 1.8 Kb HTML sot595-1.html
Information on package SOT595-1 plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm Outline drawing Package version Package name Package description Drawing issue date SOT595-1 BGA208 plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm 1/24/2003 General package information Soldering Information Thermal considerations
www.datasheetarchive.com/files/philips/packages/sot595-1-v2.html
Philips 16/06/2005 1.9 Kb HTML sot595-1-v2.html
BGA208 plastic ball grid array package; 208 balls; body 17 x 17 x 1.20 mm 2000-03-04
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Philips 05/02/2002 17.92 Kb HTML bga-v1.html
) 2003-01-22 SOT595-1 BGA208 plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm
www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/array/zzz_other/bga.html
Philips 15/04/2003 19.35 Kb HTML bga.html
) MS-034 MS-034 MS-034 MS-034 (JEDEC) 144E (IEC) 1/22/2003 - SOT595-1 BGA208 plastic ball grid array
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Philips 16/06/2005 24.32 Kb HTML bga-v2.html
Packages for ICs Ball grid array Package version Package name Package description Drawing issue date SOT472-1 BGA156 BGA156 BGA156 BGA156 plastic ball grid array package; 156 balls; body 15 x 15 x 1.15 mm 00-03-04 SOT595-1 BGA208 plastic ball grid array package; 208 balls; body 17 x 17 x 1.20 mm 00-03-04 SOT471-1 BGA256 BGA256 BGA256 BGA256 plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm 00-03-04 SOT466-1 BGA256 BGA256 BGA256 BGA256
www.datasheetarchive.com/files/philips/packages/ics.html
Philips 07/12/2000 77.35 Kb HTML ics.html