500 MILLION PARTS FROM 12000 MANUFACTURERS

Datasheet Archive - Datasheet Search Engine

 

Direct from the Manufacturer

Part Manufacturer Description PDF Samples Ordering
SN65220YZBT Texas Instruments 60W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, GREEN, BGA-4 pdf Buy
SN65220YZBR Texas Instruments 60W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, GREEN, BGA-4 pdf Buy
TMS320C5502ZZZR300 Texas Instruments TMS320C55 201-BGA MICROSTAR pdf Buy

BGA L

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: 48BAL 48BAL.L ß BGA 48BALL 48BALL « BGA 48BALL 48BALL ß BGA 48BALL 48BALL ß BGA 48BALL 48BALL ß BGA 48BALL 48BALL M BGA 48BALL 48BALL ß BGA 48BALL 48BALL ß BGA , SM A LL TSOP-I 32PJN 32PJN SM ALL TSOP-I 32P1N 32P1N SM A L L TSOP-I 32PIN 32PIN TSOP-I 32PIN 32PIN TSOP-I 32PIN 32PIN TSOP-i(R , ) 32PIN 32PIN TSOP-I 32PIN 32PIN TSOP-I 32PIN 32PIN TSOP-I(R) 32P1N 32P1N TSOP-I(R) 32PIN 32PIN SM A L L TSOP-I 32PIN 32PIN SM ALL TSOP-i 32PIN 32PIN SM ALL TSOP-I(R) 32P!N SM A L L TSOP-I(R) 32PIN 32PIN TSOP-I 32PIN 32PIN TSOP-I 32P1N 32P1N TSOP-I(R) 32PIN 32PIN TSOP-I(R) 32PIN 32PIN SM ALL TSOP-I 32PIN 32PIN SM ALL TSOP-I 32P1N 32P1N SM ALL TSOP-I(R) 32PIN 32PIN SM A L L TSOP-I(R) 32PIN 32PIN TSOP-I ... OCR Scan
datasheet

6 pages,
355.6 Kb

HY62U256 HY62U16100LLR2-I 8s100 HY6264AP HY6264ALP HY6264ALLP HY6264AJ HY6264ALJ HY6264ALLJ HY6264ALP-I HY6264ALLP-I HY6264ALJ-I HY6264ALLJ-1 HY62256AP HY62256ALP HY62256ALLP HY62256AJ HY62256ALJ HY62256ALLJ HY622S6AT1 HY62256ALT1 HY62256ALLT1 HY62256AR1 HY62256ALR1 HY62256ALLR1 TEXT
datasheet frame
Abstract: thin quad flat pack Power quad flat pack Ball-grid array FineLine BGATM Ultra FineLine BGA Notes to , PGA SOIC PQFP TQFP RQFP BGA FineLine BGA Ultra FineLine BGA Lead Material Alloy 42 Copper Alloy 42 , 7000B 7000B, MAX 7000AE 7000AE, MAX 7000A, and enhanced configuration devices are available in BGA, FineLine BGA and Ultra FineLine BGA packages. Table 2. Stratix Devices in BGA, FineLine BGA & Ultra FineLine BGA Packages Device EP1S10 EP1S10 Package Non-Thermally Enhanced Cavity Up Non-Thermally Enhanced FineLine BGA Thermally ... Altera
Original
datasheet

88 pages,
1915.59 Kb

MS-034 AAL-1 bga package weight BGA 144 192 BGA PACKAGE thermal resistance 208 pin rqfp drawing TEXT
datasheet frame
Abstract: , MAX 7000A, and enhanced configuration devices are available in BGA, FineLine BGA and Ultra FineLine BGA packages. Table 1. Cyclone Devices in BGA, FineLine BGA & Ultra FineLine BGA Packages Device Package Pins EP1C4 Non-Thermally Enhanced FineLine BGA 324 Non-Thermally Enhanced FineLine BGA 400 EP1C6 Non-Thermally Enhanced FineLine BGA 256 EP1C12 EP1C12 Non-Thermally Enhanced FineLine BGA 256 Non-Thermally Enhanced FineLine BGA 324 Non-Thermally Enhanced FineLine BGA ... Altera
Original
datasheet

135 pages,
2141.88 Kb

epm7032 plcc EP1C12 Altera pdip top mark 192 BGA PACKAGE thermal resistance BGA sumitomo 724p 240 pin rqfp drawing TEXT
datasheet frame
Abstract: Application Weight lbs. (grams) 37mm BGA 659-65AB 659-65AB L 1.45 (36.8) sq 0.650 (16.5) Notes: 1 , Weight lbs. (grams) 40mm BGA 40mm BGA 655-26AB 655-26AB L 1.600 (40.6) sq 0.260 (6.6) 0.125 (3.2 , ) Typical Application Weight lbs. (grams) 37mm BGA 660-29AB 660-29AB L 1.530SQ 530SQ. (38.9)SQ. 0.285 (7.2 , ) 642-60AB 642-60AB L 1.378 (35) Material: Aluminum, Black Anodized Typical Applications 35 mm BGA 35 mm BGA , INC. 132 Sykes Road Fall River, MA 02720 ISO 9001:2000 and QS 9000 REGISTERED BGA 2000 ... Wakefield Thermal Solutions
Original
datasheet

22 pages,
3175.43 Kb

618-100AB 622-80AB 643-35AP BERGQUIST softface bga package weight D10650 T411 Temecula T405 T412 T410 datasheet of BGAS 77AB 658-35AB D10650-40 Bergquist BP-108 Chomerics* T405 Wakefield Thermal Solutions TEXT
datasheet frame
Abstract: · Std. · L · Temperature Mark Blank V54C3128 V54C3128(16/80/40)4(BGA) Rev. 1.1 August 2001 , L L L H L L L L L L L H L L L L L L L V54C3128 V54C3128(16/80/40)4(BGA) CS RAS X H H H L L L L X H , H L L L L L L H L L L L L H L L L L V54C3128 V54C3128(16/80/40)4(BGA) CS RAS X H H H H L L L X H H , ) Self-Refresh6 V54C3128 V54C3128(16/80/40)4(BGA) CKE n-1 H L L L L L L H L L L L L L H H H H H H H H L CKE n X , MOSEL VITELIC V54C3128 V54C3128(16/80/40)4(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X ... Mosel Vitelic
Original
datasheet

45 pages,
369.26 Kb

V54C3128 TEXT
datasheet frame
Abstract: -ball mini BGA and 44-pin sTSOP (Type II) The IS S I IS62Ux12816 series is a low voltage, 131,072 words , IS62Ux12816 series is packaged in the 48-ball mini BGA and the 44-pin sTSOP (Type II). PRODUCT SERIES , IS62Ux12816 SERIES PIN CONFIGURATIONS 48-ball mini BGA (B) 1 2 3 44-pin sTSOP (Type II): (H) 4 , 41 □ OE AO C 5 40 □ UB c 6 39 □ l b i/oo E 7 38 □ 1/015 i/oi C , Disabled H X L L H X X H X H High-Z High-Z High-Z High-Z Icc, le d Read ... OCR Scan
datasheet

13 pages,
174.59 Kb

TEXT
datasheet frame
Abstract: V54C3128 V54C3128(16/80/40)4V(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4 , )4V(BGA) is a four bank Synchronous DRAM organized as 4 banks x 2Mbit x 16, 4 banks x 4Mbit x 8, or 4 banks x 8Mbit x 4. The V54C3128 V54C3128(16/80/40)4V(BGA) achieves high speed data transfer rates up to , Operating Temperature Range Package Outline B 6 7PC 7 8PC Std. L Temperature Mark 0°C to 70°C · · · · · · · Blank V54C3128 V54C3128(16/80/40)4V(BGA) Rev. 1.2 ... Mosel Vitelic
Original
datasheet

45 pages,
618.24 Kb

V54C3128 TEXT
datasheet frame
Abstract: operation and tri-state outputs · Industrial temperature available · Available in 48-ball mini BGA and 44 , series is packaged in the 48-ball mini BGA and the 44-pin sTSOP (Type II). PRODUCT SERIES OVERVIEW , IS62Ux6416 SERIES ® PIN CONFIGURATIONS 48-ball mini BGA (B) 1 2 3 44-pin sTSOP (Type II): (H , Selected Output Disabled Read Write CE OE LB UB X X H X H H H L L L Mode H X L L L L L L L L X X H X L L L X X X X H X H L H L L H L X H ... Integrated Silicon Solution
Original
datasheet

13 pages,
83.34 Kb

transistor mini A6 sl 100b A6 transistor mini TEXT
datasheet frame
Abstract: in 48-ball mini BGA and 44-pin sTSOP (Type II) The ISSI IS62Ux12816 series is a low voltage, 131 , Lower Byte (LB) access. The IS62Ux12816 series is packaged in the 48-ball mini BGA and the 44 , CONFIGURATIONS 48-ball mini BGA (B) 1 2 3 44-pin sTSOP (Type II): (H) 4 5 1 6 A LB , Write CE OE LB UB X X H X H H H L L L Mode H X L L L L L L L L X X H X L L L X X X X H X H L H L L H L X H X H H L L H L L I/O ... Integrated Silicon Solution
Original
datasheet

13 pages,
83.42 Kb

transistor mini A6 IS62UR12816SL-55BI A6 transistor mini SL 100B TEXT
datasheet frame
Abstract: L = SnAgCu for BGA (RoHS Compliant) Asynchronous: Fast Page and EDO Speed (clock cycle time) C = , Blank = SnPb L = Lead-free (RoHS Compliant) Package Code B, B1, B2, B3 = BGA CT = Copper TSOP H = , BGA(165) Prod P,SC 256Kx18 IS61LPS25618A IS61LPS25618A 128Kx36 IS61VPS12836A IS61VPS12836A 2.5V 2.5V 250,200 2.6,3.1 PBGA(119),TQFP(100) Prod P,SC 256Kx18 IS61VPS25618A IS61VPS25618A BGA(165) 128Kx36 IS61LPD12836A IS61LPD12836A 3.3V 2.5V/3.3V 250 2.6 PBGA(119),TQFP(100) Prod P,DC 256Kx18 IS61LPD25618A IS61LPD25618A BGA(165 ... Integrated Silicon Solution
Original
datasheet

16 pages,
2698.2 Kb

IS43R32800B IS42RM32800D IS41C16257C 4mx32 SRAM 16M High-speed ISSI is62c1024al IS66WVE2M16BLL tsop ddr2 ram TSOP2-44 IS42SM16400G is61c5128 IS66WVE4M16ALL is61wv51216 is45vs16160d IS43DR16640A IS66WVE4M16BLL is66wve2m16 IS43LR16320B is62c51216al TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
Ball Grid Array (BGA) "L-28pin"       Leadless Chip Carrier (LeadlessCC) "L ) Thickness (in) 28 L L 0.050 0.212
/datasheets/files/idt/docs/rp00018/rp018fa.htm
IDT 06/10/2000 44.79 Kb HTM rp018fa.htm
Ball Grid Array (BGA) "L-20pin"       Leadless Chip Carrier (LeadlessCC) "L ) Thickness (in) 20 L L 0.050 0.129
/datasheets/files/idt/docs/rp00017/rp01767.htm
IDT 06/10/2000 44.71 Kb HTM rp01767.htm
Ball Grid Array (BGA) "L-48pin"       Leadless Chip Carrier (LeadlessCC) "L-48pin" Pin Code Pin-Pitch ) Thickness (in) 48 L
/datasheets/files/idt/docs/rp00017/rp017bd.htm
IDT 06/10/2000 43.83 Kb HTM rp017bd.htm
cale P ackage L BGA technologie chip on board (COB) BGA flip-chip, Wafer Bumping   lastic L eaded C hip C arrier LCC L eadless C hip C arrier P ack L QFP
/datasheets/files/em-microelectronics/asicentrum/cz_01_01_07.html
EM Microelectronics 17/09/2002 83.83 Kb HTML cz_01_01_07.html
Please Note: PDN98004 PDN98004 for the XC1718D/L device and the                     PCN95010b for the XC1700D/L device family. PRODUCT DESCRIPTION ADAPTER P/N SCHEMATIC 0380417     XC1765D/L     XC1765E/EL XC1765E/EL(X)         8 PIN DIP       20 PIN PLCC       0380417 0380417     XC17128D/L     XC17128E/EL XC17128E/EL(X)   0380417     XC17256D/L     XC17256E/EL XC17256E/EL(X)         8 PIN DIP       20 PIN PLCC    
/datasheets/files/xilinx/docs/rp00006/rp0061a.htm
Xilinx 29/02/2000 25.36 Kb HTM rp0061a.htm
Family and Compatible FPGAs   XC1718D/L XC1736D/L XCl 765D/L XC17128D/L XCl 7256D/L XC31OOA/L XC312OA/L XC313OA/L XC3164A/L XC3195A XC3195A   XC40OOE/L   XC3142A/L XC319OA/L         XC4003E XC4003E XC4005E/L XC4008E XC4008E       XC4006E XC4006E XC4010E/L         XC4013E/L XC4000EX/XL XC4000EX/XL         ALL XC5200 XC5200     XC5202 XC5202 XC5204 XC5204 XC5210 XC5210     PQFP TQFP VQFP CQFP BGA Standard JEDEC EIAJ EIAJ EIAJ EIAJ JEDEC JEDEC
/datasheets/files/xilinx/weblinx/tour/spromtbl.htm
Xilinx 07/01/1997 8.19 Kb HTM spromtbl.htm
DIP14-P-300-2 DIP14-P-300-2.54,38351-2,1996/12/11,DIP,Yes
/datasheets/files/oki/english/packages/pkglist.txt
OKI 28/01/2000 6.29 Kb TXT pkglist.txt
0380417 XC1765D/L XC1765E/X XC1765E/X 8 PIN DIP 20 PIN PLCC 8 PIN SO/VOIC 0380417 XC17128D/L XC17128E/X XC17128E/X 8 PIN DIP 20 PIN PLCC 8 PIN SO/VOIC 0380417 XC17256D/L XC17256E/X XC17256E/X 8 PIN DIP 20 PIN PLCC 8 PIN SO/VOIC 0380417 XC1701/L XC17512L XC17512L 8 PIN DIP 20 PIN PLCC 20 PIN SOIC HW-137-DIP8 HW-137-DIP8 PQFP 144 PIN PGA 160 PIN PQFP 225 PIN BGA HW-133-PC84 HW-133-PC84 HW-133-PQ100 HW-133-PQ100 HW-133-PG144 HW-133-PG144
/datasheets/files/xilinx/docs/wcd0000d/wcd00dde-v1.htm
Xilinx 17/07/1998 15.82 Kb HTM wcd00dde-v1.htm
XC1700 XC1700 Device Adapters Please Note: PDN98004 PDN98004 for the XC1718D/L device and the                       PCN95010b for the XC1700D/L device family. PRODUCT DESCRIPTION 0380417 0380417     XC1765D/L     XC1765E/EL XC1765E/EL(X)     0380417     XC17128D/L     XC17128E/EL XC17128E/EL(X)         8 PIN DIP       20 PIN PLCC     0380417 0380417     XC17256D/L     XC17256E/EL XC17256E/EL(X)  
/datasheets/files/xilinx/docs/wcd00010/wcd010a2.htm
Xilinx 16/02/1999 21.38 Kb HTM wcd010a2.htm
bibliography of articles which provide a good overview of BGA technology. BGA Technology Q: Why has BGA technology come to the forefront all of a sudden? A: Due to fundamental limitations of recently? A: Until 1993, the only BGA assembly was in captive assembly houses. With JEDEC registration in of the space savings for system users become more evident, BGA packaging will catch on. Q: How does a cross-sectional view of a BGA look? A: Figure attached. BGA Sectional View
/datasheets/files/intel/design/i960/packdata/2451-v3.htm
Intel 30/04/1998 12.09 Kb HTM 2451-v3.htm