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Part Manufacturer Description PDF Samples Ordering
SN65220YZBT Texas Instruments 60W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, GREEN, BGA-4 pdf Buy
SN65220YZBR Texas Instruments 60W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, GREEN, BGA-4 pdf Buy
TMS320C5502ZZZR300 Texas Instruments TMS320C55 201-BGA MICROSTAR pdf Buy

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Part Manufacturer Description Last Check Distributor Ordering
BGA 231L7 E6327 Infineon Technologies RF Amplifier RF SI (Sep 2016) Mouser Electronics Buy
BGA 231N7 E6327 Infineon Technologies RF Amplifier Silicon RF Receiver MMIC from $0.2920 (Aug 2016) Mouser Electronics Buy
BGA 231N7 E6330 Infineon Technologies RF Amplifier RF SILICON MMIC from $0.2920 (Sep 2016) Mouser Electronics Buy
BGA 312 E6327 Siemens - 2,859 (Sep 2016) Chip One Exchange Buy
BGA 318 E6327 Siemens - 3,500 (Sep 2016) Chip One Exchange Buy
BGA 416 E6327 Infineon Technologies AMP RF CASCODE 6V 20MA SOT-143 3,698 from $0.4157 (Sep 2016) Digi-Key Buy
BGA 416 E6327 Infineon Technologies RF AMP, 14DB, 3GHZ, 5V, SOT-143-4 2,886 from $0.51 (Sep 2016) element14 Asia-Pacific Buy
BGA 416 E6327 Infineon Technologies - 2,901 from £0.3540 (Sep 2016) Farnell element14 Buy
BGA 416 E6327 Infineon Technologies RF Amplifier RF Cascode Amplifier 5.5mA 3V 1,885 from $0.3160 (Sep 2016) Mouser Electronics Buy
BGA 416 E6327 Infineon Technologies RF AMP, 14DB, 3GHZ, 5V, SOT-143-4; Frequency Min:0Hz; Frequency Max:3GHz; Gain:14dB; Noise Figure Typ:1.6dB; RF IC Case Style:SOT-143; No. of Pins:4Pins; Supply Voltage Min:2.5V; Supply Voltage Max:5V; Operating Temperature ;RoHS Compliant: Yes 2,886 from $0.4740 (Sep 2016) Newark element14 Buy
BGA 420 E6327 Infineon Technologies RF Amplifier Cascadable MMIC Amplifier (Sep 2016) Mouser Electronics Buy
BGA 420 E6433 Infineon Technologies RF Amplifier Si-MMIC-Amp in SIEGET 25-Technology (Sep 2016) Mouser Electronics Buy
BGA 420 H6327 Infineon RF Amp Chip Single GP 3GHz 6V 4-Pin(3+Tab) SOT-343 T/R (Alt: BGA 420 H6327) from $0.2978 (Sep 2016) Avnet Buy
BGA 420 H6327 Infineon Technologies RF Amp Chip Single GP 3GHz 6V 4-Pin(3+Tab) SOT-343 T/R (Alt: BGA 420 H6327) from $0.2978 (Sep 2016) Avnet Buy
BGA 420 H6327 Infineon Technologies MMIC AMP, 13DB, 100MHZ-3GHZ, SOT-343-4 1,792 from $0.36 (Sep 2016) element14 Asia-Pacific Buy
BGA 420 H6327 Infineon Technologies MMIC AMP, 13DB, 100MHZ-3GHZ, SOT-343-4 1,792 from £0.3240 (Sep 2016) Farnell element14 Buy
BGA 420 H6327 Infineon Technologies RF Amplifier RF SI MMIC-Amp SIEGET 25 Tech 7,905 from $0.28 (Sep 2016) Mouser Electronics Buy
BGA 420 H6327 Infineon Technologies MMIC AMP, 13DB, 100MHZ-3GHZ, SOT-343-4; Frequency Min:100MHz; Frequency Max:3GHz; Gain:13dB; Noise Figure Typ:2.3dB; RF IC Case Style:SOT-343; No. of Pins:4Pins; Supply Voltage Min:-; Supply Voltage Max:6V; Operating Temperature ;RoHS Compliant: Yes 1,792 from $0.42 (Sep 2016) Newark element14 Buy
BGA 427 E6327 Infineon Technologies - 7,232 (Aug 2016) Chip One Exchange Buy
BGA 427 E6327 Infineon Technologies RF Amplifier Cascadable MMIC Amplifier (Sep 2016) Mouser Electronics Buy

BGA and QFP Package Datasheet

Part Manufacturer Description PDF Type Ordering
BGA and QFP Package Altera CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices
ri

2 pages,
12.81 Kb

Original Buy
datasheet frame

BGA and QFP Package

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: J-lead, quad flat pack (QFP), and ball-grid array (BGA)-including FineLine BGATM-packaging are now , , QFP, and BGA packages and ensure easier soldering. This application note discusses the following , Devices Handling J-Lead and QFP Devices Transferring devices between tubes Transferring QFP and BGA devices without carriers between trays Dry-packing J-lead, QFP, and BGA devices Shipping J-lead, QFP, and BGA devices in boxes To protect device leads and ensure proper operation, J-lead and QFP ... Altera
Original
datasheet

16 pages,
225.79 Kb

bga trays exposed QFP 144 MIL-D-3464 BGA and QFP Altera Package mounting ITW Camtex strapack AQ-7 MIL-B-81705C ND07071 QFP Shipping Trays PEAK TRAY bga velcro straps PQFP 176 J-Lead s-669 strapping machine camtex trays CAMTEX MIL-I-8835A strapack Sivaron S 669 strapack d-52 strapack s-669 TEXT
datasheet frame
Abstract: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN , that use surface-mount J-Lead, QFP, BGA, FBGA, and lidless BGA are now common on boards because they , Between Tubes” on page 13 ■ “Transferring QFP, BGA, FBGA, and Lidless FBGA Devices Without Carriers Between Trays” on page 13 ■ “Dry Packing J-Lead, QFP, BGA, FBGA, and Lidless BGA Devices” on page 14 ■ “Shipping J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices in Boxes” on ... Altera
Original
datasheet

20 pages,
721.84 Kb

daewon tray DAEWON JEDEC TRAY DAEWON FBGA AN-071-5 TEXT
datasheet frame
Abstract: DataSource CD-ROM Q1-02 Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel Reflow Soldering Process Sockets Component Mass (Weight) by Package Type Package BF957 BF957 BG225 BG225 BG256 BG256 BG352 BG352 BG432 BG432 BG492 BG492 BG560 BG560 BG575 BG575 BG728 BG728 CB100 CB100 , (0.8 pitch) CSP 280 BGA - 16mm (0.8 pitch) .300 Cerdip Package 896 BallL - Flip Chip BGA 31 X 31mm Body ... Xilinx
Original
datasheet

3 pages,
50.05 Kb

PGA package weight mo 83 MO-151-AAJ-1 MO-151-AAN-1 MO-151-BAU MO-83-AH mo151 OBG0036 MS-034 AAF-1 MS-034 AAL-1 OBG0009 OPD0002 MO-047 MO-113-AA-AD Q1-02 MS-034-AAU-1 Q1-02 BGA 31 x 31 mm Q1-02 MO-151 AAL-1 Q1-02 MS-034 1152 BGA Q1-02 ak 957 Q1-02 MS-034-AAn-1 Q1-02 Q1-02 Q1-02 TEXT
datasheet frame
Abstract: patented technology can be applied to cover a wide range of package types and footprints; BGA and PGA can , complexity and higher I/O counts have pushed older technology like Quad Flat Pack packages (QFP) to the , , high density packages, such as Ball Grid Array (BGA), that are ultimately more cost effective and , , however, the only options to accommodate device transition from QFP to BGA were to re-spin boards or purchase a custom package conversion adapter A robust alternative has been developed for using BGA ... Advanced Interconnections
Original
datasheet

2 pages,
995.33 Kb

TEXT
datasheet frame
Abstract: packaging. INTRODUCTION The purpose of this document is to provide a centralized listing of package thermal characteristics (Junction-toAmbient and Junction-to-Case). This listing is not specific to individual devices sold by Analog Devices; it is representative of typical values for a given package and , -88; the test Table I. Package Leads JA JC Board Type Layers Comments BGA 225 , correct for that specific device and reflects any thermal enhancements that have been made in the ... Analog Devices
Original
datasheet

5 pages,
55.89 Kb

TSSOP 16 jc G38-87 G42-88 QFP-128 20 x 14 pad SOT23 JEDEC standard SOT23-6 1152 BGA 144 LQFP-64 thermal pad BGA-64 pad exposed QFP 128 CQFP 240 exposed QFP 144 LQFP-48 thermal pad TEXT
datasheet frame
Abstract: BGA 51 (million units/month) Mpcs/M QFP 39 the interposer, and these balls interface a , shows a comparison example between a QFP and BGA. As shown, the BGA is 20% smaller than the QFP but , package. 2. Two types of BGA packages Figure 4 shows the relation between the number of pins and body , package family, PBGA and TBGA NEC offers two types of BGA packages depending on the base materials used , single-layer model of this type of BGA package is of the face-up mounting type and has excellent cost ... Original
datasheet

7 pages,
419.36 Kb

without underfill of BGA Staggered Pins package of BGA Staggered pins BGA PACKAGE thermal resistance 60um BGA Ball Crack 35 x 35 PBGA, 580 100 balls TEXT
datasheet frame
Abstract: +10% • JEDEC 100-Pin QFP, 119-pin BGA, and 165-pin BGA packages • Automotive temperature , -6.5B3 IS61LF25618A-7 IS61LF25618A-7.5TQ IS61LF25618A-7 IS61LF25618A-7.5B2 IS61LF25618A-7 IS61LF25618A-7.5B3 Package 100 QFP 119 BGA 165 BGA 100 QFP , -7.5B2I IS61LF25618A-7 IS61LF25618A-7.5B3I Package 100 QFP 119 BGA 165 BGA 100 QFP 100 QFP, Lead-free 119 BGA 165 BGA , -7.5TQA3 Package 100 QFP 100 QFP, Lead-free 100 QFP 165 BGA, Lead-free 100 QFP , Package IS61VF12836A-6 IS61VF12836A-6.5TQI 100 QFP IS61VF12836A-6 IS61VF12836A-6.5B2I 119 BGA IS61VF12836A-6 IS61VF12836A-6.5B3I 165 BGA ... Integrated Silicon Solution
Original
datasheet

25 pages,
516.25 Kb

LF12832A IS64VF12832A LF12836A VF12836A LF25618A VF25618A TEXT
datasheet frame
Abstract: Capabilities · 0.3mm to 1.27mm pitch · 2x3mm to 50x50mm device · BGA, QFN, QFP, SOIC · 3000 pin count · , 50x50mm device · BGA, LGA, QFN, QFP, SOIC · 5000 pin count · Heat sink options · Easy chip replacement , 2x3mm to 50x50mm device · BGA, LGA, QFN, QFP, SOIC · 5000 pin count · Heat sink options · Easy chip , BGA, QFN, QFP, SOIC BGA, LGA, QFN, QFP, SOIC BGA, QFN, LGA LGA, QFN BGA, LGA, QFN, QFP , ) Capabilities · 0.5mm to 1.27mm pitch · 2x3mm to 50x50mm device · BGA, LGA, QFN, QFP, SOIC · 2000 pin count ... Ironwood Electronics
Original
datasheet

10 pages,
1634.67 Kb

CLAMSHELL qfp 100 SOCKET 0.3mm pitch package bga 8 soic pcb footprint BGA and QFP Package material for chip resistors bga socket 0.3mm pitch BGA particle QFP 0.3mm pitch BGA and QFP Package mounting QFP lead pitch 0.3mm TEXT
datasheet frame
Abstract: % VPS: Vdd 2.5V + 5%, Vddq 2.5V + 5% • JEDEC 100-Pin QFP, 119-ball and 165-ball BGA packages â , )LPS12836A LPS12836A IS61(64)VPS12836A VPS12836A IS61(64)LPS25618A LPS25618A IS61(64)VPS25618A VPS25618A 119 BGA PACKAGE PIN CONFIGURATION 128K , )LPS12836A LPS12836A IS61(64)VPS12836A VPS12836A IS61(64)LPS25618A LPS25618A IS61(64)VPS25618A VPS25618A 119 BGA PACKAGE PIN CONFIGURATION 256Kx18 , )LPS25618A LPS25618A IS61(64)VPS25618A VPS25618A 165 BGA PACKAGE PIN CONFIGURATION 128K x 36 (TOP VIEW) 1 2 3 4 , )LPS12836A LPS12836A IS61(64)VPS12836A VPS12836A IS61(64)LPS25618A LPS25618A IS61(64)VPS25618A VPS25618A 165 BGA PACKAGE PIN CONFIGURATION 256K x ... Integrated Silicon Solution
Original
datasheet

26 pages,
495.19 Kb

LPS12832A LPS12836A VPS12836A LPS25618A VPS25618A TEXT
datasheet frame
Abstract: Actel provides simple step-by-step assembly flow instructions for attaching QFP and BGA sockets to , footprint as the BGA package, and the Adapter/Socket Module has the same overall size as the BGA package. - PCB layout is the same for the BGA package and the surface mount socket. Figure 2 BGAPackage , the BGA adapter module that has already been soldered to the package and plug it into the surface , as the BGA package. It is placed and reflowed onto the PCB in the same way as the BGA package. - The ... Actel
Original
datasheet

6 pages,
101.36 Kb

reflow soldering profile BGA BGA313 FBGA-484 TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
, DESKTOP, 4 EACH. QFP $26.64 FW82452GX FW82452GX BGA PACKAGE OMC DATA PATH, SERVER BGA $110.90 Distributor S82453KX S82453KX SQFP PACKAGE OMC DRAM CONT., DESKTOP QFP $77.31 FW82454GX FW82454GX BGA PACKAGE, PCI BRIDGE SERVER BGA $248.34 S82454GX S82454GX PCI BRIDGE, SERVER SQFP PACKAGE QFP 82374 : EISA SYSTEM COMPONENT S82374EB S82374EB QFP PACKAGE ORDER S Z867, A-2 STEP QFP $25.70 82375 : PCI TO EISA BRIDGE S82375EB S82375EB QFP PACKAGE, PCI TO EISA BRIDGE
/datasheets/files/intel/products/design/pricelst/ccom2.htm
Intel 23/10/1996 7.65 Kb HTM ccom2.htm
S82451KX S82451KX SQFP PACKAGE, MEMORY INTERFACE, MIC, DESKTOP, 4 EACH. QFP $26.64 FW82452GX FW82452GX BGA QFP Contact Local Distributor FW82452KX FW82452KX SU029 SU029 BGA PACKAGE OMC DATA PATH, DESKTOP BGA DRAM CONT., DESKTOP QFP $77.31 FW82454GX FW82454GX BGA PACKAGE, PCI BRIDGE SERVER BGA $248.34 S82374EB S82374EB QFP PACKAGE ORDER S Z867, A-2 STEP QFP $25.70 82375 : PCI TO EISA BRIDGE S82375EB S82375EB QFP PACKAGE, PCI TO EISA BRIDGE, A-2 STEP, SZ865 SZ865 QFP $32.55 82379 : SYSTEM I/O FOR
/datasheets/files/intel/design/pricelst/ccom2.htm
Intel 31/01/1997 6.76 Kb HTM ccom2.htm
minimizing heating of PCB and BGA. Q: Are there any package performance comparisons between a PGA, BGA and a QFP? A: Please refer to the table provided: Various Factors PGA QFP BGA wirebonding technology and pad pitch, PQFP/TQFP package option has run into a roadblock at pin count of 256 balls and decreasing the pitch slightly. Q: With regards to manufacturing, what does BGA buy me? techniques in BGA rework/repair? A: With QFPs, rework and inspection becomes more difficult as the pitch
/datasheets/files/intel/design/i960/packdata/2451-v3.htm
Intel 30/04/1998 12.09 Kb HTM 2451-v3.htm
minimizing heating of PCB and BGA. Q: Are there any package performance comparisons between a PGA, BGA and a QFP? A: Please refer to the table provided: Various Factors PGA QFP BGA wirebonding technology and pad pitch, PQFP/TQFP package option has run into a roadblock at pin count of 256 balls and decreasing the pitch slightly. Q: With regards to manufacturing, what does BGA buy me? techniques in BGA rework/repair? A: With QFPs, rework and inspection becomes more difficult as the pitch
/datasheets/files/intel/design/i960/packdata/2451.htm
Intel 03/08/1997 11.27 Kb HTM 2451.htm
postions for QFP and SO packages Package Type Pitch typical examples of pin postions for QFP and SO packages Test and Burn-In, Series Overview   Overview - Test and Burn-In - Production Use - Connectors - Wireless Communication - Cables - Package Type Pitch (mm) Pin count Series Description PS
/datasheets/files/yamaichi/tb/tb_serie.htm
Yamaichi 28/10/2003 57.5 Kb HTM tb_serie.htm
minimizing heating of PCB and BGA. Q: Are there any package performance comparisons between a PGA, BGA and a QFP? A: Please refer to the table provided: Various Factors PGA QFP BGA wirebonding technology and pad pitch, PQFP/TQFP package option has run into a roadblock at pin count of 256 balls and decreasing the pitch slightly. Q: With regards to manufacturing, what does BGA buy me? techniques in BGA rework/repair? A: With QFPs, rework and inspection becomes more difficult as the pitch
/datasheets/files/intel/design/i960/packdata/2451-v2.htm
Intel 31/10/1997 12.07 Kb HTM 2451-v2.htm
minimizing heating of PCB and BGA. Q: Are there any package performance comparisons between a PGA, BGA and a QFP? A: Please refer to the table provided: Various Factors PGA QFP wirebonding technology and pad pitch, PQFP/TQFP package option has run into a roadblock at pin count of 256 balls and decreasing the pitch slightly. Q: With regards to manufacturing, what does BGA buy me? techniques in BGA rework/repair? A: With QFPs, rework and inspection becomes more difficult as the pitch
/datasheets/files/intel/design/i960/packdata/2451-v4.htm
Intel 31/01/1997 11.84 Kb HTM 2451-v4.htm
minimizing heating of PCB and BGA. Q: Are there any package performance comparisons between a PGA, BGA and a QFP? A: Please refer to the table provided: Various Factors PGA QFP wirebonding technology and pad pitch, PQFP/TQFP package option has run into a roadblock at pin count of 256 balls and decreasing the pitch slightly. Q: With regards to manufacturing, what does BGA buy me? techniques in BGA rework/repair? A: With QFPs, rework and inspection becomes more difficult as the pitch
/datasheets/files/intel/products/design/i960/packdata/2451.htm
Intel 23/10/1996 11.94 Kb HTM 2451.htm
minimizing heating of PCB and BGA. Q: Are there any package performance comparisons between a PGA, BGA and a QFP? A: Please refer to the table provided: Various Factors PGA QFP BGA wirebonding technology and pad pitch, PQFP/TQFP package option has run into a roadblock at pin count of 256 balls and decreasing the pitch slightly. Q: With regards to manufacturing, what does BGA buy me? techniques in BGA rework/repair? A: With QFPs, rework and inspection becomes more difficult as the pitch
/datasheets/files/intel/design/i960/packdata/2451-v1.htm
Intel 10/02/1998 12.07 Kb HTM 2451-v1.htm
of two components: the 82439HX 82439HX System Controller in a 324 BGA package; and the 82371SB 82371SB PCI ISA IDE Accelerator (PIIX3) in a 208-pin PQFP. Use of BGA packaging permits OEMs and motherboard manufacturers to 208-pin QFP, two 82438VX 82438VX Data Path Units in 100-pin QFP packages, and the 82371SB 82371SB PCI ISA IDE Xcelerator (PIIX3) in a 208-pin QFP package. The Intel 430HX 430HX and 430VX 430VX PCIsets include a host-PCI bridge that Ball Grid Array (BGA) packaging, we're also delivering a higher level of integration and quality than
/datasheets/files/intel/products/design/pcisets/prodbref/pr430iib.htm
Intel 23/10/1996 12.56 Kb HTM pr430iib.htm