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Part Manufacturer Description Datasheet BUY
EP9312-IBZ Cirrus Logic RISC Microprocessor, 32-Bit, 184MHz, CMOS, PBGA352, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-352 visit Digikey
EP9312-CBZ Cirrus Logic RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA352, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-352 visit Digikey
WM8350GEB/V Cirrus Logic Consumer Circuit, CMOS, PBGA129, 7 X 7 MM, 0.94 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, MO-195, BGA-129 visit Digikey
WM8350GEB/RV Cirrus Logic Consumer Circuit, CMOS, PBGA129, 7 X 7 MM, 0.94 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, MO-195, BGA-129 visit Digikey
WM8310CGEB/V Cirrus Logic Microprocessor Circuit, CMOS, PBGA169, 7 X 7 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, BGA-169 visit Digikey
WM8310CGEB/RV Cirrus Logic Microprocessor Circuit, CMOS, PBGA169, 7 X 7 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, BGA-169 visit Digikey

BGA and QFP Package Datasheet

Part Manufacturer Description PDF Type
BGA and QFP Package Altera CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Original

BGA and QFP Package

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change , as an additional shipping tray for various BGA and QFP packaged devices. The new Daewon tray dimensions are comparable to the existing Peak trays and have been fully qualified by Altera. However, Daewon and Peak trays cannot be stacked together and should be handled separately. Each Altera shipping , products to ensure availability and sourcing flexibility. Products Affected: Table 1 ­ Package and Altera
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FBGA256 12C-0707-E19 12F-1111-119 12Y-3535-419 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga UBGA49 UBGA169/FBGA100 FBGA144 FBGA324 FBGA484
Abstract: Revisions in This Edition Page CHAPTER 1 APPENDIX Revised points (1) Fine-pitch BGA package mouning pad dimension examples are added. (1) Fine-pitch BGA package daisy-chain wiring diagrams are added. (2) Reworking conditions of BGA package are added. (3) PWB layout is added. 4 CONTENTS CHAPTER 1 1.1 , . 164 Reference Example of Reworking Conditions of BGA Package , expected that surface mount packages, such as QFP and SOP, which are more suitable for surface mounting NEC
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GE4F UPD65013 SMD BGA 672 DRAWING 74022a ULF-210R UPD74HC00 C10535EJ9V0IF00
Abstract: ) Fine-pitch BGA package mouning pad dimension examples are added. APPENDIX (1) Fine-pitch BGA package daisy-chain wiring diagrams are added. (2) Reworking conditions of BGA package are added. (3) PWB layout is , . 164 A.5 Reference Example of Reworking Conditions of BGA Package , expected that surface mount packages, such as QFP and SOP, which are more suitable for surface mounting , , are increasingly incorporating slimmer package, more pins, and finer pin pitch, and surface mount type NEC
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marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor
Abstract: Edition Page Chapter 1 Revised points (1) BGA package mounting pad dimension examples are added , . Appendix (1) BGA package daisy-chain wiring diagrams are added. (2) Plastic-BGA socket product , , but it is expected that surface mount packages, such as QFP and SOP, which are more suitable for , package, more pins, and finer pin pitch, and surface mount type semiconductor devices (SMDs) (surface , IC 75 Flip Chip 75 & CSP COB & TAB 50 50 SOP, TSOP & other SMT QFP 25 BGA 25 NEC
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M9627 uPC451g NIHON SMD MARKING codes PR-53365 SMD 6PIN IC MARKING CODE sealed relay ge mil 7451 C10535EJ8V0IF00
Abstract: J-lead, quad flat pack (QFP), and ball-grid array (BGA)-including FineLine BGATM-packaging are now , , QFP, and BGA packages and ensure easier soldering. This application note discusses the following , Devices Handling J-Lead and QFP Devices Transferring devices between tubes Transferring QFP and BGA devices without carriers between trays Dry-packing J-lead, QFP, and BGA devices Shipping J-lead, QFP, and BGA devices in boxes To protect device leads and ensure proper operation, J-lead and QFP Altera
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strapack s-669 Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX EIA/JEP113-A 800-EPLD
Abstract: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN , that use surface-mount J-Lead, QFP, BGA, FBGA, and lidless BGA are now common on boards because they , Between Tubesâ' on page 13 â  â'Transferring QFP, BGA, FBGA, and Lidless FBGA Devices Without Carriers Between Traysâ' on page 13 â  â'Dry Packing J-Lead, QFP, BGA, FBGA, and Lidless BGA Devicesâ' on page 14 â  â'Shipping J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices in Boxesâ' on Altera
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daewon tray 1F1-1717-AXX FBGA tray kostat e20-12214-00 1F1-1717-AXX DAEWON JEDEC TRAY DAEWON FBGA AN-071-5 E30-04766 S-699
Abstract: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel Reflow Soldering Process Sockets Component Mass (Weight) by Package Type Package BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 CB100 , (0.8 pitch) CSP 280 BGA - 16mm (0.8 pitch) .300 Cerdip Package 896 BallL - Flip Chip BGA 31 X 31mm Body Xilinx
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OPQ0010 OPQ0014 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MS-034-AAU-1 MO-151 AAL-1 CB164 CB196 CB228 CG1156 CS144 CS280
Abstract: patented technology can be applied to cover a wide range of package types and footprints; BGA and PGA can , complexity and higher I/O counts have pushed older technology like Quad Flat Pack packages (QFP) to the , , high density packages, such as Ball Grid Array (BGA), that are ultimately more cost effective and , , however, the only options to accommodate device transition from QFP to BGA were to re-spin boards or purchase a custom package conversion adapter A robust alternative has been developed for using BGA Advanced Interconnections
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Abstract: packaging. INTRODUCTION The purpose of this document is to provide a centralized listing of package thermal characteristics (Junction-toAmbient and Junction-to-Case). This listing is not specific to individual devices sold by Analog Devices; it is representative of typical values for a given package and , -88; the test Table I. Package Leads JA JC Board Type Layers Comments BGA 225 , correct for that specific device and reflects any thermal enhancements that have been made in the Analog Devices
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G38-87 G42-88 LQFP-48 thermal pad exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad
Abstract: BGA 51 (million units/month) Mpcs/M QFP 39 the interposer, and these balls interface a , shows a comparison example between a QFP and BGA. As shown, the BGA is 20% smaller than the QFP but , package. 2. Two types of BGA packages Figure 4 shows the relation between the number of pins and body , package family, PBGA and TBGA NEC offers two types of BGA packages depending on the base materials used , single-layer model of this type of BGA package is of the face-up mounting type and has excellent cost -
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35 x 35 PBGA, 580 100 balls BGA Ball Crack of BGA Staggered Pins package 60um BGA PACKAGE thermal resistance of BGA Staggered pins
Abstract: +10% â'¢ JEDEC 100-Pin QFP, 119-pin BGA, and 165-pin BGA packages â'¢ Automotive temperature , -6.5B3 IS61LF25618A-7.5TQ IS61LF25618A-7.5B2 IS61LF25618A-7.5B3 Package 100 QFP 119 BGA 165 BGA 100 QFP , -7.5B2I IS61LF25618A-7.5B3I Package 100 QFP 119 BGA 165 BGA 100 QFP 100 QFP, Lead-free 119 BGA 165 BGA , -7.5TQA3 Package 100 QFP 100 QFP, Lead-free 100 QFP 165 BGA, Lead-free 100 QFP , Package IS61VF12836A-6.5TQI 100 QFP IS61VF12836A-6.5B2I 119 BGA IS61VF12836A-6.5B3I 165 BGA Integrated Silicon Solution
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LF12832A IS64VF12832A LF12836A VF12836A LF25618A VF25618A
Abstract: Capabilities · 0.3mm to 1.27mm pitch · 2x3mm to 50x50mm device · BGA, QFN, QFP, SOIC · 3000 pin count · , 50x50mm device · BGA, LGA, QFN, QFP, SOIC · 5000 pin count · Heat sink options · Easy chip replacement , 2x3mm to 50x50mm device · BGA, LGA, QFN, QFP, SOIC · 5000 pin count · Heat sink options · Easy chip , BGA, QFN, QFP, SOIC BGA, LGA, QFN, QFP, SOIC BGA, QFN, LGA LGA, QFN BGA, LGA, QFN, QFP , ) Capabilities · 0.5mm to 1.27mm pitch · 2x3mm to 50x50mm device · BGA, LGA, QFN, QFP, SOIC · 2000 pin count Ironwood Electronics
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QFP lead pitch 0.3mm BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket ISO9001
Abstract: % VPS: Vdd 2.5V + 5%, Vddq 2.5V + 5% â'¢ JEDEC 100-Pin QFP, 119-ball and 165-ball BGA packages â , )LPS12836A IS61(64)VPS12836A IS61(64)LPS25618A IS61(64)VPS25618A 119 BGA PACKAGE PIN CONFIGURATION 128K , )LPS12836A IS61(64)VPS12836A IS61(64)LPS25618A IS61(64)VPS25618A 119 BGA PACKAGE PIN CONFIGURATION 256Kx18 , )LPS25618A IS61(64)VPS25618A 165 BGA PACKAGE PIN CONFIGURATION 128K x 36 (TOP VIEW) 1 2 3 4 , )LPS12836A IS61(64)VPS12836A IS61(64)LPS25618A IS61(64)VPS25618A 165 BGA PACKAGE PIN CONFIGURATION 256K x Integrated Silicon Solution
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LPS12832A 100-P S12836A LPS/VPS25618A IS61VPS12836A-250B2I IS61VPS12836A-250B3I
Abstract: Actel provides simple step-by-step assembly flow instructions for attaching QFP and BGA sockets to , footprint as the BGA package, and the Adapter/Socket Module has the same overall size as the BGA package. - PCB layout is the same for the BGA package and the surface mount socket. Figure 2 BGAPackage , the BGA adapter module that has already been soldered to the package and plug it into the surface , as the BGA package. It is placed and reflowed onto the PCB in the same way as the BGA package. - The Actel
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BGA313 reflow soldering profile BGA
Abstract: boundary scan Test Access Port (TAP) is only available in the BGA package. (The QFP package not available , Boundary Scan for BGA package â'¢ Power Supply LPS: Vdd 3.3V (+ 5%), Vddq 3.3V/2.5V (+ 5%) VPS: Vdd , -ball BGA, and 165ball BGA packages â'¢ Lead-free available Parameter Clock Access Time Cycle Time , /VVPS204818B 119 BGA PACKAGE PIN CONFIGURATION-1M x 36 (TOP VIEW) 1 2 3 4 5 6 7 A , )LPS102436B/IS61(64)VPS/VVPS102436B IS61(64)LPS204818B/IS61(64)VPS/VVPS204818B 119 BGA PACKAGE PIN Integrated Silicon Solution
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IS61LPS/VPS102436B IS64LPS102436B IS61LPS102432B IS61LPS/VPS204818B 200MH 166MH
Abstract: mount assembly processes. Any Actel FPGA can be utilized in an Extender design, and any package format including PLCC, QFP, BGA, and PGA, can be employed on both the top side (for FPGA) and bottom side (for , common footprints for ASICs and FPGAs are PGA, BGA, and QFP. The PGA pin format, with 0.100" pin pitch in , footprint use a modified BGA connection methodology. Extenders designed for the QFP package replacement have , number of pin/ball supports among the three major pin formats. Unlike PGA and BGA packages, the QFP only Actel
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ST FP BGA solder PQ208
Abstract: In-circuit testing of surface mount packages such as BGA, PLCC, QFP, and SOIC presents the challenge of , . Locate the package code in the following BGA components table and choose the parts from that row. Note , adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and , development systems. · · · · · · · · BGA and LGA Probing Systems . . . . . page PB.3 thru DIP , , and logic analyzer adapters consists of the following products: · BGA Probing Systems (Carrier Ironwood Electronics
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FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS CA-SO18A-Z-J-T-01 bga96 BGA165 SO8A FP-X2KPC68-01 FP-X2KPC84-01 FP-X3KPC84-01 FP-X3KPC84-02 FP-X3KPG132-01 FP-X3KPG175-01
Abstract: TSOP Higher pin count ZIP SSOP SVP Area array package QFP MCM TFBGA (CSP) BGA PGA TCP 1-3 TQFP TBGA Bare Chip HDD System Configuration and Package Evolution , ) QFP family 1000 BGA family 100 TFBGA (CSP) 20 1-6 SOP family 10 100 Pin count 1000 Package Mounting Height vs. Pin Count Maximum mounting height (mm) 4.0 QFP family , profile (1.7 mm) 1000 Package Weight Comparison 10 QFP 8 Weight (g) 6 4 DIP 168 Hitachi Semiconductor
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MCP Technology Trend tfBGA PACKAGE thermal resistance SC47D EIA and EIAJ standards EE13 jwg2 EE13 JWG
Abstract: boundary scan Test Access Port (TAP) in the BGA package only. (The QFP package not available.) This port , MODE for reduced-power standby â'¢ JTAG Boundary Scan for BGA package â'¢ Power Supply LPS: Vdd , -ball BGA, and 165ball BGA packages â'¢ Lead-free available JANUARY 2014 DESCRIPTION Theâ'' ISSI , IS61LPS51218A, IS61LPS25636A, IS61LPS25632A, IS64LPS25636A, IS61VPS51218A, IS61VPS25636A 119 BGA PACKAGE PIN , IS61LPS51218A, IS61LPS25636A, IS61LPS25632A, IS64LPS25636A, IS61VPS51218A, IS61VPS25636A 119 BGA PACKAGE PIN Integrated Silicon Solution
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IS61LPS/VPS25636A IS61LPS/VPS51218A IS61LPS/ VPS25636A VPS51218A IS61VPS25636A-250TQI
Abstract: increased number of terminals, low-heat resistance and lowcost packaging. * QFP: Quad Flat Package , bar-type QFP with functions to address multiple pins and TEQFP (Thermally Enhanced Quad Flat Package , and TEQFP technology have the same assembly process as the QFP package, which has been in mass , BGA types by replacing them with the QFP package using bus bar technology. By adopting TEQFP , and BGA for package body size 20mm square to 28mm square. It has been confirmed that the thermal -
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lQFP256 TEQFP208 QFP PACKAGE thermal resistance LQFP-256
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