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First line: Guidelines Handling J-Lead Devices Application Note January ver. Introduction Devices that surface-mount Abstract: .. application note will preserve the quality of Altera devices in J-lead, QFP, and BGA packages and ensure easier soldering. This application note discusses the following topics: ■. Handling J .. datasheet abstract.. |
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First line: Packaging Contents March Application Notes Guidelines Handling J-Lead Devices Selecting Sockets Altera Abstract: .. AN 90 SameFrame Pin-Out Designs for FineLine BGA Packages. AN 113 Plastic Package Reliability .. Altera Device Package Information Data Sheet. Configuration Elements Data Sheet. QFP Carrier .. datasheet abstract.. |
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First line: PACKAGE CLASSIFICATIONS 1-5. Package Symbols Codes Package code package codes given outline Abstract: .. J-Leaded Package QFP QFJ. Dual In-line Package Small Out-line Package Small Out-line J-Leaded .. Zigzag In-line Package ZIP. Pin Grid Array Ball Grid Array. PGA BGA. Package name. Surface .. datasheet abstract.. |
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First line: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE CLASSIFICATION PACKAGE CLASSIFICATION following pages classify Mitsubishi Abstract: .. SOJ Small Outline J-leaded package QFP Quad Flat Package LQFP Low profile Quad Flat .. FBGA Fine pitch BGA M-CSP Mold-Chip Scale Package TCP PACKAGE. Surface mount Quadruple .. datasheet abstract.. |
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First line: PACKAGE CLASSIFICATIONS packages classified indicated below according shape material mounting method. 4-way Abstract: .. 1. PACKAGE CLASSIFICATIONS. 7. 1. QFP. TQFP / LQFP. SOP. SSOP. SHP. SOJ. QFJ PLCC BGA. Skinny DIP. Shrink .. Figure 1-2-1 Package Classification. IC packages are classified as indicated below according .. datasheet abstract.. |
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First line: This version Apr. Previous version Jun. PACKAGE INFORMATION PACKAGE CLASSIFICATIONS This document Abstract: .. Surface mounting type package SOP, QFP, SOJ, QFJ, BGA Tape carrier TCP COB, TCP, etc. Usage rate % Figure 1.1.2 IC Package Demand Trend Forecast. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS .. datasheet abstract.. |
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First line: PACKAGE CLASSIFICATIONS Surface mounting type package Package Symbol SSOP GS-B TSOP TypeI Abstract: .. 1 2 Surface mounting type package. *1 Under development *2 Built-in Heat Spreader *3Built-in .. LS BGA 256, 352. TS. GS. 44, 48*1, 64, 80, 100, 120*1. 144, 176, 208. TQFP. LQFP. GS SHP 32. 1. PACKAGE .. datasheet abstract.. |
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First line: CUSTOMER ADVISORY ADV0201 NON-BGA PACKAGE MARK ENHANCEMENT Change Description Altera will begin Abstract: .. -BGA packages. Exceptions: CERDIP, PGA, JLCC, PDIP packages and QFP packages less than 14mm in dimensions. Package Marking Format Examples and Transition Date: Altera will begin transitioning .. datasheet abstract.. |
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First line: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray Package Devices Change Description Altera Abstract: .. CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices. Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial .. datasheet abstract.. |
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First line: MITSUBISHI INTEGRATED CIRCUIT PACKAGES TABLE CONTENTS DETAILED DIAGRAM PACKAGE OUTLINES LIST PACKAGE Abstract: .. 2 . DETAILED DIAGRAM OF PACKAGE OUTLINES. 1. LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN .. 3.13 QFP. 3.14 HQFP. 3.15 LQFP. 3.16 TQFP. 3.17 QFJ. 3.18 BGA. 3.19 FBGA. 3.20 M-CSP. 3.21 QTP. 3.22 CERQUAD .. datasheet abstract.. |
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First line: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE CODING CONVENTIONS PACKAGE CODING CONVENTIONS This data Abstract: .. : QFP. 7 : BGA. 8 : PGA. 9 : Special outline 0 : QFN, QFJ, or SOJ F : TQFP H : CSP. T : TSOP • Secondary Outline .. 80 pins Plastic-molded package QFP Secondary outline code 1 N added to discriminate from .. datasheet abstract.. |
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First line: date HITACHI SEMICONDUCTOR TECHNICAL UPDATE Classification Production Classification Information TN-SH7-440A / E Spec change Abstract: .. The Specification change is only for the QFP package. The specification of the BGA package is not changed. 33MHz 66MHz. Pin Item Symbol Min Max Min Max Unit. IDSEL Input Setup Time tPCISU 3.0 3.0 ns .. datasheet abstract.. |
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First line: Package Drawings Package Drawings Ceramic Package 0-28 Package Drawings Plastic Package 0-29 Abstract: .. Package Drawings. 0-36. Chip Scale Package - CS280. 280-BALL CHIP SCALE BGA CS280 R. Package .. Ceramic PGA Packages - PG475, PG559. R. Package Drawings. 0-54. Ceramic Brazed QFP Packages - CB100 .. datasheet abstract.. |
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First line: PRODUCTS LATEST TECHNOLOGICAL TRENDS VLSI PACKAGES DEVELOPMENT PACKAGES Hisao Kasuga / Miwa Momma Introduction Abstract: .. PACKAGES AND DEVELOPMENT OF NEW PACKAGES. Fig. 1 Expected Global Demand for Packages. QFP 65. BGA .. QFP 31. Bare 9. DIP 4. PGA 1 Others 4. BGA 3. CC 1. QFP 39 BGA 51. Bare 9. SOP 44. QFP 30. Bare 13. CSP 1. PGA <1. Others 4 .. datasheet abstract.. |
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First line: Designing With Fineline Packages APEX FLEX ACEX Devices October ver. Application Note Abstract: .. Typical BGA packages contain up to twice as many connections as quad flat pack QFP packages for the same area. Further, BGA solder balls are considerably stronger than QFP leads, resulting .. datasheet abstract.. |
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First line: Package Drawings November Version Package Drawings Ceramic Package Plastic Package SOIC TSOP Abstract: .. BGA Packages - BG22 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-32. BGA .. Ceramic Brazed QFP Packages - CB100 XC3000 Version . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-43 .. datasheet abstract.. |
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First line: CUSTOMER ADVISORY ADV0217 FULL LASER MARKING INTRODUCTION Change Description Beginning January Altera Abstract: .. Package QFP , Thin Quad Flat Package TQFP , Plastic Ball Grid Array PBGA , FineLine® BGA FBGA , Ultra FineLine® Ball Grid Array UFBGA , Plastic Dual in Line Package PDIP , and Small Outline .. datasheet abstract.. |
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First line: AN10778 layout guidelines MCUs packages Rev. January Application note Document information Info Abstract: .. common alternative packages, such as the Quad Flat Pack QFP , the LF TF BGA device has many advantages. Such as: • The LF TF BGA has no easy-to-bend leads that can cause deviation from coplanarity .. datasheet abstract.. |
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First line: PACKAGE CLASSIFICATIONS 1-1. Packaging Trends recent years marked advances have been made Abstract: .. Surface mounting type package SOP, QFP, SOJ, QFJ, BGA, etc. Tape carrier TCP , COB, etc. 100. 80. 60. 40. 20. 1995 2000 2005. Usage Rate % .. datasheet abstract.. |
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First line: AN-5026 Using Packages AN-5026 Fairchild Semiconductor Application Note January Revised September Using Abstract: .. 6. Digital cameras BGA advantages compared to fine pitch QFP or TSSOP packages: 1. BGAs are usually smaller. 2. BGAs have larger pitch. 3. BGAs have no fragile leads, that causes yield and rework .. datasheet abstract.. |
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8 Pages
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First line: PACKAGE TRENDS Packaging Trends Needs electronic equipment Optimized System Integration Performance Multiple Abstract: .. BGA. Reduced size. 1-3. SOP. 1-4. HDD System Configuration and Package Evolution Relationship .. QFP family. BGA family. TFBGA CSP Package mounting area mm 2 Pin count. 1-7. Package Mounting .. datasheet abstract.. |
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13 Pages |
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First line: Ball Grid Array BGA Packaging Introduction plastic ball grid array PBGA become Abstract: .. ball pitch typically 1.27 mm of a BGA over a QFP or PQFP, the overall package and board assembly yields can be better. From a performance perspective, the thermal and electrical characteristics .. datasheet abstract.. |
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32 Pages |
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First line: Designing with FineLine Packages Application Note November ver. Introduction programmable logic devices Abstract: .. Typical BGA packages contain up to twice as many connections as quad flat pack QFP packages for the same area. Further, BGA solder balls are considerably stronger than QFP leads, resulting .. datasheet abstract.. |
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13 Pages
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First line: Selecting Sockets Altera Devices Application Note January ver. Introduction Surface-mount assembly places Abstract: .. pack QFP packages. ■. Socket evaluation for ball-grid array BGA packages including FineLine BGA. TM. packages ■. Socket evaluation for pin-grid array PGA packages. ■. Packaging operations .. datasheet abstract.. |
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8 Pages
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First line: Packaging Solutions Advanced Packaging Solutions High-Density PLDs June package options compatibility design Abstract: .. offer higher pin counts in sig-nificantly less board area than QFP packages. Also, BGA. packages are robust, provide improved manufacturability, and have better thermal characteristics than .. datasheet abstract.. |
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First line: AN-5026 Using Packages AN-5026 Fairchild Semiconductor Application Note January Revised February Using Abstract: .. The use of the BGA package has multiple advantages over, for example, fine pitch QFP or TSSOP packages. 1. BGAs are usually smaller. 2. BGAs have larger pitch. 3. BGAs have no fragile leads, causing .. datasheet abstract.. |
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First line: High Contents Contents What Ball Grid Varieties NECs Advantages Photographs Line-up Characteristics Abstract: .. are smaller, lighter packages than the currently prevalent QFP packages. They have excellent .. Also, BGA has a broader terminal pitch than the same pin count QFP for easier mounting onto to .. datasheet abstract.. |
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40 Pages |
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First line: Layout Recommendations Packages Introduction Ball Grid Array BGA packages become increasingly more Abstract: .. to coplanarity issues and easier PCB signal routing under a BGA package see Figure 1 . BGA .. PCB Layout Recommendations for BGA Packages. Solder Mask Defined Pads. In SMD pads, the solder .. datasheet abstract.. |
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First line: HITACHI MICROCOMPUTER TECHNICAL UPDATE DATE THEME CLASSIFICATION PRODUCTNAME REFERENCE DOCUMENTS August SH-4 Abstract: .. Product name Package Pin name Pin number. HD6417750 BGA Reserved D17. HD6417750 QFP Reserved 161. HD6417750S BGA CA D17. HD6417750S QFP CA 161. HD6417751 QFP CA 197. HITACHI MICROCOMPUTER TECHNICAL .. datasheet abstract.. |
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First line: PACKAGE MANUAL Document C10943XJ6V0IF00 Previous IEI-635 IEI-1213 Date Published January Printed Japan Abstract: .. packages. SOP , quad flat L-leaded packages QFP , and quad flat J-leaded packages QFJ have .. Packages for IC. WSOP. Dual in-line module. LQFP. SVP L-lead. QTP. BGA. 5. CHAPTER 1 PACKAGE OUTLINES AND .. datasheet abstract.. |
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First line: Ordering Information August ver. Altera Devices Figure explains ordering codes Altera devices. Abstract: .. 9000 and MAX 7000 devices in QFP packages with 100 or more pins can be ordered in QFP carriers. EPM .. EPF10K100A in a 356-pin BGA package, commercial temperature range, -2 speed grade. EPM9560 in a .. datasheet abstract.. |
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First line: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE STRUCTURE PACKAGE STRUCTURE following diagrams show structure Abstract: .. STRUCTURE OF PLASTIC MOLDED QFP. MITSUBISHI INTEGRATED CIRCUIT PACKAGES. Mar.’98. PACKAGE .. STRUCTURE OF BGA OVERMOLD TYPE STRUCTURE OF BGA CAVITY DOWN TYPE MITSUBISHI INTEGRATED .. datasheet abstract.. |
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First line: Ordering Information March ver. Altera Devices Figure explains ordering codes Altera devices. Abstract: .. 9000 devices in QFP packages with 100 or more pins can be ordered in QFP carriers. Indicates .. EPF10K100A in a 356-pin BGA package, commercial temperature range, -2 speed grade. EPM7152B in .. datasheet abstract.. |
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First line: APPNote Board Level Assembly Rework Recommendations Abstract This application note provides recommendations Abstract: .. The BGA package contains up to twice as many connections as the quad flat pack QFP packages for the same area. BGA packages are compatible with most SMT Surface Mount Technology assembly equipment .. datasheet abstract.. |
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First line: CONTENTS STANDARDIZATION PACKAGES EIAJ Standards JEDEC Standards Standards NAMES NECS PACKAGES PACKAGE Abstract: .. Device SMD packages such as Small Outline. Packages SOP , Quad Flat L-leaded Packages QFP .. J-leaded Packages QFJ , Surface Vertical Package. SVP and Ball Grid Array BGA have been .. datasheet abstract.. |
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42 Pages |
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First line: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE INNOVATION PHILIPS SEMICONDUCTORS MARCH Philips Semiconductors Abstract: .. common alternative packages, such as the Quad Flat Pack QFP , the LF BGA device has many clear advantages. Such as: • The LF BGA has no easy-to-bend leads that can cause deviation from coplanarity .. datasheet abstract.. |
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First line: Introduction C51001-1.2 Introduction Cyclone field programmable gate array family based 1.5-V 0.13-µm Abstract: .. Cyclone devices are available in quad flat pack QFP and space-saving FineLine BGA packages see Table 1–2 through 1–3 . Table 1–2. Cyclone Package Options & I/O Pin Counts. Device. 100-Pin TQFP .. datasheet abstract.. |
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First line: Microcomputer Peripheral LSIs 4-Bit Microcontrollers 8-Bit Microcontrollers 16-Bit Microcontrollers Development System Tools Abstract: .. N: Plastic shrink dual in-line package SDIP F or U: Plastic quad flat package QFP Note 2: The .. Companion chip TC6358TB T-BGA 552-3131-1.00B6. LCD controller STN/DSTN/TFT 640 × 480/800 .. datasheet abstract.. |
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First line: Freescale Semiconductor Inc. PID6-603eN Motorola Part Numbers Affected MPC603ERX100LN MPE603ERX100LN MPC603EFE100LN MPE603EFE100LN Abstract: .. 5% 0 to 105 ModiÞed AC spec, BGA package low frequency operation restricted to 120MHz minimum .. 5% 0 to 105 ModiÞed AC spec, QFP package low frequency operation restricted to 120MHz minimum .. datasheet abstract.. |
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First line: Freescale Semiconductor Inc. Information PID6-603eN Motorola Part Numbers Affected MPC603ERX100LN MPC603ERX133LN MPE603ERX100LN Abstract: .. 5% 0 to 105 ModiÞed AC spec, BGA package low frequency operation restricted to 120MHz minimum .. 5% 0 to 105 ModiÞed AC spec, QFP package low frequency operation restricted to 120MHz minimum .. datasheet abstract.. |
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First line: Information PID6-603eN Motorola Part Numbers Affected MPC603ERX100LN MPC603ERX133LN MPE603ERX100LN MPE603ERX133LN MPC603EFE100LN MPC603EFE133LN Abstract: .. 5% 0 to 105 ModiÞed AC spec, BGA package low frequency operation restricted to 120MHz minimum .. 5% 0 to 105 ModiÞed AC spec, QFP package low frequency operation restricted to 120MHz minimum .. datasheet abstract.. |
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First line: Freescale Semiconductor Inc. Information PID6-603eN Motorola Part Numbers Affected MPC603ERX100LN MPC603ERX133LN MPE603ERX100LN Abstract: .. 5% 0 to 105 ModiÞed AC spec, BGA package low frequency operation restricted to 120MHz minimum .. 5% 0 to 105 ModiÞed AC spec, QFP package low frequency operation restricted to 120MHz minimum .. datasheet abstract.. |
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First line: Packages Through-hole mount type Surface mount type1 Surface mount type2 Dual In-line Abstract: .. QFP FP Quad Flat Package Fine Pitch TSOP I Thin Small Outline Package WSOP Small .. BGA Ball Grid Array Terminals are on one surface of the package and are arranged in a grid array .. datasheet abstract.. |
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First line: Customer Applications Support Reliability Test Center Page Motorola General Business Information Customer Abstract: .. BGA. Flip Chip PBGA GTBGA TBGA CSP DCA – Customer assembly problems with Motorola packages .. Advantages of BGA over QFP Advantages of BGA over QFP. ▼ Assembly yield Significantly better .. datasheet abstract.. |
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First line: Okis ASIC Wafer Level Chip Size Packaging Technology Overview March ASIC W-CSP Abstract: .. fine pitch BGA and 25 percent of the fine pitch QFP package. <The weight of Oki’s ASIC W-CSP is one-fourth of BGA and one-tenth of QFP. •The Oki’s W-CSP package has same or better reliability than. conventional .. datasheet abstract.. |
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First line: Ceramic Ball Grid Array Packaging Assembly Reliability Andrew Mawer Terry Burnette Thomas Abstract: .. Why BGA???? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly .. .5 mm Pitch QFP. .65 mm Pitch QFP. IBM Data on CBGA COMPAQ Data on PBGA Collapsing Ball < 0.5 .. datasheet abstract.. |
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First line: hybrid features Adjustment processes decreased function ratio trimmings High density mounting bonding Abstract: .. Item COB BGA QFP Chip Package SIP DIP, SOP ZIP Over Coating Epoxy metamorphic phenol Epoxy. Substrate Materials. Conductors, Resistors. Mounting. Package, OutsideTerminals. Over Coating, Plating .. datasheet abstract.. |
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First line: Application Report SZZA021B September Semiconductor Packing Methodology Cles Troxtell Bobby ODonley Purdom Abstract: .. The tray is designed for components that have leads on four sides QFP and TQFP packages and .. MicroStar Jr BGA GQN 20 1000 330 3.3 4.3 1.6 N/A 8 12. No MicroStar Jr. BGA GQL 56 1000 330 4.8 7.3 1 .. datasheet abstract.. |
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First line: Packaging Atmel Data Conversion Circuits Introduction This document aims highlighting main issues Abstract: .. • Quad Flat Pack QFP Packages. • Ball Grid Array BGA Packages. • Column Grid Array CGA Packages. Table 1 illustrates each type of package. The Grid array Package Types are usually preferred .. datasheet abstract.. |
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First line: Selector Guide Products From leading provider FIFO solutions Standard FIFO Abstract: .. for TQFP and BGA packages on 9-bit, 18-bit and 36-bit options. Industry’s highest performance 3 .. 132-PQF 132 QFP 0.65 760 27.6 27.6 3.60. BGA Packaging. 100-BC 100 BGA 1.00 121 11 11 1.40. 121-BG 121 .. datasheet abstract.. |
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