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PC-SOIC/DIP20-04 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO20A_SO20B_SO20D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 20; Bottom Pin Count: 20; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.275 - 0.475; Adapter Size Length X Width (in.): 1 x 0.4; Part Description: SOIC to DIP Converter; ri Buy
PC-SOIC/DIP8-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO8A_S08B_SO8E; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 8; Bottom Pin Count: 8; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.15 - 0.375; Adapter Size Length X Width (in.): 0.4 x 0.4; Part Description: SOIC to DIP Converter; ri Buy
PC-SOIC/DIP24-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SOJ24A_SOJ24B_SOJ24C_SOJ24D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 24; Bottom Pin Count: 24; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.167 - 0.367; Adapter Size Length X Width (in.): 1.2 x 0.4; Part Description: SOIC to DIP Converter; ri Buy

BGA and QFP Package Datasheet

Part Manufacturer Description PDF Type Ordering
BGA and QFP Package Altera Corporation CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices
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2 pages,
12.81 Kb

Original Buy
datasheet frame

BGA and QFP Package

Catalog Datasheet Results Type PDF Document Tags
Abstract: CUSTOMER ADVISORY ADV0505 ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change , as an additional shipping tray for various BGA and QFP packaged devices. The new Daewon tray dimensions are comparable to the existing Peak trays and have been fully qualified by Altera. However, Daewon and Peak trays cannot be stacked together and should be handled separately. Each Altera shipping , products to ensure availability and sourcing flexibility. Products Affected: Table 1 ­ Package and ... Original
datasheet

2 pages,
12.82 Kb

BGA 14 TRAY 12u-1919-g19 bga Shipping Trays FBGA484 12F-1111-119 33 x 33 DAEWON tray QFP Shipping Trays FBGA672 BGA 12y-2323-919 1f1-1717-a19 12y-2323-919 daewon bga Daewon BGA 7x7 ADV0505 ADV0505 abstract
datasheet frame
Abstract: Revisions in This Edition Page CHAPTER 1 APPENDIX Revised points (1) Fine-pitch BGA package mouning pad dimension examples are added. (1) Fine-pitch BGA package daisy-chain wiring diagrams are added. (2) Reworking conditions of BGA package are added. (3) PWB layout is added. 4 CONTENTS CHAPTER 1 1.1 , . 164 Reference Example of Reworking Conditions of BGA Package , expected that surface mount packages, such as QFP and SOP, which are more suitable for surface mounting ... Original
datasheet

171 pages,
2656.69 Kb

marking code N9 8-pin P160GD-65-LBD P44GX-50-600A1 S30GT tamura EC FLUX toshiba ICs cross reference catalog toshiba smd marking code transistor do-34 hitachi smd TRANSISTOR code YW TRANSISTOR SMD MARKING CODE 352 SMD BGA 672 DRAWING GE4F C10535EJ9V0IF00 C10535EJ9V0IF00 abstract
datasheet frame
Abstract: ) Fine-pitch BGA package mouning pad dimension examples are added. APPENDIX (1) Fine-pitch BGA package daisy-chain wiring diagrams are added. (2) Reworking conditions of BGA package are added. (3) PWB layout is , . 164 A.5 Reference Example of Reworking Conditions of BGA Package , expected that surface mount packages, such as QFP and SOP, which are more suitable for surface mounting , , are increasingly incorporating slimmer package, more pins, and finer pin pitch, and surface mount type ... Original
datasheet

171 pages,
2458.67 Kb

TRANSISTOR SMD MARKING CODE MP TRANSISTOR SMD MARKING CODE 352 08172 rma390dh3 NIHON SMD MARKING codes smd transistor 1p7 PP7F MBB mini relay smd code marking NEC 1.6/SmD TRANSISTOR av BGA and QFP Package Ultrasonic humidifier circuit C10535EJ9V0IF00 C10535EJ9V0IF00 abstract
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Abstract: Edition Page Chapter 1 Revised points (1) BGA package mounting pad dimension examples are added. , Appendix (1) BGA package daisy-chain wiring diagrams are added. (2) Plastic-BGA socket product , , but it is expected that surface mount packages, such as QFP and SOP, which are more suitable for , package, more pins, and finer pin pitch, and surface mount type semiconductor devices (SMDs) (surface , IC 75 Flip Chip 75 & CSP COB & TAB 50 50 SOP, TSOP & other SMT QFP 25 BGA 25 ... Original
datasheet

154 pages,
2200.75 Kb

SMD BGA 672 DRAWING S225S TRANSISTOR SMD MARKING CODE MP GE2 TRANSISTOR GE4F PP7F smd code marking NEC g sealed relay ge mil 7451 SMD 6PIN IC MARKING CODE NIHON SMD MARKING codes C10535EJ8V0IF00 C10535EJ8V0IF00 abstract
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Abstract: J-leaded package) Surface mount QFP (Quad Flat Package) Quadruple sides LQFP (Low profile , MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE CLASSIFICATION BGA PACKAGE [Mounting Method , (Cavity Down Type) FBGA(Fine pitch BGA) M-CSP(MoldChip Scale Package) TCP PACKAGE Surface , MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE CLASSIFICATION 2. IC PACKAGE CLASSIFICATION The following pages classify Mitsubishi Packages by the sealing method and the mounting method. The ... Original
datasheet

4 pages,
165.61 Kb

integrated circuit mitsubishi package BGA and QFP Package mounting datasheet abstract
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Abstract: DataSource CD-ROM Q1-02 Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel Reflow Soldering Process Sockets Component Mass (Weight) by Package Type Package BF957 BF957 BG225 BG225 BG256 BG256 BG352 BG352 BG432 BG432 BG492 BG492 BG560 BG560 BG575 BG575 BG728 BG728 CB100 CB100 , (0.8 pitch) CSP 280 BGA - 16mm (0.8 pitch) .300 Cerdip Package 896 BallL - Flip Chip BGA 31 X 31mm Body ... Original
datasheet

3 pages,
50.05 Kb

PGA package weight MO-151-AAN-1 MO-151-BAU MO-83-AH mo 83 MS-034 AAF-1 OBG0009 OBG0036 OPD0002 OPQ0010 MO-047 MO-151 AAL-1 MS-034 1152 BGA ak 957 Q1-02 Q1-02 abstract
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Abstract: Drawings Plastic DIP Package - PD8 11 0-29 R Package Drawings SOIC and TSOP Packages - SO8 , Scale Package - CS280 CS280 280-BALL 280-BALL CHIP SCALE BGA (CS280 CS280) 0-36 Package Drawings 0 R Package , Drawings 0 R Package Drawings BGA Packages - BG225 BG225 11 0-43 R Package Drawings BGA Packages - BG256 BG256 0-44 R Package Drawings BGA Packages - BG352 BG352, BG432 BG432 11 0-45 R Package Drawings BGA Packages - BG560 BG560 0-46 Package Drawings 0 R Package Drawings Ceramic ... Original
datasheet

33 pages,
2440.58 Kb

676-PIN BG352 CS144 CS280 CS48 HQFP HT144 packages pc44 PC84 plcc how package PQ304 SO20 vo8 diode SOIC package datasheet abstract
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Abstract: Capabilities · 0.3mm to 1.27mm pitch · 2x3mm to 50x50mm device · BGA, QFN, QFP, SOIC · 3000 pin count · , 50x50mm device · BGA, LGA, QFN, QFP, SOIC · 5000 pin count · Heat sink options · Easy chip replacement , 2x3mm to 50x50mm device · BGA, LGA, QFN, QFP, SOIC · 5000 pin count · Heat sink options · Easy chip , BGA, QFN, QFP, SOIC BGA, LGA, QFN, QFP, SOIC BGA, QFN, LGA LGA, QFN BGA, LGA, QFN, QFP , ) Capabilities · 0.5mm to 1.27mm pitch · 2x3mm to 50x50mm device · BGA, LGA, QFN, QFP, SOIC · 2000 pin count ... Original
datasheet

10 pages,
1634.67 Kb

qfp 100 SOCKET 8 soic pcb footprint material for chip resistors bga socket QFP 0.3mm pitch particle BGA and QFP Package mounting QFP lead pitch 0.3mm datasheet abstract
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Abstract: susceptibility to coplanarity issues and easier PCB signal routing under a BGA package (see Figure 14-1). The , to see and may require higher resolution equipment. Figure 14-1. Misalignment of BGA Balls vs. QFP , 2009 01.5 Updated BGA Board Layout Recommendations table and BGA Package Types table for 0.4 mm , considerations when working with BGA packages. It outlines some of the most common problems and provides tips for avoiding them at the design stage. Advantages and Disadvantages of BGA Packaging One of the ... Original
datasheet

4 pages,
89.59 Kb

ultra fine pitch BGA pcb design 0,5 mm pitch FPBGA BGA NSMD ball ball grid array image solder mask FTBGA TN1074 TN1074 abstract
datasheet frame
Abstract: from each package body in two directions, and can be mounted flat. The standard lead pitch is 1.27 mm , thin SOPs with a package L-Leaded mounting height of less than 1.27 mm, and are suited to ultra-thin , Heat Sink Quad Flat L-Leaded Package with Heat Spreader QFP packages are characterized by gull-wing type leads which are drawn out from each package body in four directions, and can be mounted , package body fixed. QFP packages with a heat sink.(for high power device) QFP packages with built-in ... Original
datasheet

4 pages,
132.66 Kb

ceramic QFP Package 100 lead BGA 256 PACKAGE power dissipation THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package mounting datasheet abstract
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Datasheet Content (non pdf)

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Over 1.1 million files (1986-2014): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer.
 
QFP $26.64 FW82452GX FW82452GX FW82452GX FW82452GX BGA PACKAGE OMC DATA PATH, SERVER BGA $110.90 S82452GX S82452GX S82452GX S82452GX SQFP PACKAGE OMC DATA PATH, SERVER QFP Contact Local Distributor FW82452KX FW82452KX FW82452KX FW82452KX SU029 SU029 SU029 SU029 BGA PACKAGE OMC DATA PATH, DESKTOP BGA $82.52 S82452KX S82452KX S82452KX S82452KX SQFP PACKAGE OMC DATA PATH, DESKTOP QFP $73.00 S82453GX S82453GX S82453GX S82453GX SQFP PACKAGE OMC PACKAGE ORDER S Z867, A-2 STEP QFP $25.70 82375 : PCI TO EISA BRIDGE S82375EB S82375EB S82375EB S82375EB QFP PACKAGE, PCI TO CHIPSET QFP PKG ORDER S Z868 QFP $10.55 82424ZX 82424ZX 82424ZX 82424ZX : CACHE AND DRAM CONTROLLER S82424ZX S82424ZX S82424ZX S82424ZX QFP PKG, CACHE
www.datasheetarchive.com/files/intel/products/design/pricelst/ccom2.htm
Intel 23/10/1996 7.65 Kb HTM ccom2.htm
FW82452GX FW82452GX FW82452GX FW82452GX BGA PACKAGE OMC DATA PATH, SERVER BGA $110.90 S82452GX S82452GX S82452GX S82452GX SQFP PACKAGE OMC DATA PATH, SERVER QFP Contact Local Distributor S82453KX S82453KX S82453KX S82453KX SQFP PACKAGE OMC DRAM CONT., DESKTOP QFP $77.31 FW82454GX FW82454GX FW82454GX FW82454GX BGA PACKAGE, PCI BRIDGE SERVER BGA $248.34 S82454GX S82454GX S82454GX S82454GX PCI BRIDGE, SERVER SQFP PACKAGE QFP Contact Local 82430FX 82430FX 82430FX 82430FX SB82371FB SB82371FB SB82371FB SB82371FB SZ997 SZ997 SZ997 SZ997 PIIX QFP $24.68 82374 : EISA SYSTEM COMPONENT S82374EB S82374EB S82374EB S82374EB QFP PACKAGE ORDER S Z867, A-2 STEP QFP $25.70 82375 : PCI TO EISA BRIDGE S82375EB S82375EB S82375EB S82375EB QFP PACKAGE, PCI TO EISA
www.datasheetarchive.com/files/intel/design/pricelst/ccom2.htm
Intel 31/01/1997 6.76 Kb HTM ccom2.htm
| Package Information Package Characteristics and Mechanical EIA Standard Board Layout Drawing for BGA Package EIA Standard Board Layout Drawing for QFP Package EIA Standard Board Layout Main Menu | Device Data | Package and Sockets | App Notes Package
www.datasheetarchive.com/files/actel/htms/packageandsocket.htm
Actel 06/06/2002 3.9 Kb HTM packageandsocket.htm
Ordering information Packing and forming information only required for SOP, and QFP parts that are required in tape and reel containers. For example, to order part BA4558F BA4558F BA4558F BA4558F on paper tape tube, paper tape, or embossed tape. BGA type and QFN type can be delivered in tray or embossed tape. BGA/CSP package | TO/SIP package QFN package | ZIP package QFP package | Photo package
www.datasheetarchive.com/files/rohm/products/shortform/12lsi/7form/7form.html
Rohm 05/02/2002 8.43 Kb HTML 7form.html
Circuit (IC) Storage and Handling: Package Types Peripheral Chip-Set Types The Ball Grid Array (BGA) package can be made much smaller than corresponding Quad Flat Pack (QFP) packages and with a large number of pins because contacts do not need to be on the edges of the package. The package is light and thin. The low resistance copper tracks and shorter distance
www.datasheetarchive.com/files/intel/products one/design/quality/icstor~1/packag~2.htm
Intel 01/05/1999 3.08 Kb HTM packag~2.htm
Circuit (IC) Storage and Handling: Package Types Peripheral Chip-Set Types The Ball Grid Array (BGA) package can be made much smaller than corresponding Quad Flat Pack (QFP) packages and with a large number of pins because contacts do not need to be on the edges of the package. The package is light and thin. The low resistance copper tracks and shorter distance
www.datasheetarchive.com/files/intel/design/quality/icstor~1/packag~2-v4-vx2.htm
Intel 01/05/1999 3.08 Kb HTM packag~2-v4-vx2.htm
Circuit (IC) Storage and Handling: Package Types Peripheral Chip-Set Types The Ball Grid Array (BGA) package can be made much smaller than corresponding Quad Flat Pack (QFP) packages and with a large number of pins because contacts do not need to be on the edges of the package. The package is light and thin. The low resistance copper tracks and shorter distance
www.datasheetarchive.com/files/intel/design/quality/icstor~1/packag~2-v4.htm
Intel 01/02/1999 3.09 Kb HTM packag~2-v4.htm
Circuit (IC) Storage and Handling: Package Types Peripheral Chip-Set Types The Ball Grid Array (BGA) package can be made much smaller than corresponding Quad Flat Pack (QFP) packages and with a large number of pins because contacts do not need to be on the edges of the package. The package is light and thin. The low resistance copper tracks and shorter distance
www.datasheetarchive.com/files/intel/design/quality/icstor~1/packag~2.htm
Intel 30/04/1998 3.1 Kb HTM packag~2.htm
Circuit (IC) Storage and Handling: Package Types Peripheral Chip-Set Types The Ball Grid Array (BGA) package can be made much smaller than corresponding Quad Flat Pack (QFP) packages and with a large number of pins because contacts do not need to be on the edges of the package. The package is light and thin. The low resistance copper tracks and shorter distance
www.datasheetarchive.com/files/intel/design/quality/icstor~1/packag~2-v3.htm
Intel 01/02/1999 3.09 Kb HTM packag~2-v3.htm
Circuit (IC) Storage and Handling: Package Types Peripheral Chip-Set Types The Ball Grid Array (BGA) package can be made much smaller than corresponding Quad Flat Pack (QFP) packages and with a large number of pins because contacts do not need to be on the edges of the package. The package is light and thin. The low resistance copper tracks and shorter distance
www.datasheetarchive.com/files/intel/design/quality/icstor~1/packag~2-v2.htm
Intel 01/08/1998 3.1 Kb HTM packag~2-v2.htm