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Part Manufacturer Description Datasheet BUY
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices

BGA 40 x 40 mm St

Catalog Datasheet MFG & Type PDF Document Tags

SG-BGA-6046

Abstract: SG-MLF-7004 576 625 676 729 729 841 961 1005 1089 1225 Any (X) 15 23 21 27 23 35 25 27 40 , SOCKETS The High Density GHz BGA sockets allow prototyping and testing of 0.5 and 0.65 mm pitch BGA , Description Socket Lid Max Pincount X mm Y mm SG-MLF-7000 0.4, 0.5, 0.5, 0.65, 0.8 10 10 GHz MLF Socket , Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent , BGA High Density Sockets . . . . . . . . . . . . . . . . . . . . . . . . . page SG.5 Ghz MLF High
Ironwood Electronics
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SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 BGA Solder Ball compressive force 1mm pitch BGA socket SF-BGA256E-B-05 SF-BGA256G-B-05 SF-BGA256J-B-05 SF-BGA289A-B-05 SF-BGA289B-B-05 SF-BGA289D-B-05

BGA665

Abstract: BGA676 31X31 35.2X35.2 31X31 31X31 40X40 37.5X37.5 25X25 35X35 37.5X37.5 27x27 37.5X37.5 40 x 40 35 , BGA CHIP PACKAGE SPECIFICATIONS Ironwood Dimensions Thickness Package Pin Array Lead Body (mm , ) Package Lead Lead Pitch IC Size X IC Size Y Leads Per Leads Per Lead Width Lead Length Code Count (mm , Ironwood Electronics Appendix A AP-A.1 APPENDIX A · BGA Chip Package Specification Tables , AP.18 · BGA Package Code Patterns . . . . . . . . . . . . . . . .page AP.19 thru AP.30 · LGA
Ironwood Electronics
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BGA665 BGA676 BGA-1156 BGA-783 BGA441 LGA240 BGA16A1 BGA20A1 BGA24A1 BGA28A1 BGA28B1 BGA32A1

SnPb36Ag2

Abstract: Lead Free reflow soldering profile BGA >> 0.10mN/mm Ageing : 8H Steam Source ST Microelectronics Immersion 10seconds Lead-Frame Package , Roadmap (BGA excluded) ST Philips IFX Freescale1 Q2 05 Q2 05 Q2 05 Q2 05 Q2 05 , . Roadmap IC Package Conversion Roadmap L/T/F BGA ST Q2 05 Philips Q2 05 IFX Q2 05 , Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST , about ST / Philips SC / IFX / Freescale (E4) activities on lead-free packaging · Collect feedback
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SnPb36Ag2 Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products BGA Ball Crack 2002/95/EC

SG-BGA-6109

Abstract: torque of screw for pcb GHz BGA Socket - Direct mount, solderless 60 mm Top View Features Directly mounts to , : 4/9/04 File: SG-BGA-6109 Dwg Modified: 5/19/09 PAGE 2 of 5 Compatible BGA Spec X , elastomer 60 mm Heat sink lid for power dissipation 1 2 Heatsink Lid: Black anodized Aluminum , anodized Aluminum. Thickness = 6.35mm. 9 A Elastomer: 40 micron dia gold plated brass filaments , 6 2 3 BGA IC Side View (Section AA) 5 Target PCB 9 4 8 SG-BGA
Ironwood Electronics
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torque of screw for pcb FR4/G10

BGA reflow guide

Abstract: sn63pb37 solder SPHERES . In the table, select the part number corresponds to your IC size (length mm x width mm), array size (rows x columns) and pitch (mm) (Note: More than one part number will match your criteria). You will , . The elastomer consists of fine pitch matrix (0.1mm x 0.1mm) of gold plated wires (40 micron diameter , PO Box 21151 · St. Paul, MN 55121 · USA www.ironwoodelectronics.com 2. Place BGA package (solder , 35 30 25 20 15 10 5 0 0 10 20 30 40 IC Size (mm) Socket+Fan Socket Only
Ironwood Electronics
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BGA reflow guide sn63pb37 solder SPHERES TL-VACUUMPEN-01 20mm light dependent resistors sn63pb37 solder wire ultra fine pitch BGA

SG-BGA-6170

Abstract: : 12/5/05 File: SG-BGA-6170 Dwg Modified: PAGE 2 of 5 Compatible BGA Spec D X , 45mm Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to , Guide: Cirlex or equivalent. Thickness = 0.75mm. 6 20 watt heatsink Elastomer: 40 micron dia , . IC Frame: FR4/G10 1 2 6 10 5 BGA IC Target PCB 4 8 9 3 SG-BGA-6170 Drawing © 2005 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100
Ironwood Electronics
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STMicroelectronics smd marking code

Abstract: BGA and QFP Package 14x14 CDIP CDIP F/S 32 PLCC 32 PLCCs PBGA40x40 CDIP F/S 40 BGA 10.53X6.29 CDIP F/S 42 , PDIP 32 SHRINK BGA 8X11.6 PDIP 40 BGA 8X12 PDIP 42 .6 STD PITCH .100 SO 8 BGA 8x8 , WITH RoHS PCN # CRP 04/744 Product Family / Commercial Product All ST Products are involved , describes ST conversion program for the second level interconnect 2 change and the way ST supports its , . Therefore, once converted to ECOPACKTM, ST devices will be RoHS compliant and have a Lead-free Second level
STMicroelectronics
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STMicroelectronics smd marking code BGA and QFP Package 14x14 STMICROELECTRONICS MSL infineon msl PLCC Part Marking STMicroelectronics opto mold compound CRP/04/744 JESD97

b 6150

Abstract: SG-BGA-6150 Modified: 5/19/09 PAGE 2 of 4 Compatible BGA Spec DETAIL X D Y e E 3 Øb , GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB , 1 5 9 3 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a , , 1.59mm thick. 7 10 6 5 Customer's BGA IC SG-BGA-6150 Drawing © 2005 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com 11
Ironwood Electronics
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b 6150 5M-1994

6140

Abstract: SG-BGA-6140 4 Compatible BGA Spec DETAI L X D Y e E 3 Øb Ø0.15 Z Ø0.30 Z X Y 0.20 , Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB , . 4 1 5 9 3 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically , Plate: FR4/G10, 1.59mm thick. 7 10 6 Customer's BGA IC SG-BGA-6140 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100
Ironwood Electronics
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6140

STMicroelectronics smd marking code

Abstract: smd marking code stmicroelectronics PLCC 32 PLCCs PBGA40x40 CDIP F/S 40 BGA 10.53X6.29 CDIP F/S 42 PLCC 52 BGA 10x10 , SHRINK BGA 8X11.6 PDIP 40 BGA 8X12 PDIP 42 .6 STD PITCH .100 SO 8 BGA 8x8 PDIP 42 , CONVERSION PROGRAM FOR COMPLIANCE WITH RoHS This document describes ST conversion program for the second level interconnect 2 change and the way ST supports its customers to meet the RoHS directive with this , of certain Hazardous Substances) directive 2002/95. Therefore, once converted to ECOPACKTM, ST
STMicroelectronics
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smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 INFINEON package tqfp PART MARKING HEPTAWATT SMD MLD-MIC/05/943

SnPb36Ag2

Abstract: J-STD-020B °C · Zero cross time > 0.10mN/mm Ageing : 8H Steam Source ST , BGA On board Reliability LFBGA-208, Ball SnAgCu, solder SnPbAg -40°C/+125°C, 2000 cycles Results , balls +SnAgCu paste (245C) SnAgCu balls +SnAgCu paste (250C) -40°C/+125°C cycles Source ST , Lead-free packaging for semiconductor devices E3 presentation Infineon Technologies / ST , mm3 and a body thickness < 2.5 mm and "large" packages having a body volume >= 350 mm3 or a body
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J-STD-020B lead-free solder joint reliability thermal cycle FeNi42-leadframe reflow temperature bga bga thermal cycling reliability FeNi42 3Q-4Q03 4Q03-2Q04 3Q03-4Q04 1Q03-1Q04 2Q03-2Q04

IC 651

Abstract: 6113 GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling , . Thickness = 5mm, Hex socket = 3mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged , ) 11 10 6 Customer's BGA IC SG-BGA-6113 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com 5 11 12 Customer , *Note: BGA pattern is not symmetrical with respect to the mounting holes. Recommended PCB Layout
Ironwood Electronics
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IC 651 6113 bga socket
Abstract: 24 bits. The SAM9G25 is available in a 217-ball BGA package with 0.8 mm ball pitch, as well as in 247-ball TFBGA and 247-ball VFBGA packages with 0.5 mm ball pitch, making it ideally suited for , -ball BGA, pitch 0.8 mm 247-ball TFBGA, pitch 0.5 mm 247-ball VFBGA, pitch 0.5 mm SAM9G25 [DATASHEET] 11032BSâ'"ATARMâ'"09-Jul-13 3 Block Diagram PC T TS 1 CK -P K0 FIQ IRQ XD DR D X DT , solution for industrial applications. The multi-layer bus matrix is linked to 2 x 8 DMA channels as well Atmel
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AT91SAM ARM926EJ-S

GS12141

Abstract: Input Dual Data Temp Power Size MUX Output Range (ºC) (mW) (mm) Pkg 4:1 YES -40 to +85 , BGA 100 GS2962 270, 1485, 2970 YES YES YES NO YES 3G: 40 HD: 50 SD: 200 10 or 20 YES -40 to +85 350 YES BGA 100 GS1672 270, 1485 YES YES YES YES YES HD: 50 SD: 200 10 or 20 YES -40 to +85 350 YES BGA 100 , 545 YES BGA 100 -40 to +85 515 YES BGA 100 YES -40 to +85 350 YES
Semtech
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GS12141 GS12070

SG-BGA-6068

Abstract: 6068 : 5/19/09 PAGE 2 of 4 Compatible BGA Spec X D DETAIL Y e E 3 Øb Ø0 , GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB , 5mm. Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone , thick. 2 8 7 Side View (Section AA) 10 11 5 6 11 Customer's BGA IC SG-BGA-6068 Drawing © 2002 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100
Ironwood Electronics
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6068

SG-BGA-6063

Abstract: PAGE 2 of 4 Compatible BGA Spec DETAIL D X Y e E 3 Øb Ø0.25 Z X Y Ø0 , GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB , socket = 5mm. Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone , thick. 2 8 7 Side View (Section AA) 10 11 5 6 Customer's BGA IC SG-BGA-6063 Drawing © 2002 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100
Ironwood Electronics
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Abstract: (IP) blocks â'¢ Up to 40% lower power consumption than the previous generation device Improved , for up to three signal processing precision levels (three 9 x 9, two 18 x 18, or one 27 x 27 , SE, SX, and ST devices only) â'¢ Interface peripheralsâ'"10/100/1000 Ethernet media access control , integrated ARM-based HPS and 3.125 Gbps transceivers Cyclone V ST SoC FPGA with integrated ARM-based , Code and Available Options for Cyclone V E Devicesâ'"Preliminary Package Type F : FineLine BGA (FBGA Altera
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CV-51001

SG-BGA-6083

Abstract: IC BGA IC SG-BGA-6083 Drawing © 2003 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 , Modified: 5/19/09 PAGE 2 of 4 Compatible BGA Spec DETAIL X 0.5mm min D Y e E , GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB , Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 , subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA
Ironwood Electronics
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fillister head screw

Abstract: BOX21151 GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB , ) 5 4 1 3 9 Elastomer: 40 micron dia gold plated brass filaments arranged , : FR4/G10, 1.59mm thick. 2 12 8 7 10 6 Customer's BGA IC SG-BGA-6153 Drawing © 2009 IRONWOOD ELECTRONICS, INC. PO BOX21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 , Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes
Ironwood Electronics
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fillister head screw st 6153

SG-BGA-6098

Abstract: Modified: 5/19/09 PAGE 2 of 4 Compatible BGA Spec D X DETAIL Y e E 3 Øb , GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB , socket = 5mm. Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone , (Section AA) 10 11 5 6 Customer's BGA IC SG-BGA-6098 Drawing © 2003 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com
Ironwood Electronics
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