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1 - 50 of about 10000+ for Assembly Locations |
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First line: CHIP DIODES Bourns District Sales Managers Bourns Distributor Managers Corporate Distributor Product Abstract: .. Bourns Adds Backend Package Assembly Location for Diode Products Bourns is adding an additional backend package assembly location for the assembly of our diode products. The Diode Product Line .. datasheet abstract.. |
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First line: CHIP DIODES Bourns District Sales Managers Bourns Distributor Managers Corporate Distributor Product Abstract: .. Bourns® Diode Product Line Addition of Back-end Package Assembly Location Bourns is adding an additional back-end package assembly location for the assembly of our diode products. The Diode .. datasheet abstract.. |
315.79 Kb |
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First line: CUSTOMER ADVISORY ADDITIONAL ASSEMBLY LOCATION Altera plans Shinkos assembly location Arai Japan Abstract: .. Altera Corporation 1/31/00 ADV0001. CUSTOMER ADVISORY ADDITIONAL ASSEMBLY LOCATION. Altera plans to add Shinko’s assembly location in Arai, Japan to its qualified list. Shinko has been selected .. datasheet abstract.. |
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First line: CUSTOMER ADVISORY FineLine BGA Packages Altera adding ASAT additional sources supply FineLine Abstract: .. The assembly locations can be distinguished by the country of origin, which is marked on the topside of the device. Assembly Location Inclusion Date* Country of Origin Mark ASAT August 1, 1999 .. datasheet abstract.. |
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First line: DALLAS SEMICONDUCTOR South Beltwood Parkway Dallas Texas 75244-3292 972-371-4000 Date Subject Description Abstract: .. Customers will be able to distinguish between the assembly locations by looking at the Country of Origin mark on the backside of the device. "Hong Kong" will be marked on the material assembled .. datasheet abstract.. |
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First line: Qualification Report September Version CASCADEABLE FIFO MARKETING PART NUMBER CY7C408A CY7C409A DEVICE Abstract: .. Name/Location of Assembly prime facility: Cypress Semiconductor, San Jose, CA. Assembly Line ID and Process ID: Cypress Semiconductor/ P283. PLASTIC PACKAGE/ASSEMBLY DESCRIPTION. Package .. datasheet abstract.. |
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First line: Qualification Report February Version BICMOS CHEMICAL MECHANICAL POLISHING CMP PRODUCT DESCRIPTION for Abstract: .. Name/Location of Assembly prime facility: Anam, Korea. Assembly Line ID and Process ID: KOREA-A/S32. PLASTIC PACKAGE/ASSEMBLY DESCRIPTION. Package Outline, Type, or Name: 28-Lead, 300-Mil .. datasheet abstract.. |
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First line: Qualification Report December Version 256K SRAM TECHNOLOGY QUAL MARKETING PART NUMBER CY7C194 Abstract: .. Name/Location of Assembly prime facility: Omedata, Indonesia. Assembly Line ID and Process ID: INDNS-O / V28317AGB. CYPRESS. SEMICONDUCTOR. PAGE 4. OTHER INFORMATION. For approval by similarity .. datasheet abstract.. |
61.71 Kb |
8 Pages |
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First line: Qualification Report June Version RAM2.8 TRANSISTOR RAM2.5 PROCESS PRODUCT DESCRIPTION for qualification Abstract: .. Name/Location of Assembly prime facility: Omedata, Indonesia. Assembly Line ID and Process ID: INDNS-O / V28317AGB. PLASTIC PACKAGE/ASSEMBLY DESCRIPTION. Package Outline, Type, or Name: 28 .. datasheet abstract.. |
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First line: Qualification Report Version February 256K SRAM TECHNOLOGY MARKETING PART NUMBER CY7C191 CY7C192 Abstract: .. Name/Location of Assembly prime facility: Cypress-Bangkok, Thailand Astra, Indonesia. Assembly Line ID and Process ID: Alpha-X / P33. Astra-F / P33. CYPRESS. SEMICONDUCTOR. PAGE 3. PLASTIC PACKAGE .. datasheet abstract.. |
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First line: Integrated Device Technology Inc. PRODUCT / PROCESS CHANGE NOTICE PCN N9910-01R1 Abstract: .. external assembly and test to IDT's assembly manufacturing and test locations. Other. RELIABILITY/QUALIFICATION SUMMARY: Qualification and reliability data will be available upon request .. datasheet abstract.. |
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First line: QUALIFICATION REPORT April Version FLASH ERASABLE CMOS CONVERSION PALC22V10D PRODUCT DESCRIPTION for Abstract: .. Name/Location of Assembly prime facility: Cypress Bangkok, Thailand. Assembly Line ID and Process ID: Alpha-x / P243A. HERMETIC PACKAGE/ASSEMBLY DESCRIPTION. Package Outline, Type, or Name .. datasheet abstract.. |
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First line: Qualification Report June Version CY7C46X / 47X MINNESOTA MARKETING PART NUMBER CY7C460 CY7C462 CY7C464 Abstract: .. Name/Location of Assembly prime facility: Omedata, Indonesia. Assembly Line ID and Process ID: INDNS-O / P2868. PLASTIC PACKAGE/ASSEMBLY DESCRIPTION. Package Outline, Type, or Name: 28L Plastic .. datasheet abstract.. |
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First line: Qualification Report August Version CMOS Marketing Part PALC22V10B PLDC20G10B PLDC20RA10 Description Reprogrammable Abstract: .. Name/Location of Assembly prime facility: Omedata, Indonesia. Assembly Line ID and Process ID: Indns-O / P284. CYPRESS. SEMICONDUCTOR. PAGE 3. OTHER INFORMATION. For approval by similarity, identify .. datasheet abstract.. |
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First line: Qualification Report March Version CY7C123 Static PRODUCT DESCRIPTION for qualification Information provided Abstract: .. Name/Location of Assembly prime facility: Cypress Bangkok, Thailand. Assembly Line ID and Process ID: Alpha-X/P2831. HERMETIC PACKAGE/ASSEMBLY DESCRIPTION. Package Outline, Type, or Name .. datasheet abstract.. |
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First line: Abstract: .. PCN Type: Alternate Assembly/Test Location/Qualification. Effectivity Expected 1st Device Shipment Date: 5/10/2004 Earliest Year/Work Week of Changed Product: 0420 Note: Package marking .. datasheet abstract.. |
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First line: Qualification Report April Version PROM FAMILY MARKETING PART CY7C245A CY7C291A CY7C293A DEVICE Abstract: .. Name/Location of Assembly prime facility: Cypress Semiconductor, San Jose, CA. Assembly Line ID and Process ID: Cypress Semiconductor / P27. CYPRESS. SEMICONDUCTOR. PAGE 3. PLASTIC PACKAGE/ASSEMBLY .. datasheet abstract.. |
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First line: Qualification Report January Version Static MARKETING PART CY7C150 DEVICE DESCRIPTION PRODUCT DESCRIPTION Abstract: .. Name/Location of Assembly prime facility: Cypress Semiconductor, San Jose, CA. Assembly Line ID and Process ID: Cypress Semiconductor / P27. CYPRESS. SEMICONDUCTOR. PAGE 3. PLASTIC PACKAGE/ASSEMBLY .. datasheet abstract.. |
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First line: Qualification Report April Version BiCMOS CACHE SRAMS MARKETING PART NUMBER CY7B180 CY7B181 Abstract: .. Name/Location of Assembly prime facility: Anam, Korea. Assembly Line ID and Process ID: Anam, Korea / S32. CYPRESS. SEMICONDUCTOR. PAGE 3. OTHER INFORMATION. For approval by similarity, identify .. datasheet abstract.. |
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First line: Qualification Report January Version Static CY7C182 PRODUCT DESCRIPTION for qualification Information provided Abstract: .. Name/Location of Assembly prime facility: Alphatech, Bangkok, Thailand. Assembly Line ID and Process ID: ALPHA-X/P2831. CYPRESS. SEMICONDUCTOR. PAGE 3. HERMETIC PACKAGE/ASSEMBLY DESCRIPTION .. datasheet abstract.. |
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First line: Qualification Report August Version PROM MARKETING PART NUMBER CY7C270 CY7C276 DEVICE DESCRIPTION Abstract: .. Name/Location of Assembly prime facility: Cypress Semiconductor, Round Rock, TX. Assembly Line ID and Process ID: Anam, Korea/ J44S. CYPRESS. SEMICONDUCTOR. PAGE 3. HERMETIC PACKAGE/ASSEMBLY .. datasheet abstract.. |
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First line: Qualification Report February Version CHEMICAL MECHANICAL POLISHING CMP PRODUCT DESCRIPTION for qualification Abstract: .. Name/Location of Assembly prime facility: Anam, Korea. Assembly Line ID and Process ID: KOREA-A/S32. CYPRESS. SEMICONDUCTOR. PAGE 4. OTHER INFORMATION. For approval by similarity, identify other .. datasheet abstract.. |
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First line: Qualification Report Version PROGRAMMABLE SKEWCLOCK BUFFER CY7B9910-SC CY7B9920-SC Programable Skew Clock Buffer Abstract: .. Name/Location of Assembly prime facility: Omedata, Indonesia. Assembly Line ID and Process ID: INDNS-O/S243. CYPRESS. SEMICONDUCTOR PAGE 3. OTHER INFORMATION. For approval by similarity, identify .. datasheet abstract.. |
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8 Pages |
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First line: Qualification Report June Version MATRA HARRIS PALC22V10D PRODUCT DESCRIPTION for qualification Information Abstract: .. Name/Location of Assembly prime facility: Omedata, Indonesia. Assembly Line ID and Process ID: INDNS-O / P243A. CYPRESS. SEMICONDUCTOR PAGE 4. OTHER INFORMATION. For approval by similarity, identify .. datasheet abstract.. |
70.94 Kb |
9 Pages |
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First line: Abstract: .. PCN Type: Alternate Assembly/Test Location/Qualification. Effectivity Expected 1st Device Shipment Date: 4/25/2004 Earliest Year/Work Week of Changed Product: 0418 Note: Package marking .. datasheet abstract.. |
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First line: Qualification Report June 9113A Version FIFO QUALIFICATION MARKETING PART NUMBER CY7C453 CY7C451 Abstract: .. Name/Location of Assembly prime facility: Anam, Korea. Assembly Line ID and Process ID: Anam / J32R5. HERMETIC PACKAGE/ASSEMBLY DESCRIPTION. Package Outline, Type, or Name: 32-pin, 300-mil .. datasheet abstract.. |
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First line: Qualification Report November Version CASCADEABLE FIFOS MARKETING PART NUMBER CY7C419 CY7C420 / CY7C421 CY7C424 / CY7C425 Abstract: .. Name/Location of Assembly prime facility: Cypress Bangkok, Thailand. Assembly Line ID and Process ID: Alpha-X / P283. PLASTIC PACKAGE/ASSEMBLY DESCRIPTION 7C425 Package Outline, Type .. datasheet abstract.. |
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First line: Cypress Semiconductor Test Site Qualification Report VERSION September Test Site Qualification Timing Abstract: .. Assembly Process Flow: 49-35003. Name/Location of Assembly prime facility: OSE TAIWAN TAIWN-T ELECTRICAL TEST / FINISH DESCRIPTION. Test Location: OSE TAIWAN TAIWN-T Fault Coverage .. datasheet abstract.. |
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First line: Cypress Semiconductor Test Site Qualification Report VERSION September Test Site Qualification Timing Abstract: .. Assembly Process Flow: 49-70032M. Name/Location of Assembly prime facility: OMEDATA INDNS-O ELECTRICAL TEST / FINISH DESCRIPTION. Test Location: OSE Philippines CSPI-R Fault Coverage .. datasheet abstract.. |
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First line: Qualification Report Version September CY7C9XX LOGIC FAMILY MARKETING PART NUMBER CY7C901 CY7C910 Abstract: .. Name/Location of Assembly prime facility: Omedata, Indonesia. Assembly Line ID and Process ID: INDNS-O/P4061X. HERMETIC PACKAGE/ASSEMBLY DESCRIPTION. Package Outline, Type, or Name: 40 .. datasheet abstract.. |
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First line: Qualification Report November Version CMOS2AN PROCESS MARKETING PART NUMBER VIC64 VIC068A VAC068A Abstract: .. Name/Location of Assembly prime facility: VLSI, Texas. Assembly Line ID and Process ID: USA-V /PPGA. HERMETIC PACKAGE/ASSEMBLY DESCRIPTION. Package Outline, Type, or Name: 144-Pin Ceramic .. datasheet abstract.. |
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First line: Qualification Report December Version CY7C122 Static RAM2.1 PRODUCT DESCRIPTION for qualification Information Abstract: .. Name/Location of Assembly prime facility: Cypress Semiconductor, San Jose, CA. Assembly Line ID and Process ID: Cypress Semiconductor/ P27. CYPRESS. SEMICONDUCTOR. PAGE 3. HERMETIC PACKAGE .. datasheet abstract.. |
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First line: Qualification Report January Version Static MARKETING PART CY7C122 DEVICE DESCRIPTION PRODUCT DESCRIPTION Abstract: .. Name/Location of Assembly prime facility: Cypress Semiconductor, San Jose, CA. Assembly Line ID and Process ID: Cypress Semiconductor/ P27. CYPRESS. SEMICONDUCTOR. PAGE 3. HERMETIC PACKAGE .. datasheet abstract.. |
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First line: Qualification Report August Version 4K / 8K PROM PROM20 PROCESS FAMILY MARKETING PART NUMBER Abstract: .. Name/Location of Assembly prime facility: Alphatech, Bangkok, Thailand. Assembly Line ID and Process ID: ALPHA-X/ P27. CYPRESS. SEMICONDUCTOR. PAGE 3. HERMETIC PACKAGE/ASSEMBLY DESCRIPTION .. datasheet abstract.. |
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First line: Qualification Report August Version SRAM SHRINK MARKETING PART NUMBER CY7C109 DEVICE DESCRIPTION Abstract: .. Name/Location of Assembly prime facility: Anam, Korea. Assembly Line ID and Process ID: Korea-A / S32. CYPRESS. SEMICONDUCTOR. PAGE 3. OTHER INFORMATION. For approval by similarity, identify other .. datasheet abstract.. |
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First line: Qualification Report February Version 256K PROM 128K PROM REDESIGNED MARKETING PART NUMBER Abstract: .. Name/Location of Assembly prime facility: Omedata, Indonesia. Assembly Line ID and Process ID: Indns-O/ P286. CYPRESS. SEMICONDUCTOR. PAGE 3. HERMETIC PACKAGE/ASSEMBLY DESCRIPTION. Package .. datasheet abstract.. |
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8 Pages |
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First line: Qualification Report Version PROM FAB2 QUALIFICATION MARKETING PART NUMBER 7C258 7C259 DEVICE Abstract: .. Name/Location of Assembly prime facility: Cypress Semiconductor, San Jose, CA. Assembly Line ID and Process ID: Cypress Semiconductor / P27. PLASTIC PACKAGE/ASSEMBLY DESCRIPTION. Package .. datasheet abstract.. |
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First line: Qualification Report December Version CY6264 Static PRODUCT DESCRIPTION for qualification Information provided Abstract: .. Name/Location of Assembly prime facility: Hyundai, Korea. Assembly Line ID and Process ID: KOREA-H/S31. CYPRESS. SEMICONDUCTOR. PAGE 4. OTHER INFORMATION. For approval by similarity, identify .. datasheet abstract.. |
70.93 Kb |
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First line: Qualification Report Version CASCADEABLE FIFOS MARKETING PART NUMBER CY7C420 / CY7C421 CY7C424 / CY7C425 CY7C428 / CY7C429 DEVICE Abstract: .. Name/Location of Assembly prime facility: Cypress Bangkok, Thailand. Assembly Line ID and Process ID: CBI / P2831. HERMETIC PACKAGE/ASSEMBLY DESCRIPTION. Package Outline, Type, or Name: 28 .. datasheet abstract.. |
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First line: Qualification Report Version SRAM 256K CHOP Bloomington QUALIFICATION MARKETING PART NUMBER CY7C161 / A Abstract: .. Name/Location of Assembly prime facility: Cypress Semiconductor, Alphatec, Bangkok, Thailand. Assembly Line ID and Process ID: Alpha-X / P33. CYPRESS. SEMICONDUCTOR. PAGE 3. HERMETIC PACKAGE .. datasheet abstract.. |
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First line: Qualification Report April Version Synchronous SRAM CY7C193 PAGE CYPRESS SEMICONDUCTOR PRODUCT DESCRIPTION Abstract: .. Name/Location of Assembly prime facility: Cypress-Bangkok, Thailand. Assembly Line ID and Process ID: Alpha-X / V283. CYPRESS. SEMICONDUCTOR. PAGE 4. OTHER INFORMATION. For approval by similarity .. datasheet abstract.. |
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First line: filters filter assemblies PMFA Series Description family profile filter assemblies designed with Abstract: .. the filter assemblies mount directly on to the. existing fixing locations. The ‘T’ series is a. compact design yet very robust for where. space is at a premium. Construction. The assembly consists .. datasheet abstract.. |
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First line: Qualification Report March Version EPROM FAMILY MARKETING PART NUMBER CY7C261 CY7C263 CY7C264 Abstract: .. Name/Location of Assembly prime facility: Cypress Semiconductor, San Jose, CA. Assembly Line ID and Process ID: Cypress Semiconductor / P27. PLASTIC PACKAGE/ASSEMBLY DESCRIPTION. Package .. datasheet abstract.. |
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11 Pages |
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First line: Qualification Report January Version Static Family MARKETING PART CY7C189 CY7C190 DEVICE DESCRIPTION Abstract: .. Name/Location of Assembly prime facility: Cypress Semiconductor, San Jose, CA. Assembly Line ID and Process ID: Cypress Semiconductor / D2. CYPRESS. SEMICONDUCTOR. PAGE 3. HERMETIC PACKAGE/ASSEMBLY .. datasheet abstract.. |
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First line: Qualification Report June Version 256K SRAM QUALIFICATION MARKETING PART NUMBER CY7C191 CY7C192 Abstract: .. Name/Location of Assembly prime facility: Cypress-Bangkok, Thailand. Assembly Line ID and Process ID: Alphatech / P33. CYPRESS. SEMICONDUCTOR. PAGE 3. HERMETIC PACKAGE/ASSEMBLY DESCRIPTION .. datasheet abstract.. |
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9 Pages |
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First line: Qualification Report December Version CY7C27x / CY7C28x FAB2 QUAL MARKETING PART NUMBER CY7C271 / 274 CY7C277 / 279 Abstract: .. Name/Location of Assembly prime facility: Alphatech, Bangkok, Thailand. Assembly Line ID and Process ID: Alpha-X/ P283. CYPRESS. SEMICONDUCTOR. PAGE 3. HERMETIC PACKAGE/ASSEMBLY DESCRIPTION .. datasheet abstract.. |
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First line: Qualification Report February Version 256K SRAM TECHNOLOGY MARKETING PART NUMBER CY7C194 CY7C195 Abstract: .. Name/Location of Assembly prime facility: Omedata, Indonesia. Assembly Line ID and Process ID: INDNS-O / V28317AGB. PLASTIC PACKAGE/ASSEMBLY DESCRIPTION. Package Outline, Type, or Name: 28 .. datasheet abstract.. |
79.59 Kb |
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First line: Reliability Report April Rev. STATIC MARKETING PART NUMBERS CY10E484 / CY10E484L CY100E484 / CY100E484L CY101E484 / CY101E484L CYPRESS Abstract: .. Name/Location of Assembly prime facility: Anam, Korea. Assembly Line ID and Process ID: KOREA-A / J28S. PLASTIC PACKAGE/ASSEMBLY DESCRIPTION. Package Outline, Type, or Name: 28 Lead SOJ. Die .. datasheet abstract.. |
84.09 Kb |
9 Pages |
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First line: PRODUCT / PROCESS CHANGE NOTIFICATION MPG-EEP / 04 / 578 M50FW M50LPW M50FLW Firmware Count Product Families TSOP40 Abstract: .. Families, TSOP40 Environmental Friendly Package and Assembly Location Change. WHAT IS THE CHANGE? The present PCN replaces and upgrades PCN MPG/EE/0086 / CPCN MPG/EEP/04/450. The products .. datasheet abstract.. |
32.65 Kb |
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First line: Qualification Report September Version CY7C188 Static PRODUCT DESCRIPTION for qualification Information provided Abstract: .. Name/Location of Assembly prime facility: Anam, Korea. Assembly Line ID and Process ID: KOREA-A / S31. CYPRESS. SEMICONDUCTOR. PAGE 4. OTHER INFORMATION. For approval by similarity, identify other .. datasheet abstract.. |
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