Ablestik Datasheet, Circuit, PDF, Cross Reference, & Application Note Results |
| Fulltext Datasheet Results | 1 - 50 of about 318 for Ablestik | ||||
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First line: SUMITOMO g600 Ablestik* Ablestik 84-1 Ablestik LMISR4 Ablestik October 2009 CN-102609 Customer Notification M02045-2Y04-T M02045G-2Y04-T Second Assembly Site Abstract: .. RoHS Die attach Ablestik 84-1 LMISR4 Ablestik 84-1 LMISR4 RoHS Mold compound Sumitomo 6300H 6300H Sumitomo G600 G600 RoHS terminal finish 100% Matte Sn 100% Matte Sn. Standard Die attach Ablestik 84-1 LMISR4 .. Tags: Ablestik Ablestik LMISR4 Ablestik 84-1 Ablestik* SUMITOMO g600 CN-102609 | 19.86 Kb | 2 Pages | Original |  |
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First line: sumitomo EME G700L SUMITOMO g700l EME-G700* sumitomo crm Ablestik February 2005 022405 Customer Notification Assembly Subcontractor Change PLCC Packaged Devices Abstract: .. , Philippines Mold Compound Sumitomo 6650E 6650E Nitto MP8000CH4 MP8000CH4 Die Attach Ablestik 8361J 8361J Ablestik 8361J 8361J . Lead Frame Cu 194 Cu 194. Lead Coating 85/15 Sn/Pb 85/15 Sn/Pb. Wire 1.25 mil Au 1.0 mil Au. Marking .. Tags: Ablestik sumitomo crm EME-G700* SUMITOMO g700l sumitomo EME G700L datasheet abstract.. | 81.44 Kb | 4 Pages | Original | |
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First line: SSTE32882* Ablestik AUS308 Ablestik SSTE32882* Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, Jose, 95138 A1004-02 Abstract: .. Ablestik 2100A 2100A . Die Attach: Ablestik 2300, Ablestik 2025D 2025D , Ablestik 2000, Ablestik 2100A 2100A . Solder Balls: Sn96 Sn96 .5/Ag3.0/Cu0.5. Assembly Materials. KEG1250LKDS KEG1250LKDS . HL830NX-A HL830NX-A . Solder Balls: Sn96 Sn96 .5 .. Tags: SSTE32882* Ablestik AUS308 Ablestik SSTE32882* A1004-02 | 98.19 Kb | 4 Pages | Original | |
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First line: EME-G770 AUS308 Ablestik Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, Jose, 95138 A0911-02R1 Abstract: .. Ablestik 2025D 2025D . Die Attach: Ablestik 2300, Ablestik 2000, Ablestik 2100A 2100A . Solder Balls: Sn96 Sn96 .5/Ag3.0/Cu0.5 Green Assembly Materials KE-G1250 KE-G1250 . BT Resin HL832NX HL832NX , AUS308 AUS308 . Sn96 Sn96 .5/Ag3.0/Cu0 .. Tags: Ablestik AUS308 EME-G770 A0911-02R1 | 97.96 Kb | 4 Pages | Original | |
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First line: Cypress Semiconductor Reflow Qualification Report 235°C Solder Reflow Profile TSOP Package Family (All assembly sites these packages) Abstract: .. Die Attach Supplier: Ablestik. Die Attach Material: Ablestik 8361H 8361H . Bond Diagram Designation 10-03049. Wire Bond Method: Thermosonic. Wire Material/Size: Gold, 1.0mil. Thermal Resistance Theta .. Tags: cel hitachi Ablestik 2000 Ablestik* datasheet abstract.. | 21.92 Kb | 6 Pages | Original | |
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First line: ablebond technical data sheet Ablebond Ablecube Ablecube* ablebond 2815a DEVELOPMENTAL TECHNICAL DATASHEET THERMALLY CONDUCTIVE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 2815A attach adhesive offers high thermal conductivity minimize thermal resistance between chip substrate. This adhesive FEATURES Abstract: .. Service Fax 310 764-1783 For a technical contact nearest you, visit www.ablestik.com The information given and the recommendations made herein are believed to be accurate but no guarantee .. Tags: ablebond technical data sheet conductivity meter circuit ATM-0018 ATM-0007 Ablestik Ablecube* ablebond technical data sheet ablebond 2815a ABLEBOND* 2815A* 0116 datasheet abstract.. | 316.3 Kb | 3 Pages | Original | |
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First line: Ablestik ATM-0018 ablebond ELECTRICALLY CONDUCTIVE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 8200C bleed attach adhesive designed small medium sized dies across variety leadframes including PPF, This electrically conductive adhesive offers improved JEDEC performance type packages. FEATURES HIgh elec Abstract: .. APPLICATION GUIDELINES SHIPMENT This Ablestik product is packed and shipped in dry ice at -80 °C. Inside every dry ice shipment of Ablestik’s products is a small packet containing the ABLECUBE .. Tags: ATM-0018 ATM-0007 Ablestik* Ablecube* ablebond* RP-751 | 327.4 Kb | 3 Pages | Original | |
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First line: GE100LFCS* EME-G770 Ablestik SSTE32882HLBAKG AUS308 Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, Jose, 95138 A0911-02 Abstract: .. Ablestik 2025D 2025D . Die Attach: Ablestik 2300, Ablestik 2000. Solder Balls: Sn96 Sn96 .5/Ag3.0/Cu0.5 Green Assembly Materials KE-G1250 KE-G1250 . BT Resin HL832NX HL832NX , AUS308 AUS308 . Sn96 Sn96 .5/Ag3.0/Cu0.5 Green Au wire .. Tags: AUS308 SSTE32882HLBAKG Ablestik EME-G770 GE100LFCS* A0911-02 | 97.89 Kb | 4 Pages | Original | |
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First line: a144g Cypress Semiconductor Mold Compound Qualification Report Sumitomo 7320 Mold Compound, MSL3 DCD-Thin Quad Flat Pack, (TQFP) Taiwan CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Abstract: .. Die Attach Supplier: Ablestik. Die Attach Material: Ablestik 8361. Bond Diagram Designation 10-03379. Wire Bond Method: Thermosonic. Wire Material/Size: Gold/ 1.3mil. Thermal Resistance Theta .. Tags: a144g Ablestik 7320 datasheet abstract.. | 23.69 Kb | 8 Pages | Original | |
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First line: sumitomo 6600 Abstract: .. device will be assembled with Sumitomo 6600 mold compound and Ablestik Ablebond 8361J 8361J die attach adhesive. The change in material is intended to enhance the moisture sensitivity characteristics .. Tags: sumitomo 6600 ON SEMICONDUCTOR TRACEABILITY DS12885 Ablestik ablebond* datasheet abstract.. | 10.54 Kb | 1 Pages | Original | |
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First line: 12500 Boulevard, 8640, Dallas, Texas 75243 PCN# 20050304000 Wafer IOTA A07s Final Change Notification Dear Customer: This final announcement change device that currently offered details this change following pages. This notice does apply product end-of-life status. Should product affected previously Abstract: .. Die Attach Supplier ABLESTIK ABLESTIK ABLESTIK ABLESTIK. Moisture Level: LEVEL3-220C LEVEL3-220C LEVEL3-260C LEVEL3-260C LEVEL3-260C LEVEL3-260C LEVEL3-260C LEVEL3-260C . Qualification: Plan Test Results. Texas Instruments PCN# 20050304000 .. Tags: twl3025* shinetsu Ablestik datasheet abstract.. | 34.84 Kb | 3 Pages | Original | |
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First line: kMc Series SUMITOMO EME G700 SUMITOMO G700 A-0506-01 Abstract: .. material from Sumitomo and a new die attach material from Ablestik. This notification is to advise our customer of qualification of new assembly materials. The new mold compound and die attach .. Tags: SUMITOMO EME G700 SUMITOMO G700 kMc Series JESD22-B116* JESD22-B100* JESD22 B100 IDT79RV4700-200DP IDT72V71660DR G700 Ablestik* datasheet abstract.. | 16.16 Kb | 4 Pages | Original | |
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First line: ablestik 8390 ABLEBOND Ablebond 71 Sumitomo EME-G600 material Ablestik 8290 A-0401-01 DATE: 1/20/2004 Product Affected: SOIC package family (see attachment affected part #s). Date Effective: 4/20/2004 Contact: Geoffrey Cortes Title: Manager, Corporate Quality Reliability Phone (408) 492-8321 (408) 7 Abstract: .. compound material Sumitomo EME-G600 EME-G600 series and a new die attach material Ablestik 8290. This notification is to advise our customer of qualification and addition of new assembly material. Please .. Tags: Ablestik 8290 Ablebond 71 ABLEBOND ablestik 8390 Sumitomo EME-G600 material LDR MPY54C569 JESD22-B116 IDTQS3V245SO idtqs3383so IDTNW6005AS idt6116 physical dimension IDT49FCT3805ASOI G600 mold compound EME-G600* adhesive* datasheet abstract.. | 195.15 Kb | 10 Pages | Original | |
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First line: ablebond 3230 sumitomo G700 Tg SUMIKON EME-G700 SUMITOMO G700 Ablestik SR-0212-02 DATE: 12/20/2002 Product Affected: TSOP package family (see attachment affected part #s). Date Effective: 3/20/2003 Contact: George Snell Title: Quality Assurance Manager Phone (831) 754-4556 (831) 754-4672 E-mail: geo Abstract: .. compound EME-G700 EME-G700 Sumitomo and die attach material 3230 manufactured by Ablestik . This notification is to advise our customer of adding these new assembly materials. Please see attachment .. Tags: sumitomo G700 Tg ablebond 3230 SUMITOMO G700 SUMIKON EME-G700 Sumikon JESD22-B116* G700 EME-G700* EIA/JESD22-B116* adhesive* Ablestik 190 Ablestik Ablecube* SR-0212-02 | 123.5 Kb | 8 Pages | Original | |
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First line: photodetector CREE RESEARCH 250457b HiCRE /Ty/-^ ajBMMMMpali VllCk ESEARCHING Leader Silicon Caitride lid-State Techno logy Electrical/Optical Characteristics Silicon Carbide Ultraviolet Photodetector Chip 300|im 300jim Size CD-260-0.30-D Symbol Description Test Conditions Typical Units Short circui Abstract: .. Anode + Mount to goldplated header using either silver filled epoxy such as Ablestik part #8401 Lml-SR4 cured 1 hour at 175Â °C OR braze using gold/germanium alloy 88% Au, 12% Ge M.P. 356Â ° .. Tags: photodetector datasheet abstract.. | 158.16 Kb | 2 Pages | OCR Scan | |
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First line: photodetector Ablestik CREE RESEARCH 250457b OOOOOSfl ICRE Leader Silicon CarWde Technology Silicon Carbide Ultraviolet Photodetector Chip Size CD-260-1.00-D Electrical/Optical Characteristics Symbol Description Test Conditions Typical Units Abstract: .. + Mount to goldplated header using either silver filled epoxy such as Ablestik part #8401LMI-SR4 8401LMI-SR4 cured 1 hour at 175Â °C OR braze using gold/germanium alloy 88% Au, 12% Ge M.P. 366Â °C . Braze .. Tags: Ablestik photodetector datasheet abstract.. | 179.81 Kb | 2 Pages | OCR Scan | |
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First line: HL832*Â GE-100L* nitto GE aus303 GE-100L Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, Jose, 95138 A1008-07 Abstract: .. Die Attach: Ablestik 2000. Wire: Au wire. Solder Balls: Sn95 Sn95 .5/Ag4.0/Cu0.5 Green Au wire. Mold Compound: HC-100XJAA-M HC-100XJAA-M Nitto GE-100L GE-100L . Substrate: HL832HS HL832HS / AUS303 AUS303 HL832NX-A HL832NX-A / AUS308 AUS308 . Sn95 Sn95 .5/Ag4 .. Tags: GE-100L aus303 nitto GE GE-100L* HL832*Â A1008-07 | 97.64 Kb | 4 Pages | Original | |
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First line: CABGA ge100lfcsv GE100LFCS* Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, Jose, 95138 A1008-03 Abstract: .. Die Attach: Ablestik 2300. Assembly Materials. Die Attach: Ablestik 2000. Wire: Au wire. Solder Balls: Sn96 Sn96 .5/Ag3.0/Cu0.5 Green & Sn63 Sn63 /Pb37 Pb37 Standard Wire: Au wire. Mold Compound: GE100LFCSV GE100LFCSV .. Tags: GE100LFCS* ge100lfcsv CABGA A1008-03 | 99.21 Kb | 4 Pages | Original | |
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First line: SUMITOMO g700l Ablestik Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, Jose, 95138 A1007-04 Abstract: .. Die Attach: Ablestik 3230 Ablestik 3230. Wire: Au wire. Description Existing Add. Assembly Location Amkor, Korea Amkor, Philippines. Plating: Sn/Pb standard and matte 100% Sn green Au wire .. Tags: Ablestik SUMITOMO g700l A1007-04 | 98.19 Kb | 4 Pages | Original | |
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First line: HL832 nx-a CABGA GE100LFCS Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, Jose, 95138 A1008-05 Abstract: .. Die Attach: Ablestik 2000. Assembly Materials. Die Attach: Ablestik 2000. Wire: Cu wire. Solder Balls: Sn96 Sn96 .5/Ag3.0/Cu0.5 Green Wire: Cu wire. Mold Compound: GE100LFCS GE100LFCS . ATTACHMENT I - PCN # : A1008 A1008 .. Tags: GE100LFCS CABGA HL832 nx-a A1008-05 | 83.82 Kb | 3 Pages | Original | |
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First line: Abstract: .. Simtek has been evaluating Sumitomo G600 G600 "Green" mold compound and Ablestik 8290 epoxy die attach paste as a more suitable material set for the 260C 260C JEDEC-020C JEDEC-020C peak reflow temperature requirement .. Tags: Nitto* mp8000 G600 mold compound Ablestik LMISR4 Ablestik 84-1 Ablestik 8290 Ablestik* datasheet abstract.. | 20.37 Kb | 2 Pages | Original | |
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First line: Nitto GE100LFCS* sumitomo g700 type s GE100LFCS Hitachi Datecode SUMITOMO G700 Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0903 ALTERNATIVE ASSEMBLY SITE CONFIGURATION FAMILY Change Description Abstract: .. Die Attach Epoxy UBGA 88 Ablestik 2025D 2025D & QMI 536 Ablestik 2300 & Hitachi FH920 FH920 . Au Bondwire Diameter 1.0 mils 0.8 mils. Item Package Type. Existing Source ASEK Taiwan Additional Source ATP Philippines .. Tags: SUMITOMO G700 Hitachi Datecode GE100LFCS sumitomo g700 type s Nitto GE100LFCS* PCN0903 | 90.04 Kb | 5 Pages | Original | |
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First line: Signetics Signetics TSSOP Signetics Thin Shrink Small Outline Package Mold Compound Abstract: .. ¢ Ã D/A Epoxy --------------------------------------------------------- ABLESTIK. ¢ Ã Gold Wire --------------------------------------------------------- 1.0/1.2/1.3. ¢ Ã Encapsulation .. Tags: datasheet abstract.. | 162.99 Kb | 2 Pages | Original | |
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First line: thin TSOP 8x20 package tray Signetics Signetics TSOP Type Signetics Thin Small Outline Package Type1 Signetics Flip Chip Package Abstract: .. ¢ Ã D/A Epoxy --------------------------------------------------------- ABLESTIK / HI-BOND. ¢ Ã Gold Wire --------------------------------------------------------- 1.0/1.2/1.3 .. Tags: thin TSOP 8x20 package tray datasheet abstract.. | 144.31 Kb | 2 Pages | Original | |
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First line: Thin Small Outline Package (TSOP) Anam, Philippines Cypress Semiconductor Assembly: Anam, Philippines Package: TSOP Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 3. Test results met .. Tags: Ablestik datasheet abstract.. | 14.72 Kb | 4 Pages | Original | |
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First line: Nitto* Nitto 84-1lmis* Nitto MP-8000 Molding Compound Plastic Quad Flat Pack (PQFP) (CY7C611) Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4 84-1LMISR4 . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 5. Assembly .. Tags: 84-1lmis* Nitto* epoxy qualification Cypress Semiconductor CY7C611A Compound Ablestik* MP-8000 | 11.18 Kb | 4 Pages | Original | |
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First line: EME-7351* Compound EME-7351 sumitomo epoxy Sumitomo 1000 TSOP Package Sumitomo 7351 Mold Compound Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: TSOP Sumitomo EME-7351/S351 Mold Compound Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 4-1LMISR4. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line .. Tags: Sumitomo 1000 EME-7351 EME-7351* sumitomo epoxy sumitomo s351 Compound Ablestik* 9735* EME-7351 S351 | 14.67 Kb | 4 Pages | Original | |
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First line: G700* ablestik 2288a SUMITOMO G700 PART NUMBER(S): No.: 08-1201-02 XRT72L52IQ-F XRT72L52IQTR-F DATE: 12/10/08 PART DESCRIPTION: Abstract: .. green G700 G700 to Sumitomo green G700A G700A Die attach material: from Sumitomo CRM1064B CRM1064B to Ablestik 2288A 2288A . REASON FOR CHANGE: Supplier’s decision to end the life of this package body size and lead count .. Tags: ablestik 2288a SUMITOMO G700 sumitomo G700* ablestik XRT72L52IQ-F XRT72L52IQTR-F | 27.3 Kb | 2 Pages | Original | |
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First line: st16c2550cq48-f crm1076* a2200 CRM1076 SUMITOMO CRM1076 PART NUMBER(S): No.: 09-0903-01 Refer Attachment PART DESCRIPTION: DATE: September 2009 Abstract: .. Die attach material in Unisem and ASAT is Sumitomo CRM1076 CRM1076 and Ablestik A2200 A2200 respectively. REASON FOR CHANGE: Business consolidation. DATE OF SAMPLES AVAILABLE: 10/1/09. DATE OF QUALIFICATION .. Tags: st16c2550cq48-f Unisem SUMITOMO CRM1076 ST16C2550IQ48* crm1076* Ablestik a2200 datasheet abstract.. | 50.47 Kb | 3 Pages | Original | |
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First line: tanaka au wire tanaka wire Tanaka GL2* tanaka epoxy ph44* DATE: November 1999 MEANS DISTINGUISHING CHANGED DEVICES: G9911-04 Product Affected: Plastic packages Product Mark Back Mark Manufacturing Location Affected: Date Code Other: "assembly cut-off number" Date Effective: February 2000 C Abstract: .. RP-119-4 RP-119-4 / ABLESTIK. Wire Bond. : GL2 1.0mil Au TANAKA GL2 1.0mil Au TANAKA GL2 1.0mil Au .. Tags: ph44* tanaka epoxy tanaka wire Tanaka GL2* tanaka au wire ph44 c7025* Ablestik Ablebond 8340 ablebond* 8340 8206 G9911-04 | 21.1 Kb | 3 Pages | Original | |
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First line: IC 2732 pdf datasheet location Cypress Semiconductor Test Site Qualification Report Test Site Qualification Timing Technology Products Philippines CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Abstract: .. Die Attach Supplier: Ablestik. Die Attach Material: 8361H 8361H . Bond Diagram Designation 10-03065. Wire Bond Method: Thermosonic. Wire Material/Size: 1.0mil. Thermal Resistance Theta JA °C/W: 108 .. Tags: location IC 2732 pdf datasheet IC 2732 pdf datasheet Ablestik datasheet abstract.. | 12.45 Kb | 4 Pages | Original | |
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First line: 84-1lmis* Cypress Semiconductor Test Site Qualification Report Test Site Qualification Timing Technology Products TAIWAN CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Abstract: .. Die Attach Supplier: Ablestik. Die Attach Material: 84-1LMIS 84-1LMIS . Bond Diagram Designation 10-03628. Wire Bond Method: Thermosonic. Wire Material/Size: 1.0mil. Thermal Resistance Theta JA °C/W: 102 .. Tags: 84-1lmis* Ablestik 84-1LMIS Ablestik* 84-1lmis datasheet abstract.. | 12.44 Kb | 4 Pages | Original | |
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First line: Compound sumitomo epoxy Lead (400mil) Package Level Omedata CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Abstract: .. Die Attach Method: Silver Epoxy Die Attach Material: 8361H 8361H Ablestik. Wire Bond Method: Thermosonic Wire Material/Size: Au 1.3 mil. Moisture Level : Level 2 220 °C+ 5,-0 °C Thermal Resistance .. Tags: sumitomo epoxy Compound Omedata* datasheet abstract.. | 12.04 Kb | 4 Pages | Original | |
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First line: EME-6300 84-1lmis* SSOP Package Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: SSOP Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4 84-1LMISR4 . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 1. Assembly .. Tags: 84-1lmis* sumitomo epoxy EME-6300* datasheet abstract.. | 15.73 Kb | 4 Pages | Original | |
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First line: cel 9200 TSOP Type OSE, Taiwan Assembly Cypress Semiconductor Assembly: OSE, Taiwan Assembly Package: 44Ld TSOP Type Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H 8361H . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. Tags: cel 9200 Cypress Semiconductor datasheet abstract.. | 16.77 Kb | 5 Pages | Original | |
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First line: 84-1lmis* TSSOP Package Anam, Philippines Assembly Cypress Semiconductor Assembly: Anam, Philippines Package: TSSOP Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4 84-1LMISR4 . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 1. Assembly .. Tags: 84-1lmis* Sumitomo 7351T Cypress Semiconductor datasheet abstract.. | 15.93 Kb | 4 Pages | Original | |
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First line: Pins PLCC Omedata Assembly Cypress Semiconductor Assembly: Omedata, Inodnesia Package: pins PLCC Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4 84-1LMISR4 . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 1. Assembly .. Tags: CY7C131 datasheet abstract.. | 15.73 Kb | 4 Pages | Original | |
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First line: TSOP Type Package Anam-Seoul, Korea Assembly Cypress Semiconductor Assembly: Anam-Seoul, Korea Package: TSOP Type Abstract: .. Die Attach Method: Silver Epoxy Die Attach Material: Ablestik 84-1LMISR4 84-1LMISR4 . Wire Bond Method: Gold Ball Bond Wire Material/Size: Gold / 1.3 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 3. Assembly .. Tags: Cypress Semiconductor 84-1lmis* datasheet abstract.. | 16.07 Kb | 4 Pages | Original | |
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First line: 400-mil Package Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 400-mil Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H 8361H . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. Tags: Cypress Semiconductor datasheet abstract.. | 15.96 Kb | 4 Pages | Original | |
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First line: 9734* TSOP Package Hyundai, Korea Assembly Cypress Semiconducto Assembly: Hyundai, Korea Package: TSOP Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H 8361H . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. Tags: 9734* hyundai Semiconducto datasheet abstract.. | 15.88 Kb | 4 Pages | Original | |
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First line: 48/56 SSOP Package Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: SSOP Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H 8361H . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 1. Assembly Line ID .. Tags: Cypress Semiconductor Ablestik datasheet abstract.. | 16.24 Kb | 4 Pages | Original | |
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First line: 9718* SOIC Omedata-Indonesia Assembly Cypress Semiconductor Assembly: Omedata, Indonesia Package: 150-mil SOIC Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4 84-1LMISR4 . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 1. Assembly .. Tags: 9718* EME-6300 Cypress Semiconductor Ablestik datasheet abstract.. | 14.79 Kb | 4 Pages | Original | |
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First line: SSOP Package Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: SSOP Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4 84-1LMISR4 . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 1. Assembly .. Tags: Ablestik* datasheet abstract.. | 15.54 Kb | 4 Pages | Original | |
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First line: CEL9200 cel hitachi Package Hitachi CEL9200 Mold Compound Omedata, Indonesia Assembly Cypress Semiconductor Assembly: Omedata, Indonesia Package: Hitachi 9200 Mold Compound Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H 8361H . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 1. Assembly Line ID .. Tags: cel hitachi CEL9200 cel hitachi 00104 CEL9200 | 15.01 Kb | 4 Pages | Original | |
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First line: Pins TQFP Package (14x20x1.4mm) ASE, Taiwan Assembly Cypress Semiconductor Assembly: ASE, Taiwan Package: TQFP Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H 8361H . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. Tags: Cypress Semiconductor a112 datasheet abstract.. | 14.73 Kb | 4 Pages | Original | |
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First line: SUMITOMO EME6600 PLCC Philippines CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Abstract: .. Die Attach Method: Silver Epoxy Die Attach Material: Ablestik 841 LMISRA. Wire Bond Method: Thermosonic Wire Material/Size: Au 1.3 mil Wire. Assembly Line Process Flow: 49-49999. Name/Location .. Tags: SUMITOMO EME6600 report on PLCC Cypress Semiconductor 99053 datasheet abstract.. | 11.77 Kb | 4 Pages | Original | |
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First line: Package Cypress Philippines Assembly Cypress Semiconducto Assembly: Cypress Philippine Package: Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H 8361H . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 1. Assembly Line ID .. Tags: Semiconducto philippine Cypress Semiconductor datasheet abstract.. | 16.16 Kb | 4 Pages | Original | |
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First line: bga 388 Package ASE, Taiwan Assembly CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8355. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. Tags: bga 388 plaskon Cypress Semiconductor 99043 datasheet abstract.. | 11.65 Kb | 4 Pages | Original | |
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First line: 450-mil SOIC Package Taiwan Assembly Cypress Semiconductor Assembly: ASE, Taiwan Package: 32Ld, 450-mil SOIC Abstract: .. Die Attach Method: Silver Epoxy Die Attach Material: Ablestik 8361H 8361H . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 3. Assembly .. Tags: Cypress Semiconductor CY7C1048 datasheet abstract.. | 15.95 Kb | 4 Pages | Original | |
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First line: STSOP Package OSE, Taiwan Assembly Cypress Semiconductor Assembly: OSE, Taiwan Package: STSOP Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4 84-1LMISR4 . Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 3. Assembly .. Tags: Cypress Semiconductor datasheet abstract.. | 16.01 Kb | 4 Pages | Original | |
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