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1 - 50 of about 253 for Ablestik |
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First line: Cypress Semiconductor Reflow Qualification Report VERSION November 235°C Solder Reflow Profile TSOP Abstract: .. Die Attach Supplier: Ablestik. Die Attach Material: Ablestik 8361H. Bond Diagram Designation 10-03049. Wire Bond Method: Thermosonic. Wire Material/Size: Gold, 1.0mil. Thermal Resistance Theta .. datasheet abstract.. |
21.92 Kb |
6 Pages |
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First line: PILOT TECHNICAL DATASHEET ELECTRICALLY CONDUCTIVE ATTACH ADHESIVE DESCRIPTION ABLEBOND 8200C bleed attach Abstract: .. APPLICATION GUIDELINES SHIPMENT This Ablestik product is packed and shipped in dry ice at -80°C. Inside every dry ice shipment of Ablestik’s products is a small packet containing the ABLECUBE .. datasheet abstract.. |
327.4 Kb |
3 Pages |
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First line: DEVELOPMENTAL TECHNICAL DATASHEET THERMALLY CONDUCTIVE ATTACH ADHESIVE DESCRIPTION ABLEBOND 2815A attach adhesive Abstract: .. Service Fax 310 764-1783 For a technical contact nearest you, visit www.ablestik.com The information given and the recommendations made herein are believed to be accurate but no guarantee .. datasheet abstract.. |
316.3 Kb |
3 Pages |
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First line: Cypress Semiconductor Mold Compound Qualification Report VERSION January Sumitomo Mold Compound MSL3 Abstract: .. Die Attach Supplier: Ablestik. Die Attach Material: Ablestik 8361. Bond Diagram Designation 10-03379. Wire Bond Method: Thermosonic. Wire Material/Size: Gold/ 1.3mil. Thermal Resistance Theta .. datasheet abstract.. |
23.69 Kb |
8 Pages |
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First line: Boulevard Dallas Texas Wafer IOTA A07s Final Change Notification Dear Customer This Abstract: .. Die Attach Supplier ABLESTIK ABLESTIK ABLESTIK ABLESTIK. Moisture Level: LEVEL3-220C LEVEL3-260C LEVEL3-260C LEVEL3-260C. Qualification: Plan Test Results. Texas Instruments PCN# 20050304000 .. datasheet abstract.. |
34.84 Kb |
3 Pages |
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First line: DALLAS SEMICONDUCTOR South Beltwood Parkway Dallas Texas 75244-3292 371-4000 Date Subject Description Abstract: .. device will be assembled with Sumitomo 6600 mold compound and Ablestik Ablebond 8361J die attach adhesive. The change in material is intended to enhance the moisture sensitivity characteristics .. datasheet abstract.. |
10.54 Kb |
1 Pages |
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First line: Simtek Corporation Product Change Notification PCN Home page E-mail Buckingham Drive Abstract: .. Simtek has been evaluating Sumitomo G600 "Green" mold compound and Ablestik 8290 epoxy die attach paste as a more suitable material set for the 260C JEDEC-020C peak reflow temperature requirement .. datasheet abstract.. |
20.37 Kb |
2 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION Nitto MP-8000 Molding Compound Plastic Quad Flat Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil. JESD22-A112 Moisture Sensitivity Level Level 5. Assembly .. datasheet abstract.. |
11.18 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION January TSOP Package Sumitomo Mold Compound Anam Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 4-1LMISR4. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line .. datasheet abstract.. |
14.67 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION April Thin Small Outline Package TSOP Anam Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Test results met .. datasheet abstract.. |
14.72 Kb |
4 Pages |
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First line: Integrated Device Technology Inc. PRODUCT / PROCESS CHANGE NOTICE PCN Abstract: .. RP-119-4 / ABLESTIK. Wire Bond. : GL2 1.0mil Au TANAKA GL2 1.0mil Au TANAKA GL2 1.0mil Au .. datasheet abstract.. |
21.1 Kb |
3 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION November PLCC Philippines CYPRESS TECHNICAL CONTACT QUALIFICATION Abstract: .. Die Attach Method: Silver Epoxy Die Attach Material: Ablestik 841 LMISRA. Wire Bond Method: Thermosonic Wire Material/Size: Au 1.3 mil Wire. Assembly Line Process Flow: 49-49999. Name/Location .. datasheet abstract.. |
11.77 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION Package Taiwan Assembly CYPRESS TECHNICAL CONTACT QUALIFICATION Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8355. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. datasheet abstract.. |
11.65 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION July 400-mil Package Cypress Philippines Assembly Cypress Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. datasheet abstract.. |
15.96 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report Version July SSOP Package Anam Korea Assembly Cypress Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 1. Assembly .. datasheet abstract.. |
15.54 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report Version March TSOP Type Taiwan Assembly Cypress Semiconductor Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. datasheet abstract.. |
16.77 Kb |
5 Pages |
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First line: Cypress Semiconductor Qualification Report Version December SSOP Package Anam Korea Assembly Cypress Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 1. Assembly .. datasheet abstract.. |
15.73 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION January Package Hitachi CEL9200 Mold Compound Omedata Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 1. Assembly Line ID .. datasheet abstract.. |
15.01 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION January TSOP Package Hyundai Korea Assembly Cypress Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. datasheet abstract.. |
15.88 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION August Package Cypress Philippines Assembly Cypress Semiconducto Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 1. Assembly Line ID .. datasheet abstract.. |
16.16 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION August SSOP Package Cypress Philippines Assembly Cypress Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 1. Assembly Line ID .. datasheet abstract.. |
16.24 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION October Pins TQFP Package 14x20x1.4mm Taiwan Assembly Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. datasheet abstract.. |
14.73 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report Version February STSOP Package Taiwan Assembly Cypress Semiconductor Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly .. datasheet abstract.. |
16.01 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION August 450-mil SOIC Package Taiwan Assembly Cypress Abstract: .. Die Attach Method: Silver Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly .. datasheet abstract.. |
15.95 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION November SOIC Omedata-Indonesia Assembly Cypress Semiconductor Assembly Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 1. Assembly .. datasheet abstract.. |
14.79 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report Version December TSSOP Package Anam Philippines Assembly Cypress Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 1. Assembly .. datasheet abstract.. |
15.93 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION March TSOP Type Package Anam-Seoul Korea Assembly Abstract: .. Die Attach Method: Silver Epoxy Die Attach Material: Ablestik 84-1LMISR4. Wire Bond Method: Gold Ball Bond Wire Material/Size: Gold / 1.3 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly .. datasheet abstract.. |
16.07 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION August Pins PLCC Omedata Assembly Cypress Semiconductor Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil. JESD22-A112 Moisture Sensitivity Level Level 1. Assembly .. datasheet abstract.. |
15.73 Kb |
4 Pages |
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First line: Cypress Semiconductor Test Site Qualification Report VERSION September Test Site Qualification Timing Abstract: .. Die Attach Supplier: Ablestik. Die Attach Material: 84-1LMIS. Bond Diagram Designation 10-03628. Wire Bond Method: Thermosonic. Wire Material/Size: 1.0mil. Thermal Resistance Theta JA °C/W: 102 .. datasheet abstract.. |
12.44 Kb |
4 Pages |
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First line: Cypress Semiconductor Package Qualification Report VERSION April Lead 400mil Package Level Omedata Abstract: .. Die Attach Method: Silver Epoxy Die Attach Material: 8361H Ablestik. Wire Bond Method: Thermosonic Wire Material/Size: Au 1.3 mil. Moisture Level : Level 2 220°C+ 5,-0°C Thermal Resistance .. datasheet abstract.. |
12.04 Kb |
4 Pages |
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First line: Cypress Semiconductor Test Site Qualification Report VERSION September Test Site Qualification Timing Abstract: .. Die Attach Supplier: Ablestik. Die Attach Material: 8361H. Bond Diagram Designation 10-03065. Wire Bond Method: Thermosonic. Wire Material/Size: 1.0mil. Thermal Resistance Theta JA °C/W: 108 .. datasheet abstract.. |
12.45 Kb |
4 Pages |
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First line: Cypress Semiconductor Package Qualification Report VERSION December Lead Fine Pitch Ball Grid Abstract: .. Die Attach Supplier: Ablestik. Die Attach Material: Ablestik 8355F. Bond Diagram Designation 10-03532. Wire Bond Method: Thermosonic. Wire Material/Size: Gold 1.0mil. Thermal Resistance Theta .. datasheet abstract.. |
17.02 Kb |
5 Pages |
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First line: Cypress Semiconductor Package Qualification Report VERSION April Lead Fine Pitch Ball Grid Abstract: .. 8355F Ablestik. Wire Bond Method: Thermosonic Wire Material/Size: Au ≤1.3 mil. Assembly Line Process Flow: 49-41010M. Moisture Level : Level 3 220°C+ 5,-0°C Thermal Resistance JA °C/W: 29.9 .. datasheet abstract.. |
15.28 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION December Lead TSOP type package Moisture Level Abstract: .. Die Attach Method: Silver Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil. Thermal Resistence Theta JA 57. Assembly Line Process Flow .. datasheet abstract.. |
13.93 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION September Lead PQFP Taiwan CYPRESS TECHNICAL CONTACT Abstract: .. Die Attach Method: Silver Epoxy Die Attach Material: Ablestik 8361. Wire Bond Method: Thermosonic Wire Material/Size: 1.0/1.3 mils. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly .. datasheet abstract.. |
10.63 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report 98191 / 92VERSION August TSOP Type Package Gateway Electronics Philippines Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. datasheet abstract.. |
15.52 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION June STSOP Package Cypress Philippines Assembly Cypress Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 1. Assembly Line ID .. datasheet abstract.. |
16.4 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION July TSOP Package Sumitomo EME-7351 Molding Compound Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. datasheet abstract.. |
16.49 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report Version March SSOP Package Cypress Philippines Assembly Cypress Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 1. Assembly Line ID .. datasheet abstract.. |
16.5 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION October Backgrind Wafer Elimination mils mils package Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361A. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil. JESD22-A112 Moisture Sensitivity Level Level 1 & Level 3. packages .. datasheet abstract.. |
17.38 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION June Pins TQFP Package Cypress Philippines Assembly Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. datasheet abstract.. |
16.53 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION June TSOP Package Cypress Philippines Assembly Cypress Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. datasheet abstract.. |
16.47 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION February TSOP Package Size Cypress Philippines Assembly Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 3. Assembly Line ID .. datasheet abstract.. |
16.34 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION June 300-mil Package Cypress Philippines Assembly Cypress Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 1. Assembly Line ID .. datasheet abstract.. |
16.55 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION April SOIC Package Cypress Philippines Cypress Semiconductor Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1LMISR4. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil. JESD22-A112 Moisture Sensitivity Level Level 1. Assembly .. datasheet abstract.. |
17.07 Kb |
5 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION April Wafer Thickness All package families except Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 84-1MISR4. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil. JESD22-A112 Moisture Sensitivity Level Level 1 & Level 3. Assembly .. datasheet abstract.. |
19.61 Kb |
4 Pages |
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First line: Qualification Report October Version Thin Small Outline Package Lead TSOP Type CYPRESS Abstract: .. Die Attach Material: Ablestik. Wire Material/Size: Gold / 1.0 mils Hyundai, Korea Gold /1.3 mils Anam, Phillipine Name/Location of Assembly prime facility: Hyundai, Korea. Anam, Phillipine .. datasheet abstract.. |
28.9 Kb |
5 Pages |
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First line: Cypress Semiconductor Package Qualification Report VERSION March Reflow Profile 100-pin TQFP Anam Abstract: .. Die Attach Method: Epoxy Die Attach Material: 8361H Ablestik. Wire Bond Method: Thermosonic Wire Material/Size: 1.0,1.25 or 1.3 mil. Al or Au wire. For Mark Quals, Ink Type/Manufacturer If Laser .. datasheet abstract.. |
12.72 Kb |
4 Pages |
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First line: Cypress Semiconductor Qualification Report VERSION June TSOP Type Package Cypress Philippines Assembly Abstract: .. Die Attach Method: Epoxy Die Attach Material: Ablestik 8361H. Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.0 mil. JESD22-A112 Moisture Sensitivity Level Level 3 220°C+ 5,-0°C .. datasheet abstract.. |
12.02 Kb |
4 Pages |
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First line: Cypress Semiconductor Package Qualification Report VERSION July Leads Hitachi Molding Compound Cypress Abstract: .. Die Attach Method: Epoxy Die Attach Material: 8361H Ablestik. Wire Bond Method: Thermosonic Wire Material/Size: Au 1.00 mil. Moisture Level : Level 1. Thermal Resistance JA: 58. Name/Location of .. datasheet abstract.. |
11.54 Kb |
4 Pages |
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