| Fulltext Datasheet Results |
1 - 50 of about 10000+ for ASE |
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First line: PROCESS CHANGE NOTICE PCN0113 ADDITIONAL ASSEMBLY LOCATION Change Description: Altera adding FineLine package capability ASE's assembly location Kaohsiung, Taiwan. Abstract: .. Altera is adding FineLine BGA and QFP package capability at ASE’s assembly location in Kaohsiung, Taiwan. Reason For Change: ASE Malaysia is already a strategic manufacturing partner for Altera .. Tags: PCN0113 |
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First line: epm7032 epm7032 plcc altera EPM7032 January 1995 Dear Customer: Altera will adding EPM7032 Intel products manufactured Penang. been selected because it's excellent reliability test performance, their ability accommodate Altera's high volume capacity requirements, organization's ability flexibly test Abstract: .. Altera will be adding the EPM7032 EPM7032 to the Intel products manufactured at ASE Penang. ASE has been selected because of it’s excellent reliability and test performance, their ability to accommodate .. Tags: altera EPM7032 epm7032 plcc epm7032 EPM7032 |
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First line: Subminiature Slide Switches Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength: Operating temperature: Mechanical life: Contacts: Terminals: Material: Mounting: Soldering conditions: max. AC/DC, max. min. AC/DC, duration minute minimum operations phosphor Abstract: .. Accessories for ASE 1. Supporting bracket AZ 0009. Special pin configuration: Subminiature slide switch with 5,08 mm spacing. Additional to type number: –1 Example of order: ASE 2D – RA – 1. One pole .. Tags: datasheet abstract.. |
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First line: tsmc* PROCESS CHANGE NOTIFICATION PCN0410 ADDITIONAL ASSEMBLY, TEST, LOCATION Change Description: Altera adding TSMC/ASE Taiwan joint venture line flip-chip assembly site. Reason Change: Abstract: .. Altera is adding the TSMC/ASE Taiwan joint venture line as a new flip-chip assembly site. Reason For Change: Altera has established a partnership with TSMC/ASE Taiwan as a strategic manufacturing .. Tags: tsmcÂ* PCN0410 |
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First line: Abstract: .. F"ASE \\8GHT5_Q7LBS 2JKgJ. """"'''"",,,," '"'"'' ""'''T """"""'[I'RE'""" A. :,', , -- _. "'"-"'''E" ,- - . , .. - 00- .&. WllfffJJ ~ 1M. OUTLINE DRAWING HTe F CASE - A. T. , " "",L,L. 'c""''''' -" , ,..,,- .. Tags: |
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First line: with Backshell Accommodate MS3057 Cable Clamp (Not Included) 18-11 MIL-C-26482 Series Type Grounding Fingers (Omit Standard) Straight Plug Connector Class Crimp Contact with Backshell Code Options Table Alternate Insert Rotation Omit Normal Contact Gender Socket Shell Size Insert Arrangements Straig Abstract: .. IPT 06 ASE. Straight Plug Connector with Backshell to Accommodate MS3057 MS3057 Cable Clamp Not Included APPLICATION NOTES. 1. Straight plug with backshell for attachment of cable clamp MS3057-A MS3057-A /B .. Tags: MS3057 |
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First line: CARSEM* BCD6* Plant morocco PRODUCTION LOCATION Standard Linear production plants located indicated herebelow Abstract: .. ASE Malaysia/Taiwan Subcontractor. Chippac China Subcontractor. DIP14 DIP14 / 16 Muar Malaysia STMicroelectronics plant. ASE Malaysia/Taiwan Subcontractor. Chippac China Subcontractor. DIP20 DIP20 Muar .. Tags: Plant BCD6* CARSEM* transistor to92 transistor jfet SO20 Package so14 package Plant morocco JFET Transistor hf2c* DIP8 Package DIP8 and so Package DIP14 datasheet abstract.. |
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First line: 10-Base-T Multiport Repeater CY7C981 Cypress Semiconductor Multiport Repeater Device: CY7C981 Package: PLCC Abstract: .. Name/Location of Die Fab prime Facility: TSMC/ASE, Taiwan. Die Fab Line ID/Wafer Process ID: TSMC /SPDM. Cypress Semiconductor QTP# 96441, V. 1.0. Multiport Repeater Page 3 of 7. Device: CY7C981 CY7C981 .. Tags: tsmc Activation Energy J 96 CY7C981 |
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First line: Subminiature Slide Switches Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength: Temperature range: Mechanical life: Contacts: Terminals: Material: Mounting: Soldering conditions: max. AC/DC, max. min. AC/DC, duration minute minimum operations phosphor bron Abstract: .. Accessories for ASE 1. Supporting bracket AZ 0009. Special pin configuration: Subminiature slide switch with 5,08 mm spacing. Additional to type number: ‐1 Example of order: ASE 2D ‐ RA ‐ 1. Exceptions .. Tags: limit switch bracket datasheet abstract.. |
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First line: Peripheral Controller with Support CY82C693U Pins PQFP Cypress Semiconductor Peripheral Controller with Support Devices:CY82693U Package: pins PQFP Abstract: .. Assembly Line ID and Process ID: ASE, Malaysia. Note: Please contact a Cypress Representative for other packages availability. Cypress Semiconductor QTP# 97114/97135, V1.0. Peripheral Controller .. Tags: 3708* CY82C693U |
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First line: BCD6* CARSEM morocco CARSEM* PRODUCTION LOCATION STANDARD LINEAR production plants located indicated herebelow DIFFUSION LOCATION PLANT Carrollton Crolles Agrate Phoenix COUNTRY Singapore Singapore France Italy WAFER SIZE ASSEMBLY LOCATION PACKAGE DIP8 AREA Shenzhen Chippac Amkor Muar Shenzhen Chipp Abstract: .. Shenzhen ASE Chippac AIT. Malaysia China. Malaysia/Taïwan China Indonesia. STMicroelectronics plant STMicroelectronics plant Subcontractor Subcontractor. Subcontractor. DIP20 DIP20 Muar Malaysia .. Tags: CARSEM* morocco CARSEM BCD6* to92 mini SO8 package DIP14 China Semiconductor amkor BCD60 |
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First line: PentiumTM hyperCacheTM Chipset Peripheral Controller CY82C693, 208-Pin Plastic Quad Flatpack Pentium trademark Intel Corporation hyperCache trademark Cypress Semiconductor Corporation Abstract: .. Name/Location of Assembly prime facility: ASE, Malaysia. Note: Please contact a Cypress Representative for other package availability. CYPRESS. SEMICONDUCTOR. PAGE 4. RELIABILITY TESTS PERFORMED .. Tags: 82c693 CY82C693 |
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First line: Clocks Motherboards CY2287 L28EPD Technology Spread Spectrum Clock Synthesizer/Driver with USB, Hublink SDRAM Support Abstract: .. CY82C693-NC CY82C693-NC ASE-J 2821994 619807947 48 168 0. CY82C693-NC CY82C693-NC ASE-J 2820922 619807948 48 168 0. CY82C693-NC CY82C693-NC ASE-J 2822021 619808385 48 167 0. --------------------------------------------------------------------------------------------------------------- .. Tags: CY2287 |
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First line: MALAYSIA February 2010 CN-02012010_MSA Customer Notification M823XX-Product Family Addition Assembly, Test Ship Facility Abstract: .. This notice is to inform you that Mindspeed Technologies is in the process of qualifying ASE Malaysia as a second source for assembly, test and shipping facility for M823XX M823XX product family. Details .. Tags: MALAYSIA CN-02012010 MSA |
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First line: PROCESS CHANGE NOTIFICATION PCN0411 ADDITIONAL TEST FINISHED GOODS INVENTORY LOCATION Change Description: Altera adding Taiwan (ASET) Test Finished Goods Inventory (FGI) location. Abstract: .. Altera is adding ASE Taiwan ASET as a new Test and Finished Goods Inventory FGI location. Reason For Change: ASET is already a strategic manufacturing partner for Altera’s existing products .. Tags: PCN0411 |
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First line: BACKSHELL grommet connector backshell STRAIGHT Glenair Series Bayonet-Lock High Performance Crimp Contact (MIL-C-26482 Type) Styles Classes Series Bayonet Lock Connectors Connector/Backshell Class Abstract: .. ASE: For general-duty applications. This connector-backshell assembly is supplied with a general-duty backshell for the attachment of additional accessories such as MS 3057 cable clamps .. Tags: backshell STRAIGHT grommet connector BACKSHELL datasheet abstract.. |
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First line: FineLine BGATM Packages Altera adding ASAT additional sources supply FineLine BGATM packages currently assembled ANAM Philippines Korea. This change will affect FineLine BGATM package outline thickness*, which will result 2.10mm maximum package thickness. However, this change will affect moisture ra Abstract: .. Altera is adding ASAT and ASE as additional sources of supply for the FineLine BGA TM packages currently assembled by ANAM in the Philippines and Korea. This change will affect the FineLine BGA .. Tags: ADV9912 |
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First line: imax Abstract: .. ~nF ~ ,1----+-1 ASE. RT 82k. ~ nF. :~: GNDA. 1>- r-ADC. ~ LJ I. FREQ PWM. t= . . . ~ ;u 0. R1. ~ .. '1.'1. AGC .. Tags: imax |
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First line: CvDD Cref CvDDA Abstract: .. ASE. GNDs .. Tags: datasheet abstract.. |
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First line: M21121G-11 July 2008 CN071008 Customer Notification PBGA Marking Change Abstract: .. July 10, 2008 CN071008 CN071008 . Customer Notification ASE PBGA Marking Change. 2xxxx-PCN-007-A 2xxxx-PCN-007-A Page 1 of 2. Dear Valued Customer: This notification is for the purpose of informing you that Mindspeed is .. Tags: M21121G-11 CN071008 |
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First line: mold compound nitto hc100 Denko HC100* PROCESS CHANGE NOTIFICATION PCN0415 ADDITIONAL MOLD COMPOUND FBGA PACKAGES FROM MALAYSIA Change Description: Nitto Denko HC100-XJ series mold compound being added additional mold compound choice Altera® FineLine BGA® packages assembled Malaysia. This ch Abstract: .. PROCESS CHANGE NOTIFICATION PCN0415 PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA. Change Description: The Nitto Denko HC100-XJ HC100-XJ series mold compound is being added as an additional .. Tags: HC100* Denko nitto hc100 mold compound PCN0415 |
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First line: RSOA 1550CRI Reflective Optical Amplifier Chip 1.55 Abstract: .. ASE Output Power @250 mA mW 8 10. ASE Ripple @ 50 mA dB 0.2 0.5. 3 dB Optical Bandwidth nm 40 50. ASE Center Wavelength @ nm 1530 1550 1570. Features. High Output Power. Low internal ripple. Product Description .. Tags: Opto Speed SA datasheet abstract.. |
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First line: RSOA 1550MRI Reflective Optical Amplifier Chip 1.55 Abstract: .. ASE Output Power @250 mA mW 8 10. ASE Ripple @ 50 mA dB 0.2 0.5. 3 dB Optical Bandwidth nm 40 50. ASE Center Wavelength @ nm 1530 1550 1570. Features. High Output Power. Low internal ripple. Product Description .. Tags: Opto Speed SA datasheet abstract.. |
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First line: Abstract: .. "] will move from Amkor Technologies' Seoul, S Korea Plant ATK1 to ASE [Chung-Li] Inc plant in Chung-Li, Tawian. The overall external footprint dimensions for the package will not change. The .. Tags: SIMTEK STK22C48 datasheet abstract.. |
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First line: Pins TQFP Package (14x20x1.4mm) ASE, Taiwan Assembly Cypress Semiconductor Assembly: ASE, Taiwan Package: TQFP Abstract: .. ASE, Taiwan Assembly. Cypress Semiconductor QTP# 97302, V. 1.0. Assembly: ASE, Taiwan Page 2 of 4. Package: TQFP June, 1997. PLASTIC PACKAGE/ASSEMBLY DESCRIPTION. Package Outline, Type, or Name .. Tags: Cypress Semiconductor a112 datasheet abstract.. |
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First line: Package ASE, Taiwan Assembly CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Abstract: .. ASE, Taiwan Assembly. CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor Quality and Reliability Department. Cypress Semiconductor QTP# 99043, V. 1.0. Assembly: ASE, Taiwan .. Tags: plaskon Cypress Semiconductor 99043 datasheet abstract.. |
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First line: 450-mil SOIC Package Taiwan Assembly Cypress Semiconductor Assembly: ASE, Taiwan Package: 32Ld, 450-mil SOIC Abstract: .. ASE - Taiwan Assembly. Cypress Semiconductor QTP# 97184, V. 1.0. Assembly: ASE, Taiwan Page 2 of 4. Package: 32Ld 32Ld , 450-mil 450-mil SOIC August, 1997. PLASTIC PACKAGE/ASSEMBLY DESCRIPTION. Package Outline .. Tags: Cypress Semiconductor CY7C1048 datasheet abstract.. |
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First line: CY82C691-NC* PentiumTM hyperCacheTM Chipset System Controller CY82C691, 208-Pin Plastic Quad Flatpack Pentium trademark Intel Corporation hyperCache trademark Cypress Semiconductor Corporation Abstract: .. Name/Location of Assembly prime facility: ASE, Malaysia. Note: Please contact a Cypress Representative for other package availability. CYPRESS. SEMICONDUCTOR. PAGE 4. RELIABILITY TESTS PERFORMED .. Tags: CY82C691-NC* CY82C691 3601* 130c cap CY82C691 |
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First line: QRFS0001 QUALIFICATION REPORT M25P10 Using CMOST6X-U35 Technology Agrate Table Product Process being Qualified Product M25P10 Package Process Line Abstract: .. 150 C, 168 hr ASE 0/38. 150 C, 504 hr ASE 0/38. 150 C, 1008 hr ASE 0/38. 3 Temperature Cycling Mil Std 883 Method 1010C 1010C . ‐40 C / +150 C, 100 cycles Muar 0/60. ‐40 C / +150 C, 500 cycles Muar 0/60. ‐40 C / +150 .. Tags: QRFS0001 |
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First line: Cypress Semiconductor Mold Compound Qualification Report Sumitomo 7320 Mold Compound, MSL3 DCD-Thin Quad Flat Pack, (TQFP) Taiwan CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Abstract: .. for DCD-Thin Quad Flat Pack, TQFP ASE Taiwan. CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Rene Rodgers. Reliability Director Staff Reliability Engineer. 408 432-7069 408 .. Tags: Ablestik 7320 datasheet abstract.. |
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First line: Interfacing DP8422A 68020 (Zero Wait State Burst Mode Access) Interfacing DP8422A 68020 (Zero Wait State Burst Mode Access) INTRODUCTION This application note describes interfacing DP8422A DRAM controller (also applicable DP8420A 21A) 68020 with slower memories This design based upon burst mode acce Abstract: .. * /A24 * /A25 * FC2 * /FC1 * FC0 a /A23 * /A24 * /A25 * FC2 * FC1 * /FC0 /UUDE e /A0 * /A1 * /DSE * /ASE /UMDE e /SIZ0 * /A1 * /DSE * /ASE a A0 * /A1 * /DSE * /ASE a SIZ1 * /A1 * /DSE * /ASE /LMDE e /A0 * /A1 * /DSE * /ASE a /A1 .. Tags: F245 E142 ALS6311 |
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First line: IR ic 04-1 IRMCK201 Design Solution Application: 230V system implementation Encoder Based Digital Servo Control 380/460V system implementation Encoder Based Digital Sero Control Abstract: .. ase or IR22381 IR22381 3Ph. ase Enc. IR 2. 175. IR 2. 175. A/D. ex te. rna l. br ak. e r. e s i s t. o r. Re c. ti fi e. r. G a te. D r i. v e .. ase or IR22381 IR22381 3Ph. ase IR22141 IR22141 1Ph. ase or IR22381 IR22381 3Ph. ase bu ff. e r. bu ff. e r. IR GP3. 0 B1. 20 KDE. IR .. Tags: IR ic K201 IRMCK201 ir22381 4bc20* IRMCK201 |
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First line: to160 Lead Thin Quad Flat Pack Sumitomo 7320 Mold Compound Taiwan CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Abstract: .. ASE Taiwan. CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069. Cypress Semiconductor QTP# 000303, V. 1.0. Package: Up to 160 Lead Thin Quad Flat .. Tags: Ablestik* 7320 to160 |
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First line: Ablestick M82108G-13 CEL9750* October 2009 CN-103009 Customer Notification M821XX Second Source Assembly Site Abstract: .. for the M821XX M821XX product family, Mindspeed is qualifying a second assembly si te at ASE Malaysia. The table below identifies the products that can no w be assembled at both Amkor in Korea and ASE in .. Tags: CEL9750* M82108G-13 Ablestick CN-103009 |
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First line: 0815 SERIES Operating oltage 250/480 Delta Operating Current Max= amps Operating Frequency 60Hz Operating Temperature +50oC Diel thstand se)= 2500V ~for Min. Diel thstand 2500V Min. eakage current 250V ~60Hz= 0.35 250V 50Hz Residual oltage after secs olts Agency Approvals 2Amps UL,C SA,TUV. Pending Abstract: .. Diel W ithstand L to C ase = 2500 V~for 1 Min. Diel W ithstand L to L = 2500 Vdc for 1 Min. Leakage current @ 250 V~60Hz 60Hz = 0.35 mA at 250 Vac, 50Hz 50Hz . Max Residual Voltage after 5 secs = 6 Volts Max. Agency Approvals .. Tags: delta 2500 ase filter datasheet abstract.. |
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First line: 3.3Vdc CMOS COMPATIBLE CRYSTAL CLOCK OSCILLATOR SERIES APPLICATIONS: Suitable high density reflow capable Tight stability option clock camera Equipment connected cards Thin equipment Abstract: .. ASE SERIES. • CCD clock for VTR camera • Equipment connected to PC or PC cards • Thin equipment. • Compact and low in height • Low current consumption • Tri state function. • Suitable .. Tags: datasheet abstract.. |
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First line: Block Diagram SH-3 Abstract: .. A/D converter ASE memory Advanced user debugger Bus state controller Cache memory Cache memory controller Compare match timer Clock pulse generator/watchdog timer Central processing unit .. Tags: serial communications interface IrDA SH-3 |
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First line: Block Diagram Figure shows internal block diagram SH7622. Y-bus Abstract: .. ADC: A/D converter ASERAM: ASE memory AUD: Advanced user debugger BSC: Bus state controller CACHE: Cache memory CCN: Cache memory controller CMT0: Compare match timer 0 CMT1: Compare match timer .. Tags: SH7622 |
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First line: Block Diagram SH-3 Abstract: .. A/D converter ASE memory Advanced user debugger Bus state controller Cache memory Cache memory controller Compare match timer Clock pulse generator/watchdog timer Central processing unit .. Tags: serial communications interface irda DMAC SH-3 |
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First line: 2.8V SINGLE-ENDED AUDIO SIGNAL DIFFERENTIAL AUDIO SIGNAL Abstract: .. X IT H-i < IZ CVDD1 1 < -1- CvDD2 X 100 nF X 100 nF - - VdD1 VdD2 Vdda ASE SW FB AD1 R1 G1 AD2 B1 LP3950 LP3950 R2 SERIAL INTERFACE G2 NRST B2 PWM_LED RT IF_SEL VREF Vddjo DME AMODE GNDs Vin O— I Ll z CvDDA  C|N 4.7 |iH .. Tags: datasheet abstract.. |
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First line: light sensor jlxF TlOO JlO^iF BATTERY VDDA 1mf, CREF -II-1 Abstract: .. '-0 AUDIO INPUT IRGB IRT 50 51 SCK/SCL SS/SDA SYNC/PWM VDDIO IF SEL EN FLASH ASE -fYYfl- L1 4.7 nH SW LP3954 LP3954 GNDs. I I COUT 10 |nF y y y y y y y y y y y —VW—I"' l^^ = 300..400 mA ^OUT : 'MAX " V℠,-r = 4.. .. Tags: light sensor datasheet abstract.. |
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First line: Nitto MP 7000 PROCESS CHANGE NOTICE PCN0310 MOLD COMPOUND CHANGE LEAD PACKAGE Change Description: Malaysia will extending Nitto's MP-8000 series mold compound Altera's lead Quad Flat Package. Currently this package using Sumitomo's EME-6300 series compound. Nitto MP-8000 series compound been success Abstract: .. Change Description: ASE Malaysia will be extending the use of Nitto’s MP- 8000 series mold compound to Altera’s 100 lead Quad Flat Package. Currently this package is using Sumitomo’s EME-6300 EME-6300 .. Tags: Nitto MP 7000 PCN0310 |
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First line: EME-G700 EME-G700 datasheet EME-G700* SUMIKON EME-G700 G700 PROCESS CHANGE NOTIFICATION PCN0414 STANDARDIZED EME-G700 MOLD COMPOUND TQFP PACKAGES Change Description: Altera will standardizing Sumikon EME-G700 series mold compound mold compound used Altera's Thin Quad Flat Pack (TQFP) packages. TQFP Abstract: .. All TQFP packages assembled at Amkor Korea and ASE Malaysia that are currently assembled with other mold compounds will be standardized on this mold. compound. Reason for Change: Apart from providing .. Tags: G700 SUMIKON EME-G700 EME-G700* EME-G700 datasheet EME-G700 PCN0414 |
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First line: Fujikura Compact, insertion loss High extinction ration: reflection Rugged Design noise reduction variable attenuation Magnetic backing In-Line Polarizer General Photonics offers in-line polarizer (Model POL-001) based integrating micropolarizer rugged stainless steel capsule package. combined with Abstract: .. It can be combined with a PolaRITE polarization controller to reduce ASE noise or function as a variable attenuator. SPECIFICATIONS Model: POL-001 POL-001 . No connectors 0.3 dB typical, 0.5 dB max Insertion .. Tags: Fujikura 91710 POL-001 |
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First line: rele 5v F2MC-8FX Family Product Roadmap 28pin 32pin 48pin Products 64pin 100pin Release 224pin Internal Controller Products Abstract: .. ase. Copyright. 2005 FUJITSU LIMITED All Rights Reserved .. Tags: rele 5v datasheet abstract.. |
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First line: 23.60 TYP- 17.62+0.25 IDENT -SEE DETAIL IONS DESCRIPTION E.C.N. DATE BY/APR'D RELEASE DOCUMENT CONTROL 10943 05/10/95 14.0+0.1 NOTE 2.72 i0.15 Abstract: .. 3. REFERENCE ASE, 100 LD OFP PACKAGE OUTLINE, DRAWING No. 64-06-A000-3470 64-06-A000-3470 . APPROVALS DATE 0 National Semiconduc tor 2900 Semiconductor dr. Sonto Claro, CA 95052-8090 POFP. S . 14 X 20 X 2.7mm .. Tags: datasheet abstract.. |
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First line: Customer Change Notification PRODUCT CHANGE NOTICE PART NUMBER: SP8069 (SP8069DG) No.: 05-0615-1 Abstract: .. in addition to existing qualified subcontractor ASE for 16ld 16ld OPLGA package type. Ordering part number for new Lingsen version is SP8069DG4 SP8069DG4 . Ordering part number for existing ASE version remains .. Tags: SP8069DG sp8069 lingsen SP8069 SP8069DG |
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First line: Fractional Frequency Synthesizer 4GHz content this specification change without notification 1/28/10 Fractional Frequency Synthesizer 4GHz Abstract: .. Ph ase No ise N arro w ban d dBc/H z P/N. F req. R ang e. G Hz Step. Size. KH z Pow er. O utp ut 2. d Bm min. Flat ness. dB F re q. GH z @10. KH z. @100. KHz. @1. MH z. H armo nics. d Bc m ax. Sp uriou s. d Bc max. Swit chin .. Tags: S0540 "Frequency Synthesizer" datasheet abstract.. |
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First line: 100/256 Lead Fine Pitch Ball Grid Array (FBGA) Taiwan CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Abstract: .. ASE Taiwan. CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069. Cypress Semiconductor QTP# 99473, V. 1.0. Package: 100/256 Fine Pitch Ball Grid .. Tags: datasheet abstract.. |
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First line: 292-Pin Package ASE, Taiwan Assembly CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Abstract: .. ASE, Taiwan Assembly. CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor Quality and Reliability Department. Cypress Semiconductor QTP# 98193, V. 1.0. Assembly: ASE, Taiwan .. Tags: Ablebond 8355 9819* datasheet abstract.. |
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