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ALIVH Datasheet

Part Manufacturer Description PDF Type
ALIVH Panasonic Accessories, Printed Wiring Board Original

ALIVH

Catalog Datasheet MFG & Type PDF Document Tags

ALIVH

Abstract: ml 94v-0 Series: Type: ALIVH¨ ALIVHB Japan s - 10721 - mm 80.90 60.70 40.40 20.15 18 150 250 50/50Pad 40/40 4.0 1.4 198DMA 9 s q q q 1MHz Tg CTE m m m m - g/mL ppm/ s q MCMCSPBGA s UL (File No. E36779) UL ANSI Grade (mm) (mm) (mm) (mm) (¡C) (s) (¡C) EBKN1 B 94V-0 Ñ 0.305 0.051 0.102 19.8 260 20 120 UL s ALIVH CSP MCM s MCM CSP MCM ALIVHB ALIVH SMD s q q ACF, C4, SBB, "ALIVH® " -
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ml 94v-0 50/50P

EBKN7 94v-0

Abstract: EBKN7 Printed Wiring Board Japan Series: ALIVHTM Type: ALIVHTM C-type Combination of ALVHTM G , Outer Layer's land have a higher pull strength than "ALIVHTM G-type" RoHS Compliant Item Base , Line/Space µm Build-up Dielectric Constant - (1 GHz) Recommended Applications ALIVHTM , g/mL 2.0 Recognized Standards UL Standard (File No. E36779) Type : ALIVH C-Type , . Construction ALIVH G Type ALIVH C Type Core (ALIVH G-type Base) Build-up layer ALIVH G-type + Build
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EBKN7 94v-0 EBKN7 FR4 dielectric constant 4.6 ALIVH-G

EBKN7 94v-0

Abstract: EBKN7 Printed Wiring Board Japan ¨ Series:ALIVH Type: ALIVH G Any layer IVH structure Multilayer Printed Wiring Board adopts a base material made of woven glass-epoxy resin. ÒALIVH GÓ have a , ALIVH technology. q Easy to design, for shorter design lead time. Items Unit Via Hole Size , modulus GPa 24(´2 Compared to ALIVH) Land adhesion strength Mobile phone Digital Still Camera , Recommended Applications Line/Space N/2mm1 23(´1.4 Compared to ALIVH) s Recognized Standards UL
Panasonic
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multilayer GHz UL94V-0

ALIVH

Abstract: aramid Printed Wiring Board Japan Series:ALIVH Type: ALIVH Any Layer IVH structure Multilayer Printed Wiring Board adopts a base material made of nonwoven aramid and interconnects between arbitrary layers by filling the small via hole formed by laser with copper paste. Industrial Property ; Patent 153 n Properties Non-woven aramid fabric-epoxy resin Base Material n Features 8 Layer , . nBenefit of Any Layer IVH Structure Conventional PWB Through-hole Structure Device ALIVH Solder
Panasonic
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aramid

EBKN7 94v-0

Abstract: EBKN7 Printed Wiring Board Japan Taiwan Series: ALIVHTM Type: ALIVHTM Any Layer IVH structure , . Industrial Property ; Pending Application ­ 130 Registered Patents ­ 50 Type: ALIVHTM G-Type , ALIVHTM G-Type Non-woven aramid Glass-epoxy resin fabric-epoxy resin Base Material Smaller , PC cards µm Via Pad Size Recommended Applications ALIVHTM g/mL 1.4 2.0 Recognized Standards UL Standard (File No. E36779) Type : ALIVH Production site Type UL
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fr4 94v0 UL 94v-0 board A/EBKN7 94v-0

ALIVH

Abstract: 15D18 Printed Wiring Board Series:ALIVH¨ Type: Japan ALIVIL "ALIVIL" have a high pattern accommodation by building "VIL" on any layer IVH structure "ALIVH" s Property of Product q q q q q q q q q q Mobile phone Digital video camera Digital still camera Notebook type Personal , Development Concept Any Layer IVH Build-up ALIVH+VIL Technology Integration Integration Core Layers , 0.019 Density s Recommended Applications ALIVH G(Core Layers) Dielectric constant (1 GHz
Panasonic
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15D18

ALIVH

Abstract: E36779 Series: Type: ALIVH¨ ALIVH Japan 10721 n 1MHz - mm m m m - g/mL 80.95 60.70 150 300 60/70 4.1 1.4 n l l n l l l n UL (File No. E36779) UL ANSI Grade (mm) (mm) (mm) (mm) (¡C) (s) (¡C) EBKN1 B 94V-0 Ñ 0.305 0.051 0.102 19.8 260 20 120 UL n IVH ALIVH IVH 100 ALIVHâ -
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8095 1072-1

ALIVH

Abstract: E36779 Printed Wiring Board Japan Series:ALIVH Type: ALIVH Any Layer IVH structure Multilayer Printed Wiring Board adopts a base material made of nonwoven aramid and interconnects between arbitrary layers by filling the small via hole formed by laser with copper paste. Industrial Property ; Patent 128 s Properties Non-woven aramid fabric-epoxy resin Base Material 8 Layers:0.95 , Conventional PWB ALIVH Through-hole Structure Any Layer IVH Structure Unable to package on
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min60

ALIVH

Abstract: Printed Wiring Board ALIVH® for Bare Chip Mounting Development of new application Industry/Field: AV,OA/Information,Mobile communication The most suitable for Bare Chip Mounting · Development goals: High density, low impedance and high reliability Substrate q Suitable for Substrate of BGA, CSP and MCM q · Features: High density by any layer L/S=50/50µm Low impedance by via in pad and , L/S ALIVH MCM Via Pad Density (g/cc) Tg (°C) CTE (ppm/°C) MST (JEDEL Level 2) PCT ·
Panasonic
Original

ALIVH

Abstract: aramid Printed Wiring Board Japan Series:ALIVH Type: ALIVH-B Any Layer IVH structure Multilayer Printed Wiring Board adopts a base material made of high heat resistance nonwoven aramid and interconnects between arbitrary layers by filling the small via hole formed by laser with copper paste. Industrial Property ; Patent 128 s Properties Non-woven aramid fabric-epoxy resin Base Material 8 , 120 These values are not for PWB designing. s ALIVH for Bare chip mounting s Application q
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2 94v-0 board

ALIVH

Abstract: ® µ µ µ µ µ ALIVH 1 2 3 E K W Panasonic
Panasonic
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ALIVH PCB

Abstract: ALIVH RCC ALIVH Note 7: 2mm 3mm 5. PCB : PCB PCB / PCB www.national.com/jpn
National Semiconductor
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AN-1412 ALIVH PCB JESD22-B111 1NSMD IPC-SM-785 JESD22B111 EIA/JESD51-3

IPC-SM-785

Abstract: ALIVH 5: PCB : ENIG Note 6: PCB RCC ALIVH Note 7: 2mm 3mm 7
National Semiconductor
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pitch 0.4mm BGA

ALIVH

Abstract: 0.3mm pitch csp package : PCB RCC ALIVH 9 www.national.com/jpn/ AN-1112 ( ) FIGURE 10. Flex Test PCB Layout
National Semiconductor
Original
0.3mm pitch csp package 0.3mm pitch BGA SMD CODE wlcsp SMT SMD Devices 185M

JESD22-B111

Abstract: JESD22B111 5: PCB : ENIG Note 6: PCB RCC ALIVH Note 7: 2mm 3mm 7
National Semiconductor
Original
IPC-SM785 1412 SMD NI

AN-1112

Abstract: 0.3mm pitch BGA 4: First Fails : PCB Note 5: PCB : ENIG Note 6: PCB RCC ALIVH FIGURE
National Semiconductor
Original
AN-1112 national

0.3mm pitch csp package

Abstract: 0.3mm pitch package bga 4: First Fails : PCB Note 5: PCB : ENIG Note 6: PCB RCC ALIVH FIGURE
National Semiconductor
Original
0.3mm pitch package bga jp smd code AN100926-26-JP micro pitch BGA ic micro AN1112

JESD22-B111

Abstract: ALIVH , Immersion Gold) Note 6: Test is not sensitive to PCB build-up type (RCC or ALIVH) Note 7: 2 mm & 3 mm
National Semiconductor
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national semiconductor pb-free marking B111 JESD22 400um

ALIVH

Abstract: pcb thermal Design guide trace theta layout build-up type (RCC or ALIVH) Note 7: 2 mm & 3 mm displacement are accelerated test deflection levels, not
National Semiconductor
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pcb thermal Design guide trace theta layout micro solder ball 7x8 64 footprint CSP-9-111C2 CSP-9-111S2

ALIVH

Abstract: JESD22-B111 , Immersion Gold) Note 6: Test is not sensitive to PCB build-up type (RCC or ALIVH) Note 7: 2 mm & 3 mm
National Semiconductor
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gold embrittlement
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