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G861AD04511T1EU
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Amphenol Communications Solutions
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Wafer 2.54mm Pitch STR DIP, 1x4Pin, MATTE TIN, NY66, TAIL=3.4mm, Color-CREAM, Halogen Free, Friction |
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G861AD04101S1HR
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Amphenol Communications Solutions
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Wafer 2.54mm Pitch,STR SMT,1x4Pin,G/F,LCP,Color-Black, T&R W/CAP |
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RAJ2800024H11HPF#GB0
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Renesas Electronics Corporation
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Intelligent Power Device for automotive Application |
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RAJ2800024H12HPF#GB0
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Renesas Electronics Corporation
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Intelligent Power Device for automotive Application |
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RAA2900024H12HPD
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Renesas Electronics Corporation
|
Intelligent Power Device, TO-252-3, / |
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20021121-00024D1LF
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Amphenol Communications Solutions
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Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 24Positions, 1.27mm (0.5inch) pitch. |
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