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FDD86369_F085 Fairchild Semiconductor Corporation 80V, 90A, 5.9 mΩ, DPAKN-Channel PowerTrench, TO252 (D-PAK), MOLDED, 3 LEAD,OPTION AA&AB, 2500/TAPE REEL ri Buy

97-22140-90A

Catalog Datasheet Type PDF Document Tags
Abstract: 57-LRS50-30 7485B 97-DSS50-3 30Au/Ni 97-22140-90 97-22140-90A 97-22240-90 97-22240-90A 97-22360-90 97-22360-90A 97-22500-90 ... Original
datasheet

52 pages,
1006.16 Kb

RS-364 57-20500-270A 77-32360-51 77-32500-52 77-72500 Centronics connector footprint DSS14 Flat Ribbon Connector 2x5 IDC RJ21 rj21 cable connector 57-30500 57-10360 Cinch 97-22640-91 datasheet abstract
datasheet frame
Abstract: Catalog No. C-865 C-865 CIN:APSE ® High Speed Interconnect Technology CIN:APSE ® High-Speed Interconnect Technology High signal speed capability enabling frequencies greater than 20 GHz. Z-Axis, solderless, compression mount interconnect system. Applications include production Land Grid Array (LGA) integrated circuit sockets, flex circuit to PCB, and parallel PCB to PCB interconnections. Provides solutions to many of the problems associated with through hole and surface mount s ... Original
datasheet

280 pages,
5700.02 Kb

MS715 mini circuits 15542 2162R E 70 5059 PTI 30 040 ga MIL-C-83513 connector DIN 41529 C-865 C-865 abstract
datasheet frame
Abstract: Catalog No. C-865 C-865 CIN:APSE ® High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology High signal speed capability enabling frequencies greater than 20 GHz. Z-Axis, solderless, compression mount interconnect system. Applications include production Land Grid Array (LGA) integrated circuit sockets, flex circuit to PCB, and parallel PCB to PCB interconnections. Provides solutions to many of the problems associated with through hole ... Original
datasheet

282 pages,
5720.63 Kb

m24308/4-3f backshell cinch coaxial 1284 M24308/25-9F sd 4842 UL94-V1 5-140-Y Cinch Connectors bacc45ft TB 1226 BN bacc63bn bacc63 MIL-C-39029/31 BACC63BP M22759/33-26-9 C-865 C-865 abstract
datasheet frame
Abstract: Catalog No. C-865 C-865 CIN:APSE ® High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology High signal speed capability enabling frequencies greater than 20 GHz. Z-Axis, solderless, compression mount interconnect system. Applications include production Land Grid Array (LGA) integrated circuit sockets, flex circuit to PCB, and parallel PCB to PCB interconnections. Provides solutions to many of the problems associated with through hole ... Original
datasheet

282 pages,
5720.61 Kb

DIN 41529 OF IC 7909 94v-0 lcd display LGA 478 SOCKET PIN LAYOUT C-865 C-865 abstract
datasheet frame
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