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SG-BGA-7008 Ironwood Electronics BGA Socket; Lid Type : Swivel; Interconnect/Media : Elastomer; Pitch mm : 0.4 to 0.75; Socket Speed (GHz): 10; Operating Temperature: -35 to 100 C; Insertions: 1700 ri Buy
SZL-WL-I Honeywell Sensing and Control General Purpose Limit Switch, Series WL; Ball Bearing Plunger; Single Pole Double Throw,Double Break; Standard ri Buy
LSZ51L Honeywell Sensing and Control Roller - Standard; Material: Ball Bearing; Roller Mounted On Back Of Lever ri Buy

672-ball

Catalog Datasheet Type PDF Document Tags
Abstract: FineLine BGA EP20K200E EP20K200E 484-Ball FineLine BGA EPF10K200S EPF10K200S 672-Ball FineLine BGA EPF10K200E EPF10K200E 672-Ball FineLine BGA EP20K200E EP20K200E 672-Ball FineLine BGA EP20K300E EP20K300E 672-Ball FineLine BGA Product Traceability and ... Original
datasheet

1 pages,
10.65 Kb

EPF10K200S PCN0119 Compound EP20K200E EP20K300E Nitto EPF10K100E EPF10K130E EPF10K200E 672-BALL Nitto HC nitto hc100 HC100 shin-etsu PCN0119 abstract
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Abstract: FineLine BGA Feb 2003 EPXA4 672-Ball FineLine BGA Jan 2003 EP2A15 EP2A15 724-Ball BGA EP2A15 EP2A15 672-Ball FineLine BGA Jan 2003 EP2A25 EP2A25 724-Ball BGA Jan 2003 EP2A25 EP2A25 672-Ball FineLine BGA Jan 2003 EP2A40 EP2A40 724-Ball BGA Jan 2003 EP2A40 EP2A40 672-Ball FineLine BGA Jan 2003 , EP20K1000E EP20K1000E 652-Ball BGA Jan 2003 EP20K1000E EP20K1000E 672-Ball FineLine BGA Jan 2003 EP20K1000E EP20K1000E , FineLine BGA Feb 2003 EP20K600E EP20K600E 672-Ball FineLine BGA Jan 2003 EP20K600E EP20K600E 1020-Ball ... Original
datasheet

3 pages,
10.88 Kb

EPXA10 EP20K1000E EP1M120 amkor flip BGA PACKAGE OUTLINE Altera bga 672-BALL PCN0214 PCN0214 abstract
datasheet frame
Abstract: 672-Ball FineLine BGA EPF10K200E EPF10K200E 672-Ball FineLine BGA Additional products may be affected in the ... Original
datasheet

1 pages,
10.35 Kb

Nitto EPF10K200S EPF10K200E EPF10K130E EPF10K100E HC100 nitto hc100 PCN0116 PCN0116 abstract
datasheet frame
Abstract: (23 x 23 mm) 672-ball fpBGA (27 x 27 mm) 900-ball fpBGA (31 x 31 mm) *Advance information. 6 , 4/411 8/387 672-ball fpBGA (27 x 27 mm) 900-ball fpBGA (31 x 31 mm) 1156-ball fpBGA (35 x 35 , Combinations 256-ball fpBGA (17 x 17 mm) 4 / 133 484-ball fpBGA (23 x 23 mm) 4 / 222 672-ball , TQFP 256-ball fpBGA 672-ball fpBGA 20 x 20 mm 0.5 mm pitch 17 x 17 mm 1.0 mm pitch 27 , 484-ball fpBGA F672 = 672-ball fpBGA F900 = 900-ball fpBGA TN144 TN144 = 144-pin Lead-Free TQFP QN208 QN208 = ... Original
datasheet

20 pages,
1221.91 Kb

wishbone ECP3-35 FN484 FPGA "video wall" FPGA IMPLEMENTATION of Multi-Rate FIR Lattice ECP3 MICO32 TN144 CPRI multi rate 8 pin dip switch camera-link to sd-SDI converter FN672 camera-link to 3G-SDI converter MICO32 abstract
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Abstract: Lattice Pb-Free Ordering Part Number List 1 Revision 4.0 July 2005 GAL/ispGAL Device Family Product Family Voltage GAL16LV8 GAL16LV8 3.3V GAL16V8 GAL16V8 5V GAL22V10 GAL22V10 5V ispGAL22V10 5V ispGAL22V10AV 3.3V Standard Ordering Part Number GAL16LV8D-3LJ GAL16LV8D-3LJ GAL16LV8D-5LJ GAL16LV8D-5LJ GAL16LV8C-7LJ GAL16LV8C-7LJ GAL16LV8C-10LJ GAL16LV8C-10LJ GAL16LV8C-15LJ GAL16LV8C-15LJ GAL16V8D-3LJ GAL16V8D-3LJ GAL16V8D-5LJ GAL16V8D-5LJ GAL16V8D-7LP GAL16V8D-7LP GAL16V8D-7LJ GAL16V8D-7LJ GAL16V8D-10QP GAL16V8D-10QP GAL16V8D-10QJ GAL16V8D-10QJ GAL16V8D-10LP GAL16V8D-10LP GAL16V8D-10LJ GAL16V8D-10LJ GAL16V8D-15QP GAL16V8D-15QP GAL16V8D-15QJ GAL16V8D-15QJ GAL16V8D-15L GAL16V8D-15L ... Original
datasheet

20 pages,
168.87 Kb

LC51024MV-75F484I GAL16V8D-15QJN LC4512V-10TN176I lx64ev-3f100c LC4032ZC-75M56I 10b38 LC5512MV-45FN256C LC4032V-10TN48I M4A5-32/32-10VNI LC4256V-5T144C M4A5-32/32-10VNC48 GAL16V8D-25LJN M4A5-64/32-10VNC48 datasheet abstract
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Abstract: WSE20 µm CMOS technology. Inputs are 3.3 V tolerant. · Packaged in a 672-ball FCBGA top-hat, 27 mm x ... Original
datasheet

2 pages,
38.66 Kb

TU12 PM5397 PM5389 PM5377 PM5369 PM5326 CROSS-CONNECT STS-48/STM-16 STS-12/STM-4 STS-48/STM-16 abstract
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Abstract: Parameters · 672-ball fpBGA (LatticeECP2M-35). · SERDES VCC Supply values: 1.2V -5%. · Ambient temperature , Test Setup Parameters · 672-ball fpBGA (LatticeECP2M-35). · Ambient temperature: 125°C. · SERDES VCC ... Original
datasheet

6 pages,
275.69 Kb

TN1149 TN1124 TN1114 Signal Path Designer experiments ECP2M DSO81304B E3610A TN1149 abstract
datasheet frame
Abstract: FF Slice 0 LUT4 Carry Chain 672-ball fpBGA 27 x 27 mm High Speed sysDSP Blocks FF , ) 672-ball fpBGA (27 x 27 mm) * ECP-DSP devices only Applications Support 1-800-LATTICE 1-800-LATTICE (528-8423 ... Original
datasheet

4 pages,
1830.09 Kb

ECP15 ECP10 EC20 EC15 DDR400 wireless power transfer matlab simulink ec20 encoder datasheet abstract
datasheet frame
Abstract: 402 450 500 672-ball fpBGA (27 x 27 mm) 900-ball fpBGA (31 x 31 mm) 500 583 , ) Packages & SERDES / I/O Combinations 672-ball fpBGA (27 x 27 mm) 900-ball fpBGA (31 x 31 mm) 8/410 ... Original
datasheet

4 pages,
1082.76 Kb

ECP2M medical software FpBGA "27 x 27" datasheet abstract
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Abstract: (Configuration) Logic-SRAM Packages & I/O Combinations 484-ball fpBGA (23 x 23 mm) 672-ball fpBGA (27 x , pitch 672-BALL FPBGA MACHXO LATTICEXP2 LCMXO XXXX X ­ X XXXXXX X LFXP2 XX E ­ X XXXXX X , 208-pin PQFP FT256 FT256 = 256-ball ftBGA F484 = 484-ball fpBGA F672 = 672-ball fpBGA MN132 MN132 = 132-ball , fpBGA FN672 FN672 = 672-ball Lead-Free fpBGA Grade C = Commercial I = Industrial 27 x 27 mm 1.0 mm ... Original
datasheet

24 pages,
2132.52 Kb

EMG LIN 1.01 DDR333 lattice xp2 LCMXO1200 LCMXO2280 LCMXO256 xp3c bauelemente DDR LFXP10 MachXO1200C F324 cd 7231 xo 640c F324 EUROPE datasheet abstract
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Abstract: PROCESS CHANGE NOTIFICATION PCN0415 PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA Change Description: The Nitto Denko HC100-XJ HC100-XJ series mold compound is being added as an additional mold compound choice for Altera® FineLine BGA® packages assembled at ASE Malaysia. This change does not affect form, fit or function. Reason for Change: In addition to supporting Pb free and green package requirements, Nitto Denko's HC100-XJAA HC100-XJAA mold compound was found to provide superior performa ... Original
datasheet

2 pages,
8.61 Kb

trace code altera ASE BGA Nitto altera top marking altera marking mold compound nitto hc100 nitto hc100-xj Nitto Denko HC100-XJ HC100 HC100XJAA Denko HC100-XJ PCN0415 HC100-XJ PCN0415 abstract
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Abstract: PROCESS CHANGE NOTICE PCN0113 PCN0113 ADDITIONAL ASSEMBLY LOCATION Change Description: Altera is adding FineLine BGAä and QFP package capability at ASE's assembly location in Kaohsiung, Taiwan. Reason For Change: ASE Malaysia is already a strategic manufacturing partner for Altera's existing products. ASE Kaohsiung has been selected as a second source because of ASE's demonstrated manufacturing excellence, their assembly performance, and their ability to accommodate Altera's high-volume cap ... Original
datasheet

1 pages,
10.06 Kb

EPC16 EP20K400E EP20K1500E BGA and QFP Package PCN0113 PCN0113 abstract
datasheet frame
Abstract: Packaged in a 672-ball FCBGA top-hat, 27 mm x 27mm. BLOCK DIAGRAM TOH Extraction I/F 2 x 77.76MHz ... Original
datasheet

2 pages,
45.76 Kb

TU12 PM5377 PM5370 PM5369 PM5326 STS-48/STM-16 STS-12/STM-4 STS-48/STM-16 abstract
datasheet frame
Abstract: core and 2.5 V I/O 0.13µm CMOS technology. Inputs are 3.3 V tolerant. · Packaged in a 672-ball FCBGA ... Original
datasheet

2 pages,
45.33 Kb

TU12 PM5377 PM5370 PM537 PM5369 PM5326 STS-48/STM-16 STS-12/STM-4 STS-48/STM-16 abstract
datasheet frame