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Part : 609-50ABS3 Supplier : Wakefield-Vette Manufacturer : Newark element14 Stock : - Best Price : $5.00 Price Each : $7.48
Part : 609-50AB Supplier : Wakefield-Vette Manufacturer : Richardson RFPD Stock : - Best Price : $4.56 Price Each : $4.56
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Part : 609-50ABS3 Supplier : Wakefield-Vette Manufacturer : Master Electronics Stock : 500 Best Price : $5.25 Price Each : $7.62
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609-50AB Datasheet

Part Manufacturer Description PDF Type
609-50ABS3 Wakefield Thermal Solutions Thermal - Heat Sinks, Fans, Thermal Management, HEATSINK FOR POWERPC CPU BLK Original

609-50AB

Catalog Datasheet MFG & Type PDF Document Tags

61995AB124D1

Abstract: ) 2.895 (73.5) x 2.000 (50.8) 2.808 (71.32) x 1.700 (43.7) 609-50AB 609-100AB Dimensions "A" in , FORCED CONVECTION THERMAL PERFORMANCE DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) (609-50AB) PRODUCT DESIGNATION (609-100AB) 609-50AB HEAT SINK AND CLIP ASSEMBLY Dimensions: in. (mm) 619
Wakefield Engineering
Original
61995AB124D1 61995AB054D1

7476

Abstract: P628 (71.32) x 1.700 (43.7) 609-50AB 609-100AB Dimensions "A" in. (mm) 0.500 (12.7) 1.00 (25.4 , DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) (609-50AB) PRODUCT DESIGNATION (609-100AB) 609-50AB HEAT SINK AND CLIP ASSEMBLY Dimensions: in. (mm) 619 SERIES Fan Heat Sink for BGA and
Wakefield Engineering
Original
655-26AB 655-53AB 7476 P628 CX486slc D10650-40 pin fin heat sink 7476+truth+table 659-65AB 29240TM

BGA 64 PACKAGE thermal resistance

Abstract: BGA PACKAGE thermal resistance (43.2) 609-50AB 609-100AB Dimensions "A" in. (mm) 0.500 (12.7) 1.00 (25.4) 40&45mm BGA , conditions. 609-100 will perform better than 609-50 in cases with bypass. "A" DIM. (609-50AB) 609-50AB 3 (609-100AB) Dimensions: in. (mm) 609-50AB HEAT SINK AND CLIP ASSEMBLY Designed
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Original
624-25AB BGA 64 PACKAGE thermal resistance BGA PACKAGE thermal resistance 643-35AP 612-Series 624-35AB 624-45AB 624-60AB 624-25-T4 624-35-T4

Wakefield Thermal Solutions

Abstract: Chomerics* T405 ) Typical Applications Weight lbs. (grams) 40&45mm BGA 40&45mm BGA 609-50AB 2.895 (73.5) x , perform better than 609-50 in cases with bypass. "A" DIM. (609-50AB) 609-50AB 3 (609-100AB) Dimensions: in. (mm) 609-50AB HEAT SINK AND CLIP ASSEMBLY Designed to fit a .063" thick PCB
Wakefield Thermal Solutions
Original
Wakefield Thermal Solutions Chomerics* T405 Bergquist BP-108 658-35AB 77AB datasheet of BGAS

T405R

Abstract: Bergquist BP-108 for BGAs and PowerPCTM Packages Base Dimensions in. (mm) Dimensions "A" in. (mm) 609-50AB , better than 609-50 in cases with bypass. "A" DIM. (609-50AB) 609-50AB 3 (609-100AB) Dimensions: in. (mm) 609-50AB HEAT SINK AND CLIP ASSEMBLY Designed to fit a .063" thick PCB
Wakefield Thermal Solutions
Original
T405R T410R intel 80486sx 569-100AK 64-pin BGA thermal resistance T405 WTS001 D10650 D10850 80486DX 80486DX2TM 80486SX

T405R

Abstract: Chomerics* T405 Dimensions in. (mm) 609-50AB 609-100AB Dimensions "A" in. (mm) Typical Applications Heat Sink , PARALLEL TO EXTRUSION DIRECTION) 5 609-50AB 3 2 1 0 100 200 300 AIR VELOCITY (LFM) 400 , bypass. "A" DIM. (609-50AB) * 609-100AB 4 (609-100AB) Dimensions: in. (mm) 609-50AB
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Original
AM486DX2 BERGQUIST softface intel 82495 651b thermal printer 2 inch Intel 82495 Cache Controller Cyrix Media GX I860XR I960CA I960CF AM486DX4 669-32AG

D1065

Abstract: Chomerics* T-405 -40 D10850-40 D20850-40 609-100AB 609-50AB 619-100AB 624-25AB 624-35AB 624-45AB 624-60AB 625-25AB
Wakefield Engineering
Original
630-35AB D1065 Chomerics* T-405 BGA 21x21 Chomerics T710 tape ARCLAD 8223 Chomerics T710 D10850/D20850 625-35AB 625-45AB 625-60AB 628-20AB 628-25AB

elina fan

Abstract: heat sink for 304 point BGA a similar heat sink for the PowerPC 604 (part number 609-50AB). Alternative solutions for the
Vitesse Semiconductor
Original
VSC870 VSC880 G53034-0 elina fan heat sink for 304 point BGA 3dfx 2319B AN-36