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Abstract: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and LSI are rapidly increasing. Given this environment, package technology is rapidly increasing in importance. Fujitsu is working hard to develop packages that permit improved mounting efficie ... Original
datasheet

195 pages,
2446.12 Kb

AU 7842 64 PIN IC189 DIP008-P-0300-1 Enplas drawings PC MOTHERBOARD CIRCUIT diagram pga 370 IC297 TSSOP YAMAICHI SOCKET smd p08 fpq-144-0.5-03 YAMAICHI ic234 smd code 38P SMD transistor M05 marking code smd semiconductor fujitsu datasheet abstract
datasheet frame
Abstract: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods 2.1 Overview 2.2 Mounting Methods 2.3 Surface Mounted Plastic Package Reliability 2.4 Storage 3 Package Lineup 3.1 Package Forms and Number of Pins 3.2 Package Lineup 4 Package Outline Diagrams Package Outline Diag ... Original
datasheet

177 pages,
2335.05 Kb

QFP44 PC MOTHERBOARD CIRCUIT diagram pga 370 Analog devices smd marking code m01 Texas Instruments epoxy Sumitomo qtp socket fujitsu marking code smd fujitsu smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p L QUAD Aluminum nitride MARKING CODE SMD IC A08 datasheet abstract
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