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Abstract: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and LSI are rapidly increasing. Given this environment, package technology is rapidly increasing in importance. Fujitsu is working hard to develop packages that permit improved mounting efficie ... Original

195 pages,
2446.12 Kb

IC189 PC MOTHERBOARD CIRCUIT diagram pga 370 IC297 Enplas drawings AU 7842 64 PIN DIP008-P-0300-1 TSSOP YAMAICHI SOCKET smd p08 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 SMD transistor M05 pitch 0.4 QFP 256p datasheet abstract
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Abstract: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods 2.1 Overview 2.2 Mounting Methods 2.3 Surface Mounted Plastic Package Reliability 2.4 Storage 3 Package Lineup 3.1 Package Forms and Number of Pins 3.2 Package Lineup 4 Package Outline Diagrams Package Outline Diag ... Original

177 pages,
2335.05 Kb

IC Marking M03 Analog devices smd marking code m01 Texas Instruments epoxy Sumitomo marking code smd semiconductor fujitsu tray lcc48 qtp socket fujitsu marking code smd fujitsu pitch 0.4 QFP 256p LGA 1155 Socket PIN diagram L QUAD Aluminum nitride smd marking m05 datasheet abstract
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