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Abstract: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and LSI are rapidly increasing. Given this environment, package technology is rapidly increasing in importance. Fujitsu is working hard to develop packages that permit improved mounting efficie ... Original
datasheet

195 pages,
2446.12 Kb

Enplas drawings IC189 AU 7842 64 PIN IC297 PC MOTHERBOARD CIRCUIT diagram pga 370 TSSOP YAMAICHI SOCKET smd p08 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 SMD transistor M05 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p datasheet abstract
datasheet frame
Abstract: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods 2.1 Overview 2.2 Mounting Methods 2.3 Surface Mounted Plastic Package Reliability 2.4 Storage 3 Package Lineup 3.1 Package Forms and Number of Pins 3.2 Package Lineup 4 Package Outline Diagrams Package Outline Diag ... Original
datasheet

177 pages,
2335.05 Kb

PC MOTHERBOARD CIRCUIT diagram pga 370 marking code smd fujitsu qtp socket fujitsu Analog devices smd marking code m01 Texas Instruments epoxy Sumitomo smd marking m05 pitch 0.4 QFP 256p LGA 1155 Socket PIN diagram L QUAD Aluminum nitride MARKING CODE SMD IC A08 LGA 1155 PIN diagram datasheet abstract
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