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56-ball

Catalog Datasheet MFG & Type PDF Document Tags

LVTH162

Abstract: 48 ball VFBGA Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch , ABSTRACT TI's 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated through , functions released in the 56-ball MicroStar Jr. package have superior performance characteristics, compared , 6 56-Ball MicroStar Jr. Package Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 56-Ball MicroStar Jr. Package, Top and Bottom Views . . . .
Texas Instruments
Original
LVTH162 48 ball VFBGA 90 ball VFBGA IC280-056-237 VH373 LVCH162

56-BALL

Abstract: SST34HF1621 Polling CMOS I/O Compatibility Package Available ­56-ball LFBGA (8mm x 10mm) Temperature Ranges , . DQ15-DQ0 Data Inputs/Outputs 56-Ball (LFBGA) 8mm x 10mm ComboMemory Pinout To output data during , 56-Ball (LFBGA) 10mm x 12mm ComboMemory Pinout 2.7-3.3V Power Supply to Flash only Unconnected , 34HF3243B device Note: 3. CIOs and SA are only available for 34HF1681 device Package Diagram 56-Ball Low-Profile Fine-Pitch Ball Grid Array (LFBGA) 8mm x 10mm 56-Ball Low-Profile Fine-Pitch Ball Grid Array
Silicon Storage Technology
Original
56-BALL SST34HF1621 SST34HF1641 SST34HF1681 SST34HF

PF38F4060M0Y3DF

Abstract: PF38F3040 256Mb M PSRAM Uniform 1.8 1.8 Muxed x16 x16 LPCP - 56ball 11x8 mm 1Gb + , 1.8 1.8 Muxed x16 x16 LPCP - 56ball 11x8 mm 1Gb PF48F6000M0Y0BH 1Gb - , LPCP - 56ball 10x10 mm 512Mb product line card Numonyx NOR flash memory NOR Density , MUX 512Mb 128Mb M PSRAM Uniform 1.8 1.8 Muxed x16 x16 LPCP - 56ball , 256Mb 128Mb M PSRAM Uniform 1.8 1.8 Muxed x16 x16 LPCP - 56ball 8x8 mm
-
Original
PF38F4060M0Y3DF PF38F3040 PF38F5060M0Y0CF m36w0r6050u PF48F6000M0Y1BH M36W0R5040 1024M PF58F0062M0Y1BF PF58F0033M0Y0BF PF58F0033M0Y1BF JZ58F0112M0Q0GE PF38F6066M0Y3DF

S71VS

Abstract: S71VS128RC0AHK4L 7.7 x 6.2, 56-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter) E = 9.2 x 8.0, 56-ball BGA, 0.5 mm , Industrial 3M Top BM Bottom 2L Top Pinout: S71VS-R 56-ball AL Bottom Package: RSD056 0L Top SWM032D108M1N S71VS128RB0 AHK 108 MHz 8L Bottom Pinout: S71VS-R 56-ball , Top AL Pinout: S71VS-R 56-ball Bottom 108 MHz 20 S71VS128RC0 Top ZHK , 56-ball Package: NSD056 Wireless 108 MHz AL Bottom 20 ZHK Top SWM064D108M1N A0
Spansion
Original
S71VS S71VS128RC0AHK4L SWM064D108M1R SWM128D108M1R pSRAM_39 swm032d108m1r S71VS/XS-R

S71VS256RD0AHK3M

Abstract: ) K = 7.7 x 6.2, 56-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter) Package Type AH = Very Thin , Top AHK Pinout: S71VS-R 56-ball Package: RLA056 SWM032D108M1R BL 0, 3 108 MHz Bottom 4L Top Pinout: S71VS-R 56-ball CL Bottom Package: RSD056 4L S71VS128RC0 AHK Top Wireless SWM064D108M1R 108 MHz Pinout: S71VS-R 56-ball CL Package: RSD056 4L S71VS256RC0 Bottom Top Pinout: S71VS-R 56-ball AHK SWM064D108M1R CL 108 MHz Bottom 3L
Spansion
Original
S71VS256RD0AHK3M

8275 intel

Abstract: intel d 8275 . 5 2.3 56-Ball uBGA Package Silicon Daisy Chain Schematics . 6 2.4 56-Ball uBGA Package Drawing and Dimensions for Silicon Daisy Chain Device , . 26 5.1 56-Ball uBGA Package Drawing and Dimensions . 26 5.2 56-Ball uBGA Package Dimensions for Fast Boot Block Memory Component Devices , . 31 6.1 56-Ball uBGA Package Drawing and Dimensions for Intel StrataFlash Memory
Intel
Original
28F008S3 28F800B3 28F160B3 8275 intel intel d 8275 Intel 8275 28F008B3 28F016B3 CG-041493 US035751 US040001

flash device MARKing intel

Abstract: micron marking code information Code (ManID) · Micron (0x2Ch) · Intel (0x89h) Package · 56-ball VFBGA (Standard) 7 x 8 ball grid · 56-ball , Range 1.7V­1.95V Vcc 1.7V­2.24V VccQ Burst Mode Frequency 8 = 81 MHz Package Code FE = 56-ball VFBGA (Standard) 7 x 8 grid BE = 56-ball VFBGA (Lead-free) 7 x 8 grid Access Time -60 = 60ns
Micron Technology
Original
flash device MARKing intel micron marking code information INTEL flash part MARKING 28F Intel intel marking 28f Flash Memory micron MT MT28F644W18 MT28F644W30

micron marking code information

Abstract: flash device MARKing intel Code (ManID) · Micron (0x2Ch) · Intel (0x89h) Package · 56-ball VFBGA (Standard) 7 x 8 ball grid · 56-ball , Range 1.7V­1.95V Vcc 1.7V­2.24V VccQ Burst Mode Frequency 8 = 81 MHz Package Code FE = 56-ball VFBGA (Standard) 7 x 8 grid BE = 56-ball VFBGA (Lead-free) 7 x 8 grid Access Time -60 = 60ns
Micron Technology
Original

MX69V28F64BBXJW

Abstract: MX69V28F64 1.95V) â'¢ Deep power down mode Package â'¢ 56-Ball Thin FBGA (Fine-Pitch Ball Grid Array) â , MX69V28F64 4. PIN CONFIGURATIONS 56-Ball, VFBGA with pSRAM Legend A1 A14 NC NC C3 C4 , T T XJ W TEMPERATURE RANGE: W: Wireless (-25° C to 85° C) PACKAGE: XJ: TFBGA with 56-ball (7.7x6.2x1.2mm) XL: TFBGA with 56-ball (7.7x6.2x1.05mm) Top/ Bottom boot pSRAM Vendor pSRAM DENSITY : 64
Macronix International
Original
MX69V28F64BBXJW PM1751 128M-BIT

5 ball csp drawing

Abstract: intel 28f160 s5 ://developer.intel.com/design/flcomp/packdata/ 11 3.4 Sample 56-Ball Array uBGA* Package Drawing and Dimensions , Mark Not Shown A1 A2 A Seating Plane Y Side View Figure 7. 56-Ball Array uBGA* Package Specifications for G28F640J5 Remarks: The 56-ball package consists of partially depopulated solder ball matrix , 0.100 0.0039 3.10 56-Ball uBGA* Package Silicon Daisy Chain Schematics 8 7 6 5 4 , B7 ­ B8 D7 ­ D8 H1 ­ H2 17 3.11 56-Ball uBGA* Package Drawing and Dimensions for
Intel
Original
28F640J5 28F016S3 5 ball csp drawing intel 28f160 s5 intel i5 top mark e5 3020 h3 28F800/008B3 28F160/016B3

intel i5 block diagram

Abstract: INTEL 56BALL . 7 2.5 56-Ball uBGA* Package Tape Daisy Chain Schematics . 8 2.6 56-Ball uBGA* Package Drawing and Dimensions for Daisy Chain Device , . 23 5.1 56-Ball uBGA* Package Drawing and Dimensions for Intel StrataFlashTM Memory . 23 5.2 56-Ball uBGA* Package Dimensions for 28F320J5 and 28F640J5 Intel StrataFlashTM Memory , 0.1193 7 E MECHANICAL SPECIFICATION 2.5 56-Ball uBGA* Package Tape Daisy Chain Schematics
Intel
Original
intel i5 block diagram INTEL 56BALL intel C4 package 297846 78a17 a5 9910 US038431 US039141 NP291-04002-G4-BF-P NP291-04812-G4-BF-P NP291-04808-G4-BF-P NP291-07210-G4-BF-P

S71VS128R

Abstract: S71VS256RD0 Modifier T = 7.5 x 5.0, 52-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter) K = 7.7 x 6.2, 56-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter) E = 9.2 x 8.0, 56-ball BGA, 0.5 mm ball pitch (0.3 mm ball , 108 MHz 104 MHz 83 MHz 108 MHz 104 MHz 83 MHz 108 MHz 104 MHz 83 MHz 104 MHz 83 MHz Pinout: S71VS-R 56-ball Package: RSD056 Pinout: S71VS-R 56-ball Package: NLB056-56-ball Pinout: S71XS-R 56-ball Package: NLB056 Pinout: S71VS-R 56-ball Package: NSD056 Pinout: S71VS-R 56-ball Package: RSD056 6 S71VS/XS-R Memory
Spansion
Original
S71VS128R S71VS256RD0 mark ZH JEP95 s71vs128 SWM032D

S71VS128RB0

Abstract: S71VS128RB0AHK0L 7.7 x 6.2, 56-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter) Package Type AH = Very Thin , : S71VS-R 56-ball Package: RLA056 108 MHz Wireless Top 108 MHz Pinout: S71VS-R 56-ball Package: RSD056 Pinout: S71VS-R 56-ball Package: RSD056 108 MHz Bottom 83 MHz Bottom Top Top Wireless 108/104 MHz Industrial 108 MHz Pinout: S71VS-R 56-ball Package: RSD056 6 S71VS/XS-R Memory Subsystem Solutions , periods of time. 4.2 Connection Diagrams Figure 4.1 S71VS-R 56-ball Fine-Pitch Ball Grid Array
Spansion
Original
S71VS128RB0AHK0L JEP 95 S29VS064R ADQ11 S71VS064R G1007
Abstract: Combinations N = pSRAM 2, 70 ns, 66 MHz Package Modifier R = 1.2 mm, 8.0 x 9.2, 56-ball VFBGA V = 1.2 mm, 11 x , prolonged periods of time. 4.2 Connection Diagrams 4.2.1 pSRAM Based Pinout, 56-Ball, VFBGA 56-ball , Based Pinout, 56-Ball, VFBGA June 13, 2006 S71NS-N_00_A2 S71NS-N MCP Products 5 A d v a n c , Physical Dimensions 4.3.1 NLB056-9.2 x 8.0 mm, 56-ball VFBGA D 0.10 C (2X) 14 13 12 11 10 9 8 7 6 5 4 , reference for 56-ball connection diagram Colophon The products described in this document are designed Spansion
Original

EN71NS128B0

Abstract: ENPSS32 pSRAM Burst mode max frequency 108MHz 56-ball FBGA This Data Sheet may be revised by , Conventional P = RoHS compliant TEMPERATURE RANGE W = Wireless (-25°C to +85°C) PACKAGE D = 56-Ball Very , EN71NS128B0 PACKAGE MECHANICAL 56-ball Thin Fine-Pitch Ball Grid Array (TFBGA) 8 x 9.2 mm Package SYMBOL
Eon Silicon Solution
Original
EN71NS E29NS128 EN29NS128 ENPSS32 EN29NS sa-129 108MH

MX29GL256

Abstract: 28F512P30 Numonyx . M58LR128 128 1.7-2.0 1.7- 2.0 ADP ADM x16 Boot Sector 16 70 66 56-Ball FBGA , 1.7-2.0 ADP ADM x16 Boot Sector 4 70 66 ADP: 56-Ball FBGA ADM: 44-Ball FBGA , 32 1.7-2.0 1.7-2.0 ADP ADM x16 Boot Sector 8 70 66 ADP: 56-Ball FBGA , M58WR064 64 1.7-2.0 1.7-2.0 ADP ADM x16 Boot Sector 16 70 66 ADP: 56-Ball , 2.7-3.6 2.7-3.6 x8, x16 Uniform Sector Dual-bank 70 48-Pin TSOP 48-Ball TFBGA 56-Ball
Spansion
Original
MX29GL256 28F512P30 Numonyx M29W256G 28F00AP30 w25q128 MX25L6445 AT49SV163D S29AS016J EN29SL800 S29AS008J EN39SL800 EN29SL160
Abstract: 108MHz max frequency Package 56-ball BGA This Data Sheet may be revised by subsequent versions 1 , = Wireless (-25°C to +85°C) PACKAGE DC = 56-Ball BGA 0.50mm pitch, 6.2mm x 7.7mm package , , Inc., Rev. C, Issue Date: 2010/08/20 www.eonssi.com EN71NS128B0 PACKAGE MECHANICAL 56-ball Eon Silicon Solution
Original

EN29NS128

Abstract: PSRAM Async. Mode 7ns at Burst Read 108MHz pSRAM Burst mode 108MHz max frequency Package 56-ball BGA , PACKAGING CONTENT P = RoHS compliant TEMPERATURE RANGE W = Wireless (-25°C to +85°C) PACKAGE DC = 56-Ball , EN71NS128C0 PACKAGE MECHANICAL 56-ball Ball Grid Array (BGA) 6.2 x 7.7 x 1.0mm Package, pitch: 0.5mm, ball
Eon Silicon Solution
Original
PSRAM PSEUDO SRAM ENPSS64

S25FL256

Abstract: S25FL512 , -40°C to +85°C OTP region 48-ball, 56-ball, 64-ball and 80-ball BGA, 56-pin TSOP Top/Bottom boot , highest reliability 16Mb ­ 2Gb 48-BALL FINE PITCH BGA For small form factor 8Mb ­ 64Mb 56-BALLS For , , 64-Ball FBGA, KGD, KGW 48-Ball FBGA, 56-Ball FBGA 48-Pin TSOP, 48-Ball FBGA, KGW 48-Pin TSOP, 56-pin TSOP, 48-Ball FBGA, 64-Ball FBGA, KGW 48-Ball FBGA, 56-Ball FBGA 48-Pin TSOP, 48-Ball FBGA 80-Pin PQFP , 9.2 x 8.0 8.0 x 8.0 package footprint 56-ball 52-ball 56-ball 56-ball 133-ball 56-ball 56-ball 133
Spansion
Original
S98GL064NB0 S25FL256 S25FL512 S25FL256* spansion S98GL064 S98GL064NB S71GL032NA0 43715C

S71VS256R

Abstract: S71VS128R Package Modifier R, U = 1.2 mm, 8.0 x 9.2 mm, 56-ball VFBGA V = 1.2 mm, 11 x 10 mm, 60-ball VFBGA , pSRAM Based Pinout, 56-Ball, VFBGA Figure 4.1 pSRAM Based Pinout, 56-Ball, VFBGA 56-ball Fine-Pitch , 4.3.1 Physical Dimensions NLB056-9.2 x 8.0 mm, 56-ball VFBGA Figure 4.4 NLB056-56-ball VFBGA D , S71NS064NB0BJWUN/S71NS064NB0BHWUN pSRAM to Type 3 with pSRAM speed 66 MHz Changed typo in 56-ball pinout (K3 -> K1 , S71NS064NA0-RT - the one using pSRAM Type 2 Corrected the grid reference for 56-ball connection diagram Changed
Spansion
Original
S71VS256R

S71VS256RD0

Abstract: s71vs Model Number See Valid Combinations table below Package Modifier K = 7.7 x 6.2, 56-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter) E = 9.2 x 8.0, 56-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter , periods of time. 4.2 Connection Diagrams Figure 4.1 S71VS-R 56-ball Fine-Pitch Ball Grid Array , Data She et Figure 4.2 S71XS-R 56-ball Fine-Pitch Ball Grid Array (Top View, Balls Facing Down
Spansion
Original

SWM064D108M1R

Abstract: pSRAM_39 -inch Tape and Reel Model Number See Valid Combinations table below Package Modifier E = 9.2 x 8.0, 56-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter) K = 7.7 x 6.2, 56-ball BGA, 0.5 mm ball pitch (0.3 mm , prolonged periods of time. 4.2 Connection Diagrams Figure 4.1 56-ball Fine-Pitch Ball Grid Array , Refreshed DNU, NC, RFU definitions Updated MCP Block Diagram Updated 56-ball Fine-Pitch Ball Grid Array
Spansion
Original
S71NS-R
Abstract: ns, 66 MHz Package Modifier R = 1.2 mm, 8.0 x 9.2, 56-ball VFBGA V = 1.2 mm, 11 x 10 mm, 60 , hee t (Adva nce In for m ation) 4.2 4.2.1 Connection Diagrams pSRAM Based Pinout, 56-Ball, VFBGA Figure 4.1 pSRAM Based Pinout, 56-Ball, VFBGA 56-ball Fine-Pitch Ball Grid Array (Top View , -9.2 x 8.0 mm, 56-ball VFBGA Figure 4.4 NLB056-56-ball VFBGA D 0.10 C (2X) 14 13 12 11 10 9 8 7 6 5 , Corrected the grid reference for 56-ball connection diagram Changed the Publication Identification Number Spansion
Original
Abstract: pSRAM Burst mode 108MHz max frequency Package 56-ball BGA This Data Sheet may be revised by , CONTENT P = RoHS compliant TEMPERATURE RANGE W = Wireless (-25°C to +85°C) PACKAGE DC = 56-Ball , www.eonssi.com EN71NS128B0 PACKAGE MECHANICAL 56-ball Ball Grid Array (BGA) 6.2 x 7.7 x 1.0mm Package, pitch Eon Silicon Solution
Original

S71NS064NA0-RA

Abstract: NS064N MHz Package Modifier R = 1.2 mm, 8.0 x 9.2, 56-ball VFBGA V = 1.2 mm, 11 x 10 mm, 60-ball VFBGA , Pinout, 56-Ball, VFBGA Figure 4.1 pSRAM Based Pinout, 56-Ball, VFBGA 56-ball Fine-Pitch Ball Grid , mm, 56-ball VFBGA Figure 4.4 NLB056-56-ball VFBGA D1 A D eD 0.10 C (2X) 14 13 12 , (June 13, 2006) Connection Diagrams Corrected the grid reference for 56-ball connection diagram
Spansion
Original
S71NS064NA0-RA NS064N S29NS-N S71NS064NA0 S71NS128P marking bjw

S71NS512r

Abstract: PSRAM Model Number See Valid Combinations table below Package Modifier E = 9.2 x 8.0, 56-ball BGA, 0.5mm ball pitch (0.3mm ball diameter) K = 7.7 x 6.2, 56-ball BGA, 0.5mm ball pitch (0.3mm ball diameter) Package , above 150°C for prolonged periods of time. 4.2 Connection Diagrams Figure 4.1 56-ball Fine-Pitch
Spansion
Original
S71NS512r S71NS512RD0 S71NS256RD0 A22-A16

s71vs128

Abstract: S71VS064R pSRAM Type 1, 70 ns, Asynchronous Package Modifier R, T, U = 1.2 mm, 8.0 x 9.2 mm, 56-ball VFBGA V = , pSRAM Based Pinout, 56-Ball, VFBGA Figure 4.1 pSRAM Based Pinout, 56-Ball, VFBGA 56-ball Fine-Pitch , ) Physical Dimensions NLB056-9.2 x 8.0 mm, 56-ball VFBGA Figure 4.4 NLB056-56-ball VFBGA D1 A D , reference for 56-ball connection diagram Revision A3 (October 10, 2006) Global Added the , Connection Diagrams Changed typo in 56-ball pinout (K3 -> K1) Revision A9 (April 15, 2009) General
Spansion
Original
mediatek Spansion NS064N S71VS256 NS256N VFBGA package tray

S71NS-R

Abstract: S71NS256RD0 table below Package Modifier E = 9.2 x 8.0, 56-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter) K = 7.7 x 6.2, 56-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter) Package Type AH = Very Thin , temperatures above 150°C for prolonged periods of time. 4.2 Connection Diagrams Figure 4.1 56-ball , Updated 56-ball Fine-Pitch Ball Grid Array 10 S71NS-R Memory Subsystem Solutions S71NS-R
Spansion
Original
PSRAM 256 FLash S71NS512RD0ZHE S71NS256RC0 S29NS-R
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