NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| SN74LVCH16T245KR | Texas Instruments | SN74LVCH16T245 56-BGA MICROSTAR JUNIOR -40 to 85 | 
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| HPA02273ZQLR | Texas Instruments | FlatLink 10-85MHz Transmitter 56-BGA MICROSTAR JUNIOR -10 to 70 |
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FREE
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| 74LVCH16T245ZQLR | Texas Instruments | SN74LVCH16T245 56-BGA MICROSTAR JUNIOR -40 to 85 |
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FREE
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| SN74CBT16211AZQLR | Texas Instruments | 24-Bit FET Bus Switch 56-BGA MICROSTAR JUNIOR -40 to 85 |
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| SN74CBT16210GQLR | Texas Instruments | 20-Bit FET Bus Switch 56-BGA MICROSTAR JUNIOR -40 to 85 |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Polling CMOS I/O Compatibility Package Available Â56-ball LFBGA (8mm x 10mm) Temperature Ranges , DQ15-DQ0 DQ15-DQ0 Data Inputs/Outputs 56-Ball (LFBGA) 8mm x 10mm ComboMemory Pinout To output data during , 56-Ball (LFBGA) 10mm x 12mm ComboMemory Pinout 2.7-3.3V Power Supply to Flash only Unconnected pins , device Note: 3. CIOs and SA are only available for 34HF1681 34HF1681 device Package Diagram 56-Ball Low-Profile Fine-Pitch Ball Grid Array (LFBGA) 8mm x 10mm 56-Ball Low-Profile Fine-Pitch Ball Grid Array ... | Original |
2 pages, |
SST34HF1681 SST34HF1641 SST34HF1621 SST34HF SST34HF abstract |
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| Abstract: 256Mb M PSRAM Uniform 1.8 1.8 Muxed x16 x16 LPCP - 56ball 11x8 mm 1Gb + , 1.8 1.8 Muxed x16 x16 LPCP - 56ball 11x8 mm 1Gb PF48F6000M0Y0BH PF48F6000M0Y0BH 1Gb - , LPCP - 56ball 10x10 mm 512Mb product line card Numonyx NOR flash memory NOR Density , MUX 512Mb 128Mb M PSRAM Uniform 1.8 1.8 Muxed x16 x16 LPCP - 56ball , 256Mb 128Mb M PSRAM Uniform 1.8 1.8 Muxed x16 x16 LPCP - 56ball 8x8 mm ... | Original |
7 pages, |
256MB nor flash PF38F4050M0Y3DF Pf38f5060m0y3DG PF58F0079LLY0WE 128mb M36L0R7060U3ZAM PF38F3050M0Y3DF m36w0r6050u ZS56 M36W0R5040 Pf38f3050m0y0Ce PF48F3000M0Y0QE PF38F4060M0Y3CE datasheet abstract |
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| Abstract: ://developer.intel.com/design/flcomp/packdata/ 11 3.4 Sample 56-Ball Array uBGA* Package Drawing and Dimensions , Mark Not Shown A1 A2 A Seating Plane Y Side View Figure 7. 56-Ball Array uBGA* Package Specifications for G28F640J5 G28F640J5 Remarks: The 56-ball package consists of partially depopulated solder ball matrix , 56-Ball uBGA* Package Silicon Daisy Chain Schematics 8 7 6 5 4 3 2 A B C D E F , H1 Â H2 17 3.11 56-Ball uBGA* Package Drawing and Dimensions for Silicon Daisy Chain Device ... | Original |
10 pages, |
28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F640J5 28F800B3 3020 h3 G28F640J5 intel i5 top mark e5 5 ball csp drawing datasheet abstract |
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| Abstract: Application Report SZZA029B SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch , ABSTRACT TI's 56-ball MicroStar Jr. package, registered under JEDEC MO-225 MO-225, has demonstrated through , functions released in the 56-ball MicroStar Jr. package have superior performance characteristics, compared , 6 56-Ball MicroStar Jr. Package Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 56-Ball MicroStar Jr. Package, Top and Bottom Views . . . . ... | Original |
30 pages, |
VH373 TSSOP YAMAICHI SOCKET tSSOP 56 socket SN74LVCH16244A micro pitch BGA 48-PIN LVCH16244A ALVCH16373 56-PIN 90 ball VFBGA LVTH162 48 ball VFBGA SZZA029B SZZA029B MO-225 SZZA029B abstract |
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| Abstract: pSRAM Burst mode max frequency 108MHz 56-ball FBGA This Data Sheet may be revised by , (-25°C to +85°C) PACKAGE D = 56-Ball Very Thin Fine Pitch BGA (VFBGA) 0.50mm pitch, 9.2mm x 8mm , , Inc., Rev. A, Issue Date: 2009/7/24 www.eonssi.com EN71NS128B0 EN71NS128B0 PACKAGE MECHANICAL 56-ball ... | Original |
8 pages, |
EN71NS E29NS128 ENPSS32 EN29NS128 EN71NS128B0 EN71NS128B0 abstract |
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| Abstract: =56-Ball Fine Pitch Ball Grid Array (FBGA) 0.80mm pitch, 7mm x 9mm package SPEED 70 = 70ns pSRAM , EN71PL032A0 EN71PL032A0 PACKAGE MECHANICAL 56-ball Fine-Pitch Ball Grid Array (FBGA) 7 x 9 mm Package SYMBOL ... | Original |
7 pages, |
PSRAM EN71PL032A0 EN29PL032 EN71PL032 EN71PL032A0 abstract |
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| Abstract: R Chip Scale BGA (CP56/CPG56 CP56/CPG56) Package PK013 PK013 (v1.3) July 9, 2008 56-BALL CHIP SCALE BGA 0.50mm PITCH (CP56/CPG56 CP56/CPG56) © 2004-2008 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice. PK013 PK013 (v1.3) July 9, 2008 www.xilinx.com 1 R Chip Scale ... | Original |
2 pages, |
CP56 CPG56 CP56/CPG56 PK013 56-BALL CP56/CPG56 abstract |
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| Abstract: 7.7 x 6.2, 56-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter) E = 9.2 x 8.0, 56-ball BGA, 0.5 mm , Industrial 3M Top BM Bottom 2L Top Pinout: S71VS-R S71VS-R 56-ball AL Bottom Package , 56-ball 3L Top Package: RLA056 RLA056 BL Bottom SWM032D108M1R SWM032D108M1R 4L Top SWM064D108M1R SWM064D108M1R , Top AL Pinout: S71VS-R S71VS-R 56-ball Bottom 108 MHz 20 S71VS128RC0 S71VS128RC0 Top ZHK , 56-ball Package: NSD056 NSD056 Wireless 108 MHz AL Bottom 20 ZHK Top SWM064D108M1N SWM064D108M1N A0 ... | Original |
18 pages, |
S71VS128RC0 S71VS256RC0 S71VS256RD0AHK3M g1007 SWM128D108M3R S71VS064RB0AHT8L SWM032D SWM032D108M3R S71VS256RD0 spansion solder profile s71vs064rb0 solder ball placement SWM064D108M1R S29VS064R S71VS/XS-R S71VS/XS-R abstract |
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| Abstract: small footprint packages - 48-ball CS BGA (40 user I/O pins) - 56-ball CP BGA (48 user I/O , Package C XCR3064XL-6CP56C XCR3064XL-6CP56C 6 ns CP56 56-ball Chip Scale Package C XCR3064XL-6VQ100C XCR3064XL-6VQ100C , XCR3064XL-7CP56C XCR3064XL-7CP56C 7.5 ns CP56 56-ball Chip Scale Package C XCR3064XL-7CP56I XCR3064XL-7CP56I 7.5 ns CP56 56-ball Chip Scale Package I XCR3064XL-7VQ100C XCR3064XL-7VQ100C 7.5 ns VQ100 VQ100 100-pin Very Thin Quad Flat , 48-ball Chip Scale Package I XCR3064XL-10CP56C XCR3064XL-10CP56C 10 ns CP56 56-ball Chip Scale Package C ... | Original |
9 pages, |
XCR3064XL-7VQ44C CP56 CS48 DS012 PC44 VQ100 VQ44 XCR3064XL-10CP56C XCR3064XL-10VQ100C xcr3064xl-10vq44 XCR3064XL-6PC44C XCR3064XL-6VQ44C XCR3064XL XCR3064XL abstract |
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| Abstract: . 7 2.5 56-Ball uBGA* Package Tape Daisy Chain Schematics . 8 2.6 56-Ball uBGA* Package Drawing and Dimensions for Daisy Chain Device , MEMORY. 23 5.1 56-Ball uBGA* Package Drawing and Dimensions for Intel StrataFlashTM Memory . 23 5.2 56-Ball uBGA* Package Dimensions for 28F320J5 28F320J5 and 28F640J5 28F640J5 Intel StrataFlashTM Memory , 0.1193 7 E MECHANICAL SPECIFICATION 2.5 56-Ball uBGA* Package Tape Daisy Chain Schematics ... | Original |
35 pages, |
intel i5 block diagram 28F008S3 28F016B3 28F016S3 28F160B3 28F320J5 28F640J5 28F800B3 297846 a5 9910 28F008B3 intel C4 package datasheet abstract |
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| Abstract: BGA (VDE044 VDE044) 56-ball Fine-Pitch BGA (NSB056 NSB056, NLB056 NLB056) Product Line: ESG Â Embedded Solutions ... | Original |
2 pages, |
VDE044 S71VS064R S29VS064R S29NS032J NSB056 NLB056 S29VS064 Spansion datasheet abstract |
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| Abstract: (-25°C to +85°C) PACKAGE C =56-Ball Fine Pitch Ball Grid Array (FBGA) 0.80mm pitch, 7mm x 9mm , EN71GL128B0 EN71GL128B0 PACKAGE MECHANICAL 56-ball Fine-Pitch Ball Grid Array (FBGA) 7 x 9 mm Package, pitch: 0.8mm ... | Original |
8 pages, |
top marking PSRAM EN71GL128B0 EN71GL cFeon EN EN71GL128 cFeon EN29GL128 cFeon Flash chip ENPSL32 EN71GL128B0 abstract |
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| Abstract: ) PACKAGE C =56-Ball Fine Pitch Ball Grid Array (FBGA) 0.80mm pitch, 7mm x 9mm package SPEED 70 = 70ns , PACKAGE MECHANICAL 56-ball Fine-Pitch Ball Grid Array (FBGA) 7 x 9 mm Package, pitch: 0.8mm, ball: 0.4mm ... | Original |
8 pages, |
EN71GL EN29GL064 cFeon EN 71gl ENPSL32 cfeon en71gl064b0 EN71GL064 EN71GL064B0 EN71GL064B0 abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| Speed Programming adapter for 56-ball u MLTIAPRO.DOC - BGA package MLTIAPRO.DOC - Multi -56 ld 28F640J5 28F640J5 28F640J5 28F640J5 - uBGA-56 ball tbd , 2.40a tbd , 2.40a tbd , 2.40a tbd , 2.40a tbd www.datasheetarchive.com/files/intel/design/flcomp/devtools/7cd521a6.htm |
Intel | 10/02/1999 | 6.54 Kb | HTM | 7cd521a6.htm |
| Packages SOT542-1 ; plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm SOT542-1 TFBGA56 TFBGA56 TFBGA56 TFBGA56 plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm 00-11-22 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot542-1-v2.html |
Philips | 05/02/2002 | 4.98 Kb | HTML | sot542-1-v2.html |
| Packages SOT516-1 ; plastic low profile fine-pitch ball grid array package; 56 balls; body 6 x 6 x 1.05 mm SOT516-1 LFBGA56 LFBGA56 LFBGA56 LFBGA56 plastic low profile fine-pitch ball grid array package; 56 balls; body 6 x 6 x 1.05 mm 00-03-04 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot516-1-v1.html |
Philips | 05/02/2002 | 5 Kb | HTML | sot516-1-v1.html |
| industry-standard 56-lead SSOP and 56-ball micro ball grid array (uBGA * ) packages. In addition, the - 56-lead TSOP (16 Mbit only) - 56-lead SSOP - 56-ball uBGA High migration from 28F016SA/SV 28F016SA/SV 28F016SA/SV 28F016SA/SV and to IntelÂ's highest density devices 56-lead TSOP (16 Mb), SSOP and 56-ball uBGA OTHER RELATED COLLATERAL ITEMS DESCRIPTION www.datasheetarchive.com/files/intel/design/flcomp/prodbref/29784102.htm |
Intel | 01/11/1997 | 18.04 Kb | HTM | 29784102.htm |
| - 56-lead TSOP (16 Mbit only) - 56-lead SSOP - 56-ball uBGA High-Density 64 Â's highest density devices 56-lead TSOP (16 Mb), SSOP and 56-ball uBGA OTHER IntelÂ's 0.4-micron ETOX™V process technology. It comes in the industry-standard 56-lead SSOP and 56-ball micro ball grid array (uBGA * ) packages. In addition, the 16-Mbit device is available in the www.datasheetarchive.com/files/intel/design/flcomp/prodbref/29784102-v4.htm |
Intel | 03/08/1997 | 17.21 Kb | HTM | 29784102-v4.htm |
| industry-standard 56-lead SSOP and 56-ball micro ball grid array (uBGA * ) packages. In addition, the - 56-lead TSOP (16 Mbit only) - 56-lead SSOP - 56-ball uBGA High migration from 28F016SA/SV 28F016SA/SV 28F016SA/SV 28F016SA/SV and to IntelÂ's highest density devices 56-lead TSOP (16 Mb), SSOP and 56-ball uBGA OTHER RELATED COLLATERAL ITEMS DESCRIPTION www.datasheetarchive.com/files/intel/design/flcomp/prodbref/29784102-v2.htm |
Intel | 10/02/1998 | 18.04 Kb | HTM | 29784102-v2.htm |
| Â's 0.4-micron ETOX™V process technology. It comes in the industry-standard 56-lead SSOP and 56-ball SSOP - 56-ball uBGA High-Density 64-Kbyte Symmetrical Block Architecture /SV and to IntelÂ's highest density devices 56-lead TSOP (16 Mb), SSOP and 56-ball u www.datasheetarchive.com/files/intel/products two & tools/design/builder/flbldr/wordwide/content.htm |
Intel | 12/05/1999 | 9.55 Kb | HTM | content.htm |
| Â's 0.4-micron ETOX™V process technology. It comes in the industry-standard 56-lead SSOP and 56-ball SSOP - 56-ball uBGA High-Density 64-Kbyte Symmetrical Block Architecture /SV and to IntelÂ's highest density devices 56-lead TSOP (16 Mb), SSOP and 56-ball u www.datasheetarchive.com/files/intel/design/builder/flbldr/wordwide/content-v2.htm |
Intel | 10/02/1998 | 9.74 Kb | HTM | content-v2.htm |
| Â's 0.4-micron ETOX™V process technology. It comes in the industry-standard 56-lead SSOP and 56-ball SSOP - 56-ball uBGA High-Density 64-Kbyte Symmetrical Block Architecture /SV and to IntelÂ's highest density devices 56-lead TSOP (16 Mb), SSOP and 56-ball u www.datasheetarchive.com/files/intel/design/builder/flbldr/wordwide/content-v4.htm |
Intel | 01/11/1998 | 9.56 Kb | HTM | content-v4.htm |
| Â's 0.4-micron ETOX™V process technology. It comes in the industry-standard 56-lead SSOP and 56-ball SSOP - 56-ball uBGA High-Density 64-Kbyte Symmetrical Block Architecture /SV and to IntelÂ's highest density devices 56-lead TSOP (16 Mb), SSOP and 56-ball u www.datasheetarchive.com/files/intel/design/builder/flbldr/wordwide/content-v1.htm |
Intel | 01/11/1997 | 9.73 Kb | HTM | content-v1.htm |