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MPCZ563MVRX1 Freescale Semiconductor 56 bin2 hot test - ZD ri Buy
MPCZ563MVRX2 Freescale Semiconductor 56 bin2 cold test - ZD ri Buy
MPC834XCZQADD Freescale Semiconductor 8347 PBGA ri Buy

56-ball

Catalog Datasheet Results Type PDF Document Tags
Abstract: Polling CMOS I/O Compatibility Package Available ­56-ball LFBGA (8mm x 10mm) Temperature Ranges , DQ15-DQ0 DQ15-DQ0 Data Inputs/Outputs 56-Ball (LFBGA) 8mm x 10mm ComboMemory Pinout To output data during , 56-Ball (LFBGA) 10mm x 12mm ComboMemory Pinout 2.7-3.3V Power Supply to Flash only Unconnected pins , device Note: 3. CIOs and SA are only available for 34HF1681 34HF1681 device Package Diagram 56-Ball Low-Profile Fine-Pitch Ball Grid Array (LFBGA) 8mm x 10mm 56-Ball Low-Profile Fine-Pitch Ball Grid Array ... Original
datasheet

2 pages,
253.06 Kb

SST34HF1681 SST34HF1641 SST34HF1621 56-BALL SST34HF SST34HF abstract
datasheet frame
Abstract: 256Mb M PSRAM Uniform 1.8 1.8 Muxed x16 x16 LPCP - 56ball 11x8 mm 1Gb + , 1.8 1.8 Muxed x16 x16 LPCP - 56ball 11x8 mm 1Gb PF48F6000M0Y0BH PF48F6000M0Y0BH 1Gb - , LPCP - 56ball 10x10 mm 512Mb product line card Numonyx NOR flash memory NOR Density , MUX 512Mb 128Mb M PSRAM Uniform 1.8 1.8 Muxed x16 x16 LPCP - 56ball , 256Mb 128Mb M PSRAM Uniform 1.8 1.8 Muxed x16 x16 LPCP - 56ball 8x8 mm ... Original
datasheet

7 pages,
186.2 Kb

PF38F5070M0Y0BE ZS56 M36L0R7060U3ZAM PF58F0079LLY0WE PF38F4050M0Y3DF PF38F4060M0Y3CE PF38F5060M0Y0CF PF48F3000M0Y0QE PF38F3060M0Y1EF PF38F3050M0Y3DE Pf38f3050m0y0Ce PF58F0058M0Y1WE PF38F3050M0Y3DF datasheet abstract
datasheet frame
Abstract: Code (ManID) · Micron (0x2Ch) · Intel (0x89h) Package · 56-ball VFBGA (Standard) 7 x 8 ball grid · 56-ball VFBGA (Lead-free) 7 x 8 ball grid2 Operating Temperature Range · Extended (-40ºC to +85ºC) NOTE , Range 1.7V­1.95V Vcc 1.7V­2.24V VccQ Burst Mode Frequency 8 = 81 MHz Package Code FE = 56-ball VFBGA (Standard) 7 x 8 grid BE = 56-ball VFBGA (Lead-free) 7 x 8 grid Access Time -60 = 60ns ... Original
datasheet

5 pages,
79.9 Kb

INTEL 56BALL 56-BALL micron marking code information intel marking 28f INTEL flash part MARKING Flash Memory micron MT flash device MARKing intel datasheet abstract
datasheet frame
Abstract: Code (ManID) · Micron (0x2Ch) · Intel (0x89h) Package · 56-ball VFBGA (Standard) 7 x 8 ball grid · 56-ball VFBGA (Lead-free) 7 x 8 ball grid2 Operating Temperature Range · Extended (-40ºC to +85ºC) NOTE , Range 1.7V­1.95V Vcc 1.7V­2.24V VccQ Burst Mode Frequency 8 = 81 MHz Package Code FE = 56-ball VFBGA (Standard) 7 x 8 grid BE = 56-ball VFBGA (Lead-free) 7 x 8 grid Access Time -60 = 60ns ... Original
datasheet

5 pages,
79.91 Kb

flash device MARKing intel datasheet abstract
datasheet frame
Abstract: ://developer.intel.com/design/flcomp/packdata/ 11 3.4 Sample 56-Ball Array µBGA* Package Drawing and Dimensions , Mark Not Shown A1 A2 A Seating Plane Y Side View Figure 7. 56-Ball Array µBGA* Package Specifications for G28F640J5 G28F640J5 Remarks: The 56-ball package consists of partially depopulated solder ball matrix , 56-Ball µBGA* Package Silicon Daisy Chain Schematics 8 7 6 5 4 3 2 A B C D E F , H1 ­ H2 17 3.11 56-Ball µBGA* Package Drawing and Dimensions for Silicon Daisy Chain Device ... Original
datasheet

10 pages,
97.88 Kb

28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F640J5 28F800B3 3020 h3 G28F640J5 intel 28f160 s5 intel i5 top mark e5 5 ball csp drawing datasheet abstract
datasheet frame
Abstract: Application Report SZZA029B SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch , ABSTRACT TI's 56-ball MicroStar Jr. package, registered under JEDEC MO-225 MO-225, has demonstrated through , functions released in the 56-ball MicroStar Jr. package have superior performance characteristics, compared , 6 56-Ball MicroStar Jr. Package Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 56-Ball MicroStar Jr. Package, Top and Bottom Views . . . . ... Original
datasheet

30 pages,
889.66 Kb

VH373 48-PIN 56-PIN ALVCH16373 IC280-056-237 LVCH162 LVCH16244A micro pitch BGA SN74LVCH16244A tSSOP 56 socket TSSOP YAMAICHI SOCKET LVTH162 90 ball VFBGA 48 ball VFBGA SZZA029B MO-225 SZZA029B abstract
datasheet frame
Abstract: Mode 7ns at Burst Read 108MHz pSRAM Burst mode 108MHz max frequency Package 56-ball BGA This Data , CONTENT P = RoHS compliant TEMPERATURE RANGE W = Wireless (-25癈 to +85癈) PACKAGE DC = 56-Ball BGA , EN71NS128C0 EN71NS128C0 PACKAGE MECHANICAL 56-ball Ball Grid Array (BGA) 6.2 x 7.7 x 1.0mm Package, pitch: 0.5mm, ball ... Original
datasheet

8 pages,
241.55 Kb

E29NS128 EN29NS128 EN71NS128C0 EN71NS128C0 abstract
datasheet frame
Abstract: pSRAM Burst mode max frequency 108MHz 56-ball FBGA This Data Sheet may be revised by , (-25°C to +85°C) PACKAGE D = 56-Ball Very Thin Fine Pitch BGA (VFBGA) 0.50mm pitch, 9.2mm x 8mm , , Inc., Rev. A, Issue Date: 2009/7/24 www.eonssi.com EN71NS128B0 EN71NS128B0 PACKAGE MECHANICAL 56-ball ... Original
datasheet

8 pages,
633.32 Kb

EN29NS sa-129 EN71NS E29NS128 ENPSS32 EN29NS128 EN71NS128B0 EN71NS128B0 abstract
datasheet frame
Abstract: =56-Ball Fine Pitch Ball Grid Array (FBGA) 0.80mm pitch, 7mm x 9mm package SPEED 70 = 70ns pSRAM , EN71PL032A0 EN71PL032A0 PACKAGE MECHANICAL 56-ball Fine-Pitch Ball Grid Array (FBGA) 7 x 9 mm Package SYMBOL ... Original
datasheet

7 pages,
208.76 Kb

EN71PL PSRAM EN29PL032 EN71PL032A0 EN71PL032 EN71PL032A0 abstract
datasheet frame
Abstract: R Chip Scale BGA (CP56/CPG56 CP56/CPG56) Package PK013 PK013 (v1.3) July 9, 2008 56-BALL CHIP SCALE BGA 0.50mm PITCH (CP56/CPG56 CP56/CPG56) © 2004-2008 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice. PK013 PK013 (v1.3) July 9, 2008 www.xilinx.com 1 R Chip Scale ... Original
datasheet

2 pages,
47.49 Kb

CP56 CPG56 CP56/CPG56 PK013 56-BALL CP56/CPG56 abstract
datasheet frame
Abstract: BGA (VDE044 VDE044) 56-ball Fine-Pitch BGA (NSB056 NSB056, NLB056 NLB056) Product Line: ESG ­ Embedded Solutions ... Original
datasheet

2 pages,
15.13 Kb

VDE044 S29VS064R S29NS032J NSB056 NS032J NLB056 S71VS064R S29VS064 Spansion datasheet abstract
datasheet frame
Abstract: ) PACKAGE C =56-Ball Fine Pitch Ball Grid Array (FBGA) 0.80mm pitch, 7mm x 9mm package SPEED 70 = 70ns , PACKAGE MECHANICAL 56-ball Fine-Pitch Ball Grid Array (FBGA) 7 x 9 mm Package, pitch: 0.8mm, ball: 0.4mm ... Original
datasheet

8 pages,
323.1 Kb

71gl EN29GL064 cFeon EN EN71GL cfeon en71gl064b0 ENPSL32 EN71GL064 EN71GL064B0 EN71GL064B0 abstract
datasheet frame
Abstract: (-25°C to +85°C) PACKAGE C =56-Ball Fine Pitch Ball Grid Array (FBGA) 0.80mm pitch, 7mm x 9mm , EN71GL128B0 EN71GL128B0 PACKAGE MECHANICAL 56-ball Fine-Pitch Ball Grid Array (FBGA) 7 x 9 mm Package, pitch: 0.8mm ... Original
datasheet

8 pages,
539.28 Kb

top marking PSRAM EN71GL128B0 cFeon EN EN71GL cFeon EN29GL128 cFeon Flash chip EN71GL128 ENPSL32 EN71GL128B0 abstract
datasheet frame
Abstract: 6.2, 56-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter) E = 9.2 x 8.0, 56-ball BGA, 0.5 mm ball , 56-ball Package: RSD056 RSD056 Pinout: S71VS-R S71VS-R 56-ball Package: NLB056-56-ball Pinout: S71XS-R S71XS-R 56-ball Package: NLB056 NLB056 Pinout: S71VS-R S71VS-R 56-ball Package: NSD056 NSD056 Pinout: S71VS-R S71VS-R 56-ball Package: RSD056 RSD056 6 S71VS/XS-R S71VS/XS-R , periods of time. 4.2 Connection Diagrams Figure 4.1 S71VS-R S71VS-R 56-ball Fine-Pitch Ball Grid Array , Figure 4.3 S71XS-R S71XS-R 56-ball Fine-Pitch Ball Grid Array (Top View, Balls Facing Down) 1 A NC B No Connect ... Original
datasheet

18 pages,
666.66 Kb

S71VS256RD0 NLB056 mark ZH JEP95 S71VS128R S71VS/XS-R S71VS/XS-R abstract
datasheet frame

Datasheet Content (non pdf)

Abstract Saved from Date Saved File Size Type Download
Over 1.1 million files (1986-2014): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer.
 
loop) product family to include the CSPT857 CSPT857 CSPT857 CSPT857 devices in a 56-ball BGA (ball grid The newly introduced 56-ball BGA package is 60 percent smaller than the 48-pin Pricing and Availability The CSPT857 CSPT857 CSPT857 CSPT857 devices in 56-ball BGA packages are currently
www.datasheetarchive.com/files/idt/docs/rp00002/rp00243-v1.htm
IDT 19/05/2002 40.08 Kb HTM rp00243-v1.htm
0.4-micron ETOX™V process technology. It comes in the industry-standard 56-lead SSOP and 56-ball micro ball Industry-Standard Packaging - 56-lead TSOP (16 Mbit only) - 56-lead SSOP - 56-ball µBGA /SV and to Intel's highest density devices 56-lead TSOP (16 Mb), SSOP and 56-ball µBGA
www.datasheetarchive.com/files/intel/products two & tools/design/builder/flbldr/wordwide/content.htm
Intel 12/05/1999 9.55 Kb HTM content.htm
No abstract text available
www.datasheetarchive.com/download/43003881-260654ZC/wordwide.zip (CONTENT.HTM)
Intel 08/12/1997 4037.83 Kb ZIP wordwide.zip
0.4-micron ETOX™V process technology. It comes in the industry-standard 56-lead SSOP and 56-ball micro ball Industry-Standard Packaging - 56-lead TSOP (16 Mbit only) - 56-lead SSOP - 56-ball µBGA /SV and to Intel's highest density devices 56-lead TSOP (16 Mb), SSOP and 56-ball µBGA
www.datasheetarchive.com/files/intel/design/builder/flbldr/wordwide/content-v5.htm
Intel 12/05/1999 9.55 Kb HTM content-v5.htm
0.4-micron ETOX™V process technology. It comes in the industry-standard 56-lead SSOP and 56-ball micro ball Industry-Standard Packaging - 56-lead TSOP (16 Mbit only) - 56-lead SSOP - 56-ball µBGA /SV and to Intel's highest density devices 56-lead TSOP (16 Mb), SSOP and 56-ball µBGA
www.datasheetarchive.com/files/intel/design/builder/flbldr/wordwide/content.htm
Intel 30/04/1998 9.56 Kb HTM content.htm
0.4-micron ETOX™V process technology. It comes in the industry-standard 56-lead SSOP and 56-ball micro ball Industry-Standard Packaging - 56-lead TSOP (16 Mbit only) - 56-lead SSOP - 56-ball µBGA /SV and to Intel's highest density devices 56-lead TSOP (16 Mb), SSOP and 56-ball µBGA
www.datasheetarchive.com/files/intel/design/builder/flbldr/wordwide/content-v4.htm
Intel 01/11/1998 9.56 Kb HTM content-v4.htm
0.4-micron ETOX™V process technology. It comes in the industry-standard 56-lead SSOP and 56-ball micro ball Industry-Standard Packaging - 56-lead TSOP (16 Mbit only) - 56-lead SSOP - 56-ball µBGA /SV and to Intel's highest density devices 56-lead TSOP (16 Mb), SSOP and 56-ball µBGA
www.datasheetarchive.com/files/intel/design/builder/flbldr/wordwide/content-v3.htm
Intel 01/08/1998 9.56 Kb HTM content-v3.htm
0.4-micron ETOX™V process technology. It comes in the industry-standard 56-lead SSOP and 56-ball micro ball Industry-Standard Packaging - 56-lead TSOP (16 Mbit only) - 56-lead SSOP - 56-ball µBGA /SV and to Intel's highest density devices 56-lead TSOP (16 Mb), SSOP and 56-ball µBGA
www.datasheetarchive.com/files/intel/design/builder/flbldr/wordwide/content-v2.htm
Intel 10/02/1998 9.74 Kb HTM content-v2.htm
0.4-micron ETOX™V process technology. It comes in the industry-standard 56-lead SSOP and 56-ball micro ball Industry-Standard Packaging - 56-lead TSOP (16 Mbit only) - 56-lead SSOP - 56-ball µBGA /SV and to Intel's highest density devices 56-lead TSOP (16 Mb), SSOP and 56-ball µBGA
www.datasheetarchive.com/files/intel/design/builder/flbldr/wordwide/content-v1.htm
Intel 01/11/1997 9.73 Kb HTM content-v1.htm
No abstract text available
www.datasheetarchive.com/download/64683872-175063ZC/wordwide.zip (CONTENT.HTM)
Intel 08/12/1997 4037.83 Kb ZIP wordwide.zip